Modularized bus duct structure with heat conduction and heat dissipation effects

Abstract

The utility model discloses a modularized bus duct structure with heat conduction and heat dissipation effects, which comprises a plurality of copper conductors which are symmetrically distributed, a plurality of heat conduction side plates which are arranged among the symmetrically distributed copper conductors, and the heat conduction side plates are arranged between the copper conductors. One heat conduction side plate is arranged between every adjacent at least one copper conductor on the same side, and the cover plates which are symmetrically distributed are arranged at the upper end and the lower end of the plurality of heat conduction side plates, the heat conduction side plates are arranged between every adjacent at least one copper conductor on the same side, and the cover plates are arranged at the upper end and the lower end of the plurality of heat conduction side plates. The adjacent heat-conducting side plates on the same side are mutually sleeved, and the cover plate and the heat-conducting side plates are riveted by using rivets, so that on one hand, the structural strength of the bus duct is improved, the connection stability and reliability of the bus duct are improved, and on the other hand, through the heat-conducting side plates, the temperature on the copper conductor can be effectively conducted and transferred to the cover plate for heat dissipation; and the heat dissipation effect of the bus duct is improved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to bus duct technical field, concretely relates to a modular bus duct structure with heat conduction and heat dissipation effect. BACKGROUND

[0002] Bus duct is a kind of closed metal device formed by copper and aluminium bus column, is used to distribute large power for each element of dispersion system, and has been increasingly replaced by wire and cable in indoor low-voltage power transmission trunk line engineering project.

[0003] The existing bus duct fixes copper conductor in the middle by two side plates, and is fixed by connecting the upper and lower cover plates and two side plates, so that the bus duct structure is low in strength, unstable in connection, and the copper conductor in the interior cannot be effectively cooled, which influences the heat dissipation effect of bus duct, and therefore the modular bus duct structure with heat conduction and heat dissipation effect is provided. UTILITY MODEL CONTENTS

[0004] The utility model aims at providing a modular bus duct structure with heat conduction and heat dissipation effect to solve the problems in the above background.

[0005] To achieve the above object, the utility model provides the following technical scheme: a modular bus duct structure with heat conduction and heat dissipation effect, comprising,

[0006] Copper conductor, the copper conductor is provided with several, and several copper conductors are symmetrically distributed;

[0007] Heat conduction side plate, the heat conduction side plate is provided with several;

[0008] Between the symmetrically distributed copper conductors, at least one heat conduction side plate is arranged between each adjacent copper conductor on the same side;

[0009] Cover plate, the upper and lower ends of several heat conduction side plates are provided with symmetrically distributed cover plates.

[0010] Preferably, the heat conduction side plate is U-shaped structure.

[0011] Preferably, the size of the heat conduction side plate on the same side gradually decreases from inside to outside, and the adjacent heat conduction side plates on the same side are mutually sleeved.

[0012] Preferably, the copper conductor is arranged between the adjacent heat conduction side plates on the same side.

[0013] Preferably, the cover plate and the heat conduction side plate are connected by rivet riveting.

[0014] Compared with the prior art, the utility model has the beneficial effects that:

[0015] The utility model discloses a heat conduction side plate is arranged between every adjacent at least one copper conductor at the same side, and the heat conduction side plate of adjacent at least one copper conductor at the same side is sleeved with each other, and the heat conduction side plate is riveted and connected with the cover plate, on the one hand, the structural strength of bus duct is improved, and the connection stability and reliability of bus duct are improved, on the other hand, through the heat conduction side plate, the temperature on the copper conductor can be effectively conducted and transferred to the cover plate and radiated, and the heat dissipation effect of bus duct is improved. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is bus duct structure schematic diagram in the utility model embodiment 1;

[0017] Figure 2 It is bus duct structure schematic diagram in the utility model embodiment 2.

[0018] In the drawing: 1, copper conductor;2, heat conduction side plate;3, cover plate. DETAILED DESCRIPTION

[0019] The technical scheme in the utility model embodiments will be described clearly and completely below in conjunction with the drawings of the utility model embodiments. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the scope of protection of the utility model.

[0020] Embodiment 1:

[0021] As shown in the utility model provides a modular bus duct structure with heat conduction and heat dissipation effect, comprising, Figure 1 Copper conductor 1, copper conductor 1 is provided with four, four copper conductors 1 symmetrical distribution, copper conductor 1 is arranged between the adjacent heat conduction side plate 2 at the same side;

[0022] Heat conduction side plate 2, heat conduction side plate 2 is provided with four, symmetrical distribution copper conductor 1, is provided with a heat conduction side plate 2 between every adjacent two copper conductors 1 at the same side, heat conduction side plate 2 is U-shaped structure, the size of heat conduction side plate 2 at the same side gradually reduces from inside to outside, and the adjacent heat conduction side plate 2 at the same side is sleeved with each other;

[0023] Cover plate 3, the upper and lower ends of four heat conduction side plates 2 are provided with symmetrically distributed cover plates 3, and the cover plate 3 and the heat conduction side plate 2 are connected by rivet riveting.

[0024]

[0025] ​In the embodiment, one heat-conducting side plate 2 is arranged between each two adjacent copper conductors 1 on the same side, and the adjacent heat-conducting side plates 2 on the same side are sleeved with each other, and the cover plate 3 and the heat-conducting side plate 2 are riveted and connected by rivets, which improves the structural strength of the bus duct, improves the connection stability and reliability of the bus duct, and on the other hand, through the heat-conducting side plate 2, the temperature on the copper conductor 1 can be effectively conducted and transmitted to the cover plate 3 for heat dissipation, thereby improving the heat dissipation effect of the bus duct.

[0026] Embodiment 2:

[0027] As shown in Figure 2 The modular bus duct structure with heat-conducting and heat-dissipating effects provided by the utility model, comprising,

[0028] The copper conductor 1 is provided with four copper conductors 1, and the four copper conductors 1 are symmetrically distributed, and the copper conductor 1 is arranged between the adjacent heat-conducting side plates 2 on the same side.

[0029] The heat-conducting side plate 2 is provided with six heat-conducting side plates 2, and the symmetrically distributed copper conductors 1 are arranged between each two adjacent copper conductors 1 on the same side, and the heat-conducting side plate 2 is of a U-shaped structure, and the size of the heat-conducting side plate 2 on the same side gradually decreases from inside to outside, and the adjacent heat-conducting side plates 2 on the same side are sleeved with each other.

[0030] The cover plate 3 is provided with symmetrically distributed cover plates 3 at the upper and lower ends of the four heat-conducting side plates 2, and the cover plate 3 and the heat-conducting side plate 2 are riveted and connected by rivets.

[0031] In the embodiment, one heat-conducting side plate 2 is arranged between each two adjacent copper conductors 1 on the same side, and the adjacent heat-conducting side plates 2 on the same side are sleeved with each other, and the cover plate 3 and the heat-conducting side plate 2 are riveted and connected by rivets, which improves the structural strength of the bus duct, improves the connection stability and reliability of the bus duct, and on the other hand, through the heat-conducting side plate 2, the temperature on the copper conductor 1 can be effectively conducted and transmitted to the cover plate 3 for heat dissipation, thereby improving the heat dissipation effect of the bus duct, compared with the bus duct structure in embodiment 1, the bus duct structure in embodiment 2 has higher structural strength and better heat dissipation effect.

[0032] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A modular bus duct structure having a heat conducting heat dissipation effect, characterized by, Include, Copper conductor (1), the copper conductor (1) is provided with several, several copper conductor (1) is symmetrically distributed; Thermal side plate (2), the thermal side plate (2) is provided with several; Symmetrically distributed copper conductor (1) between, between each adjacent at least one copper conductor (1) on the same side is provided with one thermal side plate (2); Cover plate (3), the upper and lower ends of several thermal side plates (2) are provided with symmetrically distributed cover plates (3); The thermal side plate (2) is U-shaped structure; The size of the thermal side plate (2) on the same side gradually decreases from inside to outside, and the adjacent thermal side plates (2) on the same side are mutually sleeved.

2. The modular busway structure with heat conduction and heat dissipation effect according to claim 1, characterized in that: The copper conductor (1) is arranged between the adjacent thermal side plates (2) on the same side.

3. The modular busway structure with heat conduction and heat dissipation effect according to claim 1, characterized in that: The cover plate (3) and the thermal side plate (2) are connected by rivet riveting.

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