Spin coater suction head applicable to laminated battery

By designing a spin coater nozzle suitable for stacked solar cells with a circular base and a square vacuum adsorption platform, the problems of deformation and back-side contamination of crystalline silicon solar cells during spin coating were solved, achieving efficient solution coating.

CN223946022UActive Publication Date: 2026-02-27东方电气长三角(杭州)创新研究院有限公司
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Patent Information

Application Number
CN202422990662.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-05
Publication Date
2026-02-27
Estimated Expiration
2034-12-05

AI Technical Summary

Technical Problem

Existing spin coater nozzles cannot effectively protect crystalline silicon solar cells from deformation and backside contamination during spin coating, thus affecting the spin coating effect.

Method used

A spin coater nozzle suitable for stacked solar cells was designed. It features a circular base and a square vacuum adsorption platform, equipped with vacuum channels and vacuum holes. Combined with a counterweight design, it ensures that the silicon wafer does not deform during rotation and prevents solution penetration.

Benefits of technology

This ensures that the silicon wafer does not deform during high-speed rotation, avoids backside contamination, and guarantees a uniform coating effect of the solution.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a spin coater suction head suitable for a laminated battery. The spin coater suction head comprises a suction head circular base integral structure, a base and a supporting column, and the counterweight is provided with a bulge, a square vacuum adsorption platform, a vacuumizing channel and a vacuum hole. The suction head has a circular integral design, and the supporting column has a counterweight design, so that uniform stress in a high-speed rotating process is ensured; the square silicon wafer is directly adsorbed on the square adsorption platform, so that the silicon wafer can be ensured not to deform and the edge is not leaked in the high-speed rotation process through downward vacuum adsorption force, the back pollution of the perovskite material in the spin-coating process is avoided, and the spin-coating effect of the solution on the silicon wafer is ensured.
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Description

TECHNICAL FIELD

[0001] The utility model belongs to the field of gluing equipment, especially relates to a uniform glue machine suction head suitable for laminated battery. BACKGROUND

[0002] Spin coating is a mature and stable process, low cost, can complete a large number of experiments in a short period of time, and various universities and enterprises use spin coating method for research and development. The uniform glue machine is mainly applied to the preparation of thin film by spin coating method, and its working principle is that the centrifugal force generated when the substrate rotates at high speed makes the glue liquid dropped on the substrate spread uniformly from the center to the outside and be coated on the substrate, and the thickness is different according to the different viscosity coefficients between the glue liquid and the substrate, and is also related to the rotation speed and time. The uniform glue machine is a common instrument in perovskite battery research and development laboratory, and conductive glass is generally used as the substrate. The difference is that the preparation of perovskite-silicon laminated battery needs to spin coating perovskite solution, passivation layer solution and the like on the silicon wafer substrate.

[0003] The uniform glue machine suction head is an important part of the uniform glue machine, has a vacuum adsorption function, and ensures that the substrate does not fall off during rotation. However, the uniform glue machine does not develop a uniform glue machine suction head for the very thin and fragile and deformable substrate of the silicon wafer. The current suction head mainly has two kinds: the first kind is that the suction head has a small rubber ring in the center, and the vacuum pressure in the rubber ring is adsorbed, as shown in the figure. Even if the vacuum degree is adjusted to the lowest, the silicon wafer will deform invisibly to the naked eye, causing the uniformity of the thin film to decrease, and affecting the spin coating effect. The second kind is a circular suction head applied in the field of semiconductor wafers, as shown in the figure. The suction head has a full flat adsorption platform, which can ensure that the silicon wafer does not deform, but during rotation, since the silicon wafer is square, the silicon wafer has a region suspended at the four corners, and the silicon wafer will still deform invisibly to the naked eye during rotation, affecting the film forming effect. If the silicon wafer is small, it can be placed on the circular substrate, although it can be ensured to be full flat, but the solution will penetrate to the back of the silicon wafer, causing back pollution. UTILITY MODEL CONTENTS

[0004] The utility model aims at the deficiency of prior art, and proposes a uniform glue machine suction head suitable for laminated battery.

[0005] The utility model aims at the deficiency of prior art, and proposes a uniform glue machine suction head suitable for laminated battery.

[0006] The suction head circular base overall structure includes: base, support column and counterweight design protrusion, the support column is installed at the bottom center of the base, and the counterweight design protrusion is installed at the connecting place;

[0007] The square vacuum suction platform is arranged above the base of the suction head circular base integral structure, and is provided with a vacuum suction channel on the surface, and the vacuum suction channel is provided with vacuum holes.

[0008] Further, the counterweight design has four protrusions, which are all triangular pyramids with wide top and narrow bottom, and are uniformly distributed in the middle positions of the support columns corresponding to the two top corners of the square vacuum suction platform, and the four counterweight protrusions are spaced apart by 90 degrees on the outer side of the support column and connected with the bottom of the base.

[0009] Further, the base is a disc, and the size is set as a diameter of 2-500 cm according to the size of the spin-on silicon wafer.

[0010] Further, the vacuum suction channel is a plurality of concentric square channels, and each square channel is connected through two straight channels.

[0011] Further, the vacuum holes are arranged in five points of up, down, left, right and middle in the vacuum suction channel, and are uniformly distributed.

[0012] Further, the support column is a hollow cylinder for being inserted into the cylindrical protrusion of the rotating part of the uniform glue machine.

[0013] Further, the vacuum holes are gathered into a total vacuum channel inside the square vacuum suction platform, and are connected to the bottom of the square vacuum suction platform and connected with the hollow part in the support column.

[0014] Further, the size of the square vacuum suction platform is designed as 75%-95% of the size of the experimental spin-on square silicon wafer.

[0015] The uniform glue machine suction head of the utility model has the advantages that the uniform glue machine suction head of the utility model has a square suction platform, and has a counterweight design, and the downward vacuum suction force can ensure that the silicon wafer is not deformed and the edge does not leak liquid in the high-speed rotating process, avoids backside pollution in the spin-on process of perovskite material, and ensures the spin-on effect of the solution on the silicon wafer. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is a structure schematic view of the uniform glue machine suction head of the utility model;

[0017] Figure 2 It is a side view schematic view of the uniform glue machine suction head of the utility model;

[0018] Figure 3 It is a top view schematic view of the uniform glue machine suction head of the utility model.

[0019] Wherein, 1 - suction head circular base overall structure, 11 - base, 12 - support column, 13 - counterweight design protrusion, 2 - square vacuum suction platform, 21 - vacuum channel, 22 - vacuum hole, 3 - silicon wafer to be spin coated. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be described clearly and completely below in combination with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the single embodiment in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model. The glue distributor suction head provided by the utility model patent is a whole, is made in a machining mode, is part of the glue distributor, and can be directly inserted on the cylindrical protrusion of the rotating part of the glue distributor (the protrusion has a vacuum channel). The upper part is used for adsorbing a silicon wafer.

[0021] As shown in Figure 1 , Figure 2 and Figure 3 , the utility model provides a glue distributor suction head suitable for laminated battery, it includes suction head circular base overall structure 1 and square vacuum suction platform 2. The suction head circular base 1 overall structure includes: base 11, support column 12 and counterweight design protrusion 13;The base is disc-shaped, and the size is set to be 2-500cm in diameter according to the size difference of spin-on silicon wafer;The support column 12 is a hollow cylinder, is installed at the bottom center of the base 11, and four counterweight design protrusions 13 are installed at the connecting part, are all triangular pyramids with wide upper part and narrow lower part, are evenly distributed in the middle position of the support column 12 corresponding to two top corners of the square vacuum suction platform 2, and the four counterweights are spaced apart by 90° from each other;The counterweight design protrusion 13 is used to offset the inconsistent centrifugal force problem caused by the square platform.

[0022] The square vacuum suction platform 2 is installed above the base of the suction head circular base 11 overall structure and is provided with concentric square-shaped vacuum channels 21 on the surface, and the vacuum channels 21 are provided with vacuum holes 22. Each square channel is connected by two straight channels. The square vacuum channels 21 are used to uniformly distribute the vacuum suction force and avoid the deformation of the silicon wafer. The vacuum holes 22 are connected to the bottom of the square vacuum suction platform 2 and the hollow part of the support column. The vacuum holes are arranged at five points in the upper, lower, left, right and middle directions of the vacuum channel, and are uniformly distributed.

[0023] The uniform glue machine suction head has the base 11 structure of disc type, the base 11 of disc type is slightly larger than square vacuum adsorption platform 2, and the thickness is thicker than square vacuum adsorption platform 2, the main body of the suction head is circular instead of square, and the rotation is more uniform.

[0024] The base 11 is below support column 12, support column 12 is circular hollow, can be directly inserted into the cylindrical convex of the rotating part of the uniform glue machine (the convex has a vacuum hole), when using, the uniform glue machine is connected with vacuum pump to vacuumize below, the air flows from top to bottom, and the silicon wafer 3 to be spin-coated is pressed on the square adsorption platform by atmospheric pressure.

[0025] In actual use, first, the silicon wafer is placed on the base, adjusted to the center position, and the vacuum adsorption is started; after confirming the firm adsorption, the solution is added to the silicon wafer, the spin-coating is started, the vacuum adsorption is released after the spin-coating is completed, the silicon wafer is taken away, and the spin-coating process is completed.

[0026] The above embodiment is used to explain and illustrate the utility model, and is not limited to the utility model, and any modification and change made to the utility model falls within the protection scope of the utility model.

Claims

1. A spin coater nozzle suitable for laminated batteries, characterized in that, The application relates to a rotary evaporation device for spin coating silicon wafer. The rotary evaporation device comprises a suction head circular base overall structure and a square vacuum adsorption platform. The suction head circular base overall structure comprises a base, a supporting column and a counterweight design protrusion, the supporting column is arranged at the bottom center of the base, and the counterweight design protrusion is arranged at the connecting position. The square vacuum adsorption platform is arranged above the base of the suction head circular base overall structure and is provided with a vacuum suction channel on the surface, and the vacuum suction channel is provided with vacuum holes.

2. A suction head for a laminating machine for laminating a battery according to claim 1, wherein The four counterweight design protrusions are all triangular pyramids with wide upper part and narrow lower part, are uniformly distributed at the middle positions of the supporting columns corresponding to the two top corners of the square vacuum adsorption platform, and are spaced 90 degrees apart from each other on the outer side of the supporting columns and connected with the bottom of the base.

3. A suction head for a lamination machine for laminating a battery as claimed in claim 1, wherein The base is a disc, and the size is set as a diameter of 2-500 cm according to the size of the spin coating silicon wafer.

4. The uniform coating machine suction head for laminated battery according to claim 1, wherein, The vacuum suction channel is a plurality of concentric square channels, and each square channel is connected through two straight channels.

5. A uniform coating machine suction head for use with a stacked battery according to claim 4, wherein The vacuum holes are arranged in five points of upper, lower, left, right and middle directions in the vacuum suction channel and are uniformly distributed.

6. A uniform coating machine suction head for use with a stacked battery according to claim 1, wherein The supporting column is a hollow cylinder and is used for being inserted into a cylindrical protrusion of a rotating part of a spin coater.

7. A lamination cell suitable applicator suction head according to claim 6, characterized in that, The vacuum holes are gathered into a total vacuum channel in the square vacuum adsorption platform, are connected to the bottom of the square vacuum adsorption platform and are connected with the hollow part in the supporting column.

8. A suction head for a lamination machine for laminating a battery according to claim 1, wherein The size of the square vacuum adsorption platform is designed as 75%-95% of the size of the experimental spin coating square silicon wafer.