Tin dipping and tin spraying two-in-one equipment

Abstract

The utility model discloses tin dipping and tin spraying two-in-one equipment, and belongs to the technical field of electronic equipment. The equipment comprises a tin dipping module, a tin spraying module and a carrying table module, the tin dipping module and the tin spraying module are fixed to the upper portion of the carrying table module, the tin dipping module comprises a swing arm, a rotary disc and a tin dipping needle, the tin dipping needle is fixed to one end of the swing arm, and the swing arm rotates to move the tin dipping needle to the position above the rotary disc to dip tin paste; the tin spraying module comprises a piezoelectric valve, a solder paste storage part, a runner assembly and a nozzle, and the piezoelectric valve is used for controlling solder paste in the solder paste storage part to pass through the runner assembly and be sprayed out of the nozzle. According to the utility model, tin dipping and tin spraying are matched, a tube shell product with a high enclosure frame and an ultra-near-wall distance bonding pad can be processed, the variety of products suitable for the equipment is expanded, and the equipment has a good application prospect.

Description

Technical Field

[0001] This utility model belongs to the field of electronic equipment technology, and in particular relates to a two-in-one device for tin dipping and tin spraying. Background Technology

[0002] The pursuit of thinness and miniaturization in modern electronic devices has driven the development of electronic components and circuits towards high-density, multi-functional integration. This trend has led to more complex packaging structures, especially the emergence of deep-cavity or narrow-cavity structures to accommodate miniaturized, high-power components such as RF modules and MEMS sensors. These structures pose challenges to traditional soldering processes.

[0003] Traditional printing processes (such as screen printing of solder paste) are often difficult to implement in deep cavity or high-frame structures due to space constraints. The squeegee used in screen printing struggles to reach the bottom of the deep cavity, resulting in uneven solder paste distribution or ineffective pad coverage. Meanwhile, while piezoelectric valve jetting technology offers high precision, its application in deep cavity products is hampered by limitations in nozzle size and jetting distance, as well as the influence of jetting angle and solder paste rheological properties, making it difficult to achieve uniform and stable solder paste deposition. Specific problems are as follows:

[0004] (1) The enclosure of the tube product has a certain height and the distance between the enclosure and the pad is small. The existing process cannot perform tin spraying when the enclosure height is high and the distance between the enclosure and the pad is small, which limits the miniaturization of the package.

[0005] (2) Although the existing spraying process can spray tin at a certain height, it is limited by the length of the nozzle extension, the height of the nozzle to the substrate, the diameter of the spray point, the accuracy, and the consistency. It cannot spray tin at a position that is high above the pad and close to the frame, which greatly restricts the design of the pad.

[0006] While the tin-dipping process is less limited by depth and the distance between the solder pad and the wall, its production efficiency is lower than that of piezoelectric valve spraying technology. Therefore, both tin-dipping and spraying equipment have certain limitations when used alone.

[0007] In actual production, solder paste is often applied to the pads inside the deep cavity using both dipping and spraying methods. Currently, there is no combined dipping and spraying equipment that can perform both processes, which limits its applicability to deep cavity products and imposes significant limitations on product design. Utility Model Content

[0008] The main purpose of this invention is to provide a two-in-one device for tin dipping and tin spraying, so as to solve the problem that existing devices can only meet the single needs of tin dipping or tin spraying.

[0009] In a first aspect, this utility model provides a combined tin-dipping and tin-spraying device, the device comprising a tin-dipping module, a tin-spraying module, and a platform module, wherein the tin-dipping module and the tin-spraying module are fixed above the platform module.

[0010] The solder dipping module includes a swing arm, a turntable, and a solder dipping needle. The solder dipping needle is fixed to one end of the swing arm. The swing arm rotates to move the solder dipping needle above the turntable to dip in solder paste.

[0011] The solder spraying module includes a piezoelectric valve, a solder paste storage component, a flow channel assembly, and a nozzle. The piezoelectric valve is used to control the solder paste in the solder paste storage component to pass through the flow channel assembly and be sprayed out from the nozzle.

[0012] Furthermore, a scraper is provided above the turntable of the soldering module to smooth the surface of the solder paste after it has been applied.

[0013] Furthermore, a sleeve is fixed to one end of the swing arm, and a soldering needle and a spring are installed inside the sleeve, so that the soldering needle can move up and down inside the sleeve.

[0014] Furthermore, the tin-dip module also includes a ZZ-axis assembly for controlling the up-and-down movement of the swing arm and a ZR-axis assembly for controlling the rotational movement of the swing arm, and the tin-spraying module also includes a ZA-axis assembly for controlling the up-and-down movement of the piezoelectric valve.

[0015] Furthermore, the device also includes a vision positioning and height measurement module fixed on the ZA axis assembly, used to locate the height position of the nozzle of the solder spraying module.

[0016] Furthermore, the stage module includes a cleaning mechanism, a pressure sensor, a pre-printing area, and a weighing module. The cleaning mechanism is used to clean the nozzles of the solder spraying module and the solder dipping needles of the solder dipping module. The pressure sensor is used to calibrate the height position of the piezoelectric valve and the nozzle. The weighing module is used to weigh the amount of solder sprayed by the piezoelectric valve. The pre-printing area can be used for XY position calibration of solder spraying and solder dipping, and can also realize the observation of the morphology and calculation of the dot diameter by the camera after array solder spraying.

[0017] Furthermore, the platform module is also equipped with guide rails for fixing and moving the product under test.

[0018] Furthermore, the tin-dipping module and the tin-spraying module are fixed above the platform module by a gantry. The gantry is a movable design and is driven by a linear motor to move in the XY axis direction.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] The tin-dipping and tin-spraying combined equipment includes both tin-dipping and tin-spraying modules, which can be used to process tube shell products with high frame and ultra-close wall distance pads. This expands the types of products that the equipment is applicable to, reduces product design limitations, and increases product integration and miniaturization, thus showing good application prospects. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of the device described in this utility model;

[0022] Figure 2 This is a schematic diagram of the assembly structure of the tin-dipping module and the tin-spraying module described in this utility model;

[0023] Figure 3 This is a schematic diagram of the tin-spraying module of this utility model;

[0024] Figure 4 This is a schematic diagram of the tin-dipping module described in this utility model;

[0025] Figure 5 This is a schematic diagram of the deep cavity structure of the tube shell product.

[0026] The attached diagram is labeled as follows: 1-Soldering module, 2-Soldering dip module, 3-Vision positioning and height measurement module, 4-Gantry, 5-Guide rail, 6-Platform module, 7-Swing arm, 8-Soldering needle, 9-Scraper, 10-Drive motor, 11-Turntable, 12-ZR axis assembly, 13-ZZ axis assembly, 14-Piezoelectric valve, 15-Nozzle, 16-Solder paste storage component, 17-Flow channel assembly, 18-ZA axis assembly, 19-Frame, 20-Pad. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below in conjunction with the embodiments of this utility model. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0028] Existing tin-dipping equipment can operate in various deep cavity structures, but its efficiency is relatively low. Tin-spraying equipment, on the other hand, is limited by the nozzle's extension length and the diameter of the extension section, making it unable to meet the production requirements of some products. For example... Figure 5 As shown, the existing casing product has a certain height in the frame 19, and there is a situation where the distance between the frame 19 and the pad 20 is small.

[0029] This utility model provides a combined tin dipping and tin spraying device (structure as follows) Figure 1 As shown, it integrates a piezoelectric valve solder spraying module and a solder dipping module. When the solder pad depth is large or the distance between the solder pad and the wall is small, solder paste can be transferred to the solder pad using the solder dipping module. When the solder pad depth does not exceed the working range of the solder spraying module and the diameter of the solder spraying nozzle is smaller than the distance between the solder pad and the wall, solder paste can be sprayed onto the solder pad using the solder spraying module. This greatly expands the types of products that the equipment can produce, further reduces the requirements for product design, and improves the integration and miniaturization of products.

[0030] The combined tin dipping and tin spraying equipment includes: a tin spraying module 1, a tin dipping module 2, and a platform module 6, wherein the tin dipping module 2 and the tin spraying module 1 are fixed above the platform module 6. Figure 4 As shown, the soldering module 2 includes a swing arm 7, a turntable 11, and a soldering needle 8. The soldering needle 8 is fixed to one end of the swing arm 7, and the rotation of the swing arm 7 moves the soldering needle 8 above the turntable 11 to pick up solder paste; Figure 3 As shown, the solder spraying module 1 includes a piezoelectric valve 14, a solder paste storage component 16, a flow channel assembly 17, and a nozzle 15. The piezoelectric valve 14 is used to control the solder paste in the solder paste storage component 16 to be sprayed out through the flow channel assembly 17 and from the nozzle 15.

[0031] In some specific embodiments, a scraper 9 is provided above the turntable 11 of the soldering module 2 to smooth the surface of the solder paste after it has been applied. The turntable 11 contains solder paste, and the scraper 9 also stores solder paste to maintain a smooth surface of the solder paste after it has been applied.

[0032] In some specific embodiments, a sleeve is fixed to one end of the swing arm 7, and a soldering needle 8 and a spring are installed inside the sleeve, allowing the soldering needle 8 to move up and down within the sleeve. During the downward movement of the soldering needle 8, the needle tip contacts the surface of the solder pad 20 and continues to descend a short distance. This process utilizes the elasticity of the spring and the inertia of the soldering needle 8 tip to evenly and accurately transfer solder paste to the surface of the solder pad 20.

[0033] In some specific embodiments, the soldering module 2 further includes a ZZ axis assembly 13 and a ZR axis assembly 12, and the solder spraying module 1 further includes a ZA axis assembly 18. The ZZ axis assembly 13 controls the up-and-down movement of the swing arm 7, the ZR axis assembly 12 controls the rotational movement of the swing arm 7, and the ZA axis assembly 18 controls the up-and-down movement of the piezoelectric valve 14.

[0034] In some specific embodiments, the tin-dip and tin-spraying combined device also includes a visual positioning and height measurement module 3 fixed on the ZA axis assembly 18, used to locate the height position of each component and obtain height information.

[0035] In some specific embodiments, the stage module 6 includes a cleaning mechanism, a pressure sensor, a pre-printing area, and a weighing module. The cleaning mechanism is used to clean the nozzles 15 of the solder spraying module 1 and the solder dipping needles 8 of the solder dipping module 2. The pressure sensor is used to calibrate the height position of the piezoelectric valve 14 and the nozzles 15. The weighing module is used to weigh the amount of solder sprayed by the piezoelectric valve 14. The pre-printing area can be used for XY position calibration of solder spraying and solder dipping, and can also realize the observation of the morphology and calculation of the dot diameter by the camera after array solder spraying.

[0036] In some specific embodiments, the platform module 6 is also provided with guide rails 5 for fixing and moving the product to be tested. The guide rails 5 are used for loading and unloading, and are provided with loading position, processing position, and unloading position. The product is fixed at the processing position and processed by a movable XY axis working head.

[0037] In some specific embodiments, the tin-dipping module 2 and the tin-spraying module 1 are fixed above the stage module 6 by a gantry 4 (e.g., Figure 2 As shown in the figure, the gantry 4 is a movable design and is driven by a linear motor to move in the XY axis direction.

[0038] In some specific embodiments, the solder spraying module 1 can select nozzles 15 with different extension lengths (0-6mm) according to the depth of the product, and there is a certain distance (0.2-1mm) between the nozzles 15 and the product to be tested, thereby enabling solder paste spraying of deep cavity products.

[0039] Workflow: The soldering module 2 controls the swing arm 7 to reciprocate along an arc path via the ZZ axis assembly 13 and the ZR axis assembly 12. A sleeve is fixed to the farthest end of the swing arm 7 with screws. Inside the sleeve, a soldering needle, a spring, and a fixing screw are sequentially installed, allowing the needle to move up and down within the sleeve. The ZR axis assembly 12 moves the soldering needle 8 above the turntable 11 containing solder paste. The turntable 11 rotates under the drive motor 10. A fixed scraper 9 smooths the solder paste surface. The ZZ axis assembly 13 descends, at which point the turntable 11 stops rotating, and the soldering needle 8 penetrates deep into the solder paste surface. When 13 is lifted, some solder paste sticks to the surface of the needle. The turntable 11 resumes rotation to smooth the surface of the solder paste. The amount of solder paste taken away by the soldering needle 8 can be adjusted by controlling the descent height of the ZZ axis assembly 13. The ZR axis assembly 12 moves to drive the swing arm 7 to the other end of the arc path. The ZZ axis assembly 13 descends, and the soldering needle 8 descends to the surface of the product to be tested and compresses the spring. At this time, due to inertia, the solder paste will be transferred to the surface of the product to be tested. Since the spring stroke is long, the soldering needle 8 can work on the surface at different heights. The ZZ axis assembly 13 rises to the original position to start the next cycle. At the same time, the worktable moves to the next position and repeats the soldering action.

[0040] The visual positioning and height measurement module 3 is bound to the solder spraying module 1 on an axis (ZA axis) to measure the height of the pressure sensor surface. When the measured height value is 0, the visual focus is on the height measurement plane, and then the nozzle 15 below the piezoelectric valve 14 descends to the pressure sensor surface, thereby triggering the pressure sensor. The height information of the ZA axis assembly 18 at this time is recorded, thus determining the height of the nozzle 15 below the piezoelectric valve 14. The weighing module is used to estimate the amount of solder sprayed onto the piezoelectric valve 14. The weighing module is set to zero, and a fixed amount of solder paste is continuously sprayed into the weighing cup to calculate the weight of the solder paste at a single point on the piezoelectric valve 14. The guide rail 5 has a belt, and the other side of the guide rail can move to adjust the guide rail spacing, accommodating products of different widths. After the product is loaded, it is clamped in position to prevent equipment vibration from causing displacement.

[0041] Example 1

[0042] Tube shell products with ultra-high frame (frame height ≥ 8mm) and ultra-close-to-wall distance (≤ 0.3mm) solder pads processed by tin dipping.

[0043] When dealing with pads that have extremely high enclosures (deep cavities) and are close to the walls, a separate soldering module is selected for operation due to the limitations of the nozzle length and diameter of the solder spraying. Taking a precision medical electronic tube shell as an example, its internal pad depth reaches 10mm, and the edge of the pad is only 0.1mm away from the enclosure wall.

[0044] First, a needle of sufficient length, with a maximum radius of less than 0.1mm, and a suitable tip size, is customized based on the pad depth and size to ensure reliable contact with the bottom of the pad. Simultaneously, the spring's elasticity allows the needle to adapt to minor unevenness on the pad surface. The swing arm mechanism is adjusted to ensure its ZZ axis assembly descent height covers at least 10mm to accommodate the depth of deep cavity pads.

[0045] The equipment is started, the machining drawings are imported, and after material loading, the vision system identifies the mark. The swing arm drives the single needle to rotate above the turntable of the solder paste supply system. According to the preset dipping depth, the needle precisely controls the position where it penetrates into the solder paste, picking up an appropriate amount of solder paste. After picking up the solder paste, the swing arm moves above the target pad, and precise positioning is achieved through the high-precision ZR axis assembly and ZZ axis assembly control system. When the needle is accurately aligned above the pad, the descent program is initiated, causing the needle to contact the pad surface and continue to descend a short distance (usually tens to hundreds of micrometers). Utilizing the elasticity of the spring and the inertia of the needle, the solder paste is evenly and accurately transferred to the pad surface. After the solder paste transfer is completed, the needle is controlled to rise back to the initial position, and the equipment moves to the next pad to be soldered. The needle repeats the soldering operation until all pads in the drawing have been processed.

[0046] Example 2

[0047] The tube shell products with a frame (<8mm) and ultra-close wall distance (≤0.3mm) pads are processed using a combination of tin dipping and tin spraying.

[0048] When processing pads with a frame (deep cavity) and adjacent walls, pads adjacent to the wall can only be processed individually using a dip-soldering method due to the limited diameter of the solder spray nozzle. For pads far from the wall, solder spraying can be used to improve production efficiency. Taking a precision medical electronic tube shell as an example, its internal pad depth reaches 5mm, and the edge of the pad is only 0.1mm away from the frame wall.

[0049] First, a needle of sufficient length, with a maximum radius of less than 0.1mm and a suitable tip size, is customized based on the pad depth and size to ensure reliable contact with the bottom of the pad. Simultaneously, the spring's elasticity allows the needle to adapt to minor unevenness on the pad surface. The swing arm mechanism is adjusted to ensure its ZZ axis assembly descends at least 5mm to accommodate the depth of deep-cavity pads. Based on the pad depth, an extension nozzle with a minimum extension diameter and a length of at least 4mm is selected to ensure spray accuracy and effectiveness at a distance of 1mm from the pad.

[0050] After starting the equipment and importing the processing drawings, the vision system identifies the MARK and, based on the preset coordinates of the pads for the dipping operation in the drawings, uses the dipping module to transfer solder paste to these pads. Then, based on the preset coordinates of the pads for the spraying operation in the drawings, the piezoelectric valve is used to spray solder paste onto these pads. This embodiment significantly improves production efficiency while ensuring high-quality spraying.

[0051] Example 3

[0052] Tin spraying is used for tube-shell products with a frame (<8mm) and a wall distance from the pad (>0.3mm).

[0053] When processing pads with a frame (deep cavity) and far from the wall, the solder spray nozzle can extend into the frame, and the nozzle diameter is smaller than the distance from the pad to the wall, allowing for production using solder spray alone.

[0054] Select the appropriate nozzle based on the height of the product frame and the distance from the solder pad to the wall to prevent collision with the frame during operation.

[0055] After starting the equipment and importing the processing drawings, the vision system identifies the mark after loading the materials. The nozzle moves above the pads where solder paste needs to be sprayed, evenly and precisely spraying the solder paste onto the pad surface. This embodiment significantly improves production efficiency while ensuring high-quality solder spraying.

[0056] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0057] Although embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations all fall within the scope defined by the present invention.

Claims

1. A dip and spray tinning two-in-one apparatus, characterized by, The device comprises a dipping tin module, a spraying tin module and a platform module, the dipping tin module and the spraying tin module are fixed above the platform module, The dipping tin module comprises a swing arm, a rotating disc and a dipping tin needle, the dipping tin needle is fixed at one end of the swing arm, the dipping tin needle is moved above the rotating disc by rotating the swing arm to dip tin paste; The spraying tin module comprises a piezoelectric valve, a tin paste storage component, a flow channel assembly and a nozzle, the piezoelectric valve is used to control the tin paste in the tin paste storage component to pass through the flow channel assembly and be sprayed from the nozzle.

2. The dip and jet tine dual-purpose apparatus according to claim 1, wherein A scraper is arranged above the rotating disc of the dipping tin module to flatten the surface of the dipped tin paste.

3. The dip and jet tine dual-purpose apparatus according to claim 1, wherein A sleeve is fixed at one end of the swing arm, the dipping tin needle and a spring are installed in the sleeve, so that the dipping tin needle can move up and down in the sleeve.

4. The dip and jet tine dual-purpose apparatus according to claim 1, wherein The dipping tin module further comprises a ZZ shaft assembly for controlling the up-and-down movement of the swing arm and a ZR shaft assembly for controlling the rotary movement of the swing arm, the spraying tin module further comprises a ZA shaft assembly for controlling the up-and-down movement of the piezoelectric valve.

5. The dip and jet tine dual-purpose apparatus according to claim 4, wherein The device further comprises a visual positioning and height measuring module fixed on the ZA shaft assembly, which is used to position the height of each component and obtain height information.

6. The dip and jet tine dual-purpose apparatus according to claim 1, wherein The platform module comprises a cleaning mechanism for cleaning the nozzle of the spraying tin module and the dipping tin needle of the dipping tin module.

7. The dip and jet combined apparatus according to claim 6, wherein The platform module further comprises a pressure sensor, a pre-printing area and a weighing module.

8. The dip and jet in one apparatus of claim 6, wherein, The platform module further comprises a guide rail for fixing and moving the product to be tested.

9. The dip and jet tine dual-purpose apparatus according to claim 1, wherein The dipping tin module and the spraying tin module are fixed above the platform module by a gantry.

10. The dip and jet tine dual-purpose apparatus according to claim 9, wherein The gantry is designed to be movable and is driven by a linear motor to move in the XY axis direction.

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