Heat dissipation device with simple structure
By employing a combined structure of mounting components, thermal conductive components, and heat dissipation components in the heat dissipation device, the problem of small contact area between the heat sink and the heat dissipation component is solved, achieving efficient heat dissipation and cost reduction.
Patent Information
- Application Number
- CN202423131256.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-18
- Publication Date
- 2026-02-24
- Estimated Expiration
- 2034-12-18
AI Technical Summary
In existing heat dissipation devices, the contact area between the heat sink and the heat dissipation component is small, resulting in low heat dissipation efficiency, and the structure is complex and costly.
It adopts a combined structure of mounting components, heat-conducting components, and heat dissipation components, in which heat-conducting components and heat sinks are set one-to-one to increase the contact area, and heat conduction efficiency is improved by heat pipes and heat-conducting components, simplifying the structure and reducing costs.
It improves heat dissipation efficiency, increases the contact area between the heat sink and the heat dissipation component, simplifies the structure, and reduces costs.
Smart Images
Figure CN223943020U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of radiator technology, and in particular to a heat dissipation device with a simple structure. Background Technology
[0002] Because stage lights or other lighting fixtures, CPUs, and other heat-generating components have a high heat output, their lifespan will be significantly reduced if the heat generated is not cooled down in time. Therefore, placing these components on a heat dissipation device during use helps to ensure their lifespan.
[0003] Currently, a common heat dissipation device includes a mounting plate, heat pipes, and heat sinks. The heat-generating element is fixed to the mounting plate, and the heat pipes are fixed to the side of the mounting plate opposite to the heat-generating element, passing through the heat sinks to achieve heat dissipation. However, this heat dissipation structure has a small contact area between the heat pipes and the heat sinks, resulting in low heat dissipation efficiency. Another commonly used heat dissipation device includes a mounting plate, heat pipes, and a heat dissipation assembly. The heat-generating element is fixed to the mounting plate, and the heat pipes are fixed to the side of the mounting plate opposite to the heat-generating element. The heat dissipation assembly includes a mounting frame and multiple heat sinks. The heat sinks are arranged parallel and spaced apart along a direction perpendicular to the mounting plate within the mounting frame, and the heat pipes are attached to the outer wall of the mounting frame. In this heat dissipation device, heat is conducted to the mounting frame through the heat pipes, and then to the heat sinks for heat dissipation. This heat dissipation assembly structure is complex and costly.
[0004] To solve the above problems, there is an urgent need to provide a heat dissipation device with a simple structure. Summary of the Invention
[0005] The purpose of this invention is to propose a simple heat dissipation device that increases the contact area between the heat sink and the heat dissipation component, improves heat dissipation efficiency, and reduces costs.
[0006] To achieve this objective, the present invention adopts the following technical solution:
[0007] A simple heat dissipation device includes:
[0008] The mounting components are configured to mount heat-generating elements;
[0009] A heat-conducting assembly includes a plurality of heat-conducting elements, which are arranged parallel to each other and spaced apart along a first direction, and the heat-conducting elements abut against the mounting assembly.
[0010] The heat dissipation assembly includes multiple heat sinks, which are arranged parallel to each other and spaced apart along the first direction. The heat sinks are connected to the mounting assembly, and the side of the thermal conductive element is connected to the side of the heat sink. The thermal conductive element and the heat sink are arranged in a one-to-one correspondence.
[0011] As an optional solution, the heat-conducting element includes:
[0012] The heat-absorbing part abuts against the mounting assembly, and the sides of two adjacent heat-absorbing parts are in contact.
[0013] As an alternative, the heat-absorbing part has a square cross-sectional shape.
[0014] As an optional feature, the heat-conducting component further includes:
[0015] A heat-conducting part is connected to one end of the heat-absorbing part, and the cross-section of the heat-conducting part is flattened along the first direction, so that the thickness of the heat-conducting part along the first direction is less than the interval between two adjacent heat sinks.
[0016] As an optional embodiment, the heat-conducting part includes:
[0017] The first heat pipe is perpendicularly connected to the heat-absorbing part;
[0018] A bent tube is connected to the first heat-conducting pipe; and
[0019] The second heat pipe is connected to the bent pipe. The first heat pipe, the bent pipe and the second heat pipe are connected in a U-shape and the opening direction faces the heat absorption part.
[0020] As an alternative, there are two heat-conducting parts, which are respectively connected to the two ends of the heat-absorbing part.
[0021] As an optional solution, the installation components include:
[0022] Mounting plate, the heating element is mounted on the mounting plate, and the mounting plate is provided with mounting groove; and
[0023] Multiple uniformly heated heat pipes are arranged in the mounting groove in parallel and with their sides in contact.
[0024] As an alternative, the mounting plate includes a body and a boss, the boss being disposed on the end face of the body opposite to the heat dissipation assembly, and the heat-generating element being disposed on the boss.
[0025] As an optional solution, the heat dissipation device further includes:
[0026] A mounting bracket is disposed at one end of the heat dissipation assembly opposite to the mounting assembly, and the mounting bracket is configured to fix the heat sink.
[0027] As an alternative, the mounting bracket is provided with multiple mounting slots, and the heat sink is inserted into the mounting slots for fixation.
[0028] The beneficial effects of this utility model are as follows:
[0029] This utility model discloses a simple heat dissipation device, comprising a mounting component, a heat-conducting component, and a heat dissipation component. The mounting component is configured to mount a heat-generating element. The heat-conducting component includes multiple heat-conducting elements arranged parallel to each other and spaced apart along a first direction, with each heat-conducting element abutting against the mounting component. The heat dissipation component includes multiple heat sinks arranged parallel to each other and spaced apart along the first direction, connected to the mounting component, with the sides of the heat-conducting elements connected to the sides of the heat sinks. Each heat-conducting element and each heat sink is correspondingly arranged. This heat dissipation component increases the contact area between the heat sinks and the heat-conducting elements, improving heat dissipation efficiency, and its simple structure helps reduce costs. Attached Figure Description
[0030] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this utility model and these drawings without creative effort.
[0031] Figure 1 This is a schematic diagram of the structure of the heat dissipation device provided in this embodiment of the utility model. Figure 1 ;
[0032] Figure 2 This is a schematic diagram of the structure of the heat dissipation device provided in this embodiment of the utility model. Figure 2 .
[0033] The markings in the image are as follows:
[0034] 100 - Mounting component; 110 - Mounting plate; 111 - Body; 112 - Boss; 120 - Heat pipe with uniform temperature distribution;
[0035] 200 - Thermal conductive component; 210 - Thermal conductive element; 211 - Heat absorption part; 212 - Thermal conductive part; 2121 - First thermal conductive pipe; 2122 - Bent pipe; 2123 - Second thermal conductive pipe;
[0036] 300 - Heat dissipation component; 310 - Heat sink;
[0037] 400-Fixed bracket;
[0038] 500 - Heating element. Detailed Implementation
[0039] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only partial structures relevant to the present invention, not the complete structure.
[0040] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the connection of the internal structures of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0041] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0042] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.
[0043] This embodiment provides a simple heat dissipation device for dissipating heat from the heat-generating component 500.
[0044] like Figure 1 and Figure 2 The heat dissipation device includes a mounting assembly 100 for mounting a heat-generating component 500. The heat-generating component 500 can be a stage light, a general lighting fixture, an LED light, a CPU, or other heat-generating components. The mounting assembly 100 has a plate-like structure, and the heat-generating component 500 is fixed to the side of the mounting assembly 100 by fasteners.
[0045] Please continue reading Figure 1and Figure 2 Specifically, the mounting assembly 100 includes a mounting plate 110 and multiple heat pipes 120. The heating element 500 is mounted on the mounting plate 110, which has mounting grooves. The heat pipes 120 are parallel to each other and side-to-side contact within these grooves. By fixing the heating element 500 with the heat pipes 120, heat can be quickly absorbed from the heating element 500. Furthermore, the multiple heat pipes 120 in contact can conduct heat quickly, ensuring that the temperature at different locations on the heat pipes 120 is essentially the same. This helps ensure the uniformity of heat distribution in the mounting assembly 100, preventing the mounting plate 110 from shrinking due to uneven heat distribution. It also prevents uneven heat dissipation in different areas of the heat dissipation device due to uneven temperature distribution in the mounting assembly 100, thus improving the overall uniformity of heat dissipation and preventing heat concentration.
[0046] Specifically, multiple heat pipes 120 are glued together and then soldered onto the mounting plate 110 with solder paste, which helps improve the stability of the heat pipes 120. The cross-sectional shape of the heat pipes 120 is oriented in a specific direction, thereby increasing the contact area between two adjacent heat pipes 120, which helps improve the heat conduction effect.
[0047] Furthermore, the mounting plate 110 includes a body 111 and a boss 112. The boss 112 is disposed on the end face of the body 111 facing away from the heat dissipation assembly 300, and the heat-generating element 500 is disposed on the boss 112. This helps to reduce the deformation of the mounting plate 110 by increasing the thickness of the fixing position of the heat-generating element 500, and further increases the flatness of the mounting plate 110. Optionally, the thickness of the boss 112 is 0.5-3 mm. Considering material saving and the appropriate weight and volume of the heat dissipation device, a thickness of 1 mm is most suitable for the boss 112.
[0048] Furthermore, the surface of the mounting plate 110 that contacts the heating element 500 is treated with a screed finish, which helps to further increase the flatness and smoothness of the mounting plate 110. It is understood that in this embodiment, the mounting plate 110 only needs to have the boss 112 screed, reducing the area of the screed finish and thus lowering processing costs.
[0049] As an alternative, the mounting groove in this embodiment is a through groove along the thickness direction of the mounting plate 110, so that one side of the heat pipe 120 located in the mounting groove is in contact with the heating element 500 to directly absorb heat, and the other side can directly contact other heat dissipation structures of the heat dissipation device to improve heat dissipation efficiency.
[0050] As an optional solution, the heat dissipation device also includes a heat-conducting component 200 and a heat dissipation component 300. The heat-conducting component 200 includes a plurality of heat-conducting elements 210, which are arranged parallel to each other and spaced apart along a first direction. The heat-conducting elements 210 abut against the mounting component 100, thereby directly absorbing heat from the mounting component 100 and conducting it to a distant end using the plurality of heat-conducting elements 210. Furthermore, the heat-conducting elements 210 directly abut against the heat pipe 120 of the mounting component 100 to improve heat conduction efficiency.
[0051] The heat dissipation assembly 300 includes multiple heat sinks 310, which are arranged parallel to each other and spaced apart along a first direction. The heat sinks 310 are connected to the mounting assembly 100, and the side of the heat-conducting element 210 is connected to the side of the heat sink 310. The heat-conducting element 210 and the heat sink 310 are arranged in a one-to-one correspondence. Compared to the existing structure of heat pipe heat transfer and multiple heat sinks 310, this heat dissipation assembly 300 increases the contact area between the heat sinks 310 and the heat dissipation element, which is beneficial for improving heat dissipation efficiency. Compared to the existing heat dissipation devices that require a mounting frame for fixing the heat sinks 310, this heat dissipation assembly 300 has a simpler structure, which helps reduce costs.
[0052] Specifically, the bottom edge of the heat sink 310 is welded to the side of the heat pipe 120 to increase power.
[0053] Optionally, the heat-conducting component 210 includes a heat-absorbing part 211, which abuts against the mounting assembly 100. The sides of two adjacent heat-absorbing parts 211 are in contact, so that the heat-absorbing part 211 can directly contact the heat pipe 120 for heat conduction, which is beneficial to improving the thermal conductivity.
[0054] The heat-absorbing part 211 has a square cross-sectional shape, which helps to increase the contact area between adjacent heat-absorbing parts 211 and the contact area between the heat-absorbing part 211 and the heat pipe 120, thereby improving the thermal conductivity.
[0055] The heat-conducting component 210 also includes a heat-conducting part 212, which is connected to one end of the heat-absorbing part 211. Along the first direction, the cross-section of the heat-conducting part 212 is flattened, so that the thickness of the heat-conducting part 212 along the first direction is less than the gap between two adjacent heat sinks 310. On the one hand, the flattened heat-conducting part 212 can increase the contact area between the heat-conducting part 212 and the heat sink 310, thereby improving the heat conduction efficiency. On the other hand, the flattening of the heat-conducting part 212 can increase the ventilation gap formed between the heat-conducting part 212 and the heat sink 310, thereby improving the heat dissipation efficiency.
[0056] More specifically, the heat-conducting part 212 includes a first heat-conducting pipe 2121, a bent portion, and a second heat-conducting pipe 2123. The first heat-conducting pipe 2121 is perpendicularly connected to the heat-absorbing part 211, the bent pipe 2122 is connected to the first heat-conducting pipe 2121, and the second heat-conducting pipe 2123 is connected in a U-shape, with the opening facing the heat-absorbing part 211. This bent heat-conducting part 212 is advantageous because, within the limited height of the heat sink 310, the length of the heat-conducting part 212 is increased by bending the heat-conducting part 212, thereby increasing the contact area between the heat-conducting part 212 and the heat sink 310, which is beneficial for improving the heat dissipation effect.
[0057] In the prior art, the heat-conducting component 210 is usually fastened to the heat sink 310 by snap-fit and then welded. This method has a complex structure and high processing cost. In this embodiment, during the assembly process, the heat-conducting component 210 is placed one by one into the gaps of the heat sink 310, and then the heat-conducting component 210 is fixed to the heat sink 310 by a welding fixture, thereby reducing the processing cost of the heat sink 310 and the assembly cost of the heat dissipation device.
[0058] Furthermore, there are two heat-conducting parts 212, which are respectively connected to the two ends of the heat-absorbing part 211, thereby further increasing the length of the heat-conducting part 212 and increasing the contact area between the heat-conducting component 210 and the heat sink 310 to improve heat dissipation efficiency.
[0059] Optionally, the heat dissipation device also includes a mounting bracket 400, which is disposed at the end of the heat dissipation assembly 300 away from the mounting assembly 100. The mounting bracket 400 is used to fix the heat sink 310 to improve the structural stability of the multiple heat sinks 310.
[0060] Furthermore, the mounting bracket 400 is provided with multiple mounting slots, and the heat sink 310 is inserted into the mounting slots for fixation, which helps to limit the position of the heat sink 310 and further improve the relative positional stability between the multiple heat sinks 310.
[0061] Note that the above description illustrates and describes the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope. All such changes and modifications fall within the scope of the claimed utility model, which is defined by the appended claims and their equivalents.
Claims
1. A heat dissipation device with a simple structure, characterized in that, include: The mounting component (100) is configured to mount the heating element (500); The heat-conducting assembly (200) includes a plurality of heat-conducting elements (210), which are arranged parallel to each other and spaced apart along a first direction, and the heat-conducting elements (210) abut against the mounting assembly (100); The heat dissipation assembly (300) includes a plurality of heat sinks (310), which are arranged parallel to each other and spaced apart along the first direction. The heat sinks (310) are connected to the mounting assembly (100), and the side of the heat-conducting component (210) is connected to the side of the heat sink (310). The heat-conducting component (210) and the heat sink (310) are arranged in a one-to-one correspondence. The heat-conducting component (210) includes: The heat-absorbing part (211) abuts against the mounting assembly (100), and the sides of two adjacent heat-absorbing parts (211) are in contact. The heat-conducting component (210) also includes: The heat-conducting part (212) is connected to one end of the heat-absorbing part (211), and the cross section of the heat-conducting part (212) is flattened along the first direction, so that the thickness of the heat-conducting part (212) along the first direction is less than the interval between two adjacent heat sinks (310).
2. The heat dissipation device with a simple structure according to claim 1, characterized in that, The heat-absorbing part (211) has a square cross-sectional shape.
3. The heat dissipation device with a simple structure according to claim 1, characterized in that, The heat-conducting part (212) includes: The first heat pipe (2121) is perpendicularly connected to the heat-absorbing part (211); A bent tube (2122) is connected to the first heat-conducting tube (2121); and The second heat pipe (2123) is connected to the bent pipe (2122). The first heat pipe (2121), the bent pipe (2122) and the second heat pipe (2123) are connected in a U-shape, and the opening direction faces the heat absorption part (211).
4. The heat dissipation device with a simple structure according to claim 1, characterized in that, There are two heat-conducting parts (212), and the two heat-conducting parts (212) are respectively connected to the two ends of the heat-absorbing part (211).
5. The simple heat dissipation device according to any one of claims 1-4, characterized in that, The mounting component (100) includes: Mounting plate (110), the heating element (500) is disposed on the mounting plate (110), and the mounting plate (110) is provided with a mounting groove; and Multiple uniformly heated heat pipes (120) are arranged in the mounting groove in parallel and with their sides in contact.
6. The heat dissipation device with a simple structure according to claim 5, characterized in that, The mounting plate (110) includes a body (111) and a boss (112). The boss (112) is disposed on the end face of the body (111) away from the heat dissipation component (300), and the heat-generating component (500) is disposed on the boss (112).
7. The simple heat dissipation device according to any one of claims 1-4, characterized in that, The heat dissipation device also includes: A mounting bracket (400) is disposed at one end of the heat dissipation assembly (300) away from the mounting assembly (100), and the mounting bracket (400) is configured to fix the heat sink (310).
8. The heat dissipation device with a simple structure according to claim 7, characterized in that, The mounting bracket (400) is provided with multiple mounting slots, and the heat sink (310) is inserted into the mounting slots for fixation.