Digital board card module

Abstract

The utility model provides a digital board card module. The digital board card module comprises a module body, one side of the module body is used for installing a digital board card, a heat dissipation boss is designed on the side according to a chip of the digital board card, and the chip is connected with the heat dissipation boss through a heat conduction gasket; the heat of the chip is transferred to the heat dissipation boss through the heat conduction gasket; the other side of the module body is processed into heat dissipation fins; the digital board card module is placed in the box body, the upper surface of the box body is provided with an upper cover plate, and the lower surface is provided with a lower cover plate; a connector and a fan are arranged at the two ends of the box body respectively; the fan takes away heat in an air draft or air blowing mode, and therefore the heat dissipation function is achieved. According to the digital board card module provided by the utility model, under the condition that the installation space is discrete or limited, an independently installed digital module can be designed through the configuration.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic equipment field, especially a kind of digital board card module. BACKGROUND

[0002] Digital board card module is an important structural form in electronic equipment, and has a wide range of use scenarios, and can be seen everywhere on airborne, shipborne, vehicle-mounted or ground equipment, but in most cases, it is only used as a component, installed in the case, and relies on the case for reinforcement and heat dissipation. Therefore, in the case of compact or discrete installation space, a new configuration needs to be designed to make full use of the space.

[0003] Digital board card module generally has high power consumption and high heat dissipation requirements. Generally, heat is dissipated through conduction. For modules with separate functions, it is redundant to design a separate case structure. If the reinforcement and heat dissipation problems can be solved on the module box, the module can be designed separately according to the actual location to achieve free installation. UTILITY MODEL CONTENTS

[0004] The utility model aims to provide a digital board card module to achieve independent installation of digital module and integrally solve the problems of reinforcement, heat dissipation and installation.

[0005] The technical scheme of the utility model is as follows: a digital board card module is provided, which includes a module body. One side of the module body is used to install a digital board card. Heat dissipation bosses are designed on this side according to the chips of the digital board card. The chips are connected to the heat dissipation bosses through a heat-conducting gasket. The heat of the chips is transferred to the heat dissipation bosses through the heat-conducting gasket.

[0006] The other side of the module body is processed into heat dissipation fins.

[0007] The digital board card module is placed in a box. An upper cover plate is arranged on the upper surface of the box, and a lower cover plate is arranged on the lower surface of the box.

[0008] Connectors and fans are placed at both ends of the box respectively. The fans can remove heat through suction or blowing, thereby achieving the function of heat dissipation.

[0009] Further, functional devices can be selected and matched in the box.

[0010] Further, the edges of the box are designed with corresponding mounting holes according to the actual installation conditions. The box is mounted to the required position by screws or bolts.

[0011] The digital board card module provided by the utility model has the following beneficial effects:

[0012] In the case of discrete or limited installation space, the digital module can be installed separately through this configuration. BRIEF DESCRIPTION OF DRAWINGS

[0013] The utility model will be further described in connection with the drawings:

[0014] Figure 1 It is digital board module composition schematic view.

[0015] Figure 2 It is digital board heat dissipation schematic view. DETAILED DESCRIPTION

[0016] The utility model discloses digital board module will be further detailed in connection with the drawings and specific embodiment. According to the following description and claims, the advantages and features of the utility model will be more clear. It is explained that, the drawings all adopt very simplified form and all use non-precise ratio, only to facilitate, clear and assist the purpose of the description of the embodiment of the utility model.

[0017] Digital board module adopts forced air cooling heat dissipation form, first, heat-conducting gasket 3 is pasted on the heat dissipation boss of box body 5, then, digital board 2 chip is aligned with corresponding heat dissipation boss, and is inverted on, then, is fixed through screw. Chip heat can be transferred to box body 5 through heat-conducting gasket 3, heat dissipation boss, then, is taken away heat by fan 4 through the form of air extraction or air blowing, to realize the function of heat dissipation.

[0018] In addition to heat dissipation, module box body 5 also provides installation and reinforcement effect, and optional functional devices can be selected in the box body, and upper cover plate 1 and lower cover plate 6 are designed on the upper and lower surfaces of the box body, to play a protective role, to realize the independent module function. The module structure form is as shown in Figure 1 .

[0019] The utility model discloses the technical problem to be solved is to propose the structure form of digital board module, realizes the independent installation of digital module, and solves the reinforcement, heat dissipation and installation problem integrally.

[0020] The utility model discloses the technical scheme that the technical problem of solving is:

[0021] Module design is divided into two layers, one side installs digital board, and heat dissipation boss is designed according to the chip of digital board, and chip heat is transferred to heat dissipation boss through heat-conducting gasket;The other side is processed into heat dissipation fin, and connector and fan are placed at the both ends of module respectively, and upper cover plate protects digital board, and lower cover plate forms closed air duct, as shown in Figure 2 . The edge of box body is designed with corresponding mounting hole according to actual installation condition, and module is installed to the required position through screw or bolt.

[0022] It is proved that the utility model: digital module passes through +70 ℃ high temperature environment test, and the test result of onboard vibration environment test in GJB150A all prove the feasibility of this form.

[0023] The digital board card module adopts forced air cooling heat dissipation form, the digital board card is placed in the box body, the chip transmits heat to the heat dissipation fin on the other side of the box body through the heat dissipation boss, and then the heat is taken away through the forced air cooling convection mode.

[0024] The contents not described in detail in the specification belong to the prior art known to the person skilled in the art. It is obvious for the person skilled in the art that the present application is not limited to the details of the above exemplary embodiments, and the present application can be implemented in other specific forms without departing from the spirit or essential characteristics of the present application. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-limiting, the scope of the present application is defined by the appended claims rather than the above description, and therefore all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present application.

Claims

1. A digital board module, characterized by, The module body is provided with one side for mounting a digital board card, and a heat dissipation boss is designed on the side according to the chip design of the digital board card, and the chip is connected with the heat dissipation boss through a heat conduction pad; the heat of the chip is transmitted to the heat dissipation boss through the heat conduction pad; The other side of the module body is processed into a heat dissipation fin; The digital board card module is placed in a box body, the upper surface of the box body is provided with an upper cover plate, and the lower surface is provided with a lower cover plate; The box body is provided with a connector and a fan at two ends respectively; the fan carries away heat in the form of air suction or air blowing, thereby realizing the function of heat dissipation.

2. The digital board module of claim 1, wherein, The box body can be optionally provided with functional devices.

3. The digital board module of claim 1, wherein, The edge of the box body is designed with corresponding mounting holes according to the actual installation condition, and the box body is mounted to the required position through screws or bolts.

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