Common mode inductor and electronic equipment
By incorporating grooves and through slots on the base, combined with an amorphous or nanocrystalline racetrack-shaped magnetic core and a flat, elongated coil, the large size and limited position of common-mode inductors are solved, achieving compact installation and efficient filtering, thus improving electromagnetic compatibility and production efficiency.
Patent Information
- Application Number
- CN202520010491.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-02
- Publication Date
- 2026-02-27
- Estimated Expiration
- 2035-01-02
AI Technical Summary
Existing common-mode inductors are large in size and require other materials for fixing and limiting, resulting in a large installation area and problems such as poor soldering and loosening.
The design incorporates grooves and through slots on the base to securely engage the magnetic core and coil. It combines an amorphous nanocrystalline racetrack-shaped magnetic core with a flat, elongated coil structure. The base is made of PPS material and the coil spacing and pin soldering are optimized through insulating partitions and positioning holes.
The overall size of the common mode inductor is reduced, improving installation compactness and stability, avoiding cold solder joints and loosening, enhancing electromagnetic compatibility and filtering effect, and saving circuit board space and production costs.
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Figure CN223956429U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application belongs to the technical field of inductance, and more particularly to a common mode inductance and an electronic device. BACKGROUND
[0002] Various signal interferences often occur in circuits, so we need to use various devices to suppress the interference, such as common mode interference which needs to be suppressed by common mode inductance.
[0003] The existing common mode filter inductance usually adopts single or multi-strand round copper wire to be wound around a magnetic ring, so that the volume of the inductance is relatively large, and the common mode inductance needs to occupy a large mounting area on the circuit board; the coil and the magnetic core need to be fixed and limited by using rear limiting plates and limiting pins. CONTENT OF THE INVENTION
[0004] The purpose of the embodiment of the application is to provide a common mode inductance and an electronic device to solve the technical problems that the volume of the common mode inductance is large and the coil and the magnetic core need to be fixed and limited by other materials in the large current condition in the prior art.
[0005] To achieve the above purpose, the technical scheme adopted by the application is to provide a common mode inductance, comprising a magnetic core, a coil and a base, the coil is wound on the magnetic core; a recess is arranged on the upper surface of the base along the length direction of the base, the magnetic core is clamped in the recess; a through slot is arranged on the upper surface of the base along the width direction of the base, the coil is clamped in the through slot; the length of the base gradually decreases from the upper surface of the base to the lower surface of the base; the lower surface of the base is used to connect a circuit board.
[0006] Optionally, N insulation partitions are arranged in the through slot, the N insulation partitions are arranged at intervals along the length direction of the base, and the insulation partitions are used to increase the electrical distance between the coils and avoid electromagnetic interference between the coils.
[0007] Optionally, the N insulation partitions divide the through slot into N+1 placement areas; N+1 coils are arranged on the magnetic core, and one coil is placed in one placement area; wherein N is a positive integer greater than or equal to 1.
[0008] Optionally, a plurality of positioning holes are arranged at the bottom of the through slot, the positioning holes penetrate to the lower surface of the base, and the positioning holes are used for the pins of the coil to be led out.
[0009] Optionally, the lower surface of the base has a recessed part, the recessed part is arranged around the positioning hole, and the recessed part is used for air to be discharged from the recessed part when the pins of the coil are welded.
[0010] Optionally, the lower surface of the base is provided with a plurality of mounting holes for mounting and fixing the base.
[0011] Optionally, the side surface of the base in the width direction is a concave arc surface connecting the upper surface of the base and the lower surface of the base.
[0012] Optionally, the inner surface of the groove is covered with a first adhesive layer, and the magnetic core is adhesively connected to the base through the first adhesive layer; the bottom of the through groove is covered with a second adhesive layer, and the coil is adhesively connected to the base through the second adhesive layer.
[0013] Optionally, the base is an integrally formed structure.
[0014] The application also provides an electronic device comprising the common mode inductor.
[0015] The common mode inductor and the electronic device provided by the application have the following beneficial effects: compared with the prior art, the common mode inductor of the application is provided with a groove and a through groove on the base, so that the magnetic core and the coil can be stably clamped on the base and the swing of the magnetic core and the coil is prevented; the design that the length of the base gradually decreases from the upper surface to the lower surface reduces the overall volume of the common mode inductor, so that the installation of the common mode inductor on the circuit board is more compact, and the area occupied by the base on the circuit board is saved. BRIEF DESCRIPTION OF DRAWINGS
[0016] In order to more clearly illustrate the technical solutions in the embodiments of the application, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor.
[0017] Figure 1 An exploded structural schematic view of the common mode inductor provided by the embodiment of the application;
[0018] Figure 2 A three-dimensional structural schematic view of the common mode inductor provided by the embodiment of the application;
[0019] Figure 3 An assembly structural schematic view of the base and the magnetic core in the common mode inductor provided by the embodiment of the application;
[0020] Figure 4 An assembly structural schematic view of the base and the coil in the common mode inductor provided by the embodiment of the application;
[0021] Figure 5 A three-dimensional structural schematic view of the base in the common mode inductor provided by the embodiment of the application;Figure 1 ;
[0022] Figure 6 A three-dimensional structural diagram of the base of a common-mode inductor provided in an embodiment of this application. Figure 2 ;
[0023] Figure 7 This is a schematic diagram of the main structure of the base of a common mode inductor provided in an embodiment of this application;
[0024] Figure 8 This is a side view of the base structure of a common mode inductor provided in an embodiment of this application.
[0025] The following are the labeling elements in the figure:
[0026] 100-Magnetic core;
[0027] 200-coil;
[0028] 300 - Base;
[0029] 301 - Groove;
[0030] 302 - Through-slot;
[0031] 303 - Insulating partition;
[0032] 304 - Positioning hole;
[0033] 305 - Recessed area;
[0034] 306 - Mounting hole;
[0035] 307 - Circular arc surface. Detailed Implementation
[0036] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.
[0037] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.
[0038] It should be understood that the terms "length", "width", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate directions or positions based on the directions or positions shown in the drawings and are used for convenience in describing the present application and simplifying the description, and thus cannot be construed as indicating or implying that a device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus cannot be understood as limiting the present application.
[0039] In addition, the terms "first", "second", "third", etc. are used only to describe and distinguish the application, and cannot be construed as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with "first", "second", "third" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.
[0040] The existing common mode filter inductance usually adopts single or multi-strand round copper wire to be wound around the magnetic ring, resulting in a large volume; the phase and the phase are simply separated by using a strap or a partition, resulting in easy loosening under external force; the bottom fixing plate is in parallel contact with the PCB (circuit board), resulting in no air entering the welding hole during soldering, causing a virtual welding problem.
[0041] Please refer to Figure 1 and Figure 2 , the common mode inductance provided by the embodiment of the present application will be described. The common mode inductance comprises a magnetic core 100, a coil 200 and a base 300, the coil 200 is wound on the magnetic core 100; as shown in Figure 4 , the upper surface of the base 300 is provided with a groove 301 along the length direction of the base 300, the magnetic core 100 is clamped in the groove 301; the upper surface of the base 300 is provided with a through groove 302 along the width direction of the base 300, the coil 200 is clamped in the through groove 302; the length of the base 300 gradually decreases from the upper surface of the base 300 to the lower surface of the base 300; the lower surface of the base 300 is used to connect the circuit board (not shown).
[0042] Figure 5 In the figure, the direction indicated by the X axis is the length direction of the base 300, and the direction indicated by the Y axis is the width direction of the base 300.
[0043] Compared with the prior art, in the embodiment of the application, the recess 301 and the through groove 302 are arranged on the base 300, so that the magnetic core 100 and the coil 200 can be stably clamped on the base 300, and the swing of the magnetic core 100 and the coil 200 is prevented; the length of the base 300 gradually decreases from the upper surface to the lower surface, the overall volume of the common mode inductor is reduced, the installation of the common mode inductor on the circuit board is more compact, and the area occupied by the base 300 on the circuit board is saved.
[0044] In an embodiment of the application, please refer to Figure 5 and Figure 7 , the through groove 302 is provided with N insulating partitions 303, the N insulating partitions 303 are arranged at intervals along the length direction of the base 300, and the N insulating partitions 303 divide the through groove 302 into N+1 placement areas; the magnetic core 100 is provided with N+1 coils 200, and one coil 200 is placed in one placement area; wherein N is a positive integer greater than or equal to 1.
[0045] In the embodiment, the multiple coils 200 are separated by the insulating partitions 303, the electrical distance between the windings of the coils 200 is increased, the electromagnetic interference between the coils 200 is avoided, and the filtering effect of the common mode inductor is improved.
[0046] In the embodiment, one insulating partition 303 is arranged as an example, that is, N=1, please refer to Figure 4 and Figure 5 At this time, the through groove 302 of the base 300 forms two placement areas, and one coil 200 is placed in each placement area.
[0047] In an embodiment of the application, please refer to Figure 6 , the bottom of the through groove 302 is provided with multiple positioning holes 304, the positioning holes 304 penetrate to the lower surface of the base 300, and the positioning holes 304 are used for the pin wire-out of the coil 200.
[0048] In the embodiment, the pin of the coil 200 can pass through the positioning hole 304 and be connected with the circuit board, and such a design not only facilitates the pin wire-out of the coil 200, but also ensures the accuracy of the position of the pin during welding, improves the welding efficiency and quality.
[0049] Specifically, the number of the positioning holes 304 can be determined according to the number of the coils 200, one coil 200 has two pins, and correspondingly, the number of the positioning holes 304 is twice the number of the coils 200; the positions of the positioning holes 304 are determined according to the placement positions of the coils 200, as known from the foregoing, two positioning holes 304 should be arranged in one placement area. In the embodiment, two coils 200 are arranged, and therefore, the number of the positioning holes 304 is four.
[0050] In an embodiment of the present application, please refer to Figure 6 The lower surface of the base 300 has a recess 305, which is arranged around the positioning hole 304, and the recess 305 is used for air to be discharged from the recess 305 when the pins of the coil 200 are soldered.
[0051] In this embodiment, the recess 305 on the lower surface of the base 300 is designed to provide a space for air circulation when the pins of the coil 200 are soldered, thereby avoiding the problem of false welding caused by poor air circulation. The shape and size of the recess 305 can be adaptively designed according to the size and number of the pins of the coil 200 to ensure that air can be smoothly discharged from the recess 305 during soldering, while also not affecting the overall structure and strength of the base 300. In addition, the recess 305 can also play a role in guiding the flow of solder, so that the solder can be more evenly distributed around the pins, further improving the quality of soldering.
[0052] In an embodiment of the present application, please refer to Figure 6 The lower surface of the base 300 is provided with a plurality of mounting holes 306, and the mounting holes 306 are used for mounting and fixing the base 300.
[0053] In an embodiment of the present application, the shape and size of the mounting hole 306 can be adaptively designed according to the mounting requirements on the circuit board to ensure that the base 300 can be stably fixed on the circuit board. The mounting hole 306 can be circular, square, oval or other shapes, and the specific shape can be adjusted according to actual needs. In addition, the number of mounting holes 306 can also be adaptively designed according to the size and weight of the base 300 to ensure that the base 300 has sufficient stability and reliability during installation.
[0054] In an embodiment of the present application, please refer to Figure 5 and Figure 8 The side surface of the base 300 in the width direction is a concave arc surface 307, and the arc surface 307 connects the upper surface of the base 300 and the lower surface of the base 300.
[0055] In this embodiment, the side surface of the base 300 in the width direction is designed as a concave arc surface 307, which can effectively reduce the size of the lower surface of the base 300 in the length direction, thereby reducing the installation area occupied by the base 300 on the circuit board. By setting the arc surface 307, not only the appearance of the base 300 is more beautiful, but also the strength and toughness of the base 300 can be improved. The design of the arc surface 307 can reduce the stress concentration of the base 300 when subjected to external force, thereby prolonging the service life of the base 300.
[0056] In an embodiment of the present application, the inner surface of the groove 301 is covered with a first adhesive layer (not shown), and the magnetic core 100 is adhesively connected to the base 300 through the first adhesive layer; the bottom of the through slot 302 is covered with a second adhesive layer (not shown), and the coil 200 is adhesively connected to the base 300 through the second adhesive layer.
[0057] In the present embodiment, the design of the first adhesive layer and the second adhesive layer enables the magnetic core 100 and the coil 200 to be more firmly fixed on the base 300, further improving the stability and reliability of the common mode inductor. The first adhesive layer and the second adhesive layer can be made of an adhesive material with high adhesive strength and high temperature resistance to ensure that they will not fall off or loosen during long-term operation. At the same time, the design of the first adhesive layer and the second adhesive layer can also play a role in shock absorption and buffering, reducing the influence of external vibration on the common mode inductor.
[0058] In an embodiment of the present application, the base 300 is an integrally formed structure made of PPS material.
[0059] In the present embodiment, the full name of PPS in English is Polyphenylene sulfide, which is a high-performance thermoplastic resin with excellent heat resistance, chemical corrosion resistance, mechanical strength, chemical stability, and electrical insulation performance, suitable for use in high-temperature environments and not prone to deformation. The base 300 made of PPS material in an integrally formed structure not only effectively improves the overall stability and durability of the common mode inductor, but also simplifies the production process and reduces production costs. Moreover, the base 300 made of PPS material in an integrally formed structure can also enhance the insulation performance between the coil 200 and the circuit board.
[0060] In the present embodiment, the base 300 is an integrally formed structure, i.e., the base 300 is made by an integrally formed process without the need for additional assembly steps or connecting pieces to combine the various parts of the base 300 together, thereby further improving the structural strength and stability of the base 300. The integrally formed base 300 also has better dimensional accuracy and shape retention, which can ensure the accurate positioning and fixation of the magnetic core 100 and the coil 200 on the base 300, improving the overall performance and reliability of the common mode inductor.
[0061] In an embodiment of the present application, please refer to Figure 1 and Figure 3 , the magnetic core 100 is a racetrack-shaped structure of amorphous nanocrystalline.
[0062] In this embodiment, the amorphous nanocrystalline material has the advantages of high saturation magnetic induction, low loss and high stability; the flat volume of the runway-shaped structure can reduce the height of the common mode inductor and provide more winding space; the amorphous nanocrystalline magnetic core 100 in the runway-shaped structure can effectively improve the permeability of the magnetic core 100, thereby further improving the filtering effect and anti-interference ability of the common mode inductor. In addition, the design of the runway-shaped structure can also optimize the magnetic field distribution of the magnetic core 100, so that the magnetic core 100 can more efficiently utilize the magnetic field energy during operation, thereby improving the performance of the common mode inductor.
[0063] In an embodiment of the present application, the cross section of the coil 200 is a flat strip structure.
[0064] In this embodiment, the flat strip structure design of the coil 200 not only optimizes the spatial layout of the coil 200 and saves the machine winding time, but also increases the contact area between the coil 200 and the air, thereby enhancing the heat dissipation performance of the coil 200 and helping to improve the working stability of the common mode inductor in a high temperature environment. Moreover, the flat strip structure design of the coil 200 helps to reduce the direct current resistance of the inductor and improve the high frequency performance of the inductor. In addition, the cooperation of the flat strip coil 200 and the runway-shaped magnetic core 100 makes the entire common mode inductor more easily integrated into modern electronic devices while maintaining high performance, thereby meeting the needs of modern electronic industry for miniaturization and high performance of components.
[0065] In summary, the common mode inductor provided by the present application solves the technical problems of large volume and the need for other materials for fixation and limiting of the common mode inductor in the prior art by providing the recess 301 and the through slot 302 on the base 300, using the runway-shaped magnetic core 100 of amorphous nanocrystalline and the flat strip structure design of the coil 200, thereby improving the performance of the common mode inductor, making the installation of the common mode inductor on the circuit board more compact, saving space, reducing production cost, and having a wide application prospect.
[0066] The present application also provides an electronic device (not shown) comprising the common mode inductor described above.
[0067] In this embodiment, the electronic device can effectively improve the electromagnetic compatibility and filtering effect of the device by using the common mode inductor described above, thereby ensuring stable operation of the device in a complex electromagnetic environment. At the same time, due to the small size and compact structure of the common mode inductor, the internal space of the electronic device can be saved, thereby providing more possibilities for the layout of other components and further improving the overall performance and reliability of the electronic device.
[0068] The above only describes preferred embodiments of the present application and is not used to limit the present application, and any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims
1. A common mode inductor, characterized by It comprises: a magnetic core; a coil wound on the magnetic core; a base, the upper surface of the base is provided with a groove along the length direction of the base, the magnetic core is clamped in the groove; the upper surface of the base is provided with a through slot along the width direction of the base, the coil is clamped in the through slot; the length of the base gradually decreases from the upper surface of the base to the lower surface of the base; the lower surface of the base is used to connect a circuit board.
2. The common mode inductance of claim 1, wherein, The through slot is provided with N insulating partitions, the N insulating partitions are arranged at intervals along the length direction of the base; the insulating partitions are used to increase the electrical distance between the coils and avoid electromagnetic interference between the coils.
3. The common mode inductance of claim 2, wherein, The N insulating partitions divide the through slot into N+1 placement areas; the magnetic core is provided with N+1 coils, one coil is placed in one placement area; wherein N is a positive integer greater than or equal to 1.
4. The common mode inductance of claim 1, wherein, The bottom of the through slot is provided with a plurality of positioning holes, the positioning holes penetrate to the lower surface of the base, and the positioning holes are used for the pin wire of the coil.
5. The common mode inductance of claim 4, wherein, The lower surface of the base has a recess, the recess is arranged around the positioning hole, and the recess is used for air exhaust during soldering of the pin of the coil.
6. The common mode inductance of claim 1, wherein, The lower surface of the base is provided with a plurality of mounting holes, and the mounting holes are used for mounting and fixing the base.
7. The common mode inductance of claim 1, wherein, The side surface of the base in the width direction is a concave arc surface, and the arc surface connects the upper surface of the base and the lower surface of the base.
8. The common mode inductance of claim 1, wherein, The inner surface of the groove is covered with a first adhesive layer, and the magnetic core and the base are adhesively connected through the first adhesive layer. The bottom of the through slot is covered with a second adhesive layer, and the coil and the base are adhesively connected through the second adhesive layer.
9. The common mode inductance of any one of claims 1-8, wherein, The base is an integral molding structure.
10. An electronic device, comprising: The electronic device comprises the common mode inductor as claimed in any one of claims 1-9.