Conveying device and reflow soldering equipment

Abstract

The utility model relates to the field of circuit board manufacturing, in particular to a conveying device and reflow soldering equipment, which comprises a first conveying mechanism, a second conveying mechanism and a third conveying mechanism which are sequentially arranged along the front-back direction, the middle part of the second conveying mechanism is positioned in a high-temperature area of the reflow soldering equipment; the first conveying mechanism is provided with a first conveying face used for bearing a circuit board, the second conveying mechanism is provided with a second conveying face used for bearing the circuit board, the third conveying mechanism is provided with a third conveying face used for bearing the circuit board, and the first conveying face, the second conveying face and the third conveying face are flush. The second conveying mechanism is a net chain conveyor, and the conveying face of the net chain conveyor forms the second conveying face. According to the utility model, the probability of circuit board deformation is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of circuit board manufacturing equipment, especially relates to a conveying device and reflow soldering equipment. BACKGROUND

[0002] Electronic industry small electronic product, its circuit board volume is small, in manufacturing such circuit board, in order to exert the high speed of paster machine, mostly are the board technology, and multiple circuit boards of the same type are spliced into a whole.

[0003] The product conveying mechanism of the existing paster machine is divided into three parts of front, middle and rear, and each part includes a guide rail. When the circuit board after pasting passes through the high temperature area of the reflow soldering equipment, the circuit board is prone to deformation, causing the board surface to be no longer flat, quality problems exist, and subsequent processing procedures are affected. SUMMARY

[0004] The utility model solves the technical problem that the circuit board after pasting passes through the high temperature area of the existing reflow soldering equipment and is prone to deformation. A plug and connector are provided.

[0005] To solve the above technical problems, on the one hand, the utility model embodiment provides a conveying device, which comprises first conveying mechanism, second conveying mechanism and third conveying mechanism arranged in sequence along the front-back direction, the middle part of the second conveying mechanism is located in the high temperature area of the reflow soldering equipment,

[0006] The first conveying mechanism has a first conveying surface for carrying the circuit board, the second conveying mechanism has a second conveying surface for carrying the circuit board, and the third conveying mechanism has a third conveying surface for carrying the circuit board, and the first conveying surface, the second conveying surface and the third conveying surface are flush.

[0007] The second conveying mechanism is a net chain conveyor, and the conveying surface of the net chain conveyor constitutes the second conveying surface.

[0008] Optionally, it also includes two parallel guide strips, along the first direction, the two guide strips are arranged on the opposite sides of the first conveying mechanism, and the two guide strips are both extended to above the second conveying surface rearward.

[0009] Along the first direction, the interval between the two guide strips is equal to the width of the circuit board, so that when the circuit board passes between the two guide strips, the opposite sides of the two guide strips abut against the opposite side walls of the circuit board respectively, and the first direction is perpendicular to the front-back direction.

[0010] Optionally, the surface of each guide strip close to the other guide strip is a plane, and the surfaces of the opposite sides of the two guide strips are parallel.

[0011] Optionally, the surface of each guide strip close to another guide strip comprises a first plane and a first inclined plane from front to back, the rear side of the first plane is connected with the front side of the first inclined plane, and the first inclined plane gradually moves away from another guide strip from front to back.

[0012] Optionally, two guide strips are further included, and the two guide strips are arranged on opposite sides of the third conveying mechanism in the first direction, both of the two guide strips extend forward above the second conveying surface, the distance between the opposite sides of the two guide strips gradually decreases from front to back, and the minimum distance between the opposite sides of the two guide strips is equal to the width of the circuit board.

[0013] Optionally, the surface of each guide strip close to another guide strip is an inclined plane.

[0014] Optionally, the surface of each guide strip close to another guide strip comprises a second plane and a second inclined plane, the rear side of the second plane is connected with the front side of the second inclined plane, and the second inclined plane gradually moves close to another guide strip from front to back.

[0015] Optionally, the length of the guide strip in the front-back direction is 200-400 mm.

[0016] Optionally, a blocking rod is arranged on the third conveying mechanism, the blocking rod is located at the tail end of the third conveying mechanism, and the blocking rod is located above the third conveying surface, and the blocking rod is used for blocking the backward displacement of the circuit board.

[0017] In another aspect, the utility model also provides a reflow soldering equipment, including casing and above-mentioned conveying device, the casing has high temperature area in, the first conveying mechanism sets up in the front of casing, the second conveying mechanism is worn in the casing, the third conveying mechanism sets up in the rear of casing;

[0018] The first conveying mechanism is used for conveying the circuit board to the second conveying mechanism.

[0019] The second conveying mechanism is used for conveying the circuit board to the third conveying mechanism.

[0020] The third conveying mechanism is used for receiving the circuit board conveyed by the second conveying mechanism.

[0021] The embodiment of the utility model provides conveying device and reflow soldering equipment, the second conveying mechanism in reflow soldering equipment is net chain conveyer, when the circuit board should deal with high temperature, the circuit board will soften, deform downward, but because net chain conveyer lifts the surface of circuit board from the bottom surface of circuit board, can reduce the downward deformation of circuit board, thereby make the circuit board keep original as far as possible. And because the conveying surface of net chain conveyer has mesh, mesh can ventilate, thereby can guide the gas in high temperature area to heat from the bottom of circuit board, guarantee the effect of heating reflow soldering. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical scheme of the embodiment of the utility model, the following will be briefly introduced the drawings needed to be used in the description of the embodiment of the utility model, obviously, the drawings in the following description only some embodiments of the utility model, for the ordinary skilled person in the art, under the premise of not paying the creative labor, still can obtain other drawings according to these drawings.

[0023] Figure 1 It is the overall schematic view of conveying device in an embodiment of the utility model;

[0024] Figure 2 It is Figure 1 The enlarged schematic view of A part of

[0025] Figure 3 It is the enlarged schematic view of B part of Figure 1

[0026] Figure 4 It is the first conveying mechanism explosion schematic view of conveying device in an embodiment of the utility model;

[0027] Figure 5 It is the third conveying mechanism explosion schematic view of conveying device in an embodiment of the utility model;

[0028] Figure 6 It is the overall schematic view of reflow soldering equipment in an embodiment of the utility model.

[0029] BRIEF DESCRIPTION OF DRAWINGS: 1, the first conveying mechanism;11, the first shell;12, the second shell;13, the first conveying belt;14, the second conveying belt;2, the second conveying mechanism;3, the third conveying mechanism;31, the third shell;32, the fourth shell;33, the third conveying belt;34, the fourth conveying belt;35, the driving wheel;36, the blocking rod;4, the guide strip;41, the first plane;42, the first inclined plane;5, the guide strip;51, the second plane;52, the second inclined plane. DETAILED DESCRIPTION

[0030] ​In order to make the technical problems, technical schemes and beneficial effects solved by the utility model clearer and more apparent, the utility model will be further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the utility model and not to limit the utility model.

[0031] In the description of the utility model, it should be understood that the orientation or positional relationship indicated by the terms "longitudinal", "radial", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the utility model. In the description of the utility model, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0032] In the description of the utility model, it should be pointed out that, unless otherwise specified and limited, the terms "mounting", "connection" and "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected, it can be mechanically connected, or it can be electrically connected, it can be directly connected, or indirectly connected through an intermediate medium, it can be the communication between two elements. For ordinary skilled persons in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0033] The front-rear direction in the embodiment is the conveying direction of the circuit board, and the first direction is the width direction of the first conveying mechanism.

[0034] With reference to Figures 1-5 , the utility model embodiment provides a conveying device, first conveying mechanism 1, second conveying mechanism 2 and third conveying mechanism 3 are sequentially arranged along the front-rear direction, the middle part of second conveying mechanism 2 is located in the high temperature area of reflow soldering equipment, first conveying mechanism 1 has first conveying surface for bearing circuit board, second conveying mechanism 2 has second conveying surface for bearing circuit board, third conveying mechanism 3 has third conveying surface for bearing circuit board, first conveying surface, second conveying surface and third conveying surface are flush, second conveying mechanism 2 is net chain conveyor, and the conveying surface of net chain conveyor constitutes second conveying surface.

[0035] With reference to Figures 1-3 , second conveying mechanism 2 is net chain conveyor, and the conveying surface of net chain conveyor constitutes second conveying surface.

[0036] The second conveying mechanism 2 in the reflow soldering device in the embodiment is a mesh chain conveyor. When the circuit board is subjected to high temperature, the circuit board will soften and deform downward. However, since the mesh chain conveyor supports the surface of the circuit board from the bottom surface of the circuit board, the downward deformation of the circuit board can be reduced, so that the circuit board can be kept as much as possible. And since the conveying surface of the mesh chain conveyor has mesh holes, the mesh holes can be ventilated, so that the gas in the high temperature area can be guided to heat from the bottom of the circuit board, ensuring the effect of reflow soldering.

[0037] Referring to Figure 4 and Figure 5 , the first conveying mechanism includes a first housing 11, a second housing 12, a first conveying belt 13 and a second conveying belt 14. The first housing 11 and the second housing 12 are arranged in the first direction. The first conveying belt 13 is installed on the first housing 11, and the second conveying belt 14 is installed on the second housing 12, so that the first conveying belt 13 and the second conveying belt 14 are arranged in the first direction. The conveying speed of the first conveying belt 13 and the second conveying belt 14 is the same, and the conveying surface of the first conveying belt 13 and the second conveying belt 14 is located in the same plane. One side of the circuit board along the first direction is overlapped on the belt surface of the first conveying belt 13, and the other side of the circuit board along the first direction is overlapped on the belt surface of the second conveying belt 14.

[0038] In the embodiment, the driving wheels 35 of the first conveying belt 13 and the driving wheels 35 of the second conveying belt 14 are connected as a whole. The motor is connected with one of the driving wheels 35, so that the first conveying belt 13 and the second conveying belt 14 can be driven at the same time, and the conveying speed of the first conveying belt 13 and the second conveying belt 14 is kept the same.

[0039] Similarly, the third conveying mechanism includes a third housing 31, a fourth housing 32, a third conveying belt 33 and a fourth conveying belt 34. The third housing 31 and the fourth housing 32 are arranged in the first direction. The third conveying belt 33 is installed on the third housing 31, and the fourth conveying belt 34 is installed on the fourth housing 32, so that the third conveying belt 33 and the fourth conveying belt 34 are arranged in the first direction. The conveying speed of the third conveying belt 33 and the fourth conveying belt 34 is the same, and the conveying surface of the third conveying belt 33 and the fourth conveying belt 34 is located in the same plane. One side of the circuit board along the first direction is overlapped on the belt surface of the third conveying belt 33, and the other side of the circuit board along the first direction is overlapped on the belt surface of the fourth conveying belt 34.

[0040] In the embodiment, the driving wheels 35 of the third conveying belt 33 and the driving wheels 35 of the fourth conveying belt 34 are connected as a whole. The motor is connected with one of the driving wheels 35, so that the third conveying belt 33 and the fourth conveying belt 34 can be driven at the same time, and the conveying speed of the third conveying belt 33 and the fourth conveying belt 34 is kept the same.

[0041] As an example, the conveying device further comprises two parallel guide strips 4, each of the two guide strips 4 is arranged on the side of the first conveying mechanism 1 along the first direction and extends above the second conveying surface in the rear direction, the interval between the two guide strips 4 along the first direction is equal to the width of the circuit board, so that when the circuit board passes between the two guide strips 4, the opposite sides of the two guide strips 4 respectively abut against the side walls of the circuit board, and the first direction is perpendicular to the front-rear direction. One of the guide strips 4 is fixed on the first housing 11, and the other guide strip 4 is fixed on the second housing 12. The circuit board passes through the interval between the two guide strips 4, and the position of the circuit board is guided by the two guide strips 4 before entering the second conveying mechanism 2, so that the circuit boards in the same batch are conveyed to the same position on the second conveying mechanism 2, thereby avoiding the deviation of the conveying angle and position of the circuit boards in the same batch, and further avoiding the phenomenon that part of a circuit board is located outside the high-temperature zone due to the deviation.

[0042] In the prior art, manpower is invested between the first conveying mechanism and the second conveying mechanism for transferring the circuit board, and manpower is invested between the second conveying mechanism and the third conveying mechanism for transferring the circuit board, so that the circuit board can be stably conveyed from the first conveying mechanism to the third conveying mechanism. In the embodiment, the circuit board is automatically guided by the guide strips and the guide strips when entering and leaving the second conveying mechanism 2, so that the manpower investment can be reduced.

[0043] As an example, the surface of each of the guide strips 4 close to the other guide strip 4 comprises a first plane 41 and a first inclined plane 42 from front to rear, the rear side of the first plane 41 is connected to the front side of the first inclined plane 42, and the first inclined plane 42 gradually moves away from the other guide strip 4 from front to rear.

[0044] In the embodiment, after the first plane 41 guides the circuit board, the first inclined plane 42 can reduce the friction on the circuit board, thereby avoiding the phenomenon of jamming the circuit board.

[0045] In other embodiments, the surface of each of the guide strips 4 close to the other guide strip 4 is a plane, and the opposite sides of the two guide strips 4 are parallel. That is, the guide strips 4 in the embodiment are long strips, and the guide plates extend in the front-rear direction.

[0046] As an example, the conveying device further comprises two guide strips 5, each of the two guide strips 5 is arranged on the side of the third conveying mechanism 3 along the first direction and extends above the second conveying surface in the front direction, the interval between the opposite sides of the two guide strips 5 gradually decreases from front to rear, and the interval between the opposite sides of the two guide strips 5 is equal to the width of the circuit board.

[0047] In the embodiment, the two guide strips 5 gradually shrink in the direction towards the second conveying mechanism 2, and the two guide strips 5 can gradually guide the circuit board on the second conveying mechanism 2 to the middle part of the two guide strips, so that the circuit boards in the same batch can be stably overlapped on the third conveying mechanism 3.

[0048] As an example, the surface of each guide strip 5 close to the other guide strip 5 comprises a second plane 51 and a second inclined surface 52, the rear side of the second inclined surface 52 is connected with the front side of the second plane 51, and the second inclined surface 52 gradually approaches the other guide strip 5 from front to back.

[0049] In the embodiment, the second inclined surface 52 plays a role of guiding the circuit board to be conveyed from front to back, and the second plane 51 plays a role of maintaining the position of the circuit board until the circuit board is stably conveyed on the third conveying mechanism 3.

[0050] In other embodiments, the surface of each guide strip 5 close to the other guide strip 5 is an inclined surface. The inclined surface is simpler in structure as a guide surface.

[0051] As an example, the length of the guide strip 5 in the front-rear direction is 200-400 mm. In the embodiment, the length of the guide strip 5 in the front-rear direction is 300 mm.

[0052] As an example, the third conveying mechanism 3 is provided with a blocking rod, the blocking rod is located at the tail end of the third conveying mechanism 3, and the blocking rod is located above the third conveying surface, and the blocking rod is used for blocking the backward displacement of the circuit board.

[0053] After the circuit board is reflow soldered, the circuit board is blocked by the blocking rod, so that a plurality of circuit boards are temporarily located on the third conveying mechanism 3 at the same time, and the workers collect and transport all the circuit boards on the third conveying mechanism 3 to the next process.

[0054] The two ends of the blocking rod in the embodiment are connected with the third shell 31 and the fourth shell 32.

[0055] Reference Figure 6 In an embodiment, the utility model also provides a reflow soldering equipment, including casing and above-mentioned conveying device, the inside of casing is provided with a heating circuit, after heating air or nitrogen to enough high temperature, blow to the circuit board that has pasted element, let the solder of element two sides melt and bond with mainboard, the heating circuit that is provided in the casing can form high temperature area, first conveying mechanism 1 sets up at the front of casing, is used for conveying circuit board to second conveying mechanism 2, second conveying mechanism 2 is worn in the casing, high temperature area is located in the middle part of second conveying mechanism 2, is used for conveying circuit board to third conveying mechanism 3, third conveying mechanism 3 sets up at the rear of casing.

[0056] The above-described embodiments are only used to illustrate the technical solutions of the present application, rather than limit them. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacements to some of the technical features. These modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should be included in the protection scope of the present application.

Claims

1. A conveying device, characterized in that, It includes a first conveying mechanism, a second conveying mechanism, and a third conveying mechanism arranged sequentially in the front-to-back direction; the middle part of the second conveying mechanism is located in the high-temperature zone of the reflow soldering equipment; The first conveying mechanism has a first conveying surface for carrying the circuit board, the second conveying mechanism has a second conveying surface for carrying the circuit board, and the third conveying mechanism has a third conveying surface for carrying the circuit board. The first conveying surface, the second conveying surface, and the third conveying surface are flush. The second conveying mechanism is a mesh chain conveyor, and the conveying surface of the mesh chain conveyor constitutes the second conveying surface.

2. The conveying device according to claim 1, characterized in that, It also includes two parallel guide bars along a first direction, the two guide bars being disposed on opposite sides of the first conveying mechanism, and both guide bars extending rearward to above the second conveying surface; Along the first direction, the interval between the two guide bars is equal to the width of the circuit board, so that when the circuit board passes between the two guide bars, the opposing sides of the two guide bars abut against the opposite sidewalls of the circuit board; wherein, the first direction is perpendicular to the front-back direction.

3. The conveying device according to claim 2, characterized in that, The surface of each guide bar adjacent to the other guide bar is flat, and the surfaces of the two guide bars on opposite sides are parallel.

4. The conveying device according to claim 2, characterized in that, Each of the guide bars has a surface near the other guide bar that includes a first plane and a first inclined surface from front to back, the rear side of the first plane is in contact with the front side of the first inclined surface, and the first inclined surface gradually moves away from the other guide bar from front to back.

5. The conveying device according to claim 1, characterized in that, It also includes two guide bars. Along the first direction, the two guide bars are disposed on opposite sides of the third conveying mechanism. Both guide bars extend forward to above the second conveying surface. The distance between the opposing sides of the two guide bars gradually decreases from front to back. The minimum distance between the opposing sides of the two guide bars is equal to the width of the circuit board.

6. The conveying device according to claim 5, characterized in that, The surface of each guide bar adjacent to the other guide bar is a slope.

7. The conveying device according to claim 5, characterized in that, Each guide bar has a surface near the other guide bar including a second plane and a second slope, the rear side of the second slope is in contact with the front side of the second plane, and the second slope gradually approaches the other guide bar from front to back.

8. The conveying device according to claim 5, characterized in that, The length of the guide bar in the front-to-back direction is 200-400mm.

9. The conveying device according to any one of claims 1-8, characterized in that, The third conveying mechanism is provided with a blocking rod, which is located at the tail end of the third conveying mechanism and above the third conveying surface. The blocking rod is used to prevent the circuit board from moving backward.

10. A reflow soldering apparatus, characterized in that, The device includes a housing and a conveying device as described in any one of claims 1-9, wherein the housing has a high-temperature zone, the first conveying mechanism is disposed at the front of the housing, the second conveying mechanism passes through the housing, and the third conveying mechanism is disposed at the rear of the housing; The first conveying mechanism is used to convey the circuit board to the second conveying mechanism; The second conveying mechanism is used to convey the circuit board to the third conveying mechanism; The third conveying mechanism is used to receive the circuit board from the second conveying mechanism.

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