Reflow soldering process jig composition board

Abstract

The utility model discloses a reflow soldering process jig composition board, which comprises a pressing plate and an anti-warping bottom plate, the pressing plate is pressed on the anti-warping bottom plate, and the anti-warping bottom plate is pressed with a PCB (printed circuit board) to be processed by reflow soldering; the anti-warping bottom plate comprises a connecting part and a pressing part, a first through hole is formed in the connecting part, the pressing plate is connected with the anti-warping bottom plate through the first through hole, second through holes and third through holes are formed in the pressing part, and the second through holes and the third through holes are sequentially formed in the pressing part in an alternating sequence; and the aperture of the second through hole is 3-6 times of the aperture of the third through hole. The PCB is subjected to uniform pressure and heat transfer in the reflow soldering process, and the edge warping phenomenon caused by the high temperature effect is effectively reduced. The anti-warping bottom plate is beneficial for improving the attachment between the PCB and the bonding pad, so that the welding process is more stable, and the welding quality is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of electrical automation especially relates to a reflow soldering process fixture combination board. BACKGROUND

[0002] In the existing reflow soldering processing technology, the reflow soldering jig bottom plate used for pressing the PCB (printed circuit board) is prone to edge lifting, which is a common technical problem. During the reflow soldering process, the PCB is placed on the jig bottom plate and fixed by the pressing block on the jig. However, during the heating process, due to the mismatch of the thermal expansion coefficient, the material quality of the jig bottom plate, or improper processing technology, the jig bottom plate is prone to edge lifting. This edge lifting can cause the PCB to shift during welding, affecting the welding quality. The thermal expansion coefficients of the jig bottom plate and the PCB are different, resulting in inconsistent expansion during the heating process, which causes the bottom plate to lift. The jig bottom plate has poor material quality and insufficient heat resistance, which can easily deform in a high-temperature environment. During the processing of the jig bottom plate, the flatness and dimensional accuracy of the bottom plate cannot be guaranteed, causing the bottom plate to lift when heated. The fixing force of the bottom plate is insufficient, making it prone to edge lifting when heated. The uneven distribution of the furnace temperature causes the jig bottom plate to heat unevenly, further causing edge lifting. The shifting of the PCB during welding can cause quality problems such as short circuiting and virtual welding. The poor welding caused by edge lifting requires rework, increasing production costs and cycle time. Frequent rework and adjustment of the jig can cause the equipment to wear out more quickly, reducing its service life. SUMMARY

[0003] The utility model embodiment provides a reflow soldering process fixture combination board, which aims to solve the problem of edge lifting of the reflow soldering jig bottom plate in the prior art method.

[0004] The utility model embodiment discloses a reflow soldering process fixture combination board, which comprises a pressing plate and an anti-lifting bottom plate. The pressing plate is pressed onto the anti-lifting bottom plate, and the anti-lifting bottom plate is pressed onto the PCB to be reflow soldered. The anti-lifting bottom plate comprises a connecting part and a pressing part. A first through hole is provided on the connecting part, and the pressing plate is connected to the anti-lifting bottom plate through the first through hole. A second through hole and a third through hole are provided on the pressing part, and the second through hole and the third through hole are arranged in alternating order on the pressing part. The diameter of the second through hole is 3-6 times the diameter of the third through hole.

[0005] Further, the pressing plate is a magnetic pressing plate made of high-manganese magnetic material.

[0006] Further, the thickness of the pressing plate is 0.02-0.05 mm.

[0007] Further, the upper surface of the anti-warping base plate is reinforcedly connected with the pressing plate through inlaying high-temperature-resistant magnetic suction members.

[0008] Further, the thickness of the anti-warping base plate is set to be 1.2-2 times of the pressing plate.

[0009] Further, the aperture of the one-side opening of the second through hole is set to be 1.2 times of the aperture of the other-side opening.

[0010] Further, the apertures of the two sides of the third through hole are equal.

[0011] Further, the pressing plate comprises a first pressing strip, a second pressing strip and a third pressing strip, the first pressing strip and the third pressing strip are pressed to the edges of the anti-warping base plate, the second pressing strip is pressed to the central axis of the anti-warping base plate, and the second pressing strip is parallel to the first pressing strip and the third pressing strip.

[0012] Further, one end of the anti-warping base plate is provided with a control part, and a pulling hole is arranged on the control part for pulling the combined plate.

[0013] Further, the lengths of the first pressing strip, the second pressing strip, the third pressing strip and the edges of the anti-warping base plate are equal.

[0014] The combined plate is designed through the anti-warping base plate, the PCB plate receives uniform pressure and heat transfer in the reflow soldering process, and the edge warping phenomenon caused by high temperature is effectively reduced. The anti-warping base plate helps to improve the adhesion between the PCB plate and the solder pad, makes the soldering process more stable, and improves the soldering quality. The reflow soldering process jig designed with the anti-warping base plate helps to reduce the scrap rate caused by the edge warping and reduce the production cost. The use of the anti-warping base plate helps to improve the stability of the reflow soldering process, reduce the adjustment and maintenance time, and improve the production efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to more clearly illustrate the technical scheme in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0016] Figure 1 The overall structure of the reflow soldering process jig combined plate provided by the embodiments of the present application is shown in the exploded view.

[0017] Figure 2 The anti-warping base plate structure diagram of the reflow soldering process jig combined plate provided by the embodiments of the present application.

[0018] The drawings are as follows:

[0019] 1. Pressure plate; 2. Anti-warping bottom plate; 21. Connecting part; 22. Pressing part; 211. First through hole; 212. Second through hole; 213. Third through hole; 11. First pressure strip; 12. Second pressure strip; 13. Third pressure strip. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0021] It should be understood that, when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, integrals, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0022] It should also be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0023] It should also be further understood that the term "and / or" as used in this specification and the appended claims refers to any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0024] like Figure 1 as well as Figure 2 As shown, this embodiment provides a reflow soldering process fixture assembly board, which includes a pressure plate 1 and an anti-warping base plate 2. The pressure plate 1 is pressed onto the anti-warping base plate 2, and the anti-warping base plate 2 is pressed onto the PCB board to be reflow soldered. The anti-warping base plate 2 includes a connecting part 21 and a pressing part 22. The connecting part 21 is provided with a first through hole 211, and the pressure plate 1 is connected to the anti-warping base plate 2 through the first through hole 211. The pressing part 22 is provided with a second through hole 212 and a third through hole 213, which are arranged alternately on the pressing part 22. The diameter of the second through hole 212 is set to be 3-6 times the diameter of the third through hole 213.

[0025] In actual use scenarios, the above-mentioned embodiment provides a reflow soldering process jig combination plate, and the core advantage lies in that, through the design of the anti-warping bottom plate 2, the edge warping phenomenon of the PCB caused by high temperature in the reflow soldering process is effectively avoided. The combination plate mainly consists of two parts, the pressing plate 1 and the anti-warping bottom plate 2. The pressing plate 1 is pressed against the anti-warping bottom plate 2, and the anti-warping bottom plate 2 is pressed against the PCB to be reflow soldered. This structure makes the PCB receive uniform pressure during the reflow soldering process, thereby reducing the risk of edge warping. The anti-warping bottom plate 2 includes a connecting part 21 and a pressing part 22. The connecting part 21 is provided with a first through hole 211, and the pressing plate 1 is connected to the anti-warping bottom plate 2 through the first through hole 211. The pressing part 22 is provided with a second through hole 212 and a third through hole 213, and the second through hole 212 and the third through hole 213 are arranged in the pressing part 22 in an alternating order. The diameter of the second through hole 212 is 3-6 times the diameter of the third through hole 213, and the number of the second through hole 212 is 1.5 times the number of the third through hole 213. The larger diameter of the second through hole 212 is conducive to heat transfer during the reflow soldering process, reducing the risk of local overheating of the PCB. At the same time, the large diameter helps to reduce the contact area between the pressing part 22 and the PCB, reducing stress concentration caused by thermal expansion. The large number of second through holes 212 helps to improve the efficiency of heat transfer, making the PCB heat more evenly. In addition, the alternating arrangement of the second through hole 212 and the third through hole 213 helps to reduce the air resistance between the pressing part 22 and the PCB, reducing the influence of air flow on the PCB during the reflow soldering process.

[0026] Through the design of the anti-warping bottom plate 2, the PCB receives uniform pressure and heat transfer during the reflow soldering process, effectively reducing the edge warping phenomenon caused by high temperature. The anti-warping bottom plate 2 helps to improve the adhesion between the PCB and the solder pad, making the soldering process more stable and improving the soldering quality. The reflow soldering process jig designed with the anti-warping bottom plate 2 helps to reduce the scrap rate caused by edge warping, reducing production costs. The use of the anti-warping bottom plate 2 helps to improve the stability of the reflow soldering process, reduce adjustment and maintenance time, and improve production efficiency.

[0027] In summary, the reflow soldering process jig combination plate provided by the above-mentioned embodiment effectively solves the problem of PCB edge warping during the reflow soldering process, improves the soldering quality and production efficiency, and reduces the production cost.

[0028] Further, the pressing plate 1 is a magnetic pressing plate made of high-manganese magnetic material.

[0029] Further, the thickness of the pressing plate 1 is set to 0.02-0.05 mm.

[0030] Further, the upper surface of the anti-warping bottom plate 2 is reinforcedly connected to the pressing plate 1 by inlaying high-temperature-resistant magnetic attraction pieces.

[0031] Specifically, the high-manganese magnetic material has good magnetic properties and mechanical strength, can provide stable pressure, and ensures that the PCB board remains flat during reflow soldering. The material is resistant to high temperatures and can maintain stable performance in high-temperature environments during reflow soldering, and is not easily deformed or damaged. The wear resistance and corrosion resistance of the high-manganese magnetic material also help to extend the service life of the pressing plate 1. This thin design can reduce thermal resistance and improve heat conduction efficiency, making the PCB board heat more evenly. The thin pressing plate 1 helps to reduce the overall weight, making it easier to operate and transport. The appropriate thickness ensures sufficient strength while avoiding stress concentration problems caused by excessive thickness. The high-temperature-resistant magnetic element can maintain its magnetic properties in high-temperature environments, ensuring that the connection between the pressing plate 1 and the anti-warping base plate 2 does not weaken due to temperature increases. The magnetic connection method simplifies the assembly and disassembly process, improving production efficiency. The inlaid design enhances the stability of the connection, avoiding loose connections caused by vibration or movement. By using high-manganese magnetic material and thin pressing plate 1 design, heat can be transferred more quickly and evenly to the PCB board, helping to improve the consistency and reliability of soldering. The addition of the magnetic element improves the stability of the connection between the pressing plate 1 and the anti-warping base plate 2, maintaining good pressing effect even at high temperatures. The use of high-manganese magnetic material and high-temperature-resistant magnetic element makes the jig assembly plate more durable, reducing replacement frequency and maintenance costs. The magnetic connection simplifies the operation process, making the jig assembly plate easier to quickly replace and maintain. These further optimization measures not only enhance the functionality of the reflow soldering process jig assembly plate, but also improve its application value in actual production.

[0032] Further, the thickness of the anti-warping base plate 2 is set to 1.2-2 times the thickness of the pressing plate 1.

[0033] Further, the aperture of the first through hole 211 is set to 1.2 times the aperture of the second through hole 212.

[0034] Further, the apertures of the two sides of the third through hole 213 are equal.

[0035] Specifically, the appropriate thickness ratio can ensure that the anti-warping base plate 2 has sufficient strength and stability to support the PCB and prevent it from warping during the reflow soldering process. A moderate thickness can avoid excessive thickness of the base plate increasing thermal resistance and affecting heat conduction efficiency, while also preventing deformation or damage caused by excessive thinness. The setting of the thickness ratio helps to balance the structural strength and heat conduction performance of the base plate. This asymmetric design helps to form a small pressure difference during the reflow soldering process, thereby better controlling the flatness of the PCB. By adjusting the hole diameter, the hot air flow can be optimized, further reducing the warping of the PCB due to uneven heating. This design also facilitates the rapid release of pressure after reflow soldering, reducing stress when the PCB cools down. Equal hole diameters ensure uniform heat transfer, reducing the risk of local overheating of the PCB. This design simplifies the manufacturing process, as there is no need to make different size openings for the third through-hole 213. Uniform hole diameters help improve the consistency of production, so that each PCB can achieve the same soldering effect. With the asymmetric second through-hole 212 and uniform third through-hole 213 design, heat transfer is more uniform, helping to improve soldering quality. The appropriate thickness of the anti-warping base plate 2 and the special design of the second through-hole 212 help better control the flatness of the PCB and reduce warping. The thickness ratio of the anti-warping base plate 2 to the pressing plate 1 ensures the stability and durability of the overall structure. The uniform hole diameter of the third through-hole 213 simplifies the production and inspection process, reducing manufacturing costs. These improvements make the reflow soldering process jig combination plate more suitable for the production needs of high-precision and high-efficiency electronic manufacturing industry.

[0036] Further, the pressing plate 1 comprises a first pressing strip 11, a second pressing strip 12 and a third pressing strip 13, the first pressing strip 11 and the third pressing strip 13 are pressed to the edges of the anti-warping base plate 2, and the second pressing strip 12 is pressed to the central axis of the anti-warping base plate 2, and the second pressing strip 12 is parallel to the first pressing strip 11 and the third pressing strip 13.

[0037] Further, one end of the anti-warping base plate 2 is provided with a control part, and a pulling hole is arranged on the control part for pulling the combination plate.

[0038] Further, the first pressing strip 11, the second pressing strip 12, the third pressing strip 13 and the edge length of the anti-warping base plate 2 are equal.

[0039] Specifically, the press plate 1 can distribute pressure more evenly, thereby more effectively preventing PCB board warping during reflow soldering. The first and third press strips 11 and 13 are located at the edges of the warpage prevention base plate 2, which can provide lateral support, while the second press strip 12 is located at the center axis, which can provide central support. This layout helps to balance the pressure on the entire PCB board. The parallel layout helps to ensure even pressure distribution, reducing PCB board deformation during reflow soldering. This design also facilitates automated operation, as the parallel layout of the press strips facilitates recognition and positioning by machine vision systems. The control portion is configured to make the combined plate easier to operate and move in the reflow soldering equipment. The design of the towing hole facilitates the use of a mechanical arm or other automated equipment to tow the combined plate, improving the degree of automation of the production line. The equal length simplifies the production and assembly process of the press plate 1 and the warpage prevention base plate 2, as they can be mass-produced with standardized dimensions. This standardized design also helps to reduce the number of inventory types and reduce inventory management costs. The equal length also ensures the matching degree of the press plate 1 and the warpage prevention base plate 2, improving the overall stability of the combined plate. Through the design of the three press strips, it is ensured that the PCB board is subjected to uniform pressure throughout the reflow soldering process, thereby reducing warping. The design of the control portion and the towing hole makes the combined plate easier to position and move in the reflow soldering equipment. The consistency of the press strips and the edge length of the warpage prevention base plate 2 helps to achieve standardized production and reduce costs. The design of the parallel press strips and the towing hole facilitates the operation of automated equipment, improving production efficiency. These improvements make the reflow soldering process jig combined plate more suitable for modern, high-efficiency electronic manufacturing industry production environments.

[0040] The utility model discloses a reflow soldering process fixture combination board, and the combination board includes the pressing plate 1 and the anti -warping backplate 2, the pressing plate 1 is pressed in the anti -warping backplate 2, and the anti -warping backplate 2 is pressed with the PCB board of reflow soldering processing, the anti -warping backplate 2 includes the connecting portion 21 and the pressing portion 22, first through -hole 211 is provided on the connecting portion 21, the pressing plate 1 is connected with the anti -warping backplate 2 through first through -hole 211, second through -hole 212 and third through -hole 213 are provided on the pressing portion 22, and the second through -hole 212 and the third through -hole 213 are sequentially arranged in the pressing portion 22 according to the alternate order, the aperture of second through -hole 212 is 3-6 times of the aperture of third through -hole 213, and the number of second through -hole 212 is 1.5 times of the number of third through -hole 213. The combination board passes through the design of the anti -warping backplate 2, and the PCB board receives the even pressure and heat transfer in the reflow soldering process, effectively reduces the warping phenomenon due to the high temperature effect. The anti -warping backplate 2 helps to improve the adhesion between the PCB board and the pad, makes the welding process more stable, and improves the welding quality. The reflow soldering process fixture designed with the anti -warping backplate 2 helps to reduce the scrap rate caused by warping, and reduces the production cost. The use of the anti -warping backplate 2 helps to improve the stability of the reflow soldering process, reduces the adjustment and maintenance time, and improves the production efficiency.

[0041] The above is only the specific implementation manner of the utility model, but the protection scope of the utility model is not limited to this, and anyone skilled in the art can easily think of various equivalent modifications or replacements within the technical range disclosed by the utility model, and these modifications or replacements should be covered in the protection scope of the utility model. Therefore, the protection scope of the utility model should be the protection scope of the claims.

Claims

1. A reflow soldering process jig combination plate applied to a PCB board reflow soldering process, characterized in that, The combined plate comprises: a pressing plate and a warping-preventing base plate, the pressing plate being pressed against the warping-preventing base plate, and the warping-preventing base plate being pressed against a PCB to be reflow soldered; the warping-preventing base plate comprises a connecting portion and a pressing portion, the connecting portion is provided with a first through hole, the pressing plate is connected to the warping-preventing base plate through the first through hole, and the pressing portion is provided with a second through hole and a third through hole, the second through hole and the third through hole are arranged in an alternating order on the pressing portion; the diameter of the second through hole is 3-6 times that of the third through hole.

2. The reflow process fixture panel assembly of claim 1, wherein, The pressing plate is a magnetic pressing plate made of high-manganese magnetic material.

3. The reflow process fixture panel assembly of claim 1, wherein, The thickness of the pressing plate is 0.02-0.05 mm.

4. The reflow process fixture panel assembly of any one of claims 1-3, wherein, The upper surface of the warping-preventing base plate is reinforcedly connected to the pressing plate by embedding a high-temperature-resistant magnetic suction element.

5. The reflow process fixture panel assembly of any of claims 1-3, wherein, The thickness of the warping-preventing base plate is 1.2-2 times that of the pressing plate.

6. The reflow process fixture panel assembly of claim 1, wherein, The diameter of the opening on one side of the second through hole is 1.2 times that of the opening on the other side.

7. The reflow process fixture panel assembly of claim 1, wherein, The diameters of the openings on both sides of the third through hole are equal.

8. The reflow process fixture panel assembly of claim 1, wherein, The pressing plate comprises a first pressing strip, a second pressing strip and a third pressing strip, the first pressing strip and the third pressing strip are pressed against the edges of the warping-preventing base plate, the second pressing strip is pressed against the central axis of the warping-preventing base plate, and the second pressing strip is parallel to the first pressing strip and the third pressing strip.

9. The reflow process fixture panel assembly of claim 1, wherein, One end of the warping-preventing base plate is provided with a control portion, and the control portion is provided with a pulling hole for pulling the combined plate.

10. The reflow process fixture panel assembly of claim 8, wherein, The lengths of the first pressing strip, the second pressing strip, the third pressing strip and the edges of the warping-preventing base plate are equal.

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