Notebook computer heat dissipation module with good heat dissipation performance

Abstract

The utility model provides a notebook computer heat dissipation module with good heat dissipation performance, which comprises a heat dissipation fan, a heat absorption structure, an auxiliary air outlet, a heat conduction copper pipe and a heat conduction block, and is characterized in that the heat dissipation fan is fixedly arranged on a circuit board of a notebook computer, and the heat absorption structure is fixedly arranged on one side of the heat dissipation fan; the auxiliary air outlet is fixedly installed on the outer side of the cooling fan. The heat conduction copper pipe is fixedly installed in the heat absorption structure, the heat conduction blocks are fixedly installed above a computer CPU and a display card respectively, and the heat conduction blocks are fixedly connected with the heat conduction copper pipe. Due to the arrangement of the auxiliary air outlets and the heat conduction blocks, absorbed heat can be quickly dissipated outwards, and heat generated by the notebook computer can be quickly guided out.

Description

Technical Field

[0001] This utility model relates to the field of laptop heat dissipation technology, and in particular to a laptop heat dissipation module with good heat dissipation performance. Background Technology

[0002] As laptop performance continues to improve, the computing power of core components such as the processor (CPU) and graphics processing unit (GPU) is also constantly increasing. This performance improvement is often accompanied by increased heat generation, placing higher demands on laptop cooling systems. The design of these systems must not only efficiently handle large amounts of heat but also ensure the stability and reliability of the device during prolonged operation. Therefore, effectively solving the laptop cooling problem has become a key focus of research and development. However, existing laptop cooling structures still suffer from the problem of absorbing heat and failing to quickly dissipate it, thus hindering the rapid removal of heat generated by the laptop.

[0003] Therefore, it is essential to invent a laptop cooling module with good heat dissipation performance. Utility Model Content

[0004] To address the aforementioned technical problems, this utility model provides a high-performance laptop cooling module to solve the issue that existing laptop cooling structures still suffer from the inability to quickly dissipate absorbed heat, thus failing to rapidly dissipate the heat generated by the laptop. A high-performance laptop cooling module includes a cooling fan, a heat-absorbing structure, an auxiliary air outlet, a heat-conducting copper pipe, and heat-conducting blocks. The cooling fan is fixedly mounted on the laptop's circuit board, and the heat-absorbing structure is fixedly mounted on one side of the cooling fan. The auxiliary air outlet is fixedly mounted on the outside of the cooling fan. The heat-conducting copper pipe is fixedly mounted inside the heat-absorbing structure, and the heat-conducting blocks are respectively fixedly mounted above the computer's CPU and graphics card, with the heat-conducting blocks connected and fixed to the heat-conducting copper pipe.

[0005] The heat-conducting block includes a heat-conducting substrate, fixing bolt holes, heat-absorbing fins, and matching slots. Fixing bolt holes are fixedly installed at the four corners of the heat-conducting substrate. The heat-conducting substrate is fixedly installed above the computer CPU and graphics card through the fixing bolt holes. The heat-absorbing fins are fixedly installed on the surface of the heat-conducting substrate, and the matching slots are opened inside the heat-absorbing fins, and heat-conducting copper pipes are fixedly installed inside them.

[0006] The auxiliary air vent is a curved stainless steel metal chamber, mounted on the housing of the cooling fan and interconnected. A rectangular frame is located at the top of the auxiliary air vent, and the outer rectangular frame is fixedly mounted on one side of the laptop casing, with a protective mesh installed. This design serves the following functions: ① Enhanced heat dissipation: The auxiliary air vent helps guide and exhaust the hot air generated by the cooling fan, enhancing heat dissipation and preventing heat buildup inside the laptop; ② Provides an additional heat dissipation channel: The auxiliary air vent provides an additional heat dissipation channel, allowing the hot air generated by the cooling fan to be more effectively exhausted from the laptop, preventing overheating due to insufficient heat dissipation; ③ Optimized airflow distribution: The curved metal chamber design of the auxiliary air vent helps optimize airflow distribution, ensuring that the hot air exhausted by the cooling fan is distributed more evenly, improving heat dissipation performance.

[0007] The heat-conducting substrate inside the heat-conducting block is made of copper metal plate, and it contacts the computer CPU and graphics card. A thermally conductive medium is applied between the heat-conducting substrate and the computer CPU and graphics card. The heat-absorbing fins are made of several parallel copper metal plates, and the matching grooves are irregular, which match the bending and offset of the heat-conducting copper pipe. The heat-conducting substrate does not shift and matches the computer CPU and graphics card, which has the following functions: ① Efficient heat conduction: The heat-conducting block effectively conducts heat from heat-generating components such as the computer CPU and graphics card to the heat-conducting copper pipe or other heat dissipation structures through its high thermal conductivity material, thereby achieving efficient heat transfer and dissipation; ② Uniform heat distribution: The heat-conducting block can evenly distribute the heat from the CPU and graphics card to the entire heat-conducting copper pipe or heat-absorbing fins, avoiding local overheating and maintaining the overall temperature balance of the laptop; ③ Increased contact area: The design of the heat-conducting block usually covers the surface of the CPU and graphics card to increase the contact area, thereby improving heat conduction efficiency. This design helps improve the contact and heat transfer between the heat sink and the heat dissipation system; ④ Increase the heat dissipation area: The heat-absorbing fins on the heat-conducting block expand the heat dissipation area. These fins can increase the contact area with the air, thereby helping to accelerate heat dissipation and cooling.

[0008] Compared with the prior art, the present invention has the following beneficial effects:

[0009] 1. The auxiliary air outlet of this utility model has the following functions: ① Enhanced heat dissipation: The auxiliary air outlet helps guide and exhaust the hot air generated by the cooling fan, enhancing the heat dissipation effect and preventing heat from accumulating inside the laptop; ② Provides an additional heat dissipation channel: The auxiliary air outlet provides an additional heat dissipation channel, allowing the hot air generated by the cooling fan to be more effectively exhausted to the outside of the laptop, avoiding overheating of the device due to the inability to dissipate heat in time; ③ Optimized airflow distribution: The auxiliary air outlet is designed as an arc-shaped metal chamber, which helps to optimize the airflow distribution, ensuring that the hot air exhausted by the cooling fan can be distributed more evenly, improving heat dissipation performance.

[0010] 2. The heat-conducting block of this utility model has the following functions: ① Efficient heat conduction: The heat-conducting block effectively conducts heat from heat-generating components such as the CPU and graphics card to the heat-conducting copper pipe or other heat dissipation structures through its high thermal conductivity material, thereby achieving efficient heat transfer and dissipation; ② Uniform heat distribution: The heat-conducting block can evenly distribute the heat from the CPU and graphics card to the entire heat-conducting copper pipe or heat-absorbing fins, avoiding local overheating and maintaining the overall temperature balance of the laptop; ③ Increased contact area: The design of the heat-conducting block usually covers the surface of the CPU and graphics card to increase the contact area, thereby improving heat conduction efficiency. This design helps to improve the contact and heat transfer between the heat sink and the heat dissipation system; ④ Increased heat dissipation area: The heat-absorbing fins on the heat-conducting block expand the heat dissipation area. These fins can increase the contact area with air, thereby helping to accelerate heat dissipation and cooling. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the structure of this utility model.

[0012] Figure 2 This is an enlarged view of point A of this utility model.

[0013] In the picture:

[0014] Cooling fan 1, heat absorption structure 2, auxiliary air outlet 3, heat-conducting copper pipe 4, heat-conducting block 5, heat-conducting substrate 51, fixing bolt hole 52, heat-absorbing fins 53, matching slot 54. Detailed Implementation

[0015] To enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0016] As attached Figure 1 To be continued Figure 2 As shown.

[0017] This utility model provides a laptop cooling module with good heat dissipation performance, including a cooling fan 1, a heat absorption structure 2, an auxiliary air outlet 3, a heat-conducting copper pipe 4, and a heat-conducting block 5. The cooling fan 1 is fixedly installed on the circuit board of the laptop, and the heat absorption structure 2 is fixedly installed on one side of the cooling fan 1. The auxiliary air outlet 3 is fixedly installed on the outside of the cooling fan 1. The heat-conducting copper pipe 4 is fixedly installed inside the heat absorption structure 2, and the heat-conducting block 5 is fixedly installed above the computer CPU and graphics card, respectively. The heat-conducting block 5 is connected and fixed to the heat-conducting copper pipe 4.

[0018] The heat-conducting block 5 includes a heat-conducting substrate 51, fixing bolt holes 52, heat-absorbing fins 53, and matching slots 54. The heat-conducting substrate 51 is fixedly installed at the four corners of the fixing bolt holes 52. The heat-conducting substrate 51 is fixedly installed above the computer CPU and graphics card through the fixing bolt holes 52. The heat-absorbing fins 53 are fixedly installed on the surface of the heat-conducting substrate 51, and the matching slots 54 are opened inside the heat-absorbing fins 53, and heat-conducting copper pipes 4 are fixedly installed inside them.

[0019] The purpose of a laptop cooling module is to maintain a suitable operating temperature for the laptop through efficient heat conduction and dissipation. This module mainly includes the following components:

[0020] 1. Cooling fan 1

[0021] 2. Heat-absorbing structure 2

[0022] 3. Auxiliary air outlet 3

[0023] 4. Heat-conducting copper pipe

[0024] 5. Heat-conducting block 5

[0025] Workflow

[0026] Heat source

[0027] When a laptop is running, its core components, such as the central processing unit (CPU) and graphics card (GPU), generate a lot of heat. To prevent these components from overheating and affecting system performance or causing damage, the heat must be effectively conducted away from these components and dissipated to the external environment.

[0028] Heat conduction

[0029] Heatsink 5:

[0030] The heat-conducting block 5 is installed above the CPU and graphics card, and contacts these heat-generating components through the heat-conducting substrate 51.

[0031] The heat-conducting substrate 51 of the heat-conducting block 5 is usually made of copper metal plate, which has high thermal conductivity and can quickly absorb the heat from the CPU and graphics card.

[0032] Heat-absorbing fins 53 are fixed to the surface of the heat-conducting substrate 51. The design of these fins increases the heat dissipation area.

[0033] The matching slot 54 allows the heat-conducting copper tube 4 to fit well with the heat-conducting block 5, ensuring that heat can be effectively transferred from the heat-conducting block to the heat-conducting copper tube.

[0034] Heat-conducting copper pipe 4:

[0035] The heat-conducting copper pipe 4 conducts heat from the heat-conducting block 5 to other heat dissipation structures through the internal heat-conducting medium.

[0036] These copper tubes are fixed inside the heat-absorbing structure 2 and transfer heat to the cooling fan 1 and other heat dissipation areas through the highly thermally conductive copper material.

[0037] Cooling fan 1

[0038] Cooling fan 1: It is fixedly mounted on the circuit board of the laptop and is mainly responsible for drawing hot air out of the laptop.

[0039] When the fan is running, it draws in hot air from one side of the cooling fan 1 by rotating, and exhausts the hot air to the external environment through the auxiliary air outlet 3.

[0040] The airflow generated by the cooling fan 1 during operation helps improve the heat exchange efficiency of the entire cooling system, carrying away the heat from the heat sink and heat conduction block 5.

[0041] Auxiliary air outlet 3

[0042] Auxiliary air outlet 3: installed on the outside of the cooling fan 1 and designed as an arc-shaped stainless steel metal compartment.

[0043] The auxiliary air outlet 3 helps guide and exhaust the hot air generated by the cooling fan 1 by optimizing the exhaust path of the airflow.

[0044] The top of the auxiliary air vent 3 is equipped with a rectangular frame and a protective mesh to prevent dust and debris from entering the laptop and to optimize airflow.

[0045] Heat dissipation process

[0046] Heat is conducted from the CPU and graphics card to the heatsink 5, and then diffused through the heatsink substrate 51 and its heat-absorbing fins 53.

[0047] The heat-conducting copper pipe 4 transfers the heat from the heat-absorbing structure 2 to the cooling fan 1.

[0048] Cooling fan 1 draws in hot air and exhausts it to the external environment through auxiliary air outlet 3, carrying away heat and thus reducing the internal temperature of the laptop.

[0049] in conclusion

[0050] This cooling module, through the coordinated operation of the heat-conducting block 5, the heat-conducting copper pipe 4, and the cooling fan 1, effectively and quickly conducts and dissipates the heat generated by the laptop, ensuring stable system operation. The design of the auxiliary air outlet 3 further optimizes the airflow path and improves the heat dissipation effect. Overall, this cooling module provides an efficient and reliable solution to meet the heat dissipation needs of laptops under high load conditions.

[0051] Any technical solution that achieves the above-mentioned technical effects by utilizing the technical solution described in this utility model, or by designing a similar technical solution inspired by the technical solution described in this utility model, falls within the protection scope of this utility model.

Claims

1. A laptop cooling module with good heat dissipation performance, characterized in that: The device includes a cooling fan (1), a heat absorption structure (2), an auxiliary air outlet (3), a heat-conducting copper pipe (4), and a heat-conducting block (5). The cooling fan (1) is fixedly installed on the circuit board of the laptop computer, and the heat absorption structure (2) is fixedly installed on one side of the cooling fan (1). The auxiliary air outlet (3) is fixedly installed on the outside of the cooling fan (1). The heat-conducting copper pipe (4) is fixedly installed inside the heat absorption structure (2), and the heat-conducting block (5) is fixedly installed above the computer CPU and the graphics card, respectively. The heat-conducting block (5) is connected and fixed to the heat-conducting copper pipe (4).

2. The notebook heat dissipation module with good heat dissipation performance according to claim 1, characterized in that: The heat-conducting block (5) includes a heat-conducting substrate (51), fixing bolt holes (52), heat-absorbing fins (53), and matching slots (54). Fixing bolt holes (52) are fixedly installed at the four corners of the heat-conducting substrate (51). The heat-conducting substrate (51) is fixedly installed above the computer CPU and graphics card through the fixing bolt holes (52). The heat-absorbing fins (53) are fixedly installed on the surface of the heat-conducting substrate (51), and the matching slots (54) are opened inside the heat-absorbing fins (53). A heat-conducting copper pipe (4) is fixedly installed inside the fins.

3. The notebook heat dissipation module with good heat dissipation performance according to claim 1, characterized in that: The auxiliary air outlet (3) is made of an arc-shaped stainless steel metal chamber, and the auxiliary air outlet (3) is installed on the outer shell of the cooling fan (1) and is interconnected with it; a rectangular frame is provided on the top of the auxiliary air outlet (3), and the rectangular frame on the outside of the auxiliary air outlet (3) is fixedly installed on one side of the laptop shell and a protective mesh is fixedly installed.

4. The notebook heat dissipation module with good heat dissipation performance according to claim 2, characterized in that: The heat-conducting substrate (51) inside the heat-conducting block (5) is made of copper metal plate, and the heat-conducting substrate (51) is in contact with the computer CPU and graphics card. A heat-conducting medium is applied between the heat-conducting substrate (51) and the computer CPU and graphics card. The heat-absorbing fins (53) are made of several parallel copper metal plates, and the matching slots (54) are irregular slots. The matching slots (54) match the bending and offset of the heat-conducting copper pipe (4). The heat-conducting substrate (51) will not shift and is matched with the computer CPU and graphics card.

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