Semiconductor chip feeding device

Abstract

A semiconductor chip feeding device comprises two supporting plates, two transmission rollers are rotationally arranged on the side walls, close to each other, of the two supporting plates, a transmission belt is arranged between the two transmission rollers in a winding mode, one side wall of one supporting plate is fixedly connected with an L-shaped fixing plate, and a driving motor is installed on the outer wall of one side of the L-shaped fixing plate. Compared with the prior art, the chip cleaning and blowing device has the advantages that through the arrangement of the banister brush roller and the cleaning and blowing mechanism, the functions of cleaning and cleaning and blowing are integrated, dust and impurities on the surface of a chip are removed in real time in the chip transferring process, the cleanliness of the chip can be more efficiently and thoroughly guaranteed, and therefore the overall quality of the chip is remarkably improved; through the dust collection mechanism, air exhaust operation can be carried out in real time, impurities such as cleaned and blown dust can be rapidly sucked away, the dust is effectively prevented from being re-deposited on the surface of the chip or diffused to the surrounding environment in the cleaning and blowing process, and therefore secondary pollution is prevented.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip processing technical field, especially a kind of semiconductor chip feeding device. BACKGROUND

[0002] Chip is a kind of micro electronic device, usually made of semiconductor material, integrated with a large number of electronic components, for performing various electronic functions. Chip is the core component of modern electronic equipment, widely used in computer, mobile phone, household appliance, automobile, medical equipment and other fields. Feeding device plays the role of automation operation, accurate positioning, improving efficiency, compatible with a variety of chips, improving production consistency, reducing production cost, supporting complex process and improving safety in chip processing process. Feeding device efficiently and accurately transfers chip from previous process to next process to improve the quality and efficiency of chip production.

[0003] In the process of semiconductor chip production, when chip is transferred from previous process to next process for feeding, traditional feeding method often cannot effectively guarantee the cleanliness of chip. Because chip surface is easy to be contaminated by dust, particles and other impurities, the existence of these impurities will seriously affect the performance and yield of chip. Traditional feeding device usually only has simple mechanical handling function, lacks effective cleaning mechanism for chip surface, which leads to chip being easily contaminated in transfer process, and further affects the quality and efficiency of subsequent process. UTILITY MODEL CONTENTS

[0004] The main purpose of the utility model is to provide a kind of semiconductor chip feeding device, which can effectively solve the problems in the background art.

[0005] To achieve the above purpose, the technical scheme adopted by the utility model is as follows: a kind of semiconductor chip feeding device, including two supporting plates, two transmission rollers are rotatably arranged on the side wall of the two supporting plates close to each other, a transmission belt is wound between the two transmission rollers, an L-shaped fixed plate is fixedly connected to the side wall of one of the supporting plates, a drive motor is installed on the side wall of the L-shaped fixed plate, the output shaft of the drive motor penetrates the side wall of the L-shaped fixed plate and is fixedly connected to one end of one of the transmission rollers, a side plate is fixedly connected to the upper side wall of each of the two supporting plates, a soft brush roller is rotatably arranged between the two side plates, one end of the soft brush roller penetrates one of the supporting plates and is fixedly connected to a driven wheel, a driving wheel is fixedly sleeved on the output shaft of the drive motor, the driving wheel and the driven wheel are driven by a toothed belt, and a cleaning and blowing mechanism is further arranged on one of the supporting plates and a dust collecting mechanism is arranged on the other supporting plate.

[0006] As a further description of the above technical scheme, the blowing mechanism comprises an L-shaped support, a mounting seat, a spray gun, an air pump and a communication pipe, wherein the upper side wall of one of the support plates is fixedly connected with the L-shaped support, the upper side outer wall of the L-shaped support is fixedly connected with the mounting seat, the mounting seat is provided with the spray gun, the side outer wall of the L-shaped support is provided with the air pump, and the output port of the air pump is communicated with the spray gun through the communication pipe.

[0007] As a further description of the above technical scheme, the dust collecting mechanism comprises an L-shaped connecting rod, a negative pressure cover, a dust collecting box, a box cover, an air inlet pipe, a dust filter element and a fan, the upper side wall of the other support plate is fixedly connected with two L-shaped connecting rods and the dust collecting box is fixedly connected between the two L-shaped connecting rods, the other ends of the two L-shaped connecting rods are fixedly connected with the negative pressure cover, the upper side wall of the dust collecting box is detachably connected with the box cover through a connecting mechanism, the air inlet pipe is arranged between the box cover and the negative pressure cover, the dust collecting box is provided with the dust filter element, and the bottom wall of the dust collecting box is provided with the fan.

[0008] As a further description of the above technical scheme, the connecting mechanism comprises a containing cavity, a clamping block, a threaded sleeve and a bolt, the upper side inner walls of the front and rear sides of the dust collecting box are both provided with two symmetrically distributed containing cavities, the containing cavities are slidably provided with the clamping block, the side wall of the containing cavity away from the clamping block is embedded with the threaded sleeve, the threaded sleeve is threadedly connected with the bolt, and one end of the bolt is rotatably connected with the clamping block.

[0009] As a further description of the above technical scheme, the box cover is provided with a clamping groove for inserting the clamping block.

[0010] As a further description of the above technical scheme, the transmission belt is uniformly provided with a plurality of rubber columns, the other end of the rubber column is fixedly connected with a placing shell, and the placing shell is provided with an electric vacuum chuck.

[0011] Compared with the prior art, the utility model has the advantages of:

[0012] 1. The soft hair brush roller and the blowing mechanism are arranged, the functions of cleaning and blowing are integrated, dust and impurities on the surface of the chip are removed in real time during the chip transfer process, the cleanliness of the chip can be more efficiently and more completely guaranteed, and therefore the overall quality of the chip is significantly improved.

[0013] 2. The dust collecting mechanism is arranged, air suction operation can be performed in real time, dust and impurities blown down are quickly sucked away, dust is effectively prevented from being re-deposited on the surface of the chip or diffused to the surrounding environment during the blowing process, and therefore secondary pollution is prevented. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1The utility model discloses a whole structure schematic diagram of a semiconductor chip feeding device.

[0015] Figure 2 The utility model discloses a sectional view of the supporting plate of the semiconductor chip feeding device.

[0016] Figure 3 The utility model discloses a split view of the dust collecting box and the box cover of the semiconductor chip feeding device.

[0017] Figure 4 The utility model discloses a sectional view of the dust collecting box of the semiconductor chip feeding device.

[0018] Figure 5 The utility model discloses a left view of the semiconductor chip feeding device.

[0019] In the figure: 1, supporting plate;2, transmission roller;3, transmission belt;4, L-shaped fixed plate;41, drive motor;5, side plate;51, soft hair brush roller;52, driven wheel;53, driving wheel;54, toothed belt;6, clear blowing mechanism;7, dust collecting mechanism;8, connecting mechanism;61, L-shaped support;62, mounting seat;63, spray gun;64, air pump;65, communication pipe;71, L-shaped connecting rod;72, negative pressure cover;73, dust collecting box;731, box cover;74, air inlet pipe;75, dust removal filter element;76, fan;81, containing cavity;82, clamping block;83, threaded sleeve;84, bolt;7311, clamping groove;31, rubber column;9, place shell;91, electric vacuum chuck. Specific implementation

[0020] In order to make the technical means, creation features, purpose effect of the utility model easy to understand, the following is further described in combination with specific implementation.

[0021] In the description of the utility model, it is explained that the orientation or position relation of the terms "up", "down", "inner", "outer", "front end", "rear end", "two ends", "one end", "another end" and the like is based on the orientation or position relation shown in the drawing, and is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, therefore, it cannot be understood as the limitation of the utility model. In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0022] In the description of the utility model, it is necessary to explain, unless another explicit provision and limitation, the term "installation", "set with", "connection" and so on, should do broad sense understanding, for example "connection", can be fixed connection, also can be detachable connection, or integrally connected, can be mechanical connection, also can be electrical connection, can be directly connected, also can be indirectly connected through intermediate medium, can be two elements inside the intercommunication, for the ordinary skill in the art, the specific meaning of the above-mentioned term in the utility model can be understood according to specific circumstances.

[0023] Please refer to Figures 1-5 The utility model provides a kind of semiconductor chip feeding device, including two support plates 1, two support plates 1 are rotationally equipped with two transmission rollers 2 on the side wall of each other, transmission belt 3 is equipped between two transmission rollers 2, one side wall of one support plate 1 is fixedly connected with L-shaped fixed plate 4, driving motor 41 is installed on the outer wall of one side of L-shaped fixed plate 4, the output shaft of driving motor 41 passes through the side wall of L-shaped fixed plate 4 and is fixedly connected with the end of one of transmission roller 2, the output shaft of driving motor 41 can drive one of transmission roller 2 rotation, when the transmission roller 2 rotates, it can make transmission belt 3 run with the cooperation of another transmission roller 2, the upper side wall of two support plates 1 is fixedly connected with side plate 5, soft hair brush roller 51 is rotationally equipped between two side plates 5, one end of soft hair brush roller 51 passes through one of support plates 1 and is fixedly connected with driven wheel 52, driving motor 41's output shaft is fixedly sleeved with driving wheel 53, driving wheel 53 and driven wheel 52 are driven by being equipped with toothed belt 54, the output shaft of driving motor 41 can drive driving wheel 53 to rotate simultaneously, driven wheel 52 will drive soft hair brush roller 51 to rotate after the transmission of toothed belt 54, soft hair brush roller 51 can clean the surface of chip passing below it, one of support plates 1 is also equipped with clean blowing mechanism 6 and another support plate 1 is equipped with dust collecting mechanism 7.

[0024] Specifically, as shown in Figure 2 A kind of semiconductor chip feeding device, clean blowing mechanism 6 includes L-shaped bracket 61, mounting seat 62, spray gun 63, air pump 64 and communication pipe 65, the upper side wall of one of support plates 1 is fixedly connected with L-shaped bracket 61, the upper side outer wall of L-shaped bracket 61 is fixedly connected with mounting seat 62, spray gun 63 is installed on mounting seat 62, air pump 64 is installed on the outer wall of one side of L-shaped bracket 61, the output of air pump 64 is connected with spray gun 63 by communication pipe 65, air pump 64 pressurizes in spray gun 63 by communication pipe 65, spray gun 63 is cleaned and blown to the chip passing through cleaning, ensure the cleanliness of chip surface, guarantee chip is not contaminated when entering next process, effectively improve product quality.

[0025] Specifically, as shown in Figure 2 And Figure 3As shown in the figure, a semiconductor chip feeding device, the dust collecting mechanism 7 includes L-shaped link 71, negative pressure cover 72, dust collecting box 73, box cover 731, air inlet pipe 74, dust filter element 75 and fan 76, the upper side wall of the other support plate 1 is fixedly connected with two L-shaped links 71 and is fixedly connected with the dust collecting box 73 between the two L-shaped links 71, the other end of the two L-shaped links 71 is fixedly connected with the negative pressure cover 72, the upper side wall of the dust collecting box 73 is detachably connected with the box cover 731 through the connecting mechanism 8, the air inlet pipe 74 is arranged between the box cover 731 and the negative pressure cover 72, the dust collecting box 73 is provided with the dust filter element 75, and the bottom wall of the dust collecting box 73 is provided with the fan 76. While the spray gun 63 is blowing, the negative pressure cover 72 will generate negative pressure under the action of the fan 76, the dust blown down is sucked into the negative pressure cover 72, then enters the dust collecting box 73 through the air inlet pipe 74, and after the filtration of the dust filter element 75, the clean air is discharged to the outside, avoiding secondary pollution.

[0026] Specifically, as shown in the figure, Figure 4 A semiconductor chip feeding device, the connecting mechanism 8 includes accommodating cavity 81, clamping block 82, threaded sleeve 83 and bolt 84, two symmetrically distributed accommodating cavities 81 are formed in the upper side walls of the front and rear sides of the dust collecting box 73, the clamping block 82 is slidably arranged in the accommodating cavity 81, the threaded sleeve 83 is embedded on the side wall of the accommodating cavity 81 away from the clamping block 82, the bolt 84 is threadedly connected in the threaded sleeve 83, and one end of the bolt 84 is rotatably connected with the clamping block 82. When it is necessary to remove the box cover 731 for cleaning or replace the dust filter element 75, the bolt 84 is rotated, the clamping block 82 is driven to move outward under the action of the threaded sleeve 83, so that the clamping block 82 is separated from the clamping groove 7311, and the remaining bolts 84 are rotated in this way. After losing the limiting of the four clamping blocks 82, the box cover 731 can be removed, then the dust filter element 75 can be taken out. When the dust filter element 75 is installed, it is placed in the dust collecting box 73, then the box cover 731 is covered on the dust collecting box 73, the bolt 84 is reversed, the clamping block 82 is inserted into the clamping groove 7311 on the box cover 731, and the fixing of the box cover 731 is completed. The box cover 731 is convenient to disassemble and assemble, and thus it is convenient to clean and replace the dust filter element 75.

[0027] Specifically, as shown in the figure, Figure 3 A semiconductor chip feeding device, the box cover 731 is provided with a clamping groove 7311 for inserting the clamping block 82.

[0028] Specifically, as shown in the figure, Figure 1 And Figure 5 A semiconductor chip feeding device, a plurality of rubber columns 31 are uniformly arranged on the transmission belt 3, the other end of the rubber column 31 is fixedly connected with the placing shell 9, the electric vacuum chuck 91 is arranged in the placing shell 9, the chip is sucked by the electric vacuum chuck 91 after being placed in the placing shell 9, and the placing shell 9 transports the chip along with the rotation of the transmission belt 3.

[0029] It should be noted that the utility model is a kind of semiconductor chip feeding device, when using, the mechanical hand of last process can place the processed chip in the placing shell 9, the electric vacuum chuck 91 in the placing shell 9 sucks the chip, the output shaft of driving motor 41 drives one of transmission roller 2 to rotate, after transmission, make that transmission belt 3 starts to transport chip, the output shaft of driving motor 41 rotates simultaneously drive driving wheel 53 to rotate, after the transmission of toothed belt 54, driven wheel 52 will drive soft hair brush roller 51 to rotate, soft hair brush roller 51 rotation can clean the surface of chip passing below it, air pump 64 pressurizes to spray gun 63 by communicating pipe 65, spray gun 63 is cleaned to the chip passing cleaning, ensure the cleanliness of chip surface, guarantee that chip is not contaminated by dust when entering next process, effectively improve product quality, while spray gun 63 is cleaned, under the action of fan 76, negative pressure cover 72 will generate negative pressure, dust cleaned down is sucked into negative pressure cover 72, then by air inlet pipe 74 into dust collecting box 73, after the filtration of dust filter element 75, clean air is discharged to outside, avoid secondary pollution, along with the continuous movement of placing shell 9, when moving to the rear of support plate 1, chip will be taken away by the mechanical hand of next process, can complete feeding, when needing to remove box cover 731 and clean or replace dust filter element 75, rotate bolt 84, under the action of threaded sleeve 83, bolt 84 drives clamping block 82 to move outward, so that it is separated from clamping groove 7311, according to this way, rotate the remaining bolt 84, after losing the limiting of four clamping blocks 82, box cover 731 can be removed, then dust filter element 75 can be removed, when installing dust filter element 75, it is placed into dust collecting box 73, then box cover 731 is covered on dust collecting box 73, reverse bolt 84, so that it promotes clamping block 82 to insert into clamping groove 7311 on box cover 731, the fixation of box cover 731 can be completed, box cover 731 is conveniently disassembled, in turn facilitate cleaning and replacement of dust filter element 75.

[0030] The basic principles and main features of the utility model and the advantages of the utility model are shown and described above. Those skilled in the art should understand that the utility model is not limited by the above examples, and the above examples and descriptions in the specification are only to illustrate the principles of the utility model. Without departing from the spirit and scope of the utility model, the utility model can have various changes and improvements, and these changes and improvements all fall within the scope of the claimed utility model. The scope of protection of the utility model is defined by the appended claims and their equivalents.

Claims

1. A semiconductor chip feeding device, comprising two support plates (1), two drive rollers (2) rotatably mounted on one side wall of the two support plates (1) close to each other, a drive belt (3) wound between the two drive rollers (2), an L-shaped fixing plate (4) fixedly connected to one side wall of one of the support plates (1), a drive motor (41) mounted on one outer side wall of the L-shaped fixing plate (4), the output shaft of the drive motor (41) passing through one side wall of the L-shaped fixing plate (4) and fixedly connected to one end of one of the drive rollers (2), characterized in that: Two upper side walls of the two support plates (1) are fixedly connected with side plates (5), a soft hair brush roller (51) is rotatably arranged between the two side plates (5), one end of the soft hair brush roller (51) penetrates through one of the support plates (1) and is fixedly connected with a driven wheel (52), a driving wheel (53) is fixedly arranged on an output shaft of the driving motor (41), the driving wheel (53) and the driven wheel (52) are driven by a toothed belt (54), one of the support plates (1) is further provided with a blowing and cleaning mechanism (6) and the other support plate (1) is provided with a dust collecting mechanism (7).

2. The semiconductor on-chip material loading device of claim 1, wherein: The blowing and cleaning mechanism (6) comprises an L-shaped support (61), a mounting seat (62), a spray gun (63), an air pump (64) and a communication pipe (65), the upper side wall of one of the support plates (1) is fixedly connected with the L-shaped support (61), the outer wall of the upper side of the L-shaped support (61) is fixedly connected with the mounting seat (62), the mounting seat (62) is installed with the spray gun (63), the outer wall of one side of the L-shaped support (61) is installed with the air pump (64), the output port of the air pump (64) is connected with the spray gun (63) through the communication pipe (65).

3. A semiconductor on-chip material loading device according to claim 2, wherein: The dust collecting mechanism (7) comprises an L-shaped connecting rod (71), a negative pressure cover (72), a dust collecting box (73), a box cover (731), an air inlet pipe (74), a dust removal filter element (75) and a fan (76), the upper side wall of the other support plate (1) is fixedly connected with two L-shaped connecting rods (71) and the dust collecting box (73) is fixedly connected between the two L-shaped connecting rods (71), the other ends of the two L-shaped connecting rods (71) are fixedly connected with the negative pressure cover (72), the upper side wall of the dust collecting box (73) is detachably connected with the box cover (731) through the connecting mechanism (8), the air inlet pipe (74) is arranged between the box cover (731) and the negative pressure cover (72), the dust collecting box (73) is provided with the dust removal filter element (75), and the bottom wall of the dust collecting box (73) is installed with the fan (76).

4. The on-chip material loading device of claim 3, wherein: The connecting mechanism (8) comprises a containing cavity (81), a clamping block (82), a threaded sleeve (83) and a bolt (84), two symmetrically distributed containing cavities (81) are formed in the upper side inner walls of the front and rear sides of the dust collecting box (73), the clamping block (82) is slidably arranged in the containing cavity (81), the threaded sleeve (83) is embedded on the side wall of the containing cavity (81) away from the clamping block (82), and the bolt (84) is threadedly connected in the threaded sleeve (83).

5. A semiconductor on-chip material loading device according to claim 4, wherein: A clamping groove (7311) is formed in the box cover (731) and can be inserted into the clamping block (82).

6. The on-chip material loading device of claim 1, wherein: A plurality of rubber columns (31) are uniformly arranged on the transmission belt (3), one end of each rubber column (31) is fixedly connected with a placing shell (9), and the placing shell (9) is provided with an electric vacuum chuck (91).

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