Polishing machine

Abstract

The polishing machine comprises a machine body, a polishing part, a ceramic disc, a driving piece and a washing structure, the polishing part, the ceramic disc and the driving piece are installed on the machine body, the polishing part faces the ceramic disc, the driving piece is connected with the washing structure, and the washing structure is connected with the ceramic disc. The washing structure is driven to move to the lower part of the ceramic plate; the flushing structure comprises a support and spray head assemblies, the support is provided with a mounting groove, the multiple spray head assemblies are arranged at intervals in the extending direction of the mounting groove, and the spray head assemblies are movably connected with the mounting groove. The spray head assembly can flexibly move in the mounting groove, the position of the spray head can be adjusted according to actual needs, it is ensured that flushing liquid can cover the center position of each wafer, the problem that a traditional flushing pipe with the fixed length cannot conduct effective flushing is solved, the flushing efficiency and uniformity are improved, and the service life of the flushing pipe is prolonged. And the product reject ratio caused by incomplete washing is reduced.

Description

Technical Field

[0001] This utility model relates to the field of wafer polishing and cleaning technology, and in particular to a polishing machine. Background Technology

[0002] Polishing is a crucial step in semiconductor manufacturing, designed to ensure the wafer surface achieves the required flatness. This process involves uniformly spraying polishing solution onto the wafer surface using a polishing machine, while the polishing pads of the machine rub against the wafer surface to remove any unevenness. After polishing, to prevent residual polishing solution from corroding the wafer and affecting product quality, the wafer surface is typically rinsed with water to remove all residual solution and safely proceed with the wafer unloading process.

[0003] However, current methods use a fixed-length flushing hose to rinse away residual polishing fluid. Since the wafers are circumferentially distributed on the polishing pad, this fixed-length hose cannot effectively rinse the center of each wafer, resulting in uneven rinsing. When residual fluid is not completely rinsed away, these residues can corrode the wafers, leading to increased product defect rates. Utility Model Content

[0004] The technical problem this invention aims to solve is that the current method of rinsing polished wafers using a fixed-length water pipe cannot effectively rinse the center of each wafer, resulting in uneven rinsing, which makes the wafers susceptible to corrosion and thus increases the product defect rate.

[0005] To solve the above-mentioned technical problems, this utility model provides a polishing machine, including a machine body, a polishing part, a ceramic disc, a driving component, and a rinsing structure. The polishing part, the ceramic disc, and the driving component are installed on the machine body, with the polishing part facing the ceramic disc. The driving component is connected to the rinsing structure to drive the rinsing structure to move below the ceramic disc. The rinsing structure includes a bracket and a nozzle assembly. The bracket has a mounting groove, and a plurality of nozzle assemblies are spaced apart along the extension direction of the mounting groove, and the nozzle assemblies are movably connected to the mounting groove.

[0006] Furthermore, the bracket includes a connecting part, an external threaded connector, and a mounting part. The mounting part and the external threaded connector are respectively connected to both ends of the connecting part. The external threaded connector is connected to the driving member. The mounting part has the mounting groove.

[0007] Furthermore, the mounting part is arc-shaped, and the mounting groove is arranged along its arc direction.

[0008] Furthermore, an adjustment groove is provided on one side of the mounting groove wall, the adjustment groove is connected to the mounting groove, and the nozzle assembly has an adjustment part that passes through the adjustment groove and is exposed in the mounting groove.

[0009] Furthermore, the nozzle assembly also includes a mounting base, a nozzle, and a water pipe connector. The adjustment part passes through the adjustment groove and is connected to the mounting base to lock the mounting base in a preset position. The nozzle and the water pipe connector are mounted on the mounting base, and the water pipe connector is in communication with the nozzle.

[0010] Furthermore, the mounting base has a first mating hole adapted to the adjustment part, a second mating hole for mounting the nozzle, and a third mating hole for mounting the water pipe connector.

[0011] Furthermore, the bracket also includes a drive connector, which is connected to the external thread connector, and the other side of the drive connector is connected to the drive component.

[0012] Furthermore, the machine body also includes a base, and the flushing structure and the drive component are mounted on the base.

[0013] Furthermore, the flushing structure has multiple structures, which are spaced apart around the axis of the base.

[0014] Furthermore, the ceramic disk has multiple mounting positions for placing wafers.

[0015] Compared with the prior art, the polishing machine of this utility model has the following advantages:

[0016] This utility model embodiment allows the nozzle assembly to move flexibly within the mounting slot, and the position of the nozzle can be adjusted according to actual needs, ensuring that the rinsing liquid can cover the center of each wafer. This overcomes the problem that traditional fixed-length rinsing pipes cannot effectively rinse, improves rinsing efficiency and uniformity, and reduces the product defect rate caused by incomplete rinsing. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of the polishing machine provided in this embodiment of the utility model;

[0018] Figure 2 This is a front view of the polishing machine provided in this embodiment of the utility model;

[0019] Figure 3 This is a cross-sectional view of the polishing machine provided in this embodiment of the utility model;

[0020] Figure 4 This is a schematic diagram of the flushing structure provided in an embodiment of the present invention;

[0021] Figure 5 This is a front view of the flushing structure provided in an embodiment of the present invention;

[0022] Figure 6 This is provided along with the embodiments of the present utility model. Figure 5 A cross-sectional view along the AA direction;

[0023] In the diagram, 1 is the main body; 11 is the base; 2 is the polishing part; 3 is the ceramic disc; 4 is the rinsing structure; 41 is the bracket; 411 is the mounting slot; 412 is the connecting part; 413 is the external thread connector; 414 is the mounting part; 415 is the drive component connector; 42 is the nozzle assembly; 421 is the adjustment part; 422 is the mounting base; 4221 is the first mating hole; 4222 is the second mating hole; 423 is the nozzle; 424 is the water pipe connector; and 5 is the wafer. Detailed Implementation

[0024] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit its scope.

[0025] like Figures 1 to 5 As shown, this utility model provides a polishing machine, including a body 1, a polishing part 2, a ceramic disc 3, a driving component, and a rinsing structure 4. The body 1 is used to support and install other components. The polishing part 2, the ceramic disc 3, and the driving component are installed on the body 1. The polishing part 2 is positioned facing the ceramic disc 3 to contact and rub against the surface of the wafer 5 on the ceramic disc 3 to achieve a polishing effect. The driving component is connected to the rinsing structure 4 to drive the rinsing structure 4 to move below the ceramic disc 3 to spray water to rinse away residual polishing solution. The rinsing structure 4 includes a bracket 41 and a nozzle assembly 42. The bracket 41 has a mounting groove 411 to provide a mounting base for the nozzle assembly 42. Multiple nozzle assemblies 42 are spaced apart along the extension direction of the mounting groove 411, and the nozzle assembly 42 is movably connected to the mounting groove 411, so that the nozzle assembly 42 can move within the mounting groove 411 and adjust its position to adapt to wafers 5 of different sizes or layouts, thereby achieving more uniform and effective rinsing.

[0026] This embodiment allows the nozzle assembly 42 to move flexibly within the mounting slot 411, and the position of the nozzle 423 can be adjusted according to actual needs, ensuring that the rinsing liquid can cover the center of each wafer 5. This overcomes the problem that traditional fixed-length rinsing pipes cannot effectively rinse, improves rinsing efficiency and uniformity, and reduces the product defect rate caused by incomplete rinsing.

[0027] The driving component in this embodiment can be an electrode, a cylinder, or other driving component structure, and is not specifically limited to it.

[0028] like Figure 4 As shown, the bracket 41 includes a connecting part 412, an external thread connector 413, and a mounting part 414. The mounting part 414 and the external thread connector 413 are respectively connected to the two ends of the connecting part 412. The external thread connector 413 is connected to the driving component, ensuring a firm connection between the bracket 41 and the driving component. This allows the driving component to apply force to move the bracket 41, thereby moving the nozzle assembly 42 below the ceramic disc 3. The mounting part 414 has mounting grooves 411, which allow the nozzle assembly 42 to be spaced along the extension direction of the groove and to be adjusted in position as needed.

[0029] Furthermore, the mounting portion 414 is arc-shaped, and the mounting groove 411 is set along its arc direction, which can better adapt to the polishing working environment and help to make the arrangement of the nozzle assembly 42 more closely match the actual position and movement trajectory of the wafer 5, thereby improving rinsing efficiency and coverage area. In addition, since the wafer 5 is circular and may rotate or move on the polishing pad, the arc-shaped mounting groove 411 allows the nozzle assembly 42 to follow the edge contour of the wafer 5 for rinsing, which can ensure that even the edge part of the wafer 5 can be rinsed evenly and effectively, reducing the possibility of residual solution.

[0030] Furthermore, an adjustment groove (not shown in the figure) is provided on one side of the mounting groove 411. The adjustment groove is connected to the mounting groove 411, providing physical space and means for adjusting the position of the nozzle assembly 42. The nozzle assembly 42 has an adjustment part 421, which passes through the adjustment groove and is exposed in the mounting groove 411. Through the adjustment part 421, the operator can directly adjust the position of the nozzle assembly 42.

[0031] In this embodiment, the adjustment unit 421 can be moved through the adjustment slot, so that the nozzle assembly 42 can be adjusted in a certain range along the direction of the adjustment slot to make adjustments according to the specific layout or size of the wafer 5, ensuring that each wafer 5 can be rinsed. Compared with the fixed installation method, the design with the adjustment slot makes the maintenance and adjustment process simpler and faster. If it is necessary to clean or replace the nozzle assembly 42, it can be easily removed or repositioned through the adjustment slot, reducing downtime and improving work efficiency.

[0032] Furthermore, the nozzle assembly 42 also includes a mounting base 422, a nozzle 423, and a water pipe connector 424. The adjustment part 421 passes through the adjustment groove and is connected to the mounting base 422 to lock the mounting base 422 in a preset position, thereby adjusting the position of the nozzle assembly 42. The nozzle 423 and the water pipe connector 424 are mounted on the mounting base 422. The nozzle 423 is responsible for spraying water or other cleaning fluid onto the surface of the wafer 5, and the water pipe connector 424 is connected to the nozzle 423 to guide water or other cleaning fluid to the nozzle 423 and then spray it out from the nozzle 423 to complete the rinsing operation.

[0033] In this embodiment, the adjustment unit 421 allows the nozzle assembly 42 to move within the adjustment groove and lock it in a preset position. This allows operators to flexibly adjust the position of the nozzle assembly 42 according to actual needs, such as the size and shape of the chip 5 or special rinsing requirements, to ensure rinsing effectiveness. Furthermore, since both the nozzle 423 and the water pipe connector 424 are mounted on the mounting base 422, cleaning, inspection, or replacement only requires handling these components on the mounting base 422, making the process relatively simple and quick, reducing maintenance difficulty and downtime.

[0034] like Figure 6 As shown, the mounting base 422 has a first mating hole 4221 that is adapted to the adjustment part 421, a second mating hole 4222 for mounting the nozzle 423, and a third mating hole for mounting the water supply pipe connector 424.

[0035] In this embodiment, the first mating hole 4221 is a hole adapted to the adjusting part 421. The adjusting part 421 passes through this hole to the mounting base 422, allowing the mounting base 422 to move along the adjusting groove and be locked after being adjusted to a suitable position. This allows for precise adjustment of the position of the nozzle assembly 42 to accommodate wafers 5 of different sizes or layouts. It should be noted that the adjusting part 421 in this embodiment is a bolt, preferably a T-slot bolt. The second mating hole 4222 is a hole for mounting the nozzle 423. By fixing the nozzle 423 in the second mating hole 4222, the stability and accuracy of the nozzle 423 installation can be ensured, thereby achieving a uniform and effective rinsing effect. The third mating hole is a hole for mounting the water supply pipe connector 424. The cleaning medium is introduced into the nozzle 423 through the third mating hole, ensuring a smooth water supply during rinsing and helping to maintain stable rinsing pressure and flow rate.

[0036] Furthermore, the bracket 41 also includes a drive connector 415 (such as...). Figure 2 As shown, the drive connector 415 is connected to the external thread connector 413, and the other side of the drive connector 415 is connected to the drive component. This embodiment, by providing the drive connector 415, makes the connection between the bracket 41 and the drive component more robust and stable; furthermore, it simplifies the assembly process between the bracket 41 and the drive component, allowing for faster installation and disassembly, facilitating equipment maintenance and repair, reducing downtime, and improving work efficiency.

[0037] Furthermore, the body 1 also includes a base 11, a rinsing structure 4, and a drive component mounted on the base 11 to support and fix other key components, such as the rinsing structure 4 and the drive component, thereby enhancing the stability of the entire system and helping to reduce displacement or deviation caused by mechanical vibration or other external factors, thus ensuring the accuracy of the polishing and rinsing process.

[0038] Furthermore, the rinsing structure 4 is multiplied and spaced apart around the axis of the base 11 to improve rinsing efficiency and coverage. Multiple rinsing structures 4 can simultaneously rinse different wafers 5, ensuring that the surface of each wafer 5 is thoroughly cleaned. In addition, since each rinsing structure 4 can be independently adjusted in position to adapt to different cleaning needs, multiple rinsing structures 4 can reduce the rinsing time for multiple wafers 5. It should be noted that in this embodiment, the rinsing structures 4 are spaced at equal angles along the axis of the base 11.

[0039] Furthermore, the ceramic disc 3 has multiple mounting positions for placing wafers 5, allowing multiple wafers 5 to be processed simultaneously in a single operation. This increases the output per polishing cycle, reduces equipment preparation and changeover time, and thus improves overall production efficiency. In addition, it ensures that each wafer 5 contacts the polishing pad and polishing slurry in the same manner during polishing, contributing to a more uniform polishing effect. It should be noted that the polishing unit 2 in this embodiment uses a conventional polishing machine structure, and its arrangement with the ceramic disc 3 can also be a conventional polishing machine arrangement; therefore, no particular limitation is made here.

[0040] In summary, this utility model provides a polishing machine that allows the nozzle assembly 42 to move flexibly within the mounting groove 411, and the position of the nozzle 423 can be adjusted according to actual needs, ensuring that the rinsing liquid can cover the center of each wafer 5. This overcomes the problem that traditional fixed-length rinsing pipes cannot effectively rinse, improves rinsing efficiency and uniformity, and reduces the product defect rate caused by incomplete rinsing.

[0041] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and substitutions can be made without departing from the technical principles of the present utility model, and these improvements and substitutions should also be considered within the protection scope of the present utility model.

Claims

1. A polishing machine, characterized in that, The device includes a body, a polishing section, a ceramic disc, a driving component, and a rinsing structure. The polishing section, the ceramic disc, and the driving component are mounted on the body, with the polishing section facing the ceramic disc. The driving component is connected to the rinsing structure to drive the rinsing structure to move below the ceramic disc. The rinsing structure includes a bracket and nozzle assemblies. The bracket has a mounting groove, and multiple nozzle assemblies are spaced apart along the extension direction of the mounting groove, with each nozzle assembly being movably connected to the mounting groove.

2. The polishing machine according to claim 1, characterized in that, The bracket includes a connecting part, an external threaded connector, and a mounting part. The mounting part and the external threaded connector are respectively connected to the two ends of the connecting part. The external threaded connector is connected to the driving component. The mounting part has the mounting groove.

3. The polishing machine according to claim 2, characterized in that, The mounting part is arc-shaped, and the mounting groove is arranged along its arc direction.

4. The polishing machine according to claim 1, characterized in that, An adjustment groove is provided on one side of the mounting groove. The adjustment groove is connected to the mounting groove. The nozzle assembly has an adjustment part that passes through the adjustment groove and is exposed in the mounting groove.

5. The polishing machine according to claim 4, characterized in that, The nozzle assembly also includes a mounting base, a nozzle, and a water pipe connector. The adjustment part passes through the adjustment groove and is connected to the mounting base to lock the mounting base in a preset position. The nozzle and the water pipe connector are mounted on the mounting base, and the water pipe connector is in communication with the nozzle.

6. The polishing machine according to claim 5, characterized in that, The mounting base has a first mating hole adapted to the adjustment part, a second mating hole for mounting the nozzle, and a third mating hole for mounting the water pipe connector.

7. The polishing machine according to claim 2, characterized in that, The bracket also includes a drive connector, which is connected to the external thread connector, and the other side of the drive connector is connected to the drive component.

8. The polishing machine according to claim 1, characterized in that, The machine body also includes a base, and the flushing structure and the drive component are mounted on the base.

9. The polishing machine according to claim 8, characterized in that, The flushing structure is a plurality of such structures, which are spaced apart around the axis of the base.

10. The polishing machine according to claim 1, characterized in that, The ceramic disk has multiple mounting positions for placing wafers.

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