Printed circuit board with buried capacitor and buried resistor

By integrating a protective frame, substrate, and heat dissipation components onto the circuit board, the problems of heat dissipation and bending resistance of the circuit board are solved, achieving efficient heat conduction and buffering effects, and improving the service life and ease of installation of the circuit board.

CN223912640UActive Publication Date: 2026-02-13JIANGXI JINGCHAO TECH CO LTD
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Patent Information

Application Number
CN202520429359.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-03-12
Publication Date
2026-02-13
Estimated Expiration
2035-03-12

AI Technical Summary

Technical Problem

Existing circuit boards lack effective heat dissipation structures in thin and light miniaturized electronic products, resulting in insufficient thermal conductivity and insulation performance, and they are easily bent under pressure, reducing their service life.

Method used

The printed circuit board design with embedded capacitors and resistors includes components such as a protective frame, substrate, L-shaped mounting plate, heat-conducting plate, and shock-absorbing base. Heat dissipation is achieved through the heat-conducting plate and heat sink fins. The ease of installation is adjusted using sliding blocks and sliding rods, and the impact resistance is improved through buffer springs and insulating sleeves.

Benefits of technology

It enables flexible installation of circuit boards, effective heat dissipation and enhanced buffering, reduces costs and improves the service life and bending resistance of circuit boards.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a printed circuit board with buried capacitors and buried resistors, which comprises a circuit board body, a protective frame and a substrate, the protective frame is sleeved and fixed on the outer side of the circuit board body, the substrate is fixedly connected to the bottom side of the protective frame, two sides of the substrate are respectively and symmetrically connected with L-shaped mounting plates, through holes are arranged on the L-shaped mounting plates in a penetrating manner, and the L-shaped mounting plates are fixedly connected with the protective frame. The substrate and the circuit board mounting panel can be flexibly adjusted, the mounting operation is more convenient, the circuit board body can be subjected to heat conduction and heat dissipation, external heat dissipation devices do not need to be mounted on the circuit board body, the manufacturing cost of the whole circuit board is greatly reduced, the upper surface of the circuit board body can be pressed and impacted, and the circuit board can be conveniently mounted and dismounted. The buffer effect can be effectively improved, the service life of the circuit board body is greatly prolonged, and the situation that the circuit board is bent due to impact and pressing is avoided.
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Description

TECHNICAL FIELD

[0001] The utility model relates to printed wiring board technical field, concretely related to a kind of buried capacitance buried resistance printed wiring board. BACKGROUND

[0002] With the development of technology, people's living standards are higher and higher, and light, thin and small electronic products are favored by more consumers; This puts forward higher design requirements for the circuit board in electronic products.

[0003] In the prior art, the circuit board is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components, which connects various components. Due to the working characteristics of the circuit board, the performance requirements are high, and it needs to have good thermal conductivity and insulation performance. With the development of science and technology, more and more circuit boards are used, and the circuit board does not have a special heat dissipation structure, and needs to be connected to a heat sink for heat dissipation. During installation and use, the circuit board is easily bent under pressure, greatly reducing the service life of the circuit board.

[0004] For the problems in the related art, no effective solution has been proposed so far. UTILITY MODEL CONTENT

[0005] To overcome the above technical problems existing in the prior art, the utility model provides a buried capacitance buried resistance printed wiring board.

[0006] Therefore, the utility model adopts the following specific technical solutions:

[0007] A buried capacitance buried resistance printed wiring board includes a circuit board body, a protective frame, and a substrate. The protective frame is fixedly sleeved on the outer side of the circuit board body. The substrate is fixedly connected to the bottom side of the protective frame. L-shaped mounting plates are symmetrically connected to both sides of the substrate. Through holes are provided in the L-shaped mounting plates.

[0008] As a preferred embodiment, connection grooves are formed in both sides of the substrate. Sliding rods are fixedly connected between the inner walls of the connection grooves. Sliding blocks are sleeved on the outer sides of the sliding rods. The outer sides of the sliding blocks are fixedly connected to the L-shaped mounting plates.

[0009] As a preferred embodiment, a concave opening is formed in the top of the protective frame, and the protective frame is fixedly connected to the outer side of the circuit board body through the concave opening. A heat dissipation plate is fixedly connected to the middle of the top side of the substrate. Heat dissipation fins are equidistantly connected around the outer wall of the heat dissipation plate.

[0010] As preferred, insulation sleeves are fixedly connected to the four corners of the bottom of the protective frame respectively, and shock-absorbing seats are fixedly connected to the four corners of the top of the base plate respectively, and the positions of the shock-absorbing seats correspond to the positions of the insulation sleeves.

[0011] As preferred, the shock-absorbing seat comprises a connecting pipe and a positioning bolt, the positioning bolt is arranged inside the connecting pipe, and a threaded ring is movably connected between the inner walls of the connecting pipe, and the insulation sleeve is sleeved inside the connecting pipe.

[0012] As preferred, the positioning bolt penetrates the insulation sleeve and the connecting pipe inside in sequence and is threadedly connected with the threaded ring, a buffer spring is fixedly connected to the bottom side of the threaded ring, and the bottom end of the buffer spring is fixedly connected to the top side of the base plate.

[0013] The base plate and the circuit board mounting panel can be flexibly adjusted, the installation operation is more convenient, the circuit board body can be heat-conducted and heat-dissipated, an external heat-dissipating device does not need to be installed on the circuit board body, the overall cost of the circuit board is greatly reduced, the circuit board body can be pressed and impacted on the upper surface, the buffer effect can be effectively improved, the service life of the circuit board body is greatly improved, and the circuit board is prevented from being bent due to impact and pressing. BRIEF DESCRIPTION OF DRAWINGS

[0014] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed in the embodiments will be briefly introduced as follows. Obviously, the drawings in the following description only constitute some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort on the basis of these drawings.

[0015] Figure 1 is a general structure schematic diagram of a buried capacitor and buried resistor printed circuit board according to an embodiment of the present application;

[0016] Figure 2 is an internal structure schematic diagram of a connecting groove of a buried capacitor and buried resistor printed circuit board according to an embodiment of the present application;

[0017] Figure 3 is a split structure schematic diagram of a protective frame and a base plate of a buried capacitor and buried resistor printed circuit board according to an embodiment of the present application;

[0018] Figure 4 is a shock-absorbing seat cross-sectional structure schematic diagram of a buried capacitor and buried resistor printed circuit board according to an embodiment of the present application.

[0019] In the drawings:

[0020] 1, circuit board body; 2, protective frame; 3, base plate; 4, L-shaped mounting plate; 5, through hole; 6, connecting groove; 7, sliding rod; 8, sliding block; 9, concave opening; 10, heat conduction plate; 11, heat dissipation fin; 12, insulating sleeve; 13, shock absorbing seat; 14, connecting pipe; 15, positioning bolt; 16, internal thread ring; 17, buffer spring. DETAILED DESCRIPTION

[0021] To further illustrate the embodiments, the utility model provides drawings, these drawings are part of the utility model disclosure, it mainly used to illustrate the embodiment, and can cooperate with the relevant description of the specification to explain the operating principle of the embodiment, cooperate with reference to these contents, the person skilled in the art should be able to understand other possible implementation ways and the advantages of the utility model, the components in the drawing are not drawn according to scale, and similar component symbols are usually used to represent similar components.

[0022] According to the embodiment of the utility model, a buried capacitor and buried resistance printed circuit board is provided.

[0023] Embodiment one

[0024] As Figures 1-4 The utility model discloses a buried capacitor and buried resistance printed circuit board, which comprises a circuit board body 1, a protective frame 2 and a base plate 3, the protective frame 2 is sleeved and fixed on the outer side of the circuit board body 1, the base plate 3 is fixedly connected to the bottom side of the protective frame 2, L-shaped mounting plates 4 are symmetrically connected to the two sides of the base plate 3, through holes 5 are formed in the L-shaped mounting plates 4, connecting grooves 6 are formed in the two sides of the base plate 3, sliding rods 7 are fixedly connected between the inner walls of the connecting grooves 6, sliding blocks 8 are sleeved on the outer sides of the sliding rods 7, and the sliding blocks 8 are fixedly connected to the L-shaped mounting plates 4.

[0025] Embodiment two

[0026] As Figures 1-4As shown, a printed circuit board with embedded capacitors and resistors according to an embodiment of the present invention includes a circuit board body 1, a protective frame 2, and a substrate 3. The protective frame 2 is sleeved and fixed to the outside of the circuit board body 1. The substrate 3 is fixedly connected to the bottom side of the protective frame 2. L-shaped mounting plates 4 are symmetrically connected to both sides of the substrate 3. Through holes 5 are provided on each of the L-shaped mounting plates 4. A concave opening 9 is provided at the top of the protective frame 2, and it is fixedly connected to the outside of the circuit board body 1 through the concave opening 9. A heat-conducting plate 10 is fixedly connected to the middle of the top side of the substrate 3. Heat dissipation fins are equidistantly connected to the outer perimeter of the heat-conducting plate 10. Insulating sleeves 12 are fixedly connected to the four corners of the bottom of the protective frame 2, and shock-absorbing seats 13 are fixedly connected to the four corners of the top of the substrate 3. The positions of the shock-absorbing seats 13 correspond to the positions of the insulating sleeves 12. The heat-conducting plate 10 is attached to the bottom side of the circuit board body 1. The heat-conducting plate 10 can conduct heat to the circuit board body 1. The heat dissipation fins 11 can increase the contact area between the heat-conducting plate 10 and the external space, which can conduct heat and dissipate heat to the circuit board body 1. There is no need to install external heat dissipation devices on the circuit board body 1, which greatly reduces the overall cost of the circuit board.

[0027] Example 3

[0028] like Figures 1-4 As shown, a printed circuit board with embedded capacitors and resistors according to an embodiment of the present invention includes a circuit board body 1, a protective frame 2, and a substrate 3. The protective frame 2 is sleeved and fixed to the outside of the circuit board body 1. The substrate 3 is fixedly connected to the bottom side of the protective frame 2. L-shaped mounting plates 4 are symmetrically connected to both sides of the substrate 3. Through holes 5 are provided on each of the L-shaped mounting plates 4. The shock-absorbing seat 13 includes a connecting pipe 14 and a positioning bolt 15. The positioning bolt 15 is disposed inside the connecting pipe 14. An internal threaded ring 16 is movably connected between the inner walls of the connecting pipe 14. An insulating sleeve 12 is sleeved inside the connecting pipe 14. The positioning bolt 15 passes through the insulating sleeve 12 and the connecting pipe 14 in sequence and is threadedly connected to the internal threaded ring 16. A buffer spring 17 is fixedly connected to the bottom side of the internal threaded ring 16. The bottom end of the 7 is fixedly connected to the top side of the substrate 3. The insulating sleeve 12 is installed inside the connecting tube 14. Then, the positioning bolt 15 passes through the insulating sleeve 12 and the connecting tube 14 and is threadedly connected to the inner threaded ring 16. This makes the splicing operation of the circuit board body 1 and the substrate 3 more convenient. The circuit board body 1 does not need to be installed by welding, which greatly reduces the installation and use cost. Under the action of the protective frame 2, the outside of the circuit board body 1 can be protected, which improves the strength of the circuit board body 1. Under the action of the buffer spring 17, the inner threaded ring 16 can be pressed and impacted on the upper surface of the circuit board body 1, which can effectively improve the buffering effect and greatly improve the service life of the circuit board body 1, avoiding the bending of the circuit board due to impact and pressure.

[0029] In summary, by means of the above technical scheme of the utility model, when the device is used, the L-shaped mounting plate 4 can be longitudinally moved outside the sliding rod 7 through the sliding block 8, the through hole 5 on the L-shaped mounting plate 4 can be corresponded to the hole opened on the circuit board mounting panel, the heat conduction plate 10 can be attached to the bottom side of the circuit board body 1, the heat conduction plate 10 can conduct heat to the circuit board body 1, the contact area of the heat conduction plate 10 and the external space can be increased through the heat dissipation fin 11, the circuit board body 1 can be heat-conducted and heat-dissipated, the insulating sleeve 12 is installed inside the connecting pipe 14, then the positioning bolt 15 penetrates through the insulating sleeve 12 and the inside of the connecting pipe 14 and is matched with the internal thread ring 16 for threaded connection, the circuit board body 1 and the base plate 3 can be more conveniently spliced, the circuit board body 1 does not need to be installed through welding, the installation and use cost is greatly reduced, the circuit board body 1 can be protected outside through the protection frame 2, the strength of the circuit board body 1 is improved, and the internal thread ring 16 can effectively improve the buffering effect under the action of the buffer spring 17 when the circuit board body 1 is pressed and impacted on the upper surface.

[0030] The above merely describes the preferred embodiments of the utility model and is not used to limit the utility model, and any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A buried capacitance and resistance printed wiring board comprising a wiring board body (1), a protective frame (2), and a substrate (3), characterized in that, The protective frame (2) is sleeved and fixed outside the circuit board body (1), the base plate (3) is fixedly connected to the bottom side of the protective frame (2), the base plate (3) is symmetrically connected with the L-shaped mounting plate (4) on both sides, and the L-shaped mounting plate (4) is provided with the through hole (5).

2. The buried capacitor and buried resistor printed wiring board of claim 1 wherein, The connecting grooves (6) are formed on both sides of the base plate (3), the sliding rods (7) are fixedly connected between the inner walls of the connecting grooves (6), the sliding blocks (8) are sleeved on the outer sides of the sliding rods (7), and the sliding blocks (8) are fixedly connected with the L-shaped mounting plates (4) on the outer sides.

3. The buried capacitor and buried resistor printed wiring board of claim 2 wherein, The concave opening (9) is formed in the top of the protective frame (2), and the concave opening (9) is fixedly connected with the outer side of the circuit board body (1), the heat-conducting plate (10) is fixedly connected to the top side of the base plate (3), and the heat-conducting plate (10) is connected with the heat dissipation fins (11) at equal intervals around the outer wall.

4. The buried capacitor and buried resistor printed wiring board of claim 3 wherein, The insulating sleeves (12) are fixedly connected to the four corners of the bottom of the protective frame (2), the shock-absorbing seats (13) are fixedly connected to the four corners of the top of the base plate (3), and the positions of the shock-absorbing seats (13) correspond to the positions of the insulating sleeves (12).

5. The buried capacitor / resistor printed wiring board of claim 4 wherein, The shock-absorbing seat (13) comprises a connecting pipe (14) and a positioning bolt (15), the positioning bolt (15) is arranged in the connecting pipe (14), the inner thread ring (16) is movably connected between the inner walls of the connecting pipe (14), and the insulating sleeve (12) is sleeved in the connecting pipe (14).

6. The buried capacitor / resistor printed wiring board of claim 5 wherein, The positioning bolt (15) penetrates the insulating sleeve (12) and the connecting pipe (14) from top to bottom, and is in threaded connection with the inner thread ring (16), the inner thread ring (16) is fixedly connected with the buffer spring (17) on the bottom side, and the bottom end of the buffer spring (17) is fixedly connected with the top side of the base plate (3).