Thickness detection device in preparation process of PZT piezoelectric film wafer

Abstract

The utility model discloses a thickness detection device in a PZT piezoelectric film wafer preparation process, comprising a detection bench, the upper surface of the detection bench is fixedly connected with a support cylinder, the upper end of the support cylinder is rotatably connected with a rotating disc, the side surface of the rotating disc is fixedly connected with a plurality of groups of transverse plates II, one end of each transverse plate II is fixedly connected with a bottom plate, and the other end of each transverse plate II is fixedly connected with a base plate. A supporting rod is slidably connected into the bottom plate, a suction cup is fixedly connected to the upper end of the supporting rod, an air pipe is fixedly connected to the side surface of the suction cup, a control mechanism is arranged at one end of the air pipe, a roller is fixedly connected to the lower end of the supporting rod, an expansion spring is fixedly connected to the upper surface of the roller, and the upper end of the expansion spring is located on the lower surface of the bottom plate. A pushing and lifting table is arranged on one side of the supporting cylinder and fixedly connected with the upper surface of the detection table. Compared with the prior art, the wafer thickness detection device has the advantages that the trouble of wafer detection by workers is reduced, the workload of the workers is reduced, the interval time in the wafer detection process is shortened, and the smoothness of the wafer thickness detection device and the wafer thickness detection efficiency are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer detection technical field, concretely is thickness detection device in PZT piezoelectric film wafer preparation process. BACKGROUND

[0002] Wafer refers to the silicon wafer used for making silicon semiconductor circuit, and its raw material is silicon, high-purity polycrystalline silicon is dissolved and then doped into silicon crystal seeds, then slowly pulled out to form cylindrical monocrystalline silicon, after grinding, polishing and slicing, silicon crystal rod forms silicon wafer, that is wafer, PZT piezoelectric film wafer is covered with a layer of lead zirconate titanate film on the wafer surface, and the wafer surface must have extremely high flatness, smoothness and cleanliness, so the thickness detection equipment is particularly important.

[0003] According to patent application number 202323586709.8, a wafer thickness detection device is disclosed, which comprises a support frame, a support seat is fixed on the top outer wall of the support frame, a sleeve ring is rotatably connected to the outer wall of the support seat, a placing plate is fixed on the outer wall of the sleeve ring on both sides, a suction cup is fixed on the top outer wall of the placing plate, a limiting mechanism is arranged on the top outer wall of the support frame, a connecting frame is fixed on the top outer wall of the support seat, and a thickness detection mechanism is fixed on the outer wall of one side of the connecting frame.

[0004] However, during the wafer detection process, the staff needs to manually load and unload, which is troublesome and increases the work burden of the staff, and the interval time during the wafer detection process is relatively long, which reduces the detection efficiency of the wafer. Utility model content

[0005] In view of the deficiencies of the prior art, the utility model provides a thickness detection device in PZT piezoelectric film wafer preparation process, which solves the problem that the existing wafer thickness detection device needs manual operation of loading and unloading during wafer detection, reduces the trouble of staff detection of wafer, reduces the work burden of staff, shortens the interval time during wafer detection process, improves the smoothness of wafer thickness detection device and the efficiency of wafer thickness detection.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a thickness detection device for PZT piezoelectric thin film wafer fabrication process, comprising a detection stage, a support cylinder fixedly connected to the upper surface of the detection stage, a turntable rotatably connected to the upper end of the support cylinder, multiple sets of horizontal plates II fixedly connected to the side surface of the turntable, a base plate fixedly connected to one end of the horizontal plates II, a support rod slidably connected inside the base plate, a suction cup fixedly connected to the upper end of the support rod, an air pipe fixedly connected to the side surface of the suction cup, a control mechanism provided at one end of the air pipe, a roller fixedly connected to the lower end of the support rod, an expansion spring fixedly connected to the upper surface of the roller, the upper end of the expansion spring located on the lower surface of the base plate, a lifting platform provided on one side of the support cylinder, the lifting platform being fixedly connected to the upper surface of the detection stage, a feeding mechanism provided above the lifting platform, the horizontal plates II located between the feeding mechanism and the lifting platform, a detection component provided on the other side of the support cylinder, and a driving mechanism provided inside the support cylinder.

[0007] Preferably, the feeding mechanism includes a support base, and the lower end of the support base is fixedly connected to the upper surface of the testing table. The upper end of the support base is fixedly connected to a feeding box, and the inside of the feeding box contains wafers. Both sides of the lower end of the feeding box have discharge ports, and one side of the feeding box has a limiting mechanism.

[0008] Preferably, the limiting mechanism includes a horizontal plate I, and a rotating plate is rotatably connected to the upper surface of the horizontal plate I. A pressing rod is slidably connected to one end of the rotating plate, and a spring is fixedly connected to the upper end of the pressing rod. One end of the spring is fixedly connected to the upper surface of the rotating plate, and a pressure block is fixedly connected to the lower end of the pressing rod.

[0009] Preferably, the testing mechanism includes a support frame, and the lower end of the support frame is fixedly connected to the upper surface of the testing station. A wafer thickness detector is fixedly connected to the lower surface of the support frame, and the wafer thickness detector is wirelessly connected to a display. The display is fixedly installed at one end of the testing station.

[0010] Preferably, the control mechanism includes an air cylinder and a compression block, and the upper surface of the air cylinder is fixedly connected to the lower surface of the horizontal plate II through a mounting block. One end of the air cylinder is fixedly connected to one end of the air pipe, and a push rod is slidably connected inside one end of the air cylinder. A piston plate is fixedly connected to one end of the push rod, and the piston plate is slidably connected to the inner wall of the air cylinder. The compression block is fixedly connected to the outer surface of the support cylinder, and the compression block is aligned with the other end of the push rod.

[0011] Preferably, the driving mechanism includes a gear, the upper surface of which is fixedly connected to the lower surface of the turntable, a half-foot wheel meshing with the side surface of the gear, and a motor fixedly connected to the lower surface of the half-foot wheel. The side surface of the motor is fixedly connected to the inner wall of the support cylinder.

[0012] This invention provides a thickness detection device during the fabrication of PZT piezoelectric thin film wafers. Compared with existing technologies, it has the following advantages:

[0013] 1. The combination of a base plate connected to the turntable side surface via a horizontal plate II, a support rod slidably connected inside the base plate, a suction cup fixedly connected to the upper end of the support rod, a control mechanism connected to the suction cup side surface via an air pipe, a push platform set on one side of the support cylinder, and an extrusion block on the side surface of the support cylinder, solves the problem of manual operation for loading and unloading wafers in existing wafer thickness inspection devices. This reduces the hassle for workers during wafer inspection, lowers their workload, shortens the interval time during wafer inspection, and improves the smoothness and efficiency of the wafer thickness inspection device.

[0014] 2. The wafers inside the feeding box are limited by the cooperation of a horizontal plate I fixedly connected to the side surface of the feeding box, a rotating plate rotatably connected to the upper surface of the horizontal plate I, an extrusion rod slidably connected to one end of the rotating plate, a spring fixedly connected to the upper side surface of the extrusion rod, and a pressure block. This prevents the wafers from moving upwards as the number of wafers decreases and the support rod is pushed upwards by the rollers, thus preventing the suction cup from being able to adhere to the lower surface of the wafers. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model;

[0016] Figure 2 This is a side view of the structure of this utility model;

[0017] Figure 3 This is a schematic diagram of the connection structure between the horizontal plate and the support rod in this utility model;

[0018] Figure 4 This is a schematic diagram of the internal structure of the support cylinder in this utility model;

[0019] Figure 5 This is a schematic diagram of the internal structure of the air cylinder in this utility model;

[0020] Figure 6 This is a bottom view of the material feeding box in this utility model.

[0021] In the diagram: 1. Inspection table; 103. Lifting platform; 2. Support cylinder; 201. Turntable; 202. Extrusion block; 203. Gear; 204. Motor; 205. Half-foot wheel; 3. Support frame; 301. Wafer thickness detector; 4. Display; 5. Feed box; 501. Extrusion rod; 502. Spring; 503. Rotating plate; 504. Horizontal plate I; 505. Pressing block; 506. Support base; 7. Horizontal plate II; 701. Suction cup; 702. Base plate; 703. Expansion spring; 704. Roller; 705. Support rod; 8. Air cylinder; 801. Mounting block; 802. Piston plate; 803. Push rod; 804. Air pipe. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figures 1-6 This utility model provides a technical solution: a thickness detection device in the PZT piezoelectric thin film wafer fabrication process, including a detection stage 1, a support cylinder 2 fixedly connected to the upper surface of the detection stage 1, a turntable 201 rotatably connected to the upper end of the support cylinder 2, multiple sets of horizontal plates II 7 fixedly connected to the side surface of the turntable 201, a base plate 702 fixedly connected to one end of the horizontal plate II 7, a support rod 705 slidably connected inside the base plate 702, a suction cup 701 fixedly connected to the upper end of the support rod 705, and an air tube 804 fixedly connected to the side surface of the suction cup 701. One end of the air pipe 804 is equipped with a control mechanism. The lower end of the support rod 705 is fixedly connected to a roller 704. The upper surface of the roller 704 is fixedly connected to an expansion spring 703. The upper end of the expansion spring 703 is located on the lower surface of the base plate 702. One side of the support cylinder 2 is equipped with a lifting platform 103. The lifting platform 103 is fixedly connected to the upper surface of the detection platform 1. A feeding mechanism is provided above the lifting platform 103. The horizontal plate II 7 is located between the feeding mechanism and the lifting platform 103. The other side of the support cylinder 2 is equipped with a detection component. The inside of the support cylinder 2 is equipped with a drive mechanism.

[0024] As a technical optimization of this utility model, the feeding mechanism includes a support base 506. The lower end of the support base 506 is fixedly connected to the upper surface of the detection table 1. The upper end of the support base 506 is fixedly connected to a feeding box 5. The inside of the feeding box 5 contains wafers. Both sides of the lower end of the feeding box 5 are provided with discharge ports. One side of the feeding box 5 is provided with a limiting mechanism.

[0025] As a technical optimization of this utility model, the limiting mechanism includes a horizontal plate I 504, a rotating plate 503 rotatably connected to the upper surface of the horizontal plate I 504, a pressing rod 501 slidably connected to one end of the rotating plate 503, a spring 502 fixedly connected to the upper end of the pressing rod 501, one end of the spring 502 fixedly connected to the upper surface of the rotating plate 503, and a pressure block 505 fixedly connected to the lower end of the pressing rod 501. The pressing rod 501, spring 502 and pressure block 505 in the limiting mechanism can limit the wafer and prevent the wafer from moving upward when the support rod 705 pushes the suction cup 701 upward to pick up the wafer.

[0026] As a technical optimization of this utility model, the testing mechanism includes a support frame 3, the lower end of the support frame 3 is fixedly connected to the upper surface of the testing platform 1, a wafer thickness detector 301 is fixedly connected to the lower surface of the support frame 3, the wafer thickness detector 301 is wirelessly connected to a display 4, and the display 4 is fixedly installed at one end of the testing platform 1.

[0027] As a technical optimization of this utility model, the control mechanism includes an air cylinder 8 and a pressing block 202. The upper surface of the air cylinder 8 is fixedly connected to the lower surface of the horizontal plate II 7 through a mounting block 801. One end of the air cylinder 8 is fixedly connected to one end of the air pipe 804. A push rod 803 is slidably connected inside one end of the air cylinder 8. A piston plate 802 is fixedly connected to one end of the push rod 803. The piston plate 802 is slidably connected to the inner wall of the air cylinder 8. The pressing block 202 is fixedly connected to the outer surface of the support cylinder 2. The pressing block 202 is aligned with the other end of the push rod 803. The push rod 803 slidably connected to the other end of the air cylinder 8 and the piston plate 802 inside the air cylinder 8 cooperate with the pressing block 202 to separate the suction cup 701 from the lower surface of the wafer, making it convenient for subsequent staff to remove the wafer after testing.

[0028] As a technical optimization of this utility model, the driving mechanism includes a gear 203. The upper surface of the gear 203 is fixedly connected to the lower surface of the turntable 201. A half-foot wheel 205 is meshed with the side surface of the gear 203. A motor 204 is fixedly connected to the lower surface of the half-foot wheel 205. The side surface of the motor 204 is fixedly connected to the inner wall of the support cylinder 2. The motor 204 and the half-foot wheel 205 can drive the turntable 201 to rotate intermittently, which facilitates the wafer thickness detector 301 to detect the wafer.

[0029] In use, the operator first pulls the extrusion rod 501 upwards, causing the pressure block 505 at the lower end of the extrusion rod 501 to leave the upper end of the feeding box 5. Then, the rotating plate 503 is rotated to move the pressure block 505 out of the feeding box 5. After that, the wafer is placed into the feeding box 5, and the pressure block 505 is returned to its original position, pressing on the upper surface of the wafer. Then, the motor 204 inside the support cylinder 2 is started. At this time, the motor 204 drives the turntable 201 and the horizontal plate II 7 to rotate through the half-foot wheel 205 and the gear 203. When the support rod 705 inside the base plate 702 moves past the lifting platform 103, the base plate 702 will be passively raised, and the suction cup 701 at the upper end of the base plate 702 will be pressed against the lower end. The lower surface of the wafer inside the feed box 5 is then rotated to carry the wafer out of the feed box 5. When it passes under the wafer thickness detector 301, the wafer thickness detector 301 will detect the wafer on the upper surface of the suction cup 701. After detection, the turntable 201 continues to rotate. When the horizontal plate II 7 on the side surface of the turntable 201 passes the extrusion block 202, the extrusion block 202 will extrude the push rod 803 inside the other end of the air cylinder 8. The push rod 803 will push the piston plate 802 inside the air cylinder 8. Therefore, the piston plate 802 pushes the gas through the mounting block 801 into the inside of the suction cup 701. At this time, the suction cup 701 will separate from the wafer. After that, the operator will remove the wafer after the test is completed.

[0030] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0031] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, the phrase "comprising an element defined as..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0032] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A thickness detection device in the preparation process of a PZT piezoelectric thin film wafer, comprising a detection table (1), characterized in that: The upper surface of the detection table (1) is fixedly connected with a supporting cylinder (2), and the upper end of the supporting cylinder (2) is rotatably connected with a rotating disc (201), the side surface of the rotating disc (201) is fixedly connected with a plurality of groups of transverse plates II (7), and one end of the transverse plate II (7) is fixedly connected with a bottom plate (702), the inside of the bottom plate (702) is slidably connected with a supporting rod (705), and the upper end of the supporting rod (705) is fixedly connected with a suction disc (701), the side surface of the suction disc (701) is fixedly connected with an air pipe (804), and one end of the air pipe (804) is provided with a control mechanism, the lower end of the supporting rod (705) is fixedly connected with a roller (704), and the upper surface of the roller (704) is fixedly connected with an expansion spring (703), the upper end of the expansion spring (703) is located on the lower surface of the bottom plate (702), one side of the supporting cylinder (2) is provided with a push-up table (103), and the upper surface of the push-up table (103) is fixedly connected with the detection table (1), the upper side of the push-up table (103) is provided with a blanking mechanism, the transverse plate II (7) is located between the blanking mechanism and the push-up table (103), the other side of the supporting cylinder (2) is provided with a detection assembly, and the inside of the supporting cylinder (2) is provided with a driving mechanism.

2. The thickness detection device for PZT piezoelectric thin film wafer preparation process according to claim 1, characterized in that: The blanking mechanism comprises a supporting seat (506), and the lower end of the supporting seat (506) is fixedly connected with the upper surface of the detection table (1), the upper end of the supporting seat (506) is fixedly connected with a blanking box (5), and the inside of the blanking box (5) is placed with a wafer, the lower end of the blanking box (5) is provided with a discharging port on both side surfaces, and the side surface of the blanking box (5) is provided with a limiting mechanism. 3.The thickness detection device for PZT piezoelectric thin film wafer preparation process according to claim 2, characterized in that: The limiting mechanism comprises a transverse plate I (504), and the upper surface of the transverse plate I (504) is rotatably connected with a rotating plate (503), the inside of one end of the rotating plate (503) is slidably connected with an extrusion rod (501), and the upper end of the extrusion rod (501) is fixedly connected with a spring (502), one end of the spring (502) is fixedly connected with the upper surface of the rotating plate (503), and the lower end of the extrusion rod (501) is fixedly connected with a pressing block (505).

4. The thickness detection device for PZT piezoelectric thin film wafer preparation process according to claim 1, characterized in that: The detection mechanism comprises a supporting frame (3), and the lower end of the supporting frame (3) is fixedly connected with the upper surface of the detection table (1), the lower surface of the supporting frame (3) is fixedly connected with a wafer thickness detector (301), and the wafer thickness detector (301) is wirelessly connected with a display (4), and the display (4) is fixedly installed on one end of the detection table (1).

5. The thickness detection device for PZT piezoelectric thin film wafer preparation process according to claim 1, wherein: The control mechanism comprises a gas cylinder (8) and an extrusion block (202), and the upper surface of the gas cylinder (8) is fixedly connected with the lower surface of the horizontal plate II (7) through a mounting block (801), one end of the gas cylinder (8) is fixedly connected with one end of a gas pipe (804), and the inside of the other end of the gas cylinder (8) is slidably connected with a push rod (803), one end of the push rod (803) is fixedly connected with a piston plate (802), and the piston plate (802) is slidably connected with the inner wall of the gas cylinder (8), and the extrusion block (202) is fixedly connected with the outer side surface of the supporting cylinder (2), and the other end of the push rod (803) is aligned with the extrusion block (202).

6. The thickness detection device for PZT piezoelectric thin film wafer preparation process according to claim 1, wherein: The driving mechanism comprises a gear (203), and the upper surface of the gear (203) is fixedly connected with the lower surface of the rotating disc (201), the side surface of the gear (203) is meshingly connected with a half-size wheel (205), the lower surface of the half-size wheel (205) is fixedly connected with a motor (204), and the side surface of the motor (204) is fixedly connected with the inner side wall of the supporting cylinder (2).

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