Double-sided ceramic plate

Abstract

The utility model relates to the technical field of ceramic materials, in particular to a double-sided ceramic plate. The device comprises a ceramic substrate, a gum layer is adhered to an inner cavity of the ceramic substrate, a circuit board is slidably connected to an inner cavity of the gum layer, a sensor is installed on the surface of the circuit board, the model of the sensor comprises a PFID radio frequency IC induction card, and four telescopic rods are fixedly connected to one side, away from the gum layer, of the circuit board. The sides, away from the circuit board, of the four telescopic rods are fixedly connected with a connecting plate, the connecting plate is fixedly connected with an inner cavity of the ceramic substrate, the arc faces of the telescopic rods are sleeved with springs, the two ends of the springs are fixedly connected with the circuit board and the connecting plate respectively, and the connecting plate and the inner cavity of the circuit board are slidably connected with a heat conduction plate. The problem that in the daily use process, a sensor installed in a ceramic plate is prone to displacement due to external conventional shaking, vibration and other factors, and consequently the sensor is damaged is solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to ceramic material technical field especially relates to a double -sided ceramic plate. BACKGROUND

[0002] With the rapid development of electronic technology, the heat dissipation, insulation and stability of electronic components are increasingly demanding. The traditional single-sided ceramic plate has been difficult to meet the demand in some complex application scenarios, for example, in high power density electronic equipment, the single-sided ceramic plate cannot simultaneously meet the heat dissipation requirements of the upper and lower surfaces, which easily leads to local overheating, affecting the service life and performance of the equipment.

[0003] A Chinese patent application CN201620610410.2 discloses a ceramic double-sided plate, which has the technical scheme as follows: it comprises a ceramic plate, the upper end of the ceramic plate is sequentially provided with a first buffer layer and a first conductive layer, the lower end of the ceramic plate is sequentially provided with a second buffer layer and a second conductive layer, the first conductive layer, the first buffer layer, the ceramic plate, the second buffer layer and the second conductive layer are sequentially provided with conductive through holes in communication with each other, the first conductive layer and the second conductive layer are located at the inner end face and laid with an FPC plate, the FPC plate comprises a first electrode seat, a second electrode seat and an input end, the first electrode seat is arranged between the first conductive layer and the second conductive layer along the "X" axis, the second electrode seat is arranged between the first conductive layer and the second conductive layer along the "Y" axis, and the first electrode seat and the second electrode seat are mutually spliced. The utility model has good compression resistance, simple structure and strong practicability.

[0004] In view of the above and the prior art, the inventors believe that the following defects often exist: the sensor installed inside the ceramic plate is easily displaced due to external regular shaking, vibration and other factors during daily use, resulting in damage to the sensor; therefore, a double-sided ceramic plate is proposed to solve the above problems. UTILITY MODEL CONTENTS

[0005] The utility model discloses a double -sided ceramic plate to solve the technical problems in the prior art that the sensor installed inside the ceramic plate is easily displaced due to external regular shaking, vibration and other factors during daily use, resulting in damage to the sensor.

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a double-sided ceramic plate, comprising a ceramic substrate, the inner cavity of the ceramic substrate is bonded with a gum layer, the inner cavity of the gum layer is slidably connected with a circuit board, the surface of the circuit board is mounted with a sensor, the model of the sensor includes but is not limited to PFID radio frequency IC induction card, four telescopic rods are fixedly connected to the side of the circuit board away from the gum layer, four telescopic rods are fixedly connected with a connecting plate on the side away from the circuit board, and the connecting plate is fixedly connected with the inner cavity of the ceramic substrate.

[0007] The effect achieved by the above components is that the gum layer is adhered in the inner cavity of the ceramic substrate, providing a relatively stable attachment basis for the circuit board, so that the sensor mounted on the surface of the circuit board can be in a relatively fixed position, avoiding displacement caused by external regular shaking, vibration and other factors, and at the same time playing a buffering role in the telescopic deformation of the telescopic rod, absorbing impact force and preventing damage caused by direct transmission of external force to the sensor, thereby improving the practicality of the device.

[0008] Preferably, the telescopic rod is sleeved with a spring, and the two ends of the spring are fixedly connected with the circuit board and the connecting plate, respectively.

[0009] The effect achieved by the above components is that the spring and the telescopic rod cooperate to provide better buffering effect, and the elasticity of the spring can also enable the circuit board to quickly reset after being subjected to external force, thereby improving the practicality of the device.

[0010] Preferably, the connecting plate and the inner cavity of the circuit board are slidably connected with a heat-conducting plate, the surface of the heat-conducting plate is provided with a plurality of heat dissipation holes, the side wall of the heat-conducting plate is provided with a plurality of through holes, and the heat dissipation holes and the through holes are in communication.

[0011] The effect achieved by the above components is that the heat dissipation holes and the through holes are in communication, which achieves the effect of dissipating the heat generated by the sensor on the circuit board, so that the sensor is in a stable temperature state, thereby improving the service life of the sensor.

[0012] Preferably, the gum layer is a gum fiber layer.

[0013] The effect achieved by the above components is that the gum fiber is set as a gum layer, which achieves the effect of air permeability, facilitating the dissipation of heat transferred by the heat-conducting plate, and improving the practicality of the device.

[0014] Preferably, the surface of the circuit board is adhered with an insulating layer, and the material of the insulating layer is polytetrafluoroethylene.

[0015] The effect achieved by the above components is that the insulating layer is provided to achieve the effect of insulating the circuit board, avoiding the danger caused by electric leakage, ensuring the safety of the sensor, and improving the practicality of the device.

[0016] Preferably, the surface of the heat-conducting plate is fixedly connected with two buffer pads, and the material of the buffer pads is silica gel material.

[0017] The effect achieved by the above components is that the circuit board is protected, avoiding the possibility of damage to the circuit board and the heat-conducting plate caused by extrusion contact when the ceramic substrate is subjected to external force, thereby affecting the operation of the sensor and improving the practicality of the device.

[0018] In summary, the beneficial effects of the utility model are:

[0019] In the utility model, the gum layer is adhered in the inner cavity of the ceramic substrate, which provides a relatively stable adhesion base for the circuit board, so that the sensor installed on the surface of the circuit board can be in a relatively fixed position, avoiding displacement caused by external conventional shaking, vibration and other factors, and at the same time, the buffer effect in the telescopic deformation of the telescopic rod is achieved, the impact force is absorbed, the damage caused by the direct transmission of external force to the sensor is prevented, and the practicability of the device is improved. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 It is a three-dimensional structure schematic diagram of the utility model;

[0021] Figure 2 It is a structure schematic diagram of the gum layer in the utility model;

[0022] Figure 3 It is an internal structure schematic diagram of the gum layer in the utility model;

[0023] Figure 4 It is a structure schematic diagram of the circuit board in the utility model;

[0024] Figure 5 It is an enlarged view of A in the utility model; Figure 4

[0025] Figure 6 It is a structure schematic diagram of the heat conduction plate in the utility model.

[0026] Legend: 1, ceramic substrate; 2, gum layer; 3, sensor; 4, insulating layer; 5, circuit board; 6, telescopic rod; 7, connecting plate; 8, heat conduction plate; 9, spring; 10, buffer pad; 11, heat dissipation hole. DETAILED DESCRIPTION

[0027] Refer to Figures 1-6 ​The utility model provides a technical scheme: a double -sided ceramic plate, including ceramic substrate 1, the inner chamber of ceramic substrate 1 is glued with gum layer 2, the inner chamber sliding connection of gum layer 2 has circuit board 5, the surface of circuit board 5 is equipped with sensor 3, the side fixedly connected with four telescopic links 6 of circuit board 5 away from gum layer 2, four telescopic links 6 fixedly connected with the side of connecting plate 7 away from circuit board 5, connecting plate 7 is fixedly connected with the inner chamber of ceramic substrate 1, by gluing gum layer 2 in the inner chamber of ceramic substrate 1, for circuit board 5 provides a relatively stable adhesion foundation, so that the sensor 3 installed on the surface of circuit board 5 can be in a more fixed position, avoid because of the outside conventional shaking, vibration and other factors easily shift, at the same time in the telescopic deformation of telescopic link 6 play the buffering effect, absorb the impact force, prevent external force directly on sensor 3 transmission cause damage, improve the practicality of device, the arc surface cover of telescopic link 6 has spring 9, the both ends of spring 9 are fixedly connected with circuit board 5 and connecting plate 7, under the cooperation of spring 9 and telescopic link 6, can provide better buffering effect, simultaneously, the elasticity of spring 9 can also make circuit board 5 after receiving external force can reset quickly, improve the practicality of device, the inner chamber sliding connection of connecting plate 7 and circuit board 5 has heat conduction plate 8, the surface of heat conduction plate 8 is equipped with a plurality of heat dissipation holes 11, the side wall of heat conduction plate 8 is equipped with a plurality of through -holes, heat dissipation hole 11 is connected with the through -hole intercommunication, by the intercommunication of heat dissipation hole 11 and through -hole, reached the effect of exporting the heat generated by sensor 3 on circuit board 5, make sensor 3 be in stable temperature state, improve the service life of sensing, gum layer 2 is gum fiber layer, by setting up gum fiber as gum layer 2, reached the effect of ventilation, facilitate the heat transfer of heat conduction plate 8 to dissipate, improve the practicality of device, the surface of circuit board 5 is glued with insulating layer 4, the material of insulating layer 4 is polytetrafluoroethylene, by setting up insulating layer 4, reached the effect of insulating circuit board 5, avoided the danger caused by electric leakage, safeguarded the safety of sensor 3, improved the practicality of device, the surface fixedly connected with two buffer pads 10 of heat conduction plate 8, the material of buffer pad 10 is silica gel material, reached the effect of protecting circuit board 5, avoided the extrusion contact of circuit board 5 and heat conduction plate 8 when ceramic substrate 1 received external force, possibly damage, thereby influence sensor 3's operation, improved the practicality of device.

[0028] Working principle, by gluing gum layer 2 in the inner chamber of ceramic substrate 1, for circuit board 5 provides a relatively stable adhesion foundation, so that the sensor 3 installed on the surface of circuit board 5 can be in a more fixed position, simultaneously, the cooperation between telescopic link 6 and spring 9 prevents external force directly on sensor 3 transmission cause damage, after circuit board 5 and connecting plate 7 inner chamber sliding connection has heat conduction plate 8, under the cooperation of heat dissipation hole 11 and through -hole on heat conduction plate 8, the heat generated by sensor 3 is discharged outside ceramic substrate 1 through the air permeability of gum layer 2.

[0029] In the description of the utility model, it is to explain, unless another explicit stipulation and limit, term " install " " link " " connection " should do broad sense understanding, for example, can be fixed connection, also can be detachable connection, or integrally connected, can be mechanical connection, also can be electric connection, can be direct connection, also can indirectly connect through intermediate medium, can be two element inside intercommunication, for ordinary skilled person in the art, can understand the concrete meaning of above -mentioned term in the utility model through specific situation.

Claims

1. A double-face ceramic plate comprising a ceramic substrate (1), characterized in that: The inner cavity of the ceramic substrate (1) is adhered with a gum layer (2), the inner cavity of the gum layer (2) is slidably connected with a circuit board (5), the surface of the circuit board (5) is mounted with a sensor (3), the side, away from the gum layer (2), of the circuit board (5) is fixedly connected with four telescopic rods (6), the side, away from the circuit board (5), of the four telescopic rods (6) is fixedly connected with a connecting plate (7), and the connecting plate (7) is fixedly connected with the inner cavity of the ceramic substrate (1).

2. A double-sided ceramic plate according to claim 1, characterized in that: The arc surface of the telescopic rod (6) is sleeved with a spring (9), and the two ends of the spring (9) are fixedly connected with the circuit board (5) and the connecting plate (7) respectively.

3. A double-sided ceramic plate according to claim 1, characterized in that: The inner cavity of the connecting plate (7) and the circuit board (5) is slidably connected with a heat-conducting plate (8), a plurality of heat dissipation holes (11) are formed in the surface of the heat-conducting plate (8), a plurality of through holes are formed in the side wall of the heat-conducting plate (8), and the heat dissipation holes (11) are in communication connection with the through holes.

4. The double-sided ceramic plate according to claim 1, characterized in that: The gum layer (2) is a gum fiber layer.

5. The double-sided ceramic plate according to claim 1, characterized in that: The surface of the circuit board (5) is adhered with an insulating layer (4), and the material of the insulating layer (4) is polytetrafluoroethylene.

6. A double-sided ceramic plate according to claim 3, characterized in that: The surface of the heat-conducting plate (8) is fixedly connected with two buffer pads (10), and the material of the buffer pads (10) is silica gel.

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