Texturing blanking device

Abstract

The utility model relates to the technical field of batteries, particularly provides a texturing and blanking device, and aims to solve the problems of low selection accuracy and low selection efficiency caused by the fact that double silicon wafers need to be selected manually in the texturing and blanking process of an existing solar battery. The texturing and discharging device comprises a silicon wafer removing mechanism, a silicon wafer discharging mechanism and a silicon wafer discharging mechanism, wherein the silicon wafer removing mechanism is used for removing bad wafers and reworked wafers in a basket to be removed; the silicon wafer transmission mechanism is configured to be capable of conveying the rejected rework wafers into the rework basket and conveying the rejected defective wafers into the defective wafer collection box; wherein the bad wafers are double silicon wafers in the basket to be rejected, and the reworked wafers are silicon wafers in a set range around the double silicon wafers in the basket to be rejected. According to the invention, two silicon wafers in the basket to be rejected and the silicon wafers near the two silicon wafers can be rejected, the two silicon wafers are transmitted into the bad wafer collection box, the silicon wafers near the two silicon wafers are transmitted into the reworking basket, and the silicon wafer selection accuracy and efficiency are greatly improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of batteries, and specifically provides a texturing unloading device. BACKGROUND

[0002] At present, the production of solar cells cannot be separated from the texturing process. Texturing aims to clean the silicon wafer while etching the silicon wafer, so that the silicon wafer has a pyramid textured surface, increases the light trapping effect, and improves the absorption of sunlight.

[0003] However, due to machine identification problems, when the silicon wafer is inserted into the basket for carrying the silicon wafer, there may be a case that two silicon wafers are inserted into one basket tooth at the same time. After the slot process, the double silicon wafers cannot be dried, flow into the subsequent process, and cause the generation of bad wafers such as burning and basket tooth marks. At the same time, the silicon wafers near the double silicon wafers in the basket are also contaminated to different degrees. Therefore, the double silicon wafers in the basket and the silicon wafers near the double silicon wafers need to be selected out to reduce the generation of bad wafers.

[0004] In the prior art, after the double silicon wafers in the basket are identified, the selection process of the double silicon wafers and the silicon wafers near them usually relies on camera recognition and manual selection. Manual selection not only has low selection efficiency, but also has the risk of mis-selection and missed selection, resulting in low selection accuracy and low selection efficiency. CONTENT OF THE UTILITY MODEL

[0005] The present application aims to at least partially solve the above technical problems, that is, at least partially solve the problem that the existing solar cells need manual selection of double silicon wafers in the texturing unloading process, resulting in low selection accuracy and low selection efficiency.

[0006] In a first aspect, the present application provides a texturing unloading device, which comprises: a silicon wafer rejection mechanism for rejecting bad wafers and rework wafers in a to-be-rejected basket; and a silicon wafer transmission mechanism configured to transport the rejected rework wafers into a rework basket and transport the rejected bad wafers into a bad wafer collection box; wherein the bad wafers are double silicon wafers in the to-be-rejected basket, and the rework wafers are silicon wafers within a set range around the double silicon wafers in the to-be-rejected basket.

[0007] In the preferred technical solution of the above texturing unloading device, the silicon wafer transmission mechanism comprises a silicon wafer transmission track, a rework wafer loading assembly, and a bad wafer transmission assembly. The silicon wafer transmission track is used to transmit the bad wafers and the rework wafers rejected from the to-be-rejected basket. The rework wafer loading assembly is used to load the rework wafers on the silicon wafer transmission track into the rework basket. The bad wafer transmission assembly is used to transmit the bad wafers on the silicon wafer transmission track into the bad wafer collection box.

[0008] In the preferred technical scheme of the above-mentioned wafering discharging device, the defective wafer conveying assembly comprises a lifting track, a defective wafer conveying track and a defective wafer placing platform, wherein the lifting track is arranged on the inner side of the wafer conveying track and is capable of transferring the defective wafer on the wafer conveying track to the defective wafer conveying track, the defective wafer placing platform is arranged at the end of the defective wafer conveying track away from the lifting track and is used for placing the defective wafer collecting box, and the defective wafer conveying track is used for conveying the defective wafer to the defective wafer collecting box.

[0009] In the preferred technical scheme of the above-mentioned wafering discharging device, the wafer conveying mechanism further comprises a rework wafer placing platform, the rework wafer placing platform is used for placing the rework wafer basket, the rework wafer basket is provided with a plurality of loading slots distributed in the vertical direction, and the rework wafer placing platform is arranged to be movable in the vertical direction so as to align the loading slots in the rework wafer basket with the rework wafer loading assembly.

[0010] In the preferred technical scheme of the above-mentioned wafering discharging device, the rework wafer loading assembly comprises a first driving member and a loading member, the first driving member is drivingly connected with the loading member so as to drive the loading member to move towards or away from the rework wafer basket, thereby loading the rework wafer on the wafer conveying track into the rework wafer basket.

[0011] In the preferred technical scheme of the above-mentioned wafering discharging device, the wafer rejection mechanism comprises a wafer rejection platform and a wafer rejection assembly, the wafer rejection platform is used for placing the wafer-to-be-rejected basket, the wafer-to-be-rejected basket is provided with a plurality of placing slots distributed in the vertical direction, the defective wafer and the rework wafer are respectively located in different placing slots, the wafer rejection platform is arranged to be movable in the vertical direction so as to align the defective wafer or the rework wafer in the wafer-to-be-rejected basket with the wafer rejection assembly, and the wafer rejection assembly is used for rejecting the defective wafer or the rework wafer in the wafer-to-be-rejected basket.

[0012] In the preferred technical scheme of the above-mentioned wafering discharging device, the wafer rejection assembly comprises a second driving member and a rejection member, the second driving member is drivingly connected with the rejection member so as to drive the rejection member to move towards or away from the wafer-to-be-rejected basket, thereby rejecting the rework wafer or the defective wafer in the wafer-to-be-rejected basket.

[0013] In the preferred technical scheme of the above-mentioned wafering discharging device, the wafering discharging device further comprises a detection platform and an identification assembly, the detection platform is used for carrying a wafer-to-be-detected basket, and the identification assembly is used for detecting whether the double-wafer silicon wafer exists in the wafer-to-be-detected basket.

[0014] In the preferred technical scheme of the foregoing wafering discharging device, the wafering discharging device further comprises a first sensor configured to detect the lifting frequency of the lifting track; and / or the wafering discharging device further comprises a second sensor configured to detect whether the rework wafer basket is full.

[0015] In the preferred technical scheme of the foregoing wafering discharging device, the wafering discharging device further comprises an alarm device in communication connection with the first sensor and / or the second sensor.

[0016] In the case of using the foregoing preferred technical scheme, the present application can remove the double wafer (defective wafer) in the to-be-removed wafer basket and the wafer (rework wafer) near the double wafer, not only can transmit the removed defective wafer into the defective wafer collecting box, but also can transmit the removed rework wafer into the rework wafer basket, thereby conveniently separating the defective wafer and the rework wafer, greatly improving the selection accuracy and selection efficiency of the wafer, and solving the problem of low selection accuracy and low selection efficiency caused by the manual selection of double wafer in the wafering discharging process of the solar cell in the prior art.

[0017] Further, by setting the wafer transmission mechanism to comprise a wafer transmission track, a rework wafer loading assembly and a defective wafer transmission assembly, not only can the defective wafer and the rework wafer be separated, but also the rework wafer can be loaded into the rework wafer basket, facilitating the reprocessing of the rework wafer and further improving the processing efficiency.

[0018] Still further, by setting the identification assembly, it can be identified whether the double wafer exists in the to-be-detected wafer basket. Compared with manual identification, setting the identification assembly to detect whether the double wafer exists in the to-be-detected wafer basket can improve the detection accuracy, and further improve the selection accuracy.

[0019] Still further, by setting the first sensor, it can be judged whether the defective wafer collecting box is full by detecting the lifting frequency of the lifting track. By setting the second sensor, it can be detected whether the rework wafer in the rework wafer basket is full. By setting the first sensor and the second sensor in communication connection with the alarm device, when the first sensor detects that the defective wafer in the defective wafer collecting box is full, or when the second sensor detects that the rework wafer in the rework wafer basket is full, a signal is transmitted to the alarm device, and the alarm device issues an alarm to remind the operator to replace a new defective wafer collecting box or rework wafer basket, further improving the selection efficiency of the wafer. BRIEF DESCRIPTION OF DRAWINGS

[0020] The preferred embodiments of the present application will be described below with reference to the accompanying drawings, in which:

[0021] Figure 1is a structural schematic of the wafering unloading device of the present application Figure One ;

[0022] Figure 2 is Figure 1 a left view structural schematic of the wafer conveying track and the lifting track in the present application;

[0023] Figure 3 is a structural schematic of the wafering unloading device of the present application Figure Two , wherein the position relation of each component of the rejecting assembly when rejecting a rework wafer is shown;

[0024] Figure 4 is a structural schematic of the wafering unloading device of the present application Figure Three , wherein the position relation of each component when a rework wafer is rejected is shown;

[0025] Figure 5 is a structural schematic of the wafering unloading device of the present application Figure Four , wherein the position relation of each component of the wafer conveying track when a rework wafer is conveyed is shown;

[0026] Figure 6 is a structural schematic of the wafering unloading device of the present application Figure Five , wherein the position relation of each component of the wafer loading assembly when a rework wafer is loaded into a rework boat is shown;

[0027] Figure 7 is a structural schematic of the wafering unloading device of the present application Figure Six , wherein the position relation of each component of the wafer loading assembly when the wafer loading assembly moves away from the rework boat after loading a rework wafer into the rework boat is shown;

[0028] Figure 8 is a top view schematic of the wafer rejecting assembly of the present application;

[0029] Figure 9 is a top view schematic of the rework wafer loading assembly of the present application.

[0030] List of Reference Numerals:

[0031] 11, wafer conveying track; 12, rework wafer loading assembly; 121, first driving member; 122, loading member; 131, lifting track; 132, defective wafer conveying track; 133, defective wafer placing platform; 14, rework wafer placing platform; 21, wafer rejection platform; 22, wafer rejection assembly; 221, second driving member; 222, rejection member; 31, detection platform; 32, identification assembly; 33, flower basket conveying track; 41, first sensor; 42, second sensor; 5, to-be-detected flower basket; 6, to-be-rejected flower basket; 7, rework flower basket; 71, loading slot; 8, defective wafer collection box. DETAILED DESCRIPTION

[0032] The preferred embodiments of the present application will be described below with reference to the drawings. It should be understood by those skilled in the art that the embodiments are only used to explain the technical principles of the present application and are not intended to limit the protection scope of the present application.

[0033] It should be noted that, in the description of the present application, the terms "upper", "lower", "inner", "outer", "top", etc. indicating the direction or positional relationship are based on the direction or positional relationship shown in the drawings, which is only for the convenience of description and is not intended to indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0034] In addition, it should also be noted that, in the description of the present application, unless otherwise explicitly specified and limited, the terms "mounting", "setting", "connecting" should be understood in a broad sense, for example, it can be fixed connection, or detachable connection, or integral connection. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0035] The present application will be further described below in conjunction with the specific embodiments. It should be understood that these specific embodiments are only used to illustrate the present application and not to limit the scope of the present application.

[0036] As shown in Figure 1 and Figure 2 The wafer rejection mechanism and the wafer conveying mechanism are configured to reject the defective wafer and the rework wafer in the to-be-rejected flower basket 6, and to convey the rejected rework wafer into the rework flower basket 7 and the rejected defective wafer into the defective wafer collection box 8.

[0037] The defective wafer is a double wafer in the to-be-rejected flower basket 6, and the rework wafer is a wafer within a set range around the double wafer in the to-be-rejected flower basket 6.

[0038] By setting the silicon wafer rejection mechanism, the double wafer silicon wafer existing in the to-be-rejected wafer basket 6 and the silicon wafer within the set range around the double wafer silicon wafer can be rejected out. By setting the silicon wafer transmission mechanism, the rejected rework wafer can be transported into the rework wafer basket 7, and the rejected defective wafer can be transported into the collection box, so that the rework wafer and the defective wafer are conveniently separated, the selection accuracy and selection efficiency of the silicon wafer are greatly improved, and the problems of low selection accuracy and low selection efficiency caused by manual selection of double wafer silicon wafers during the etching of solar cells in the prior art are solved.

[0039] It should be noted that since the wafer basket is provided with a plurality of silicon wafer placing grooves, only one silicon wafer is placed in each silicon wafer placing groove. When there are two silicon wafers in the silicon wafer placing groove, it is a double wafer silicon wafer, that is, a stacked wafer (as shown in Figures 3 to 7 ).

[0040] It should be further noted that the rework wafer is the silicon wafer within the set range around the double wafer silicon wafer in the to-be-rejected wafer basket 6. The set range around the double wafer silicon wafer is not limited in the present application, and can be flexibly set by those skilled in the art according to actual application. For example, the set range can be set to the range of the double wafer silicon wafer and 3 wafers above and below the double wafer silicon wafer, or the set range can be set to the range of the double wafer silicon wafer and 5 wafers above and below the double wafer silicon wafer, or the set range can be set to the range of the double wafer silicon wafer and 10 wafers above and below the double wafer silicon wafer, and the like. Such flexible adjustment and change do not deviate from the principles and scope of the present application, and should be included in the protection scope of the present application.

[0041] For example, the set range is the range of the double wafer silicon wafer and 10 wafers above and below the double wafer silicon wafer.

[0042] It should be noted that in actual application, the specific setting type of the silicon wafer transmission mechanism is not limited in the present application, as long as the rejected rework wafer can be transported into the rework wafer basket 7 and the rejected defective wafer can be transported into the defective wafer collection box 8.

[0043] In a specific embodiment, as shown in Figure 1 and Figure 2 , the silicon wafer transmission mechanism includes a silicon wafer transmission track 11, a rework wafer loading assembly 12, and a defective wafer transmission assembly. The silicon wafer transmission track 11 is used to transport the rejected defective wafer and rework wafer from the to-be-rejected wafer basket 6. The rework wafer loading assembly 12 is arranged at the end of the silicon wafer transmission track 11 and is used to load the rework wafer on the silicon wafer transmission track 11 into the rework wafer basket 7. The defective wafer transmission assembly is used to transport the defective wafer on the silicon wafer transmission track 11 into the defective wafer collection box 8.

[0044] In another embodiment, the wafer transport mechanism comprises a wafer transport track for transporting the rejected scrap wafers and the rejected rework wafers from the to-be-rejected wafer baskets 6, a rework wafer transport assembly for transporting the rework wafers on the wafer transport track to the rework wafer loading assembly, and a rework wafer loading assembly (not shown) for loading the rework wafers on the wafer transport track into the rework wafer baskets.

[0045] In another possible embodiment, the wafer transport mechanism comprises a first wafer transport track for transporting the rejected rework wafers, a rework wafer loading assembly 12 (not shown) for loading the rework wafers on the first wafer transport track into the rework wafer baskets 7, and a second wafer transport track for transporting the rejected scrap wafers and transporting the rejected scrap wafers into the scrap wafer collection box 8.

[0046] It should be noted that although the above three embodiments can all achieve the purpose of transporting the rejected rework wafers into the rework wafer baskets 7 and transporting the rejected scrap wafers into the scrap wafer collection box 8, compared with the form of the wafer transport mechanism comprising the first wafer transport track, the second wafer transport track, and the rework wafer loading assembly, the form of the wafer transport mechanism comprising the wafer transport track 11, the rework wafer loading assembly 12, and the scrap wafer transport assembly can save the setting of the transport track, which not only helps to simplify the structure of the wafer rejection mechanism, but also helps to save costs.

[0047] Meanwhile, since the number of rework wafers is significantly more than that of scrap wafers, compared with the form of the wafer transport mechanism comprising the wafer transport track, the rework wafer transport assembly, and the rework wafer loading assembly, the form of the wafer transport mechanism comprising the wafer transport track 11, the rework wafer loading assembly 12, and the scrap wafer transport assembly and setting the rework wafer loading assembly 12 at the end of the wafer transport track 11 can directly transport the rework wafers on the wafer transport track 11 to the end and load the rework wafers into the rework wafer baskets 7 through the rework wafer loading assembly 12, thereby reducing the running time of the rework wafer transport assembly and further helping to save energy.

[0048] Of course, preferably, the wafer transport mechanism comprises the wafer transport track 11, the rework wafer loading assembly 12, and the scrap wafer transport assembly, the wafer transport track 11 is used for transporting the rejected scrap wafers and the rejected rework wafers from the to-be-rejected wafer baskets 6, the rework wafer loading assembly 12 is used for loading the rework wafers on the wafer transport track 11 into the rework wafer baskets 7, and the scrap wafer transport assembly is used for transporting the scrap wafers on the wafer transport track 11 into the scrap wafer collection box 8.

[0049] When the silicon wafer rejection mechanism rejects the defective wafer and the rework wafer in the wafer basket 6, the silicon wafer conveying track 11 can transfer the defective wafer and the rework wafer to the conveying belt by the conveying action of the conveying belt, so as to facilitate the conveying of the defective wafer and the rework wafer to the defective wafer collecting box 8 and the rework wafer basket 7 respectively.

[0050] Preferably, as shown in Figure 1 and Figure 2 The defective wafer conveying assembly comprises a lifting track 131, a defective wafer conveying track 132 and a defective wafer placing platform 133, wherein the lifting track 131 is arranged at the inner side of the silicon wafer conveying track 11 and can transfer the defective wafer on the silicon wafer conveying track 11 to the defective wafer conveying track 132, the defective wafer placing platform 133 is arranged at the end of the defective wafer conveying track 132 away from the lifting track 131 and is used for placing the defective wafer collecting box 8, and the defective wafer conveying track 132 is used for conveying the defective wafer to the defective wafer collecting box 8.

[0051] Through such an arrangement, when the rework wafer and the defective wafer are conveyed to the silicon wafer conveying track 11, the rework wafer on the silicon wafer conveying track 11 is directly conveyed to the end of the silicon wafer conveying track 11 and loaded into the rework wafer basket 7 by the rework wafer loading assembly 12, and the defective wafer on the silicon wafer conveying track 11 is transferred to the defective wafer conveying track 132 by the lifting track 131 and then conveyed to the defective wafer collecting box 8 on the defective wafer placing platform 133, so as to realize the separation of the rework wafer and the defective wafer and greatly improve the selection efficiency.

[0052] It should be noted that the defective wafer conveying assembly is not limited to being arranged to comprise the lifting track 131 and to transfer the defective wafer on the silicon wafer conveying track 11 to the defective wafer conveying track 132 by the lifting track 131, for example, the defective wafer conveying assembly can also be arranged to comprise a suction cup assembly and to transfer the defective wafer on the silicon wafer conveying track 11 to the defective wafer conveying track 132 by the suction cup assembly, or the defective wafer conveying assembly can also be arranged to comprise a push rod assembly and to transfer the defective wafer on the silicon wafer conveying track 11 to the defective wafer conveying track 132 by the push rod assembly, and the like. Such adjustment and change of the specific manner of transferring the defective wafer on the silicon wafer conveying track 11 to the defective wafer conveying track 132 do not deviate from the principles and scope of the present application and should be included in the protection scope of the present application. Of course, preferably, the defective wafer conveying assembly is arranged to comprise the lifting track 131 and to transfer the defective wafer on the silicon wafer conveying track 11 to the defective wafer conveying track 132 by the lifting track 131.

[0053] Preferably, as shown in Figures 1 to 7As shown, the silicon wafer conveying mechanism further comprises a rework wafer placing platform 14 configured to place the rework wafer basket 7, the rework wafer basket 7 having a plurality of loading slots 71 vertically spaced apart, and the rework wafer placing platform 14 is vertically movable to align the loading slots 71 in the rework wafer basket 7 with the rework wafer loading assembly 12.

[0054] By vertically moving the rework wafer placing platform 14, the empty loading slots 71 in the rework wafer basket 7 can be aligned with the rework wafer loading assembly 12, so as to facilitate the rework wafer loading assembly 12 to load the rework wafer on the silicon wafer conveying track 11 into the loading slots 71 in the rework wafer basket 7, and improve the loading efficiency of the rework wafer.

[0055] It should be noted that in actual applications, the rework wafer placing platform 14 is not necessarily vertically movable to align the loading slots 71 in the rework wafer basket 7 with the rework wafer loading assembly 12, for example, the rework wafer loading assembly 12 can also be vertically movable to align the loading slots 71 in the rework wafer basket 7 with the rework wafer loading assembly 12, and the like, and such flexible adjustment and change does not deviate from the principles and scope of the present application, and should be included in the protection scope of the present application.

[0056] Of course, preferably, the rework wafer placing platform 14 is vertically movable to align the loading slots 71 in the rework wafer basket 7 with the rework wafer loading assembly 12.

[0057] It should be noted that in actual applications, the present application does not make any limitation on the specific type of the rework wafer loading assembly 12, as long as it can load the rework wafer on the silicon wafer conveying track 11 into the rework wafer basket 7. For example, the rework wafer loading assembly 12 can be configured to comprise a first driving member 121 and a loading member 122, the first driving member 121 is drivingly connected with the loading member 122 to drive the loading member 122 to move towards or away from the rework wafer basket 7, so as to load the rework wafer on the silicon wafer conveying track 11 into the rework wafer basket 7, or the rework wafer loading assembly 12 can be configured as a mechanical hand to directly load the rework wafer on the silicon wafer conveying track 11 into the rework wafer basket 7, and the like, and such adjustment and change of the specific type of the rework wafer loading assembly 12 does not deviate from the principles and scope of the present application, and should be included in the protection scope of the present application.

[0058] Preferably, as shown in Figure 9 the rework wafer loading assembly 12 comprises a first driving member 121 and a loading member 122, the first driving member 121 is drivingly connected with the loading member 122 to drive the loading member 122 to move towards or away from the rework wafer basket 7, so as to load the rework wafer on the silicon wafer conveying track 11 into the rework wafer basket 7.

[0059] When the rework wafer on the wafer conveying track 11 is conveyed above the loading member 122, the first driving member 121 drives the loading member 122 to move towards the direction of the rework wafer basket 7, and the rework wafer is conveyed into the loading slot 71 in the rework wafer basket 7 under the driving of the loading member 122. The rework wafer placing platform 14 is driven to move upwards along the vertical direction so that the rework wafer is separated from the loading member 122. The first driving member 121 drives the loading member 122 to move away from the rework wafer basket 7, so as to facilitate loading of the next rework wafer.

[0060] It should be noted that, in actual application, the specific setting type of the first driving member 121 is not limited in the present application. For example, the first driving member 121 can be set as a cylinder module, or the first driving member 121 can be set as a lead screw module, etc. The adjustment and change of the specific setting type of the first driving member 121 do not deviate from the principles and scope of the present application, and should be included in the protection scope of the present application.

[0061] Exemplarily, the first driving member 121 is a cylinder module.

[0062] It should be noted that, in actual application, the specific setting type of the loading member 122 is not limited in the present application. For example, the loading member 122 can be set as a loading plate, or the loading member 122 can be set as a suction disc, etc. The adjustment and change of the specific setting type of the loading member 122 do not deviate from the principles and scope of the present application, and should be included in the protection scope of the present application.

[0063] Preferably, the loading member 122 is a loading plate.

[0064] By setting the loading member 122 as a loading plate, compared with the form of setting the loading member 122 as a suction disc, the cost of the loading member 122 can be further reduced, so as to reduce the cost of the wafering and unloading device.

[0065] Preferably, as shown in Figures 1 to 7 The wafer rejection mechanism includes a wafer rejection platform 21 and a wafer rejection assembly 22. The wafer rejection platform 21 is used for placing a to-be-rejected wafer basket 6. The to-be-rejected wafer basket 6 is provided with a plurality of placing slots distributed along the vertical direction. The defective wafer and the rework wafer are respectively located in different placing slots. The wafer rejection platform 21 is set to be movable along the vertical direction so as to align the defective wafer or the rework wafer in the to-be-rejected wafer basket 6 with the wafer rejection assembly 22. The wafer rejection assembly 22 is used for rejecting the defective wafer or the rework wafer in the to-be-rejected wafer basket 6.

[0066] By setting the silicon wafer rejection platform 21 to be movable along the vertical direction, the defective wafer or the rework wafer in the wafer basket 6 to be rejected can be aligned with the silicon wafer rejection assembly 22, so as to facilitate the silicon wafer rejection assembly 22 to reject the defective wafer or the rework wafer in the wafer basket 6 to be rejected, and improve the accuracy and efficiency of wafer picking.

[0067] It should be noted that the silicon wafer rejection platform 21 is not limited to being set to be movable along the vertical direction to align the defective wafer or the rework wafer in the wafer basket 6 to be rejected with the silicon wafer rejection assembly 22. For example, the silicon wafer rejection assembly 22 can also be set to be movable along the vertical direction to align the defective wafer or the rework wafer in the wafer basket 6 to be rejected with the silicon wafer rejection assembly 22, or the silicon wafer rejection platform 21 and the silicon wafer rejection assembly 22 can both be set to be movable along the vertical direction to align the defective wafer or the rework wafer in the wafer basket 6 to be rejected with the silicon wafer rejection assembly 22, and the like. Such flexible adjustment and change do not deviate from the principles and scope of the present application, and should be included in the protection scope of the present application.

[0068] Of course, preferably, the silicon wafer rejection platform 21 is set to be movable along the vertical direction to align the defective wafer or the rework wafer in the wafer basket 6 to be rejected with the silicon wafer rejection assembly 22.

[0069] It should be noted that in actual applications, the silicon wafer rejection platform 21 can be set to be movable along the vertical direction by a gas cylinder module, or the silicon wafer rejection platform 21 can be set to be movable along the vertical direction by a lead screw module, and the like. Such adjustment and change of the specific driving mode of the silicon wafer rejection platform 21 along the vertical direction do not deviate from the principles and scope of the present application, and should be included in the protection scope of the present application.

[0070] Preferably, the silicon wafer rejection platform 21 is movable along the vertical direction by a gas cylinder module.

[0071] It should be noted that in actual applications, the silicon wafer rejection assembly 22 can be installed on the wafer conveying track 11, or the silicon wafer rejection assembly 22 can be located between the wafer basket 6 to be rejected and the wafer conveying track 11, and the like. Such adjustment and change of the specific setting position of the silicon wafer rejection assembly 22 do not deviate from the principles and scope of the present application, and should be included in the protection scope of the present application.

[0072] Preferably, the silicon wafer rejection assembly 22 is installed on the wafer conveying track 11 close to one end of the wafer basket 6 to be rejected.

[0073] It should be noted that the present application does not make any limitation on the specific type of the silicon wafer rejection assembly 22, as long as it can reject the defective wafer and the rework wafer in the wafer basket 6, for example, the silicon wafer rejection assembly 22 can be arranged to include a second driving member 221 and a rejection member 222, the second driving member 221 is drivingly connected with the rejection member 222 to drive the rejection member 222 to move towards or away from the wafer basket 6, so as to reject the rework wafer or the defective wafer in the wafer basket 6, or the silicon wafer rejection assembly 22 can be arranged as a mechanical hand, and the mechanical hand directly rejects the rework wafer and the defective wafer in the wafer basket 6, and the like, and such adjustment and change of the specific type of the silicon wafer rejection assembly 22 does not deviate from the principles and scope of the present application, and should be included in the protection scope of the present application.

[0074] Preferably, as shown in Figure 8 the silicon wafer rejection assembly 22 includes a second driving member 221 and a rejection member 222, the second driving member 221 is drivingly connected with the rejection member 222 to drive the rejection member 222 to move towards or away from the wafer basket 6, so as to reject the rework wafer or the defective wafer in the wafer basket 6.

[0075] Through such an arrangement, when the rework wafer or the defective wafer in the wafer basket 6 is aligned with the silicon wafer rejection assembly 22, the second driving member 221 drives the rejection member 222 to move towards the wafer basket 6 and is placed below the wafer to be rejected, the silicon wafer rejection platform 21 moves downward in the vertical direction, then the rejection member 222 is supported below the wafer to be rejected, the second driving member 221 drives the rejection member 222 to move away from the wafer basket 6, so as to move the wafer to be rejected to the silicon wafer conveying track 11, and the wafer rejection is achieved.

[0076] It should be noted that in actual application, the present application does not make any limitation on the specific type of the second driving member 221, for example, the second driving member 221 can be arranged as a cylinder module, or the second driving member 221 can be arranged as a lead screw module, and the like, and such adjustment and change of the specific type of the second driving member 221 does not deviate from the principles and scope of the present application, and should be included in the protection scope of the present application.

[0077] Exemplarily, the second driving member 221 is a cylinder module.

[0078] It should be noted that in practical applications, this application does not limit the specific setting type of the rejection component 222. For example, the rejection component 222 can be set as a rejection plate, or it can be set as a suction cup, etc. Such adjustments and changes to the specific setting type of the rejection component 222 do not deviate from the principles and scope of this application and should be included within the protection scope of this application.

[0079] Preferably, the rejection component 222 is a rejection plate.

[0080] Preferably, such as Figure 1 As shown, the texturing and feeding device of this application also includes a detection platform 31 and an identification component 32. The detection platform 31 is used to carry the flower basket 5 to be detected, and the identification component 32 is used to detect whether there are double silicon wafers in the flower basket 5 to be detected.

[0081] By setting the identification component 32, it is possible to identify whether there are double silicon wafers in the basket 5 to be inspected. Compared with manual identification, setting the identification component 32 to detect whether there are double silicon wafers in the basket 5 to be inspected can improve the detection accuracy, thereby improving the selection accuracy.

[0082] It should be noted that, in practical applications, those skilled in the art can configure the identification component 32 as a camera, or as a video camera, or as a through-beam sensor, etc. Such adjustments and changes to the specific configuration type of the identification component 32 do not deviate from the principles and scope of this application and should all be included within the protection scope of this application.

[0083] Preferably, the identification component 32 is a camera.

[0084] Preferably, such as Figure 1 As shown, the texturing and unloading device of this application also includes a basket conveying track 33 disposed on the detection platform 31, wherein one end of the basket conveying track 33 is disposed adjacent to the silicon wafer rejection platform 21, and the other end of the basket conveying track 33 is disposed adjacent to the normal conveying track (not shown in the figure).

[0085] The robotic arm places the basket 5 to be inspected on the inspection platform 31. The identification component 32 inspects the basket on the inspection platform 31. When the basket on the inspection platform 31 is found to contain double wafers, the basket on the inspection platform 31 is conveyed to the silicon wafer rejection platform 21 by the basket conveyor track 33 for rejection of defective and rework wafers. When the basket on the inspection platform 31 is found not to contain double wafers, the basket on the inspection platform 31 is conveyed to the normal conveyor track by the basket conveyor track 33, and the normal conveyor track transports the basket without double wafers to the normal processing station.

[0086] Preferably, such asFigures 3 to 7 As shown, the wafering discharging device of the present application further comprises a first sensor 41, which is used to detect the lifting frequency of the lifting track 131.

[0087] By setting the first sensor 41, the lifting frequency of the lifting track 131 can be detected, so that the number of defective wafers in the defective wafer collection box 8 can be detected, and the operator can be timely informed to replace a new defective wafer collection box 8 when the number of defective wafers in the defective wafer collection box 8 reaches a certain number.

[0088] Preferably, as Figures 3 to 7 As shown, the wafering discharging device further comprises a second sensor 42, which is used to detect whether the silicon wafers in the rework wafer basket 7 are full.

[0089] By setting the second sensor 42, whether the silicon wafers in the rework wafer basket 7 are full can be detected, so that the operator can be timely informed to replace a new rework wafer basket 7 when the silicon wafers in the rework wafer basket 7 are full.

[0090] It should be noted that the present application does not limit the specific type of the second sensor 42, for example, the second sensor 42 can be set as a distance sensor such as a photoelectric sensor or an infrared sensor, which judges whether the silicon wafers in the rework wafer basket 7 are full by testing the distance between the silicon wafers in the rework wafer basket 7 and the bottom plate of the rework wafer placing platform 14, or the second sensor 42 can be set as a camera, which judges whether the silicon wafers in the rework wafer basket 7 are full by comparing the picture taken by the camera with the preset picture, and the like. Such adjustment and change of the specific type of the second sensor 42 does not deviate from the principles and scope of the present application, and should be included in the protection scope of the present application.

[0091] Preferably, the second sensor 42 is a distance sensor.

[0092] Preferably, the wafering discharging device of the present application further comprises an alarm device, which is in communication connection with the first sensor 41 and the second sensor 42.

[0093] Through such a setting, when the first sensor 41 detects that the defective wafers in the defective wafer collection box 8 are full, or when the second sensor 42 detects that the rework wafers in the rework wafer basket 7 are full, a signal is transmitted to the alarm device, and the alarm device issues an alarm to remind the operator to replace a new defective wafer collection box 8 or rework wafer basket 7, further improving the picking efficiency of the silicon wafers.

[0094] It should be noted that in practical applications, the first sensor 41 and the second sensor 42 are not limited to being configured to communicate with the alarm device. For example, only one of the first sensor 41 and the second sensor 42 may be configured to communicate with the alarm device. Such flexible adjustments and changes do not deviate from the principles and scope of this application and should be included within the protection scope of this application. Of course, it is preferable that the first sensor 41 and the second sensor 42 are both configured to communicate with the alarm device.

[0095] The following is combined Figures 3 to 7 The process of selecting silicon wafers is described.

[0096] like Figure 3 As shown, the silicon wafer rejection assembly 22 rejects defective and rework wafers from the rejection basket 6. The rejected defective and rework wafers are conveyed on the silicon wafer transport track 11. When the defective wafer is conveyed to the top of the lifting track 131, the lifting track 131 rises and lifts the defective wafer to a position that matches the defective wafer transport track 132. The defective wafer on the lifting track 131 is then conveyed to the defective wafer transport track 132, which conveys the defective wafer to the defective wafer collection box 8 at its end. Meanwhile, the rework wafers on the silicon wafer transport track 11 are conveyed to the end of the silicon wafer transport track 11 and loaded into the rework basket 7 by the rework wafer loading assembly 12.

[0097] The technical solutions of this application have been described above with reference to the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the scope of protection of this application is obviously not limited to these specific embodiments. Without departing from the principles of this application, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the scope of protection of this application.

Claims

1. A texturing and dispensing apparatus, comprising: The wafering downfeed device comprises: a wafer rejection mechanism for rejecting defective wafers and rework wafers in a to-be-rejected wafer basket; and a wafer conveying mechanism configured to convey the rejected rework wafers into a rework wafer basket and convey the rejected defective wafers into a defective wafer collecting box; wherein the defective wafers are double-wafer wafers in the to-be-rejected wafer basket, and the rework wafers are wafers within a set range around the double-wafer wafers in the to-be-rejected wafer basket; the wafer rejection mechanism comprises a wafer rejection platform and a wafer rejection assembly, the wafer rejection platform is used for placing the to-be-rejected wafer basket, the to-be-rejected wafer basket is provided with a plurality of placement slots spaced apart in the vertical direction, the defective wafers and the rework wafers are respectively located in different placement slots, and the wafer rejection platform and / or the wafer rejection assembly is / are configured to move in the vertical direction to align the defective wafers or the rework wafers in the to-be-rejected wafer basket with the wafer rejection assembly, and the wafer rejection assembly is used for rejecting the defective wafers or the rework wafers in the to-be-rejected wafer basket.

2. The silvering feed device of claim 1, wherein, the wafer conveying mechanism comprises a wafer conveying track, a rework wafer loading assembly, and a defective wafer conveying assembly, the wafer conveying track is used for conveying the rejected defective wafers and rework wafers from the to-be-rejected wafer basket, the rework wafer loading assembly is used for loading the rework wafers on the wafer conveying track into the rework wafer basket, and the defective wafer conveying assembly is used for conveying the defective wafers on the wafer conveying track into the defective wafer collecting box.

3. The silvering feed device of claim 2, wherein, the defective wafer conveying assembly comprises a lifting track, a defective wafer conveying track, and a defective wafer placement platform, wherein the lifting track is arranged on the inner side of the wafer conveying track and is capable of transferring the defective wafers on the wafer conveying track to the defective wafer conveying track, the defective wafer placement platform is arranged at the end of the defective wafer conveying track away from the lifting track and is used for placing the defective wafer collecting box, and the defective wafer conveying track is used for conveying the defective wafers into the defective wafer collecting box.

4. The abrading material dispensing device of claim 2, wherein, the wafer conveying mechanism further comprises a rework wafer placement platform, the rework wafer placement platform is used for placing the rework wafer basket, the rework wafer basket has a plurality of loading slots spaced apart in the vertical direction, and the rework wafer placement platform is configured to move in the vertical direction to align the loading slots in the rework wafer basket with the rework wafer loading assembly.

5. The silvering feed device of claim 2, wherein, the rework wafer loading assembly comprises a first driving member and a loading member, the first driving member is drivingly connected with the loading member to drive the loading member to move towards or away from the rework wafer basket, so as to load the rework wafers on the wafer conveying track into the rework wafer basket.

6. The woolled off-cutter device of claim 1, wherein, the wafer rejection assembly comprises a second driving member and a rejection member, the second driving member is drivingly connected with the rejection member to drive the rejection member to move towards or away from the to-be-rejected wafer basket, so as to reject the rework wafers or the defective wafers in the to-be-rejected wafer basket.

7. The woolled off-cutter device of claim 1, wherein, The wafering unloading device further comprises a detection platform and an identification assembly, the detection platform is used for carrying a to-be-detected flower basket, and the identification assembly is used for detecting whether the double-slice silicon wafer exists in the to-be-detected flower basket.

8. The silvering feed device of claim 3, wherein, The wafering unloading device further comprises a first sensor, which is used for detecting the lifting frequency of the lifting track. And / or, the wafering unloading device further comprises a second sensor, which is used for detecting whether the rework wafer in the rework flower basket is full.

9. The etching ribbon dispensing device of claim 8, wherein, The wafering unloading device further comprises an alarm device, which is in communication connection with the first sensor and / or the second sensor.

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