Ice making device and water purifier
By employing an ice-making structure that combines semiconductor cooling components and a heat sink in the water purifier, efficient switching between ice making and ice removal is achieved, solving the space and cost issues caused by compressor refrigeration systems and simplifying the ice-making device of the water purifier.
Patent Information
- Application Number
- CN202520524103.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-24
- Publication Date
- 2026-02-27
- Estimated Expiration
- 2035-03-24
AI Technical Summary
The ice-making function of existing water purifiers uses a compressor refrigeration system, which results in a complex structure, large space occupation, and high cost.
The ice-making structure combines a semiconductor cooling component and a heat sink. It achieves cooling and heating functions by changing the power supply state. The ice box body rotates between the ice-making position and the ice-removing position to avoid interfering with the ice-removing process.
It reduces space occupation and cost, while improving ice-making efficiency and simplifying the structure.
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Figure CN223954440U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to water purification technical field especially, relate to an ice making device and water purifier. BACKGROUND
[0002] The existing water purifier integrates multiple functions, such as purifying drinking function, heating function, ice making function and the like. The water purifier with ice making function enables users to obtain ice cubes, and thus is favored by people.
[0003] The traditional water purifier adopts a compressor refrigeration system, which drives refrigerant to circulate into an evaporator to perform phase change evaporation heat absorption through compressor suction compression and discharge. The local part of the evaporator is in contact with water in a water box, thereby realizing the process of refrigerated water and ice making. The compressor refrigeration system has a complex structure, large space occupation and high cost.
[0004] And there are two ways to remove ice. One is to fix the heating wire on the evaporator. The heating wire conducts heat to the evaporator to generate heating and ice removal after being electrified. The other is to connect an electromagnetic valve in parallel with the condenser on the compressor refrigeration system pipeline. The electromagnetic valve is electrified, and the compressor directly brings the compressed high-temperature refrigerant to the evaporator through the electromagnetic valve to heat and remove ice. The additional heating wire or electromagnetic valve makes the structure more complex and high in cost. UTILITY MODEL CONTENTS
[0005] The utility model aims at providing an ice making device and water purifier to solve the technical problems of complex structure, large space occupation and high cost of the compressor refrigeration system in the prior art.
[0006] According to the above idea, the utility model adopts the technical scheme of:
[0007] An ice making device comprises:
[0008] A shell has a containing cavity.
[0009] An ice box structure comprises an ice box body and a driving assembly. The ice box body is arranged in the containing cavity. The ice box body has an open ice making cavity. The driving assembly is used to drive the ice box body to rotate between an ice making position and an ice removing position.
[0010] An ice making structure comprises an ice making piece, a semiconductor refrigeration piece and a radiator. At least part of the ice making piece is located in the ice making cavity. One side of the semiconductor refrigeration piece is matched with the ice making piece. The other side of the semiconductor refrigeration piece is matched with the radiator. The semiconductor refrigeration piece can transfer heat or cold to the ice making piece under different electrified states.
[0011] As preferred, the ice making part comprises a plurality of ice making columns, the inside of the ice making columns is hollow to form ice containing cavities, and the ice making columns are provided with through openings at one end away from the semiconductor refrigeration part, which are communicated with the ice containing cavities.
[0012] As preferred, the outer surface of the ice making column is in a cylindrical or inverted conical shape; and / or, the side wall of the ice containing cavity is in a cylindrical or inverted conical shape.
[0013] As preferred, the ice making part further comprises an ice making plate, which is attached to the semiconductor refrigeration part, and the plurality of ice making columns are arranged on the ice making plate in a spaced manner.
[0014] As preferred, the heat sink is flat and attached to the semiconductor refrigeration part.
[0015] As preferred, the ice box structure further comprises a first water supply assembly, which is used to inject water into the ice making cavities, or the first water supply assembly is used to spray water to the ice making part.
[0016] As preferred, the ice making structure further comprises a second water supply assembly, the inside of the heat sink forms a water flow channel, and the second water supply assembly can continuously guide water flow through the water flow channel in a single pass and be discharged.
[0017] As preferred, the heat sink comprises a first cover plate and a second cover plate which are detachably connected, the first cover plate and the second cover plate enclose a heat dissipation cavity, a plurality of fins are arranged in the heat dissipation cavity in a spaced manner, and the plurality of fins enclose the reciprocating bent water flow channel.
[0018] As preferred, the shell is provided with a water receiving box and an ice receiving box at the bottom of the containing cavity, the water receiving box is located below the ice box body, the top of the water receiving box is provided with an ice guide plate to guide the ice block to slide to the ice receiving box, and the ice guide plate is provided with water leakage holes communicated with the water receiving box.
[0019] A water purifier comprises a machine body and the ice making device as described above, the machine body is provided with a filter assembly, and the shell is located in the machine body.
[0020] As preferred, the waste water outlet of the filter assembly can supply waste water through the heat sink in a single pass.
[0021] The utility model discloses the beneficial effects of:
[0022] The ice making device provided by the utility model, when the ice box body is located at the ice making position, the semiconductor refrigerating part transmits cold quantity to the ice making part, so that the water with low temperature is attached to the ice making part to form ice, at the same time, the radiator takes away the heat of the semiconductor refrigerating part, realizing the refrigeration water and ice making process; when the ice is removed, the ice box body needs to be driven to rotate to the ice removing position by the driving assembly, and the semiconductor refrigerating part also needs to be reversely inputted with current, so that the semiconductor refrigerating part transmits heat to the ice making part, and the heat is conducted to the ice making part to realize the heating ice removing process. BRIEF DESCRIPTION OF DRAWINGS
[0023] Figure 1 is the first structure schematic view of the ice making device provided by the utility model embodiment;
[0024] Figure 2 is the first side view of the ice making device provided by the utility model embodiment;
[0025] Figure 3 is the first schematic view of the partial structure of the ice making device provided by the utility model embodiment;
[0026] Figure 4 is the second structure schematic view of the ice making device provided by the utility model embodiment;
[0027] Figure 5 is the second side view of the ice making device provided by the utility model embodiment;
[0028] Figure 6 is the second schematic view of the partial structure of the ice making device provided by the utility model embodiment;
[0029] Figure 7 is the structure schematic view of the ice making structure provided by the utility model embodiment;
[0030] Figure 8 is the sectional view of the ice making structure provided by the utility model embodiment;
[0031] Figure 9 is the enlarged view of A of Figure 8 ;
[0032] Figure 10 is the sectional view of the radiator provided by the utility model embodiment;
[0033] Figure 11 is the sectional view of another radiator provided by the utility model embodiment;
[0034] Figure 12 is a structural schematic view of an ice making structure provided by an embodiment of the present application.
[0035] In the figure,
[0036] 10, housing; 11, accommodating cavity;
[0037] 20, ice box structure; 21, ice box body; 211, ice making cavity; 212, rotating shaft; 22, first water supply assembly; 221, first water pump; 222, first water supply pipe; 23, driving assembly;
[0038] 30, ice making structure; 31, ice making piece; 311, ice making column; 3111, ice containing cavity; 312, ice making plate; 32, semiconductor refrigeration piece; 33, heat sink; 331, water inlet; 332, water outlet; 333, first cover plate; 334, second cover plate; 335, fin; 3351, flow guide fin; 3352, flow distribution fin; 336, sealing ring; 337, flow guide opening; 34, second water supply assembly; 341, second water pump; 342, second water supply pipe;
[0039] 40, water receiving box; 41, ice guide plate; 42, water leakage hole;
[0040] 50, ice receiving box. DETAILED DESCRIPTION
[0041] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are intended to explain the present application, and cannot be understood as a limitation of the present application.
[0042] In the description of the present application, unless explicitly defined and limited otherwise, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For ordinary skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0043] In the utility model, unless another definite provision and limitation, first feature is "on" or "under" second feature, can include that first and second features are in direct contact, also can include that first and second features are not in direct contact but contact through other feature between them. Moreover, first feature "on", "above" and "on" second feature includes that first feature is directly above and obliquely above second feature, or only indicates that first feature horizontal height is higher than second feature. First feature "under", "below" and "under" second feature includes that first feature is directly below and obliquely below second feature, or only indicates that first feature horizontal height is less than second feature.
[0044] The technical scheme of the utility model is further illustrated below by specific implementation manners in combination with the drawings.
[0045] Referring to Figures 1 to 11 The embodiment provides an ice making device, which comprises a shell 10, an ice box structure 20 and an ice making structure 30. The shell 10 has a containing cavity 11. The ice box structure 20 comprises an ice box body 21 and a driving assembly 23. The ice box body 21 is arranged in the containing cavity 11 and has an ice making cavity 211 in the form of an open mouth. The driving assembly 23 is used for driving the ice box body 21 to rotate between an ice making position and an ice removing position. The ice making structure 30 comprises an ice making piece 31, a semiconductor refrigerating piece 32 and a heat sink 33. At least part of the ice making piece 31 is located in the ice making cavity 211. One side of the semiconductor refrigerating piece 32 is matched with the ice making piece 31, and the other side of the semiconductor refrigerating piece 32 is matched with the heat sink 33. The semiconductor refrigerating piece 32 can transfer heat or cold to the ice making piece 31 under different power-on states.
[0046] When the ice box body 21 is located at the ice making position, the semiconductor refrigerating piece 32 transfers cold to the ice making piece 31, so that water at low temperature is attached to the ice making piece 31 to form ice. At the same time, the heat sink 33 takes away the heat of the semiconductor refrigerating piece 32, so that the ice making and ice removing processes are realized. When the ice is removed, the driving assembly 23 needs to drive the ice box body 21 to rotate to the ice removing position, and the semiconductor refrigerating piece 32 also needs to be reversely inputted with current, so that the semiconductor refrigerating piece 32 transfers heat to the ice making piece 31, and the heat is conducted to the ice making piece 31 to realize the heating and ice removing process. Since the ice box body 21 can rotate between the ice making position and the ice removing position, the ice box body 21 can avoid interfering with the ice removing process. Since the semiconductor refrigerating piece 32 is adopted, the heat or cold transferred by the semiconductor refrigerating piece 32 to the ice making piece 31 can be changed by changing the power-on state, so that the space occupation is reduced and the cost is lowered.
[0047] Wherein, when deicing, the driving assembly 23 drives the ice box body 21 to rotate to the deicing position, and the current is reversely input to the semiconductor refrigeration piece 32, which can be performed simultaneously or sequentially. The current can be reversely input to the semiconductor refrigeration piece 32 first, and then the driving assembly 23 drives the ice box body 32 to rotate to the deicing position, or the current can be reversely input to the semiconductor refrigeration piece 32 first, and then the driving assembly 23 drives the ice box body 32 to rotate to the deicing position. The execution sequence and time interval are not limited herein, as long as the ice box body 21 does not interfere with deicing.
[0048] In the embodiment, the semiconductor refrigeration piece 32 cooperates with the ice box body 21 to adopt static water ice making, and the ice box structure 20 further comprises a first water supply assembly 22 for injecting water into the ice making cavity 211. Since at least part of the ice making piece 31 is located in the ice making cavity 211, the water injected into the ice making cavity 211 can fully contact the ice making piece 31, increase the contact area, and enable the cold energy to be fully transferred in the static water during ice making, so that the water is condensed into ice on the ice making piece 31, thereby improving the ice making efficiency.
[0049] In other embodiments, the semiconductor refrigeration piece 32 cooperates with the ice box body 21 to adopt dynamic water ice making, and the ice box structure 20 further comprises a first water supply assembly 22 for spraying water to the ice making piece 31. The first water supply assembly 22 can spray water to the ice making piece 31 from one side of the ice making piece 31, or spray water to the ice making piece 31 upward from below the ice making piece 31. Since at least part of the ice making piece 31 is located in the ice making cavity 211, part of the water forms ice on the ice making piece 31, and the water that does not form ice flows along the ice making piece 31 to the ice making cavity 211 and is stored in the ice making cavity 211. The water stored in the ice making cavity 211 can contact the ice making piece 31 to further form ice, thereby improving the ice making efficiency.
[0050] Wherein, the ice making cavity 211 can store water during ice making, and the ice blocks are condensed on the ice making piece 31. Alternatively, part of the ice blocks are stored in the ice making cavity 211 after being separated from the ice making piece 31, and the ice making piece 31 continues to make ice, and the ice making cavity 211 plays a role of ice storage.
[0051] The shell 10 is open at the top of the shell 10, so as to facilitate water and ice collection at the bottom of the shell 10. The shape of the shell 10 can be set according to actual needs. In the embodiment, the shell 10 is cuboid-shaped, which is convenient for processing and production. A cover plate can be arranged at the top opening of the shell 10 to cover the accommodation cavity 11, so as to prevent impurities from entering the inside of the ice box body 21.
[0052] The water receiving box 40 is located below the ice box body 21, and the top of the water receiving box 40 is provided with an ice guide plate 41 to guide the ice cubes to slide to the ice receiving box 50. The ice guide plate 41 is provided with a water leakage hole 42 in communication with the water receiving box 40. When ice needs to be removed, the driving assembly 23 drives the ice box body 21 to rotate to the ice removal position, and the water in the ice box body 21 flows out and flows to the ice guide plate 41 under the action of gravity. Since the ice guide plate 41 is provided with the water leakage hole 42, the water flows into the water receiving box 40. By reversely inputting current to the semiconductor refrigeration element 32, the semiconductor refrigeration element 32 transmits heat to the ice making element 31, and the heat is conducted to the ice making element 31 to achieve heating and ice removal. The ice cubes slide along the ice guide plate 41 to the ice receiving box 50. In other embodiments, the ice receiving box 50 can be slidingly connected with the shell 10. After the water in the ice box body 21 flows into the water receiving box 40, the ice receiving box 50 slides to the top of the water receiving box 40 to facilitate ice receiving.
[0053] In some embodiments, the water receiving box 40 and the ice receiving box 50 are arranged side by side at the bottom of the accommodation cavity 11, the ice box body 21 is located above the water receiving box 40, and the ice guide plate 41 is inclinedly arranged with the low end of the ice guide plate 41 located at one side of the ice receiving box 50. In some embodiments, the water receiving box 40 is arranged in an L shape at the bottom of the accommodation cavity 11, the ice receiving box 50 is located at the step surface of the water receiving box 40, and the ice guide plate 41 is inclinedly arranged with the low end of the ice guide plate 41 located at one side of the ice receiving box 50.
[0054] In some embodiments, the ice receiving box 50 is slidingly connected with the shell 10 to facilitate taking out the ice receiving box 50. For example, the ice receiving box 50 is pullably arranged in the shell 10 to facilitate pulling out the ice receiving box 50 to take ice. In some embodiments, the water receiving box 40 is integrally formed with the shell 10 to facilitate processing and production.
[0055] The ice box body 21 has an ice making cavity 211 in an open shape. The shape of the ice box body 21 can be set according to actual needs, such as a cuboid, a semi-cylindrical shape, or a semi-elliptical cylindrical shape. In this embodiment, the ice box body 21 is in a semi-cylindrical shape to facilitate water flowing out of the ice box body 21.
[0056] When the ice box body 21 is located at the ice making position, the opening of the ice making cavity 211 faces upward. When the driving assembly 23 drives the ice box body 21 to rotate to the ice removal position, the opening of the ice making cavity 211 faces one side or is inclined downward. In this embodiment, the rotation speed angle of the ice box body 21 from the ice making position to the ice removal position is between 80° and 180°. Preferably, the rotation speed angle of the ice box body 21 from the ice making position to the ice removal position is between 90° and 120°.
[0057] In the present embodiment, the ice box body 21 is rotatably connected with the housing 10. In other embodiments, the ice box body 21 is rotatably arranged on a support, which is located in the housing 10. Exemplarily, both ends of the ice box body 21 are provided with rotating shafts 212, one of which is rotatably connected with the housing 10, and the other is connected with the driving assembly 23. In some embodiments, the driving assembly 23 comprises a motor, which is connected with the rotating shaft 212 to drive the ice box body 21 to rotate. In some embodiments, the driving assembly 23 comprises a motor and a transmission mechanism, which is arranged between the motor and the rotating shaft 212, and the motor drives the transmission mechanism to move to drive the rotating shaft 212 to rotate. The transmission mechanism can adopt a gear mechanism. The motor can adopt a stepping motor.
[0058] The first water supply assembly 22 is used to supply water into the ice making cavity 211. Exemplarily, the first water supply assembly 22 comprises a first water pump 221 and a first water supply pipe 222, one end of which is connected with the first water pump 221, and the other end of which is located in the ice making cavity 211. When it is needed to fill water into the ice box body 21, the first water pump 221 is turned on to guide water flow along the first water supply pipe 222 into the ice making cavity 211. Optionally, a flow meter is arranged on the first water supply pipe 222 to monitor the flow of water filled into the ice box body 21, so as to stop filling water in time. Optionally, a liquid level sensor is arranged in the ice box body 21 to monitor the liquid level in the ice box body 21, so as to stop filling water in time. Even if part of the water overflows from the top edge of the ice making cavity 211, the overflowing water can flow into the water receiving box 40, without affecting ice making.
[0059] The ice making piece 31 can adopt a metal piece that is convenient for heat transfer, such as an aluminum piece or a stainless steel piece. In the present embodiment, the ice making piece 31 comprises a plurality of ice making columns 311, one end of which away from the semiconductor refrigeration piece 32 is located in the ice making cavity 211.
[0060] In some embodiments, as shown in Figure 12 The ice making column 311 is in a columnar structure, and the ice is solidified on the outer surface of the ice making column 311 during ice making. The plurality of ice making columns 311 can simultaneously form a plurality of ice blocks, and since the plurality of ice making columns 311 are all in a columnar structure, the ice blocks formed on the plurality of ice making columns 311 are all in a bullet shape. The ice making column 311 can be a solid structure or a hollow structure. When the ice making column 311 is a hollow structure, a medium with good heat conduction performance, such as a graphene liquid or a solid graphite rod, can be filled in the inside of the ice making column 311.
[0061] In some embodiments, as shown in Figures 7 to 9As shown, the inside of the ice making column 311 is hollow to form an ice containing cavity 3111, and the end of the ice making column 311 away from the semiconductor refrigeration piece 32 is provided with an opening in communication with the ice containing cavity 3111. The water in the ice making cavity 211 can enter the ice containing cavity 3111 through the opening, so that the inside and outside of the ice making column 311 have water, and thus the inside and outside of the ice making column 311 can make ice at the same time during ice making, thereby increasing the ice making area and the ice making amount. Since the ice containing cavity 3111 is arranged on the ice making column 311, the ice making column 311 has a ring-shaped cylindrical structure. The ring-shaped wall of the ice making column 311 can be a solid structure or a hollow structure. When the ring-shaped wall of the ice making column 311 is a hollow structure, the inside of the ring-shaped wall of the ice making column 311 can be filled with a medium with good heat conduction performance, such as graphene liquid or a solid graphite rod.
[0062] The outer surface of the ice making column 311 is in a cylindrical shape or a reverse conical shape; and / or, the side wall of the ice containing cavity 3111 is in a cylindrical shape or a reverse conical shape. In some embodiments, the outer surface of the ice making column 311 is in a reverse conical shape, and the side wall of the ice containing cavity 3111 is in a reverse conical shape. The reverse conical surface can guide the ice to be removed quickly.
[0063] The ice making piece 31 further comprises an ice making plate 312, which is attached to the semiconductor refrigeration piece 32 to increase the contact area and improve the heat transfer efficiency. The plurality of ice making columns 311 are arranged on the ice making plate 312 in a spaced manner. The plurality of ice making columns 311 can be arranged in a matrix, or two adjacent rows of ice making columns 311 can be arranged alternately, so as to maximize the number of ice making columns 311 arranged on the ice making plate 312 and improve the ice making efficiency. The ice making plate 312 and the heat sink 33 can be locked by a locking piece. Exemplarily, the locking piece is a bolt.
[0064] Optionally, the semiconductor refrigeration piece 32 comprises a plurality of semiconductor refrigeration pieces, each of which has a first side and a second side arranged oppositely, the first side is attached to the heat sink 33, and the second side is attached to the ice making piece 31. In different power-on states, one of the first side and the second side is a hot end and the other is a cold end. During ice making, the second side is a cold end to transfer cold to the ice making piece 31, and the first side is a hot end to transfer heat away by the heat sink 33. During ice removal, the second side is a hot end to transfer heat to the ice making piece 31 to facilitate ice removal, and the first side is a cold end to transfer cold away by the heat sink 33.
[0065] The heat sink 33 is flat and adheres to the semiconductor refrigeration element 32 to increase the contact area between the heat sink 33 and the semiconductor refrigeration element 32 and improve the heat dissipation efficiency. The heat sink 33 is cooled by water, and the heat sink 33 has a water inlet 331 and a water outlet 332. In a conventional arrangement, a circulating pump is used to drive the water flow into the heat sink 33 from the water inlet 331 and out of the heat sink 33 from the water outlet 332. The water flow out of the water outlet 332 is then driven by the circulating pump into the heat sink 33 from the water inlet 331 to achieve water circulation. Because the water flow is circulated, the heated water is used multiple times, and the heat dissipation effect is reduced.
[0066] In this embodiment, the ice making structure 30 further includes a second water supply assembly 34. The interior of the heat sink 33 forms a water flow channel, and the second water supply assembly 34 can continuously guide the water flow to pass through the water flow channel in a single pass and be discharged. The water flow passes through the water flow channel in a single pass and is not recycled, that is, the water flow enters the heat sink 33 from the water inlet 331 and flows out of the heat sink 33 from the water outlet 332, and the water flow out of the water outlet 332 will not enter the heat sink 33 from the water inlet 331. The water flow is not circulated, and after flowing through the heat sink 33, it is directly discharged. A sufficient water source is needed to continuously supply water to the water inlet 331. During the process of the water flow passing through the water flow channel, the water flow carries away heat so that the heated water is discharged, ensuring the heat dissipation effect.
[0067] Exemplarily, the second water supply assembly 34 includes a water inlet valve and a water outlet valve. The water inlet valve is arranged upstream of the water inlet 331, and the water outlet valve is arranged downstream of the water outlet 332. In use, both the water inlet valve and the water outlet valve are opened, and the water pressure of the water inlet is used to make the water flow into the heat sink 33 from the water inlet 331 and flow out of the heat sink 33 from the water outlet 332. Exemplarily, the second water supply assembly 34 includes a second water pump 341 and a second water supply pipe 342. One end of the second water supply pipe 342 is connected to the second water pump 341, and the other end of the second water supply pipe 342 is in communication with the water inlet 331 of the heat sink 33. When heat dissipation is needed, the second water pump 341 is started to guide the water flow into the heat sink 33 along the second water supply pipe 342.
[0068] The water flow channel in the heat sink 33 is bent and extended to increase the heat dissipation area. Exemplarily, the water flow channel is S-shaped or reciprocatingly bent and extended. In this embodiment, the heat sink 33 includes a first cover plate 333 and a second cover plate 334 that are detachably connected. The first cover plate 333 and the second cover plate 334 enclose a heat dissipation cavity, and a plurality of fins 335 are arranged in the heat dissipation cavity in a spaced manner. The plurality of fins 335 enclose a reciprocatingly bent water flow channel. Through the detachable connection, the heat sink 33 is convenient to install, disassemble and maintain.
[0069] Optionally, as Figure 10As shown, multiple fins 335 are arranged in parallel and spaced apart within the heat dissipation cavity. One end of each fin 335 is sealed to the inner wall of the heat dissipation cavity, while the other end is spaced apart from the inner wall to form flow guides 337. These flow guides 337 are arranged alternately on opposite sides of the heat dissipation cavity. Water entering from the inlet 331 flows along the fins 335 to the flow guides 337, sequentially passing through both sides of each fin 335 and exiting from the outlet 332. The more fins 335 there are, the more tortuous the water flow channel becomes, thus extending the residence time of the water within the channel and improving heat exchange efficiency.
[0070] Optionally, such as Figure 11 As shown, multiple fins 335 are arranged in parallel and spaced apart within the heat dissipation cavity. One end of some fins 335 is sealed to the inner wall of the heat dissipation cavity to form a flow guide fin 3351, and the other end of the flow guide fin 3351 is spaced apart from the inner wall of the heat dissipation cavity to form a flow guide port 337. Multiple flow guide ports 337 are arranged alternately on opposite sides of the heat dissipation cavity. Both ends of some fins 335 are spaced apart from the inner wall of the heat dissipation cavity to form a flow divider fin 3352. A flow divider fin 3352 is provided between two adjacent flow guide fins 3351. By setting the flow divider fin 3352, the water flow is divided into at least two paths when flowing between adjacent flow guide ports 337. The contact between the water flow and the flow divider fin 3352 increases the heat exchange area and improves the heat exchange efficiency.
[0071] The first cover plate 333 and the second cover plate 334 can be locked together by a locking member. Exemplarily, the locking member is a conventional bolt. A sealing ring 336 is provided between the first cover plate 333 and the second cover plate 334 to ensure the airtightness of the heat dissipation cavity. Exemplarily, the second cover plate 334 has a mounting groove, into which the sealing ring 336 is inserted and abuts against the first cover plate 333.
[0072] Exemplarily, the first cover plate 333 is attached to the semiconductor cooling element 32, and the fins 335 are integrally formed with the first cover plate 333. The first cover plate 333 and the fins 335 can be made of metal to improve heat transfer efficiency. For example, aluminum or stainless steel. Exemplarily, the second cover plate 334 is made of plastic to reduce weight.
[0073] The heat sink 33 can also be cooled by a fan. In other embodiments, the heat sink 33 may be a heat pipe type heat sink.
[0074] This embodiment also provides a water purifier, including a body and the aforementioned ice-making device. A filter assembly is disposed within the body, and the outer casing 10 is located within the body. The purified water inlet of the filter assembly can be connected to the first water pump 221 of the first water supply assembly 22, so that the water used for ice making is purified water.
[0075] In some embodiments, the waste water outlet of the filter assembly is used to supply water to the radiator 33 so that the waste water is fully utilized. Exemplarily, the waste water outlet of the filter assembly can supply the waste water that has passed through the radiator 33 once to the radiator 33. The waste water can flow through the radiator 33 by using its own water pressure or gravity, or the second water supply assembly 34 can guide the waste water to pass through the water flow channel of the radiator 33 once and be discharged. Since the waste water is not generated in real time, a waste water tank can be arranged so that the waste water is stored in the waste water tank, and when ice is made, the waste water flows through the radiator 33 under the action of gravity, or the second water supply assembly 34 guides the waste water in the waste water tank to pass through the water flow channel of the radiator 33 once and be discharged.
[0076] The above embodiments only illustrate the basic principles and characteristics of the present application, and the present application is not limited to the above embodiments. Without departing from the spirit and scope of the present application, various changes and modifications can be made to the present application, and these changes and modifications all fall within the scope of the present application. The scope of protection of the present application is defined by the appended claims and their equivalents.
Claims
1. An ice making device, characterized by, The application relates to an ice making device, comprising: a shell (10) with a containing cavity (11); an ice box structure (20) comprising an ice box body (21) and a driving assembly (23), the ice box body (21) is arranged in the containing cavity (11), the ice box body (21) has an open ice making cavity (211), and the driving assembly (23) is used for driving the ice box body (21) to rotate between an ice making position and an ice removing position; an ice making structure (30) comprising an ice making piece (31), a semiconductor refrigeration piece (32) and a heat sink (33), at least part of the ice making piece (31) is located in the ice making cavity (211), one side of the semiconductor refrigeration piece (32) is matched with the ice making piece (31), the other side of the semiconductor refrigeration piece (32) is matched with the heat sink (33), and the semiconductor refrigeration piece (32) can transfer heat or cold to the ice making piece (31) under different power-on states.
2. The ice making device according to claim 1, wherein, The ice making piece (31) comprises a plurality of ice making columns (311), the inside of the ice making column (311) is hollow to form an ice containing cavity (3111), and an opening is formed in one end of the ice making column (311) away from the semiconductor refrigeration piece (32) and is communicated with the ice containing cavity (3111).
3. The ice making device according to claim 2, wherein, The outer surface of the ice making column (311) is in a cylindrical shape or an inverted conical shape; and / or the side wall of the ice containing cavity (3111) is in a cylindrical shape or an inverted conical shape.
4. The ice making device according to claim 2, wherein, The ice making piece (31) further comprises an ice making plate (312), the ice making plate (312) is matched with the semiconductor refrigeration piece (32), and a plurality of the ice making columns (311) are arranged on the ice making plate (312) at intervals.
5. The ice making device of claim 1, wherein, The heat sink (33) is flat and is matched with the semiconductor refrigeration piece (32).
6. The ice making device of claim 1, wherein, The ice box structure (20) further comprises a first water supply assembly (22), the first water supply assembly (22) is used for injecting water into the ice making cavity (211), or the first water supply assembly (22) is used for spraying water on the ice making piece (31).
7. The ice making device of claim 1, wherein, The ice making structure (30) further comprises a second water supply assembly (34), the inside of the heat sink (33) forms a water flow channel, and the second water supply assembly (34) can continuously guide water flow to pass through the water flow channel once and be discharged.
8. The ice-making device according to any one of claims 1 to 7, characterized in that, A water receiving box (40) and an ice receiving box (50) are arranged in the bottom of the containing cavity (11) in the shell (10), the water receiving box (40) is located below the ice box body (21), the top of the water receiving box (40) is provided with an ice guide plate (41) for guiding ice blocks to slide to the ice receiving box (50), and a water leakage hole (42) is formed in the ice guide plate (41) and is communicated with the water receiving box (40).
9. A water purifier characterized by comprising: The application further relates to a machine body and the ice making device of any one of claims 1-8, the machine body is provided with a filter assembly, and the shell (10) is arranged in the machine body.
10. The water purifier according to claim 9, wherein The waste water outlet of the filter assembly can supply waste water that has passed through the heat sink (33) once to the heat sink (33).