Drive mechanism

By designing a drive mechanism that includes a fixed part and a movable part, using guide rod connection and glue fixation, and combining a magnetic scale sensor, the miniaturization and stability problems of the lens drive module are solved, and the functions of autofocus and optical image stabilization are improved.

CN223926692UActive Publication Date: 2026-02-17AITE TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202422726024.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Priority Date
2023-11-10
Filing Date
2024-11-08
Publication Date
2026-02-17
Estimated Expiration
2034-11-08

AI Technical Summary

Technical Problem

Existing technologies make it difficult to miniaturize lens drive modules and improve their stability and reliability.

Method used

A drive mechanism is employed, comprising a fixed part and a movable part, connected by a guide rod and welded together with glue and a metal plate. A magnetic scale and a sensor are used to detect position changes, thereby enabling the movement of optical elements.

Benefits of technology

It achieves miniaturization of the lens drive module and improves stability and reliability, enabling autofocus and optical image stabilization.

✦ Generated by Eureka AI based on patent content.

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Abstract

A driving mechanism is used for driving an optical element to move and mainly comprises a fixed part, a movable part and a driving assembly. The movable part is movably connected with the fixed part, the optical element is arranged on the movable part, and the driving assembly is used for driving the movable part to move relative to the fixed part.
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Description

Technical Field

[0001] This invention relates to a driving mechanism. More specifically, it relates to a driving mechanism for moving an optical element. Background Technology

[0002] With the development of technology, many electronic devices today (such as smartphones or digital cameras) have the function of taking pictures or recording videos. The use of these electronic devices is becoming more and more common, and they are developing towards convenient and thinner designs to provide users with more choices.

[0003] Some electronic devices with photographic or video recording functions are equipped with a lens drive module to drive an optical element to move, thereby achieving the functions of autofocusing (AF) and optical image stabilization (OIS), in which light can pass through the aforementioned optical element to form an image on a photosensitive element.

[0004] However, further miniaturization of the lens drive module and improvement of its stability and reliability have become important challenges for researchers in this field. Utility Model Content

[0005] The purpose of this invention is to provide a driving mechanism to solve at least one of the above-mentioned problems.

[0006] In view of the aforementioned known problems, one embodiment of the present invention provides a driving mechanism for driving an optical element to move, which mainly includes a fixed part, a movable part, and a driving assembly. The movable part is movably connected to the fixed part, wherein the optical element is disposed on the movable part, and the driving assembly is used to drive the movable part to move relative to the fixed part.

[0007] In one embodiment, the aforementioned driving mechanism further includes a guide rod extending in a horizontal direction, and the aforementioned fixing part has a housing and a base connected to each other, wherein the aforementioned base has a first sidewall and a second sidewall, a first end of the aforementioned guide rod is fixed in a first opening in the aforementioned first sidewall, a second end of the aforementioned guide rod is fixed in a second opening in the aforementioned second sidewall, and the aforementioned movable part is slidably disposed on the aforementioned guide rod.

[0008] In one embodiment, the first sidewall and the second sidewall are located on opposite sides of the base, and the first end of the guide rod does not protrude from an outer surface of the base.

[0009] In one embodiment, the drive mechanism further includes a metal plate embedded inside the first sidewall and exposed at the first opening, wherein the first end of the guide rod is welded to the metal plate.

[0010] In one embodiment, the drive mechanism further includes an adhesive, and the first sidewall is formed with a groove adjacent to the metal plate and communicating with the first opening for receiving the adhesive.

[0011] In one embodiment, the first sidewall and the second sidewall are located on opposite sides of the base, and the second end does not protrude from an outer surface of the base.

[0012] In one embodiment, the drive mechanism further includes an adhesive disposed within the second opening for bonding the base and the second end.

[0013] In one embodiment, the second opening includes a first segment and a second segment, the first segment having a first inclined surface that tapers towards the horizontal direction, and the second segment having a second inclined surface that tapers towards the horizontal direction.

[0014] In one embodiment, the guide rod passes through the second section and reaches the first section.

[0015] In one embodiment, the angle between the first inclined plane and the horizontal direction is greater than the angle between the second inclined plane and the horizontal direction.

[0016] In one embodiment, the guide rod is formed with a groove for receiving the adhesive, and the groove is located within the second section.

[0017] In one embodiment, the length of the first segment in the horizontal direction is less than the length of the second segment in the horizontal direction.

[0018] In one embodiment, the base is formed with a protrusion located between the first sidewall and the second sidewall, and the guide rod is disposed on the protrusion.

[0019] In one embodiment, the protrusion is formed with a curved surface, and the guide rod is disposed on the curved surface.

[0020] In one embodiment, the radius of curvature of the surface is greater than the radius of curvature of the guide rod.

[0021] In one embodiment, the protrusion further forms a recess, and the recess is located on the curved surface.

[0022] In one embodiment, the drive mechanism further includes a circuit board, a magnetic scale, and a sensor. The circuit board is fixed on the base, the magnetic scale is disposed on the movable part, and the sensor is disposed on the circuit board to sense the position change of the magnetic scale.

[0023] In one embodiment, the circuit board has an interconnected body and a bend, the body being perpendicular to a vertical direction, and the sensor being disposed on the body, wherein the sensor and the magnetic grating ruler at least partially overlap in the vertical direction.

[0024] In one embodiment, the sensor and the guide rod do not overlap each other in the vertical direction.

[0025] In one embodiment, the first sidewall has a first thickness in the horizontal direction, and the second sidewall has a second thickness in the horizontal direction, wherein the first thickness is less than the second thickness. Attached Figure Description

[0026] Figure 1 A perspective view of an optical system according to an embodiment of the present invention.

[0027] Figure 2 express Figure 1 A cross-sectional view of the optical system in the image.

[0028] Figure 3 express Figure 1 A 3D view of the drive mechanism.

[0029] Figure 4 express Figure 1 A three-dimensional view of another driving mechanism in the process.

[0030] Figure 5 express Figure 4 Exploded view of the drive mechanism.

[0031] Figure 6 This shows a cross-sectional view of the optical components and drive mechanism after assembly. Figure 6 The casing is omitted in the text.

[0032] Figure 7 This is a partial enlarged cross-sectional view showing the first end of the guide rod extending into the first opening in the first sidewall.

[0033] Figure 8 This is a partial enlarged sectional view showing the second end of the guide rod extending into the second opening in the second sidewall.

[0034] Figure 9 A schematic diagram showing the relative positional relationships of the circuit board, substrate, coil, magnetic components, guide rod, and carrier components.

[0035] Figure 10 This diagram illustrates the curved surfaces and recesses formed on the protrusions of the base.

[0036] Figure 11 express Figure 5An exploded view of the substrate, coil, and metal support before they are assembled.

[0037] Figure 12 express Figure 5 An exploded view from another perspective before the substrate, coil, and metal support are assembled.

[0038] Figure 13 This is a three-dimensional view showing the circuit board and substrate after they are combined.

[0039] Figure 14 This is a three-dimensional view showing the circuit board and substrate after they are combined.

[0040] Figure 15 A schematic diagram showing the relative positions of optical elements, guide rods, circuit boards, substrates, and coils after assembly.

[0041] Figure 16 This is a schematic diagram showing the drive mechanism after the housing has been removed.

[0042] The attached figures are labeled as follows:

[0043] 100: Optical System

[0044] 10: Drive mechanism

[0045] 11: Circuit Board

[0046] 20: Drive mechanism

[0047] 21: Circuit Board

[0048] 211:Ontology

[0049] 212: Bending section

[0050] 23: Guide rod

[0051] 231: First End

[0052] 232: Second end

[0053] 233: Trench

[0054] B: Base

[0055] BC: Conductive components

[0056] BP: convex block

[0057] BP1: Surface

[0058] BP2: Depression

[0059] BR: Limiting Surface

[0060] BW1: First sidewall

[0061] BW2: Second sidewall

[0062] C: Coil

[0063] D1: Vertical direction

[0064] D2: Horizontal direction

[0065] E: Electronic components

[0066] H: Shell

[0067] HM: Magnetic ruler

[0068] h1: First opening

[0069] h11: Groove

[0070] h2: Second opening

[0071] h21: First paragraph

[0072] h211: First inclined plane

[0073] h22: Second section

[0074] h221: Second inclined plane

[0075] L1: Optical components

[0076] L2: Optical components

[0077] LH: Load-bearing component

[0078] LH1: Guide groove

[0079] M: Magnetic element

[0080] P: Substrate

[0081] P1: Plate-like structure

[0082] P2: Protrusion

[0083] P3: Winding post

[0084] P4: Depression

[0085] R: Optical element

[0086] S: Sensor

[0087] T: Metal bracket

[0088] T1: First thickness

[0089] T2: Second thickness

[0090] U: Metal plate Detailed Implementation

[0091] The following describes the drive mechanism of an embodiment of the present invention. However, it will be readily apparent that the embodiments of the present invention provide many suitable inventive concepts that can be implemented in a wide range of specific contexts. The specific embodiments disclosed are merely illustrative of the use of the present invention in a particular manner and are not intended to limit the scope of the present invention.

[0092] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by those skilled in the art to which this disclosure pertains. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the relevant art and the background or context of this disclosure, and should not be interpreted in an idealized or overly formal manner, unless specifically defined herein.

[0093] The foregoing and other technical contents, features, and effects of this utility model will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as up, down, left, right, front, or back, are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used in the embodiments are for illustrative purposes and not for limiting the present utility model.

[0094] Please refer to the following: Figures 1 to 4 ,in Figure 1 This is a perspective view of an optical system 100 according to an embodiment of the present invention. Figure 2 express Figure 1 A cross-sectional view of the optical system 100 in the middle. Figure 3 express Figure 1 A perspective view of the drive mechanism 10 in the middle. Figure 4 express Figure 1 A three-dimensional view of another drive mechanism 20 in the middle.

[0095] like Figures 1 to 4 As shown, the optical system 100 of this embodiment can be installed inside a mobile phone or other portable electronic device. It mainly includes two interconnected drive mechanisms 10 and 20 and several optical elements R, L1, and L2. Specifically, the aforementioned optical element R (e.g., a prism) is disposed inside the drive mechanism 10, and the aforementioned optical elements L1 and L2 (e.g., optical lenses) are disposed inside the drive mechanism 20.

[0096] In this embodiment, the aforementioned driving mechanisms 10 and 20 are, for example, voice coil motors (VCMs). The aforementioned driving mechanism 10 can drive the optical element R to rotate, and the aforementioned driving mechanism 20 can drive the optical element L2 to move along the X-axis, thereby achieving functions such as autofocusing (AF) or optical image stabilization (OIS).

[0097] With the aforementioned mechanism configuration, external light can enter the optical element R of the drive mechanism 10 along a vertical direction D1 (-Z axis direction). Then, the light will be reflected by the optical element R and pass through the optical elements L1 and L2 in sequence along a horizontal direction D2 (X axis direction). Then, the light will exit the optical system 100 and reach an image sensing element (not shown) to generate a digital image.

[0098] from Figures 1 to 4 It can also be seen that a circuit board 11 and a circuit board 21 are respectively provided on the bottom side of the drive mechanisms 10 and 20. The external circuit can apply current signals to the coils inside the drive mechanisms 10 and 20 through the aforementioned circuit boards 11 and 21, thereby generating an electromagnetic driving force, which can drive the optical elements R, L1 and L2 inside the drive mechanisms 10 and 20 to move, so as to achieve functions such as autofocus (AF) or optical image stabilization (OIS).

[0099] Please refer to the following: Figures 5 to 6 ,in Figure 5 express Figure 4 Exploded view of drive mechanism 20 in the middle. Figure 6 This shows a cross-sectional view of optical elements L1, L2, and drive mechanism 20 after assembly. Figure 6 The housing H is omitted in the text.

[0100] like Figures 5 to 6 As shown, the drive mechanism 20 of one embodiment of the present invention mainly includes a circuit board 21, two guide rods 23 extending along the X-axis, a base B, a carrier LH, two magnetic elements M, two coils C, two substrates P, and a housing H.

[0101] Specifically, the aforementioned housing H and base B are combined to form a fixed part of the drive mechanism 20, and the aforementioned carrier LH is movably disposed inside the base B and forms a movable part of the drive mechanism 20. The two ends of the guide rod 23 are respectively fixed in the first opening h1 of the first side wall BW1 and the second opening h2 of the second side wall BW2 of the base B. Furthermore, the aforementioned guide rod 23 extends through the carrier LH, and the carrier LH can slide relative to the base B in the X-axis direction along the guide rod 23.

[0102] In this embodiment, optical element L1 is fixed to a first sidewall BW1 of base B, and optical element L2 is disposed on carrier LH, wherein the first sidewall BW1 is adjacent to the aforementioned driving mechanism 10, and carrier LH and optical element L2 are adjacent to the second sidewall BW2 of base B.

[0103] The aforementioned magnetic element M (e.g., a magnet) is fixed to the outer surface of the carrier LH, and the aforementioned substrate P is fixed to the base B, wherein the coil C is disposed on the substrate P and adjacent to the aforementioned magnetic element M.

[0104] It should be noted that the aforementioned magnetic element M and coil C constitute a drive component of the drive mechanism 20, and the aforementioned circuit board 21 is disposed on the bottom side of the base B and electrically connected to the coil C. When a current signal is applied to the aforementioned coil C through the aforementioned circuit board 21, the magnetic force generated between the coil C and the magnetic element M can drive the carrier LH and the optical element L2 disposed therein to move together relative to the base B along the X-axis direction, thereby achieving the function of autofocus (AF) or optical image stabilization (OIS).

[0105] For example, the aforementioned circuit board 21 is a flexible circuit board (thickness of about 0.1 mm) and has a body 211 and a bending portion 212, wherein the aforementioned body 211 is perpendicular to the Z-axis direction, and an electronic component E (e.g., a control IC or other integrated circuit component) and a sensor S (e.g., a Hall effect sensor or other magnetic field sensing component) are provided on the aforementioned body 211.

[0106] from Figure 6 As can be seen, the two ends of the guide rod 23 are fixed in the first opening h1 of the first sidewall BW1 and the second opening h2 of the second sidewall BW2 of the base B, respectively. Furthermore, the middle portion of the guide rod 23 is supported by a protrusion BP on the base B. Specifically, the guide rod 23 extends through the bearing member LH, wherein the first sidewall BW1 has a first thickness T1 in the X-axis direction, and the second sidewall BW2 has a second thickness T2 in the X-axis direction, wherein the first thickness T1 is less than the second thickness T2.

[0107] In addition, a metal plate U is embedded in the first side wall BW1 of the aforementioned base B. The aforementioned metal plate U and the plastic base B can be manufactured by insert molding, thereby improving the structural strength of the first side wall BW1 of the base B. A portion of the metal plate U will be exposed in the aforementioned first opening h1 to connect the aforementioned guide rod 23.

[0108] Please refer to this as well. Figure 6 and Figure 7 ,in Figure 7 This is a partial enlarged cross-sectional view showing the first end 231 of the guide rod 23 extending into the first opening h1 of the first sidewall BW1.

[0109] like Figure 7 As shown, the first end 231 of the guide rod 23 extends into the first opening h1 of the first sidewall BW1 and is welded to the metal plate U exposed at the first opening h1. Furthermore, a groove h11 is formed inside the first sidewall BW1, adjacent to the metal plate U and communicating with the first opening h1. The groove h11 facilitates the assembly of the guide rod 23 and prevents welding damage to the first sidewall BW1 when welding the first end 231 of the guide rod 23 to the metal plate U.

[0110] In this embodiment, the first end 231 of the guide rod 23 does not completely pass through the first opening h1 and protrudes from the outer surface of the base B. After the first end 231 of the guide rod 23 is welded to the metal plate U, glue can be applied in the first opening h1. The aforementioned groove h11 can be used to accommodate the glue, thereby improving the bonding strength between the guide rod 23, the base B and the metal plate U.

[0111] Please refer to the following: Figure 6 and Figure 8 Figure, in which Figure 8 This is a partial enlarged cross-sectional view showing the second end 232 of the guide rod 23 extending into the second opening h2 of the second sidewall BW2.

[0112] like Figure 8 As shown, the second end 232 of the guide rod 23 extends into the second opening h2 of the second sidewall BW2, and glue can be applied to the second opening h2 during assembly so that the second end 232 of the guide rod 23 can be glued and fixed in the second opening h2.

[0113] Specifically, the aforementioned second opening h2 includes a first segment h21 and a second segment h22, wherein the aforementioned first segment h21 forms a first inclined surface h211 that tapers towards the horizontal direction (X-axis direction), and the aforementioned second segment h22 forms a second inclined surface h221 that tapers towards the horizontal direction (X-axis direction), wherein the angle (acute angle) between the aforementioned first inclined surface h211 and the X-axis direction is greater than the angle (acute angle) between the second inclined surface h221 and the X-axis direction.

[0114] It should be noted that the aforementioned guide rod 23 extends in the -X-axis direction through the aforementioned second section h22 and reaches the first section h21. The guide rod 23 does not completely pass through the first section h21 and protrude from the outer surface of the base B. Furthermore, the length of the aforementioned first section h21 in the X-axis direction is less than the length of the second section h22 in the X-axis direction.

[0115] On the other hand, from Figure 8 As can be seen, an annular groove 233 is formed on the guide rod 23. The aforementioned groove 233 is adjacent to the second end 232 of the guide rod 23 and is located in the second section h22 of the second opening h2.

[0116] In one embodiment, when the second end 232 of the guide rod 23 is fixed in the second opening h2 on the base B, adhesive can be applied in the second opening h2. The adhesive can flow through the first section h21 of the second opening h2 to the second section h22 and the groove 233 of the guide rod 23, thereby effectively improving the bonding strength between the guide rod 23 and the base B.

[0117] Please refer to the following: Figure 9 ,in Figure 9 This diagram illustrates the relative positions of the circuit board 21, substrate P, coil C, magnetic element M, guide rod 23, and carrier LH after assembly.

[0118] like Figure 9 As shown, the bottom side of the aforementioned carrier LH forms a guide groove LH1 for accommodating the guide rod 23, wherein the guide rod 23 passes through the guide groove LH1 of the carrier LH along the X-axis direction, so that the carrier LH can slide relative to the base B in the X-axis direction along the guide rod 23.

[0119] In this embodiment, the body 211 of the aforementioned circuit board 21 is fixed to the bottom side of the base B, and the bent portion 212 of the circuit board 21 is fixed to the substrate P. The sensor S on the circuit board 21 is located outside the two guide rods 23, and the sensor S and the guide rods 23 do not overlap each other in the vertical direction (Z-axis direction). In addition, the magnetic element M and the guide rods 23 also do not overlap each other in the vertical direction (Z-axis direction).

[0120] On the other hand, from Figure 9As can be seen, a magnetic scale HM is also provided on the bottom side of the carrier LH, wherein the sensor S on the circuit board 21, the magnetic scale HM, and the magnetic element M at least partially overlap in the vertical direction (Z-axis direction). It should be understood that, in this embodiment, by providing the magnetic scale HM on the bottom side of the carrier LH, and by using the sensor S on the circuit board 21 to detect the positional change of the magnetic scale HM, it is possible to know the movement of the carrier LH and the optical element L2 relative to the base B in the horizontal direction (X-axis direction).

[0121] Please refer to the following: Figure 6 and Figure 10 ,in Figure 10 This diagram shows a curved surface BP1 and a recess BP2 formed on the protrusion BP of the base B.

[0122] like Figure 6 and Figure 10 As shown, in order to provide stable support for the guide rod 23, a protrusion BP is formed on the bottom side of the base B, wherein the protrusion BP is located between the first side wall BW1 and the second side wall BW2, and a curved surface BP1 is formed on the protrusion BP to support the guide rod 23.

[0123] In this embodiment, the radius of curvature of the aforementioned curved surface BP1 is greater than the radius of curvature of the aforementioned guide rod 23. Furthermore, a recess BP2 is formed in the center of the aforementioned curved surface BP1, which can be used to hold glue, thereby improving the bonding strength between the guide rod 23 and the base B.

[0124] Please refer to the following: Figure 11 , Figure 12 , Figure 13 and Figure 14 ,in Figure 11 express Figure 5 An exploded view of the substrate P, coil C, and metal support T before they are assembled. Figure 12 express Figure 5 An exploded view from another perspective before the substrate P, coil C, and metal support T are assembled. Figure 13 This is a three-dimensional view showing the circuit board 21 after it is joined to the substrate P. Figure 14 This is a three-dimensional view showing the circuit board 21 after it is combined with the substrate P.

[0125] like Figure 11 , Figure 12 , Figure 13 and Figure 14As shown, the substrate P in this embodiment has a plate-like structure P1, a protrusion P2, and two winding posts P3. The thickness of the plate-like structure P1 is greater than or equal to 0.2 mm (e.g., 0.3 mm). The protrusion P2 protrudes from the center of the plate-like structure P1 toward the magnetic element M. The winding posts P3 protrude from the bottom side of the plate-like structure P1 toward the -Z axis. During assembly, the coil C can be wound on the protrusion P2, and the coil C and the winding posts P3 can be connected by wires (not shown). Then, the wires on the winding posts P3 can be soldered to the conductive parts on the base B, and the conductive parts can be electrically connected to the external circuit via the circuit board 21.

[0126] It should be noted that, in order to improve the structural strength of the plastic substrate P, an H-shaped metal support T can be embedded inside the substrate P by insert molding, thereby preventing the substrate P from being deformed and damaged by external forces.

[0127] In addition, from Figure 12 and Figure 14 As can be seen, a recessed portion P4 is formed on the substrate P, which can be used to accommodate and fix the bent portion 212 of the circuit board 21 to achieve miniaturization of the drive mechanism 20.

[0128] Please refer to the following: Figure 15 ,in Figure 15 This diagram illustrates the relative positions of optical elements L1, L2, guide rod 23, circuit board 21, substrate P, and coil C after assembly.

[0129] like Figure 15 As shown, after the drive mechanism 20 of this embodiment is assembled, the optical elements L1 and L2 will partially overlap with the guide rod 23 in the vertical direction (Z-axis direction). However, the aforementioned optical elements L1 and L2 and the guide rod 23 may not overlap in the vertical direction (Z-axis direction) after assembly. Instead, the optical elements L1 and L2 may be located between the two guide rods 23, and one of the guide rods 23 may be located between the sensor S and the optical elements L1 and L2.

[0130] In addition, from Figure 15 As can be seen, the protrusion P2 protrudes from the center of the plate-like structure P1 toward the magnetic element M and passes through the coil C. The thickness of the protrusion P2 in the Y-axis direction is greater than the thickness of the coil in the Y-axis direction. This can prevent the coil C from directly colliding with the magnetic element M on the carrier LH and causing structural damage when the drive mechanism 20 is impacted by an external force.

[0131] Next, please refer to Figure 16 ,in Figure 16 This is a schematic diagram showing the drive mechanism 20 after the housing H has been removed.

[0132] like Figure 16 As shown, the aforementioned substrate P is fixed to the base B during assembly, and the plate-like structure P1 of the substrate P abuts against a limiting surface BR on the base B; in addition, the winding post P3 located below the substrate P may have a T-shaped or L-shaped structure. During assembly, the wires (not shown) wound on the winding post P3 can be soldered to the conductive element BC exposed on the side of the base B. In this way, the coil C can be electrically connected to the external circuit in sequence through the wires, the conductive element BC and the circuit board 21 located below the base B.

[0133] In this embodiment, the aforementioned conductive element BC can be embedded inside the plastic base B and exposed on one side of the base B by means of insert molding, and the positions of the aforementioned conductive element BC and the winding post P3 are adjacent to the limiting surface BR of the base B.

[0134] While the embodiments and advantages of this utility model have been disclosed above, it should be understood that those skilled in the art can make modifications, substitutions, and refinements without departing from the spirit and scope of this utility model. Furthermore, the scope of protection of this utility model is not limited to the processes, machines, manufacturing methods, material compositions, apparatuses, methods, and steps described in the specific embodiments of the specification. Any processes, machines, manufacturing methods, material compositions, apparatuses, methods, and steps currently in development or to be developed in the future can be understood from the disclosure of this utility model, and can be used according to this utility model as long as they can perform substantially the same function or obtain substantially the same results in the embodiments described herein. Therefore, the scope of protection of this utility model includes the aforementioned processes, machines, manufacturing methods, material compositions, apparatuses, methods, and steps. In addition, each claim constitutes an individual embodiment, and the scope of protection of this utility model also includes combinations of the various claims and embodiments.

[0135] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Those skilled in the art can make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A driving mechanism for driving the movement of an optical element, characterized in that, include: One fixed part; A movable part is movably connected to the fixed part, wherein the optical element is disposed on the movable part; as well as A drive assembly for driving the movable part to move relative to the fixed part; The drive mechanism also includes a guide rod extending in a horizontal direction, and the fixing part has a housing and a base connected to each other, wherein the base has a first side wall and a second side wall, a first end of the guide rod is fixed in a first opening in the first side wall, a second end of the guide rod is fixed in a second opening in the second side wall, and the movable part is slidably disposed on the guide rod.

2. The driving mechanism as described in claim 1, characterized in that, The first sidewall and the second sidewall are located on opposite sides of the base, and the first end of the guide rod does not protrude from an outer surface of the base.

3. The driving mechanism as described in claim 2, characterized in that, The drive mechanism also includes a metal plate embedded inside the first sidewall and exposed at the first opening, wherein the first end of the guide rod is welded to the metal plate.

4. The driving mechanism as described in claim 3, characterized in that, The drive mechanism also includes an adhesive, and the first sidewall is formed with a groove adjacent to the metal plate and connected to the first opening for receiving the adhesive.

5. The driving mechanism as described in claim 1, characterized in that, The first sidewall and the second sidewall are located on opposite sides of the base, and the second end does not protrude from an outer surface of the base.

6. The driving mechanism as described in claim 5, characterized in that, The drive mechanism also includes an adhesive disposed in the second opening for bonding the base and the second end.

7. The driving mechanism as described in claim 6, characterized in that, The second opening includes a first section and a second section. The first section has a first inclined surface that tapers towards the horizontal direction, and the second section has a second inclined surface that tapers towards the horizontal direction.

8. The driving mechanism as described in claim 7, characterized in that, The guide rod passes through the second section and reaches the first section.

9. The driving mechanism as described in claim 8, characterized in that, The angle between the first inclined plane and the horizontal direction is greater than the angle between the second inclined plane and the horizontal direction.

10. The driving mechanism as described in claim 9, characterized in that, The guide rod has a groove for accommodating the adhesive, and the groove is located within the second section.

11. The driving mechanism as described in claim 10, characterized in that, The length of the first segment in the horizontal direction is less than the length of the second segment in the horizontal direction.

12. The driving mechanism as described in claim 1, characterized in that, The base has a protrusion located between the first sidewall and the second sidewall, and the guide rod is disposed on the protrusion.

13. The driving mechanism as described in claim 12, characterized in that, The protrusion has a curved surface, and the guide rod is disposed on the curved surface.

14. The driving mechanism as described in claim 13, characterized in that, The radius of curvature of the surface is greater than the radius of curvature of the guide rod.

15. The driving mechanism as described in claim 13, characterized in that, The protrusion further forms a recess, and the recess is located on the curved surface.

16. The driving mechanism as described in claim 1, characterized in that, The drive mechanism also includes a circuit board, a magnetic scale, and a sensor. The circuit board is fixed on the base, the magnetic scale is disposed on the movable part, and the sensor is disposed on the circuit board to sense the position change of the magnetic scale.

17. The driving mechanism as described in claim 16, characterized in that, The circuit board has an interconnected body and a bent portion, the body being perpendicular to a vertical direction, and the sensor being disposed on the body, wherein the sensor and the magnetic grating ruler at least partially overlap in the vertical direction.

18. The drive mechanism as described in claim 17, characterized in that, The sensor and the guide rod do not overlap each other in the vertical direction.

19. The driving mechanism as described in claim 1, characterized in that, The first sidewall has a first thickness in the horizontal direction, and the second sidewall has a second thickness in the horizontal direction, wherein the first thickness is less than the second thickness.