Precise circuit pcb (printed circuit board)

By setting copper blocks and inclined surfaces on a precision PCB circuit board, combined with high thermal conductivity materials and clamping components, the problem of poor heat dissipation was solved, achieving efficient heat dissipation and stable clamping of the substrate.

CN223912626UActive Publication Date: 2026-02-13JIANGXI KEXIANG ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202423309215.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-31
Publication Date
2026-02-13
Estimated Expiration
2034-12-31

AI Technical Summary

Technical Problem

Existing precision PCB circuit boards lack effective heat dissipation mechanisms, resulting in poor heat dissipation and a tendency for circuit failures due to excessive heat generation.

Method used

A copper block is placed on the substrate, and inclined surfaces are provided on both sides of it. Combined with an outer frame and clamping components, the increased contact area and thermal conductivity between the copper block and the substrate are achieved. High thermal conductivity materials and thermal grease are used to fill the substrate to improve heat dissipation. The clamping components facilitate substrate clamping.

Benefits of technology

It effectively improves the heat dissipation of the substrate, prevents circuit failures caused by overheating, and adapts to the clamping requirements of substrates of various sizes and specifications.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a precise circuit pcb (printed circuit board). The precise circuit pcb comprises a substrate, an outer frame and a copper block are further included. The outer frame is provided with an installation cavity used for installing a substrate, and a clamping assembly capable of clamping the substrate is arranged in the installation cavity. A mounting hole matched with the copper block is formed in the base plate, first inclined surfaces are arranged on the two sides of the copper block, second inclined surfaces matched with the first inclined surfaces are arranged in the mounting hole, and a plurality of grooves are further formed in the side face of the copper block. The copper block is arranged on the substrate, the heat dissipation effect on the substrate can be effectively improved, meanwhile, the first inclined faces are arranged on the two sides of the copper block, the contact area between the copper block and the substrate can be effectively increased, the heat dissipation effect of the copper block is further improved, and the substrate can be conveniently clamped through the outer frame and the clamping assembly.
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Description

TECHNICAL FIELD

[0001] The utility model relates to pcb board technical field, concretely relates to a precision circuit pcb board. BACKGROUND

[0002] The existing PCB precision circuit board does not have a dedicated heat dissipation mechanism, can only rely on the natural heat dissipation of the plate body, or increase a heat dissipation fan at the device (such as CPU) of big heat emission, but the heat dissipation effect is not good enough, and the plate body is prone to line fault due to serious heating. UTILITY MODEL CONTENTS

[0003] The utility model wants to solve the problem that provide a kind of precision circuit pcb board, by setting copper block on base plate, can effectively improve the heat dissipation effect of base plate, simultaneously, be provided with inclined plane one on the both sides of copper block, can effectively improve the contact area between copper block and base plate, further improve the heat dissipation effect of copper block, and the outer frame and clamping assembly of the application can be conveniently clamped to base plate.

[0004] The utility model provides a technical scheme for solving the above problems: a precision circuit pcb board, including base plate, still including outer frame and copper block,

[0005] The outer frame is provided with mounting cavity for mounting base plate, and the mounting cavity is provided with clamping assembly for clamping base plate;

[0006] The base plate is provided with mounting hole matched with copper block, the both sides of copper block are provided with inclined plane one, the mounting hole is provided with inclined plane two matched with inclined plane one, and the side surface of copper block is further provided with a plurality of grooves.

[0007] Preferably, the clamping assembly includes a clamping plate and an adjusting bolt, the mounting cavity is provided with a clamping slot for the clamping plate to move, the outer frame is provided with a threaded hole matched with the adjusting bolt, and one end of the adjusting bolt is rotatably connected with the clamping plate.

[0008] Preferably, the side of the clamping plate matched with the base plate is provided with a soft pad.

[0009] Preferably, the grooves are tapered grooves or arc grooves.

[0010] Preferably, the outer frame is made of a material with high thermal conductivity.

[0011] Preferably, the lower end of the outer frame is provided with a plurality of heat dissipation fins.

[0012] Preferably, the heat dissipation fins are integrally formed with the outer frame.

[0013] Preferably, the lower end surface of the copper block and the cavity bottom of the mounting cavity are filled with heat-conducting silicone grease.

[0014] Preferably, the copper block is filled with epoxy resin between the mounting hole.

[0015] Compared with the prior art, the utility model has the advantages that the copper block is arranged on the base plate, the heat dissipation effect of the base plate is effectively improved, the inclined surface one is arranged on the two sides of the copper block, the contact area between the copper block and the base plate is effectively improved, the heat dissipation effect of the copper block is further improved, and the outer frame and the clamping assembly can conveniently clamp the base plate. BRIEF DESCRIPTION OF DRAWINGS

[0016] The accompanying drawings, which are included to provide a further understanding of the present application and constitute a part of this application, illustrate embodiments of the present application and together with the description serve to explain the present application.

[0017] Figure 1 is a schematic view of the three-dimensional structure of the utility model;

[0018] Figure 2 is a sectional view of the base plate of the utility model;

[0019] Figure 3 is a top view of the copper block of the utility model;

[0020] Figure 4 is a sectional view of the clamping assembly of the utility model;

[0021] Figure 5 is Figure 1 the enlarged schematic view of A in the figure.

[0022] Fig. 1, outer frame, 2, adjusting bolt, 3, heat dissipation fin, 4, copper block, 5, base plate, 6, groove, 7, inclined surface one, 8, clamping plate, 9, soft pad. DETAILED DESCRIPTION

[0023] The embodiments of the present application will be described in detail below with the accompanying drawings and examples, so that the realization process of how to apply technical means to solve technical problems and achieve technical effects of the present application can be fully understood and implemented.

[0024] In the description of the utility model, it is necessary to explain that, for the direction words, if the term "center", "transverse", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate the orientation and positional relationship based on the orientation or positional relationship shown in the drawings, only for the convenience of describing the utility model and simplifying the description, and not indicating or implying that the device or element indicated must have a particular orientation, be constructed and operated in a particular orientation, and cannot be understood as limiting the specific protection scope of the utility model.

[0025] In addition, if the terms "first", "second" are only used for description purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. Therefore, the "first" and "second" features can be explicitly or implicitly included one or more features, and in the description of the utility model, the meaning of "several" is two or more than two, unless otherwise explicitly specified and limited.

[0026] In the utility model, unless otherwise specified and limited, if the terms "assembly", "connection", "connection" are understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; It can be mechanical connection; It can be directly connected, or it can be connected through an intermediate medium, or it can be connected inside two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific situation.

[0027] It should be understood that when used in the specification and the appended claims, the terms "include" and "contain" indicate the presence of described features, whole, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, whole, steps, operations, elements, components and / or their collection.

[0028] It should also be understood that the terms used in the description of the embodiments of the utility model herein are only for the purpose of describing specific embodiments and are not intended to limit the embodiments of the utility model. As used in the description of the embodiments of the utility model and the appended claims, unless the context clearly indicates otherwise, the singular form "one", "a" and "the" is intended to include the plural form.

[0029] The specific embodiments of the utility model are shown in the drawings, a kind of precision circuit pcb board, including substrate 5;Further including outer frame 1 and copper block 4;

[0030] The outer frame 1 is provided with mounting cavity for mounting substrate 5, the mounting cavity is provided with clamping assembly that can clamp substrate 5 in;

[0031] The substrate 5 is provided with a mounting hole matched with the copper block 4, both sides of the copper block 4 are provided with inclined surface one 7, the mounting hole is provided with inclined surface two matched with the inclined surface one 7, and the side surface of the copper block 4 is further provided with a plurality of grooves 6.

[0032] In the above scheme, the copper block is arranged on the substrate, so that the heat dissipation effect of the substrate can be effectively improved, and the inclined surface one is arranged on both sides of the copper block, so that the contact area between the copper block and the substrate can be effectively improved, and the heat dissipation effect of the copper block is further improved, and the outer frame and the clamping assembly can conveniently clamp the substrate.

[0033] As another embodiment of the utility model, the clamping assembly includes clamping plate 8 and adjusting bolt 2, the mounting cavity is provided with clamping plate 8 movable clamping plate 8, the outer frame 1 is provided with the threaded hole matched with adjusting bolt 2, and one end of adjusting bolt 2 is rotatably connected with clamping plate 8. In order to prevent the substrate from being crushed by the clamping plate during clamping, a soft pad 9 is arranged on the side of the clamping plate 8 matched with the substrate 5, and the clamping force of the clamping plate can be effectively buffered by the soft pad. Specifically, after the substrate is placed into the placing cavity, the adjusting bolt is screwed by a screwdriver, so that the clamping plate moves towards the substrate and clamps the substrate, and the present scheme is simple in structure and can clamp substrates of various sizes.

[0034] Specifically, as shown in the figure, Figure 2 The groove 6 is a tapered groove or an arc-shaped groove, epoxy resin is filled between the copper block and the mounting hole, and the epoxy resin in the groove forms a limit for the copper block after hardening.

[0035] As another embodiment of the utility model, the outer frame 1 is made of a material with high thermal conductivity; a plurality of heat dissipation fins 3 are arranged at the lower end of the outer frame 1. Further, the heat dissipation fins 3 are integrally formed with the outer frame 1. In order to improve the heat conduction effect between the copper block and the outer frame, heat-conducting silicone grease is filled between the lower end surface of the copper block 4 and the bottom of the mounting cavity.

[0036] It should be noted that epoxy resin is filled between the copper block 4 and the mounting hole.

[0037] The above only describes the best embodiment of the utility model, but cannot be understood as a limitation on the claims. The utility model is not limited to the above embodiments, and the specific structure can be changed. Any change made within the protection scope of the independent claims of the utility model is within the protection scope of the utility model.

Claims

1. A precision circuit pcb board comprising a substrate (5); characterized in that: It also comprises an outer frame (1) and a copper block (4); The outer frame (1) is provided with a mounting cavity for mounting a substrate (5), and the mounting cavity is provided with a clamping assembly capable of clamping the substrate (5); The substrate (5) is provided with a mounting hole matched with the copper block (4), both sides of the copper block (4) are provided with an inclined surface (7), the mounting hole is provided with an inclined surface (7) matched with the inclined surface (7), and the side surface of the copper block (4) is further provided with a plurality of grooves (6).

2. A precision circuit pcb board according to claim 1, characterized in that: The clamping assembly comprises a clamping plate (8) and an adjusting bolt (2), the mounting cavity is provided with a clamping plate (8) movable clamping plate (8), and the outer frame (1) is provided with a threaded hole matched with the adjusting bolt (2).

3. A precision circuit pcb board according to claim 2, characterized in that: The side of the clamping plate (8) matched with the substrate (5) is provided with a soft pad (9).

4. The precision circuit pcb board of claim 1, wherein: The grooves (6) are tapered grooves or arc grooves.

5. The precision circuit pcb board of claim 1, wherein: The outer frame (1) is made of a material with high thermal conductivity.

6. A precision circuit pcb board according to claim 5, characterized in that: The lower end of the outer frame (1) is provided with a plurality of heat dissipation fins (3).

7. A precision circuit pcb board according to claim 6, characterized in that: The heat dissipation fins (3) and the outer frame (1) are integrally formed.

8. A precision circuit pcb board according to claim 7, characterized in that: The lower end surface of the copper block (4) and the bottom of the mounting cavity are filled with heat-conducting silicone grease.

9. The precision circuit pcb board of claim 1, wherein: The copper block (4) and the mounting hole are filled with epoxy resin.