PCB stress testing device

Abstract

The utility model provides a PCB board stress testing device comprising a pedestal, a clamping assembly slidably arranged on the pedestal, and a supporting assembly slidably arranged on the pedestal, the clamping assembly is used for clamping two side edges of a PCB board, the supporting assembly is used for supporting the other two side edges of the PCB board when the clamping assembly clamps the two side edges of the PCB board, and the supporting assembly is used for supporting the other two side edges of the PCB board when the clamping assembly clamps the other two side edges of the PCB board. And the to-be-tested point of the PCB is provided with a strain gauge, and the strain gauge is connected with a dynamometer, so that the stress of the to-be-tested point of the PCB can be tested. The PCB stress testing device provided by the utility model can provide an accurate stress value, and is beneficial for ensuring the accuracy of a testing result.

Description

Technical Field

[0001] This utility model relates to the field of stress testing technology, and in particular to a PCB board stress testing device. Background Technology

[0002] A PCB (Printed Circuit Board) is a provider of electrical connections for electronic components. It is made of insulating board as the base material, cut to a certain size, and has at least one conductive pattern and holes. It is used to replace the chassis of the previous electronic components and realize the interconnection between electronic components. It is an important electronic component and a support for electronic components.

[0003] Furthermore, when manufacturing circuit boards, companies often arrange multiple circuit modules together on a single PCB board. Each circuit module is connected to the PCB board by only about 1mm of PCB material. It can be easily removed by gently pressing and breaking it off during use. However, during the pressing and warping process, the stress value that the PCB board can withstand may be exceeded, causing the circuit module to dent and deform, damaging the solder joints, and thus leading to the failure of the circuit module.

[0004] Therefore, when dividing circuit modules, stress testing is necessary to prevent module failure. Currently, most stress tests are conducted by manually breaking the module. However, manual breaking cannot provide accurate stress values, and the magnitude, method, and speed of the applied force during the breaking operation can vary, making it difficult to guarantee the accuracy of the test results. Utility Model Content

[0005] In view of this, the present invention aims to provide a PCB board stress testing device to ensure the accuracy of test results.

[0006] To achieve the above objectives, the technical solution of this utility model is implemented as follows:

[0007] A PCB board stress testing device includes a base, a clamping assembly slidably disposed on the base, and a supporting assembly slidably disposed on the base. The clamping assembly is used to clamp two sides of the PCB board, and the supporting assembly is used to support the other two sides of the PCB board when the clamping assembly clamps the two sides of the PCB board. A strain gauge is provided at the test point of the PCB board, and the strain gauge is connected to a force gauge to test the stress at the test point of the PCB board.

[0008] Furthermore, the side includes a first side located at both ends in the width direction of the PCB board, and a second side located at both ends in the length direction of the PCB board;

[0009] The clamping assembly includes a plurality of first support plates arranged at intervals along the width direction of the base, and a detachable pressure plate disposed on each of the first support plates. Each pressure plate forms a clamping engagement with the corresponding first support plate to clamp the first side.

[0010] Furthermore, the support assembly includes a plurality of second support plates arranged at intervals along the length direction of the base, and a pad slidably disposed on each of the second support plates, each of the pads being used to support the second side.

[0011] Furthermore, the base is provided with a first sliding groove extending along its own width direction, and each of the first support plates is provided with a first bolt, and each of the first support plates slides in the first groove through the corresponding first bolt.

[0012] Furthermore, the base is provided with a second sliding groove extending along its own length direction, and each of the second support plates is provided with a second bolt, and each of the second support plates slides in the second groove through the corresponding second bolt.

[0013] Furthermore, each of the pads is provided with a slider at its bottom, and each of the second support plates is provided with a third sliding groove extending along the width direction of the base, and each pad slides on the third sliding groove by the corresponding slider.

[0014] Furthermore, each of the first support plates has a clearance groove at its bottom that extends along the length of the base, the clearance groove being used to avoid the pad plate.

[0015] Compared with the prior art, this utility model has the following advantages:

[0016] The PCB stress testing device of this utility model, through the arrangement of clamping components and supporting components, enables the clamping components to clamp two sides of the PCB board and the supporting components to support the other two sides of the PCB board, ensuring the stability of the PCB board and allowing the applied force to be evenly distributed on the surface of the PCB board, thereby avoiding errors in the test structure. At the same time, through the arrangement of strain gauges and force gauges, the stress at the test point on the PCB board can be accurately measured when the PCB board is pressed, providing accurate stress values, thus helping to ensure the accuracy of the test results.

[0017] Secondly, the clamping assembly consists of a first support plate and a pressure plate. The clamping action between the pressure plate and the first support plate clamps the first side of the PCB board, which can firmly fix the PCB board and keep it stable throughout the test. This helps to ensure the consistency of test conditions and thus improve the accuracy of test results. At the same time, the clamping method of using the pressure plate and the first support plate to clamp the PCB is simple and quick, which helps to improve test efficiency.

[0018] The support assembly consists of a second support plate and a pad, providing stable support for the second side of the PCB board. This ensures the PCB board maintains good flatness during testing, preventing warping and deformation of the second side and thus improving the reliability of test results. Simultaneously, allowing the pad to slide on the second support plate provides more testing conditions and variations, reducing testing limitations.

[0019] Furthermore, the first slide groove and the first bolt allow the first support plate to slide stably on the base. They can also be flexibly adjusted according to the specific dimensions of the PCB board to clamp PCBs of different sizes, thus enabling the device to meet various testing requirements and improving its flexibility and applicability. Similarly, the second slide groove and the second bolt allow the second support plate to slide stably on the base. The support position and spacing can be adjusted according to the specific dimensions of the PCB board, ensuring stable and appropriate support regardless of its size, thereby guaranteeing the accuracy and reliability of stress testing.

[0020] Furthermore, by setting up the slider and the third slide groove, the stable sliding of the pad can be ensured. At the same time, the pad sliding on the third slide groove can provide support at different positions on the second side, thereby facilitating the acquisition of more comprehensive test data. The setting of the clearance groove can provide clearance space for the sliding of the pad, thereby ensuring the smooth progress of the test process. Attached Figure Description

[0021] The accompanying drawings, which form part of this utility model, are used to provide a further understanding of the utility model. The illustrative embodiments of the utility model and their descriptions are used to explain the utility model and do not constitute an undue limitation of the utility model. In the drawings:

[0022] Figure 1 This is a schematic diagram of the overall structure of the PCB board stress testing device described in this embodiment of the utility model;

[0023] Figure 2 for Figure 1 Enlarged view of the structure shown at point A in the middle;

[0024] Figure 3 for Figure 1 The diagram shows the structure from another perspective.

[0025] Figure 4 for Figure 3 A schematic diagram of the structure shown from another perspective;

[0026] Figure 5 This is a schematic diagram of the structure of the first support plate described in an embodiment of the present utility model;

[0027] Figure 6 This is a schematic diagram of the structure of the first support plate described in an embodiment of the present utility model;

[0028] Figure 7 This is a schematic diagram of the PCB board structure according to an embodiment of the present utility model;

[0029] Figure 8 This is a schematic diagram of the structure of a single-module PCB board constrained by the PCB board stress testing device described in this embodiment of the utility model.

[0030] Figure 9 This is a schematic diagram of the structure of the PCB board stress testing device constraining a multi-module PCB board according to an embodiment of the present invention.

[0031] Explanation of reference numerals in the attached figures:

[0032] 1. Base; 11. First slide groove; 12. Second slide groove;

[0033] 2. Clamping assembly; 21. First support plate; 211. Clearance groove; 22. Pressure plate; 23. First bolt;

[0034] 3. Support assembly; 31. Second support plate; 311. Third slide groove; 32. Pad; 321. Slider; 33. Second bolt;

[0035] 4. PCB board; 41. First side; 42. Second side; 43. Circuit module. Detailed Implementation

[0036] It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0037] In the description of this utility model, it should be noted that if terms such as "upper," "lower," "inner," or "outer" appear, indicating orientation or positional relationship, they are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, if terms such as "first" or "second" appear, they are also used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0038] Taking the PCB board stress testing device described in this utility model as an example, the directional terms used in the embodiments, such as "up," "down," "left," "right," "front," and "back," are based on... Figure 1 The left-right direction (also known as the width direction, or the overall Y direction) and the front-back direction (also known as the length direction, or the overall X direction) in the state shown are as follows: Figure 3 The vertical direction (also known as the height direction or the overall Z-direction) in the state shown is defined as the reference.

[0039] Furthermore, in the description of this utility model, unless otherwise explicitly defined, the terms "installation," "connection," "joining," and "connector" should be interpreted broadly. For example, they can refer to stress testing connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model in light of the specific circumstances.

[0040] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0041] Example 1

[0042] This embodiment relates to a PCB board stress testing device that can provide accurate stress values, which helps to ensure the accuracy of test results.

[0043] In terms of overall structure, combined Figures 1 to 8 As shown, the PCB board 4 stress testing device of this embodiment includes a base 1, a clamping assembly 2 slidably disposed on the base 1, and a support assembly 3 slidably disposed on the base 1. The clamping assembly 2 is used to clamp the two sides of the PCB board 4, and the support assembly 3 is used to support the two sides of the PCB board 4 when the clamping assembly 2 clamps the two sides of the PCB board 4. Strain gauges are provided at the test points of the PCB board 4, and the strain gauges are connected to a force gauge to test the stress at the test points of the PCB board 4.

[0044] At this point, with the above configuration, the clamping component 2 and the support component 3 can clamp the two sides of the PCB board 4, and the support component 3 can support the other two sides of the PCB board 4. This ensures the stability of the PCB board 4 and allows the applied force to be evenly distributed on the surface of the PCB board 4, thereby avoiding errors in the test structure. At the same time, with the strain gauge and force gauge, the stress at the test point on the PCB board 4 can be accurately measured when the PCB board 4 is pressed, providing accurate stress values, which helps to ensure the accuracy of the test results.

[0045] In the specific structure, a circuit module 43 is provided on the PCB board 4, and the four corners of the circuit module 43 are connected to the PCB board 4 through PCB material. In specific implementation, strain gauges are set at the test points on the PCB board 4, and the strain gauges are connected to a force gauge. It is worth mentioning that the strain gauges and force gauges in this embodiment can be set with reference to existing technology.

[0046] Next, the PCB board 4 is placed on the base 1, and the two sides of the PCB board 4 are clamped by the sliding clamping assembly 2, and the other two sides of the PCB board 4 are supported by the sliding support assembly 3. After ensuring the stability of the PCB board 4, the PCB board 4 is pressed until the circuit module 43 falls off the PCB board 4. At this time, the pressing stress will be transmitted to the force gauge through the strain gauge, so that the maximum stress value that the PCB board 4 can withstand can be accurately obtained. Therefore, when splitting other circuit modules 43, the failure of the circuit module 43 can be effectively avoided.

[0047] It should be noted that the test point of PCB board 4 in this embodiment refers to the connection point between circuit module 43 and PCB board 4. Of course, in addition to the connection point between circuit module 43 and PCB board 4, it can also be the solder joint of PCB board 4 that is easily damaged (i.e., the area where component pins are densely packed).

[0048] Based on the above overall introduction, in this embodiment, as a preferred implementation, such as Figure 1 , Figure 5 and Figure 7 As shown, the side includes a first side 41 located at both ends in the width direction of the PCB board 4, and a second side 42 located at both ends in the length direction of the PCB board 4. Furthermore, the clamping assembly 2 includes a plurality of first support plates 21 arranged at intervals along the width direction of the base 1, and a detachable pressure plate 22 disposed on each of the first support plates 21. Each pressure plate 22 forms a clamping engagement with the corresponding first support plate 21 to clamp the first side 41.

[0049] Here, the clamping assembly 2 consists of a first support plate 21 and a pressure plate 22. The first side 41 of the PCB board 4 is clamped by the clamping cooperation formed between the pressure plate 22 and the first support plate 21, which can firmly fix the PCB board 4 and keep the PCB board 4 stable throughout the test. This helps to ensure the consistency of test conditions and thus improve the accuracy of test results. At the same time, the clamping method of clamping the PCB by the pressure plate 22 and the first support plate 21 is simple and quick, which helps to improve test efficiency.

[0050] In the specific structure, there are two first support plates 21 in this embodiment, and both first support plates 21 extend along the length direction of the base 1. Of course, in addition to setting two first support plates, the first support plates 21 in this embodiment can also be designed and adjusted according to actual needs, such as four or six.

[0051] In practice, the two first support plates 21 can slide along the width direction of the base 1 to accommodate PCB boards 4 of different sizes. After the two first support plates 21 are adjusted to the appropriate position, the pressure plate 22 is removed from the corresponding first support plate 21, and the two first sides 41 of the PCB board 4 are placed on the two first support plates 21 respectively. Then, the pressure plate 22 on each first support plate 21 is pressed firmly onto the corresponding first side 41.

[0052] It should be noted that the pressure plate 22 in this embodiment can be connected to the first support plate 21 by screwing. Of course, in addition to screwing, other common detachable connection methods can also be used.

[0053] It should be understood that in other embodiments, such as Figure 9 As shown, the clamping component 2 in this embodiment can also clamp a PCB board 4 with multiple circuit modules 43. In this case, it is only necessary to clamp the two first sides 41 of the PCB board 4 by the clamping component 2, while the two second sides 42 do not need to be supported by the support component 3.

[0054] Furthermore, in this embodiment, as a preferred implementation, such as Figure 1 , Figure 6 and Figure 8 As shown, the support assembly 3 includes a plurality of second support plates 31 arranged at intervals along the length direction of the base 1, and pads 32 slidably disposed on each of the second support plates 31, each pad 32 being used to support the second side 42.

[0055] Understandably, the support assembly 3 consists of a second support plate 31 and a pad 32, providing stable support for the second side 42 of the PCB board 4. This ensures that the PCB board 4 maintains good flatness during testing, preventing warping or deformation of the second side 42 during testing and thus improving the reliability of the test results. Simultaneously, allowing the pad 32 to slide on the second support plate 31 provides more testing conditions and variations, thereby reducing testing limitations.

[0056] In the specific structure, the second support plate 31 in this embodiment can be set to two. Of course, in addition to setting it to two, the specific number of the second support plate 31 can also be designed and adjusted according to actual needs, such as four or six.

[0057] In practice, both second support plates 31 are located below the first support plate 21. After the two first support plates 21 clamp the corresponding first side 41, the two second support plates 31 are slid to allow the pads 32 on each second support plate 31 to support the two second side 42 respectively, thus maintaining good flatness of the PCB board 4. It is worth mentioning that in this embodiment, the height of the pads 32 is level with the bottom of the first support plate 21, and in other embodiments, it is also possible to provide a pressure plate 22 on the pads 32.

[0058] Furthermore, in this embodiment, as a preferred implementation, such as Figure 3 As shown, the base 1 is provided with a first groove 11 extending along its own width direction, and each first support plate 21 is provided with a first bolt 23. Each first support plate 21 slides in the first groove through the corresponding first bolt 23.

[0059] Therefore, by setting the first slide groove 11 and the first bolt 23, the first support plate 21 can be stably slid on the base 1. At the same time, it can be flexibly adjusted according to the specific size of the PCB board 4 to clamp PCB boards 4 of different sizes, thereby enabling the device to meet various testing requirements and improving the flexibility and applicability of the device.

[0060] In the specific structure, each first support plate 21 extends along the length of the base 1, and each first support plate 21 is provided with a first bolt 23 at both ends along the length of the base 1. Both sides of the base 1 are provided with a first sliding groove 11. In specific implementation, the two first bolts 23 at both ends of each first support plate 21 pass through the corresponding first sliding groove 11 and are connected to the first support plate 21, so that each first support plate 21 can be connected to the base 1 while also allowing each first support plate 21 to slide.

[0061] Meanwhile, in this embodiment, as a preferred implementation, such as Figure 4 As shown, the base 1 is provided with a second sliding groove 12 extending along its own length direction, and each second support plate 31 is provided with a second bolt 33. Each second support plate 31 slides in the second groove through the corresponding second bolt 33.

[0062] Here, the second slide 12 and the second bolt 33 enable the second support plate 31 to slide stably on the base 1. At the same time, the support position and spacing can be adjusted according to the specific size of the PCB board 4, ensuring that the PCB board 4 can be stably and appropriately supported regardless of its size, thereby ensuring the accuracy and reliability of stress testing.

[0063] In the specific structure, each second support plate 31 extends along the width direction of the base 1, and each second support plate 31 has a second bolt 33 at both ends along the width direction of the base 1, and a second sliding groove 12 is provided on both sides along the width direction of the base 1. In specific implementation, the two second bolts 33 at both ends of each second support plate 31 pass through the corresponding second sliding groove 12 and are connected to the second support plate 31, so that each second support plate 31 can slide while being connected to the base 1.

[0064] Furthermore, in this embodiment, as a preferred implementation, such as Figure 1 and Figure 2 As shown, each pad 32 is provided with a slider 321 at its bottom, and each second support plate 31 is provided with a third slide groove 311 extending along the width direction of the base 1. Each pad 32 slides on the third slide groove 311 through the corresponding slider 321.

[0065] Here, by setting the slider 321 and the third slide groove 311, the stable sliding of the pad 32 can be ensured. At the same time, by making the pad 32 slide on the third slide groove 311, it can support different positions of the second side 42, thereby facilitating the acquisition of more comprehensive test data.

[0066] In practical implementation, the sliding pad 32 can be used to support part or all of the second side 42 according to the actual needs of stress testing. This provides more testing conditions and variations for the PCB board 4, helping to more comprehensively evaluate the performance of the PCB board 4 and improve the validity and accuracy of the test results. Of course, in other embodiments, the pad 32 can also be connected to the second support plate 31 by a detachable connection method, such as screw connection or snap connection.

[0067] In addition, in this embodiment, as a preferred implementation, such as Figure 5As shown, each of the first support plates 21 has a relief groove 211 extending along the length of the base 1 at its bottom. The relief groove 211 is used to avoid the pad 32. The advantage of this arrangement is that the relief groove 211 provides clearance space for the sliding of the pad 32, thereby ensuring the smooth progress of the test process.

[0068] In specific implementation, after each first support plate 21 clamps the corresponding first side 41, each second support plate 31 slides to support the corresponding second side 42. At this time, in order to avoid the pad 32 on each second support plate 31 sliding and causing a conflict between the pad 32 and the first support plate 21, a clearance groove 211 is opened at the bottom of each first support plate 21 to ensure that each second support plate 31 slides smoothly.

[0069] In this embodiment, the PCB board stress testing device adjusts the position of the two first support plates 21 by sliding them, placing the two first sides 41 of the PCB board 4 on the two first support plates 21 respectively, and screwing the pads 32 onto the corresponding first support plates 21 to clamp the first sides 41. Next, by adjusting the positions of the two second support plates 31 and the pads 32 on each support plate, the two second sides 42 are supported, keeping the PCB board 4 stable.

[0070] Furthermore, the circuit module 43 on the PCB board 4 is pressed down until it falls off. At this time, the pressing stress is transmitted to the force gauge through the strain gauge located at the test point on the PCB board 4, thereby obtaining an accurate stress value, which helps to ensure the accuracy of the test results.

[0071] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A PCB board stress testing device, characterized in that: The device includes a base (1), a clamping assembly (2) slidably disposed on the base (1), and a support assembly (3) slidably disposed on the base (1). The clamping assembly (2) is used to clamp two sides of the PCB board (4), and the support assembly (3) is used to support the other two sides of the PCB board (4) when the clamping assembly (2) clamps the two sides of the PCB board (4). A strain gauge is provided at the test point of the PCB board (4), and the strain gauge is connected to a force gauge to test the stress at the test point of the PCB board (4).

2. The PCB board stress testing device according to claim 1, characterized in that: The side includes a first side (41) located at both ends of the width direction of the PCB board (4), and a second side (42) located at both ends of the length direction of the PCB board (4). The clamping assembly (2) includes a plurality of first support plates (21) arranged at intervals along the width direction of the base (1), and a detachable pressure plate (22) disposed on each of the first support plates (21). Each pressure plate (22) forms a clamping engagement with the corresponding first support plate (21) to clamp the first side (41).

3. The PCB board stress testing device according to claim 2, characterized in that: The support assembly (3) includes a plurality of second support plates (31) arranged at intervals along the length direction of the base (1), and pads (32) slidably disposed on each of the second support plates (31), each of the pads (32) being used to support the second side (42).

4. The PCB board stress testing device according to claim 3, characterized in that: The base (1) is provided with a first groove (11) extending along its own width direction, and each of the first support plates (21) is provided with a first bolt (23). Each of the first support plates (21) slides in the first groove (11) through the corresponding first bolt (23).

5. The PCB board stress testing device according to claim 3, characterized in that: The base (1) is provided with a second slide groove (12) extending along its own length direction, and each of the second support plates (31) is provided with a second bolt (33). Each of the second support plates (31) slides in the second slide groove (12) through the corresponding second bolt (33).

6. The PCB board stress testing device according to claim 3, characterized in that: Each of the pads (32) is provided with a slider (321) at the bottom, and each of the second support plates (31) is provided with a third slide groove (311) extending along the width direction of the base (1). Each of the pads (32) slides on the third slide groove (311) through the corresponding slider (321).

7. The PCB board stress testing device according to claim 6, characterized in that: Each of the first support plates (21) has a relief groove (211) extending along the length of the base (1) at its bottom. The relief groove (211) is used to avoid the pad plate (32).

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