Copper substrate

Abstract

The utility model discloses a copper substrate. The copper substrate comprises a circuit substrate, a first printing ink layer and a polypropylene adhesive layer. The circuit substrate is provided with a first surface and a second surface which are opposite to each other, a plurality of copper circuits are formed on the first surface of the circuit substrate, and the first thickness of each copper circuit is not less than 100 microns. The first printing ink layer is formed on the first surface, and the first printing ink layer is formed among the plurality of copper circuits on the first surface. And the polypropylene adhesive layer is formed on the first printing ink layer. According to the copper substrate provided by the utility model, the problem that the overall thickness of the copper substrate is too large due to the fact that an existing copper substrate comprises too many polypropylene adhesive layers is solved.

Description

Technical Field

[0001] This utility model relates to a substrate, and more particularly to a copper substrate. Background Technology

[0002] Existing copper substrates typically include a polypropylene adhesive layer to fill the gaps between the copper traces. However, because the copper traces on a copper substrate are relatively thick, the amount of polypropylene adhesive layer required to fill these gaps is excessive, resulting in an overall excessive thickness of the copper substrate. Utility Model Content

[0003] This utility model discloses a copper substrate, which is mainly used to improve the problem that the existing copper substrate contains too much polypropylene adhesive layer, resulting in an excessively high overall thickness of the copper substrate.

[0004] One embodiment of this utility model discloses a copper substrate, comprising: a circuit substrate having a first surface and a second surface opposite to each other; a plurality of copper lines formed on the first surface of the circuit substrate, wherein the first thickness of each copper line is not less than 100 micrometers; a first printing ink layer formed on the first surface; wherein the first printing ink layer is formed between the plurality of copper lines located on the first surface; and

[0005] A polypropylene adhesive layer is formed on the first printing ink layer.

[0006] Optionally, the initial thickness of each copper line is between 127 micrometers and 380 micrometers.

[0007] Optionally, the second thickness of the polypropylene adhesive layer is between 2 mils and 32 mils.

[0008] Optionally, the third thickness of the copper substrate is between 18 mils and 236 mils.

[0009] Optionally, the copper substrate has only one polypropylene adhesive layer formed in the first printed ink layer; wherein the polypropylene adhesive layer does not directly contact the first surface of the circuit board.

[0010] Optionally, the top surface of the first printed ink layer is flush with the copper traces located on the first surface.

[0011] Optionally, the circuit substrate has a plurality of copper lines formed on both the first and second surfaces; wherein the copper substrate further includes a second printed ink layer and the second printed ink layer is formed on the second surface; wherein the second printed ink layer is formed between the plurality of copper lines located on the second surface.

[0012] Optionally, the copper substrate includes two polypropylene adhesive layers, and the two polypropylene adhesive layers are respectively formed on the first printing ink layer and the second printing ink layer.

[0013] Optionally, the copper substrate forms only one polypropylene adhesive layer in the first printed ink layer, and the copper substrate forms only one polypropylene adhesive layer in the second printed ink layer.

[0014] Optionally, the top surface of the first printed ink layer and the top surface of the second printed ink layer are respectively aligned with the copper lines located on the first surface and the copper lines located on the second surface.

[0015] In summary, the copper substrate provided by this utility model can improve the problem of excessive overall thickness of existing copper substrates due to excessive polypropylene adhesive layers by means of the technical solutions of "the first thickness of each copper line is not less than 100 micrometers" and "the first printing ink layer is formed on the first surface and the first printing ink layer is formed between the plurality of copper lines located on the first surface".

[0016] To further understand the features and technical content of this utility model, please refer to the following detailed description and drawings of this utility model. However, these descriptions and drawings are only used to illustrate this utility model and are not intended to limit the scope of protection of this utility model in any way. Attached Figure Description

[0017] Figure 1 This is a flowchart illustrating a method for manufacturing a copper substrate according to an embodiment of the present invention.

[0018] Figure 2 A schematic diagram of the preliminary steps in the manufacturing method of the copper substrate according to an embodiment of this utility model.

[0019] Figure 3 A schematic diagram of the first resin ink printing step in the manufacturing method of the copper substrate according to an embodiment of this utility model.

[0020] Figure 4 This is a schematic diagram of the first grinding step in the manufacturing method of the copper substrate according to an embodiment of the present invention.

[0021] Figure 5 This is a schematic diagram of the copper substrate according to an embodiment of the present invention.

[0022] Figure 6 This is a flowchart illustrating a method for manufacturing a copper substrate according to another embodiment of the present invention.

[0023] Figure 7 This is a schematic diagram of the preliminary steps in a method for manufacturing a copper substrate according to another embodiment of the present invention.

[0024] Figure 8 This is a schematic diagram of the first resin ink printing step in a method for manufacturing a copper substrate according to another embodiment of the present invention.

[0025] Figure 9 This is a schematic diagram of the second resin ink printing step in a method for manufacturing a copper substrate according to another embodiment of the present invention.

[0026] Figure 10 A schematic diagram of the second grinding step in the manufacturing method of the copper substrate according to an embodiment of the present invention.

[0027] Figure 11 This is a schematic diagram of a copper substrate according to another embodiment of the present invention. Detailed Implementation

[0028] The following specific embodiments illustrate the implementation of the "copper substrate" disclosed in this utility model. Those skilled in the art can understand the advantages and effects of this utility model from the content disclosed in this specification. This utility model can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this utility model. Furthermore, the accompanying drawings of this utility model are for simple illustrative purposes only and are not depictions of actual dimensions, as stated in advance. The following embodiments will further describe the relevant technical content of this utility model in detail, but the disclosed content is not intended to limit the scope of protection of this utility model.

[0029] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used in this document should, depending on the context, include any combination of one or more related listed items.

[0030] [Manufacturing method of copper substrate]

[0031] Please see Figure 1 As shown, Figure 1 This is a flowchart illustrating a method for manufacturing a copper substrate according to an embodiment of the present invention. The present invention provides a method for manufacturing a copper substrate. The method includes a pre-processing step S110, a first resin ink printing step S120, a first baking step S130, and a lamination step S140. Of course, the method for manufacturing the copper substrate may include other steps as needed, and the present invention does not limit this.

[0032] Please see Figure 2 As shown, Figure 2This is a schematic diagram of the preliminary steps of the copper substrate manufacturing method according to an embodiment of the present invention. In the preliminary step S110, a circuit substrate 1 is provided. The circuit substrate 1 has a first surface 1a and a second surface 1b that are opposite to each other. A plurality of copper lines 11 are formed on the first surface 1a of the circuit substrate 1, and the first thickness T1 of each copper line 11 is not less than 100 micrometers. It is worth mentioning that the first thickness T1 of each copper line 11 is relatively thick, so other lines with a thickness of less than 100 micrometers are not suitable for comparison with the copper lines of the present invention. Optionally, the first thickness T1 of each copper line 11 is between 127 micrometers and 380 micrometers.

[0033] Please see Figure 3 As shown, Figure 3 This is a schematic diagram of the first resin ink printing step in the method for manufacturing a copper substrate according to an embodiment of the present invention. In the first resin ink printing step S120, resin ink is filled between and covers the plurality of copper lines 11 on the first surface 1a by printing, so as to form a first printed ink layer 2 on the first surface of the circuit substrate.

[0034] It is worth mentioning that the copper line 11 provided in the preliminary step S110 of this utility model is relatively thick. If the polypropylene adhesive layer is directly attached to the copper line 11, it is easy to cause gaps between the polypropylene adhesive layer and the copper line 11 or to use too much polypropylene adhesive layer.

[0035] Based on a total weight of 100 wt% for the resin ink, the resin ink comprises 20 wt% to 25 wt% triglycidylaminom-cresol, 5 wt% to 10 wt% epoxy resin, and 60 wt% to 65 wt% silica. Optionally, the resin ink may further comprise a hardener and a defoamer. Based on a total weight of 100 wt% for the resin ink, the content of the hardener is between 1 wt% and 5 wt%, and the content of the defoamer is between 1 wt% and 5 wt%, but the present invention is not limited thereto.

[0036] The resin ink has a pencil hardness greater than or equal to 6H, a glass transition temperature between 140°C and 170°C, a first coefficient of thermal expansion (α1) between 14 ppm / °C and 24 ppm / °C, and a second coefficient of thermal expansion (α2) between 63 ppm / °C and 73 ppm / °C. The first coefficient of thermal expansion (α1) is defined as the coefficient of thermal expansion of the resin ink below the glass transition temperature, and the second coefficient of thermal expansion (α2) is defined as the coefficient of thermal expansion of the resin ink above the glass transition temperature.

[0037] In the first resin ink printing step S120, the first printed ink layer 2 is formed on the first surface 1a of the circuit board 1 by a squeegee S with a squeegee angle between 15 degrees and 30 degrees, a pressure between 0.2 MPa and 0.45 MPa, and a printing speed between 100 mm / s and 450 mm / s.

[0038] In the first baking step S130, the circuit board 1 on which the first printed ink layer 2 is formed is baked. Optionally, in the first baking step S130, the circuit board 1 on which the first printed ink layer 2 is formed is baked at a baking temperature between 90°C and 120°C for 60 to 90 minutes, but the present invention is not limited thereto.

[0039] Please see Figure 1 and Figure 4 As shown, after the first baking step S130 and before the pressing step S140, the method for manufacturing the copper substrate may further include a first grinding step S1301, in which a portion of the first printed ink layer 2 is removed by grinding, so that the copper lines 11 located on the first surface 1a are exposed from the first printed ink layer 2. After the first grinding step S1301, the copper lines 11 located on the first surface 1a may be flush with the first printed ink layer 2, but the present invention is not limited thereto.

[0040] Please see Figure 5 As shown, Figure 5 This is a schematic diagram of a copper substrate according to an embodiment of the present invention. In the lamination step S140, a polypropylene adhesive layer 3 is formed on the first printed ink layer 2 by lamination, thereby forming a copper substrate 100. It is worth mentioning that the first polishing step S1301 can improve the bonding force between the polypropylene adhesive layer 3 and the copper circuit 11, but the manufacturing method of the copper substrate of the present invention is not limited to including the first polishing step S1301.

[0041] Optionally, the second thickness T2 of the polypropylene adhesive layer 3 is between 2 mils and 32 mils, and the third thickness T3 of the copper substrate 100 is between 18 mils and 236 mils, but the present invention is not limited thereto. More preferably, the second thickness T2 of the polypropylene adhesive layer 3 is between 10 mils and 25 mils, and the third thickness T3 of the copper substrate 100 is between 50 mils and 200 mils, but the present invention is not limited thereto.

[0042] Please see Figure 6 and Figure 7 As shown, Figure 6This is a flowchart illustrating a method for manufacturing a copper substrate according to another embodiment of the present invention. Figure 7 This is a schematic diagram of the preliminary steps of a method for manufacturing a copper substrate according to another embodiment of the present invention. In the preliminary step S110' of the other embodiment, a plurality of copper lines 11 are formed on both the first surface 1a and the second surface 1b of the circuit substrate 1. After the first baking step S130 and before the lamination step S140', the printing method of the copper substrate may further include a second resin ink printing step S131 and a second baking step S132.

[0043] Please see Figures 8 to 11 As shown, Figure 8 This is a schematic diagram of the first resin ink printing step in a method for manufacturing a copper substrate according to another embodiment of the present invention. Figure 9 This is a schematic diagram of the second resin ink printing step in a method for manufacturing a copper substrate according to another embodiment of the present invention. Figure 10 This is a schematic diagram of the second polishing step in the manufacturing method of the copper substrate according to an embodiment of the present invention, and Figure 11 This is a schematic diagram of a copper substrate according to another embodiment of the present invention.

[0044] The first resin ink printing step S120 in this embodiment can be the same as in the previous embodiment, and will not be described again here. In the second resin ink printing step S131, the resin ink is filled between and covers the plurality of copper lines 11 on the second surface 1b by printing, so as to form a second printed ink layer 4 on the second surface 1b of the circuit board. The resin ink forming the first printed ink layer 2 can be the same as or different from the resin ink forming the second printed ink layer 4, and this invention does not limit this.

[0045] In the second resin ink printing step S131, the second printed ink layer 4 is formed on the second surface 1b of the circuit board 1 by a squeegee S with a squeegee angle between 15 degrees and 30 degrees, a pressure between 0.2 MPa and 0.45 MPa, and a printing speed between 100 mm / s and 450 mm / s.

[0046] In the second baking step S132, the circuit board 1 on which the first printed ink layer 2 and the second printed ink layer 4 are formed is baked. Optionally, in the second baking step S132, the circuit board 1 on which the first printed ink layer 2 and the second printed ink layer 4 are formed is baked at a baking temperature between 90°C and 120°C for 60 minutes to 90 minutes, but the present invention is not limited thereto.

[0047] like Figure 6 and Figure 11 As shown, after the second baking step S132 and before the pressing step S140', the method for manufacturing the copper substrate may further include a second grinding step S133, in which a portion of the first printed ink layer 2 and a portion of the second printed ink layer 4 are removed by grinding, so that the copper lines 11 located on the first surface 1a and the copper lines 11 located on the second surface 1b are exposed from the first printed ink layer 2 and the second printed ink layer 4, respectively.

[0048] After the second polishing step S133, the copper lines 11 located on the first surface 1a and the copper lines 11 located on the second surface 1b may be respectively aligned with the first printed ink layer 2 and the second printed ink layer 4, but the present invention is not limited thereto. Furthermore, the manufacturing method of the copper substrate of the present invention is not limited to including the second polishing step S133, and in this embodiment, the manufacturing method of the copper substrate does not include the first polishing step S1301.

[0049] Furthermore, in the lamination step S140', two polypropylene adhesive layers 3 are formed on the first printed ink layer 2 and the second printed ink layer 4 respectively by lamination, thereby forming a copper substrate 100'.

[0050] [Copper substrate]

[0051] Please see Figure 5 As shown, this embodiment of the present invention also provides a copper substrate 100. The copper substrate 100 can be obtained, for example, by performing the aforementioned copper substrate manufacturing method, but the present invention is not limited thereto. The copper substrate 100 includes a circuit board 1, a first printed ink layer 2, and a polypropylene adhesive layer 3.

[0052] The circuit board 1 has a first surface 1a and a second surface 1b that are opposite to each other. A plurality of copper lines 11 are formed on the first surface 1a of the circuit board 1, and the first thickness T1 of each copper line 11 is not less than 100 micrometers.

[0053] The first printed ink layer 2 is formed on the first surface 1a, and is formed between the plurality of copper lines 11 located on the first surface 1a. The polypropylene adhesive layer 3 is formed on the first printed ink layer 2 and the copper lines 11. In other words, the first printed ink layer 2 is located between the circuit board 1 and the polypropylene adhesive layer 3, and the polypropylene adhesive layer 3 may not be in direct contact with the first surface 1a of the circuit board 1. Furthermore, the copper substrate 100 may have only one polypropylene adhesive layer 3 formed on the first printed ink layer 2, but this invention is not limited thereto. In addition, the top surface of the first printed ink layer 2 may be flush with the copper lines 11 located on the first surface 1a, but this invention is not limited thereto.

[0054] Optionally, the first thickness T1 of each of the copper lines 11 is between 127 micrometers and 380 micrometers, the second thickness T2 of the polypropylene adhesive layer 3 is between 2 mils and 32 mils, and the third thickness T3 of the copper substrate 100 is between 18 mils and 236 mils, but the present invention is not limited thereto.

[0055] Please see Figure 11 As shown, in another embodiment, both the first surface 1a and the second surface 1b of the circuit substrate 100' are formed with a plurality of copper lines 11. The copper substrate 100' may further include a second printed ink layer 4, and the second printed ink layer 4 is formed on the second surface 1b, and is formed between the plurality of copper lines 11 located on the second surface 1b.

[0056] Furthermore, the copper substrate 100' may include two polypropylene adhesive layers 3, and the two polypropylene adhesive layers 3 are respectively formed on the first printed ink layer 2 and the second printed ink layer 4. The second printed ink layer 4 is located between the circuit substrate 1 and one of the polypropylene adhesive layers 3. The second printed ink layer 4 does not directly contact the second surface 1b of the circuit substrate 1.

[0057] Furthermore, the copper substrate 100' may form only one polypropylene adhesive layer 3 on the first printed ink layer 2, and the copper substrate 100' may form only one polypropylene adhesive layer 3 on the second printed ink layer 4, but the present invention is not limited thereto. The top surface of the first printed ink layer 2 and the top surface of the second printed ink layer 4 may be respectively aligned with the copper lines 11 located on the first surface 1a and the copper lines 11 located on the second surface 1b, but the present invention is not limited thereto.

[0058] [Beneficial Effects of the Embodiments of this Utility Model]

[0059] In summary, the copper substrate provided by this utility model can improve the problem of excessive overall thickness of existing copper substrates due to excessive polypropylene adhesive layers by means of the technical solutions of "the first thickness of each copper line is not less than 100 micrometers" and "the first printing ink layer is formed on the first surface and the first printing ink layer is formed between the plurality of copper lines located on the first surface".

[0060] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. Therefore, all equivalent technical changes made based on the contents of the present utility model specification and drawings are included in the protection scope of the present utility model.

Claims

1. A copper substrate, characterized in that, The copper substrate comprises: A circuit board having a first surface and a second surface opposite to each other, wherein a plurality of copper lines are formed on the first surface, and the first thickness of each copper line is not less than 100 micrometers; A first printed ink layer is formed on the first surface; wherein the first printed ink layer is formed between a plurality of copper lines located on the first surface; as well as A polypropylene adhesive layer is formed on the first printing ink layer.

2. The copper substrate according to claim 1, characterized in that, The first thickness of each of the copper lines is between 127 micrometers and 380 micrometers.

3. The copper substrate according to claim 1, characterized in that, The second thickness of the polypropylene adhesive layer is between 2 mils and 32 mils.

4. The copper substrate according to claim 1, characterized in that, The third thickness of the copper substrate is between 18 mils and 236 mils.

5. The copper substrate according to claim 1, characterized in that, The copper substrate has only one polypropylene adhesive layer formed on the first printed ink layer; wherein the polypropylene adhesive layer does not directly contact the first surface of the circuit substrate.

6. The copper substrate according to claim 1, characterized in that, The top surface of the first printed ink layer is flush with the copper trace located on the first surface.

7. The copper substrate according to claim 1, characterized in that, The circuit board has a plurality of copper lines formed on both the first surface and the second surface; wherein the copper board further includes a second printed ink layer, and the second printed ink layer is formed on the second surface; wherein the second printed ink layer is formed between the plurality of copper lines located on the second surface.

8. The copper substrate according to claim 7, characterized in that, The copper substrate includes two polypropylene adhesive layers, and the two polypropylene adhesive layers are respectively formed on the first printing ink layer and the second printing ink layer.

9. The copper substrate according to claim 8, characterized in that, The copper substrate forms only one polypropylene adhesive layer in the first printed ink layer, and the copper substrate forms only one polypropylene adhesive layer in the second printed ink layer.

10. The copper substrate according to claim 7, characterized in that, The top surfaces of the first printed ink layer and the second printed ink layer are respectively aligned with the copper lines located on the first surface and the copper lines located on the second surface.

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