Cooling fin for circuit board

Abstract

The utility model belongs to the technical field of radiating fins, and particularly relates to a radiating fin for a circuit board, which comprises a plurality of radiating units sequentially connected along the length direction. The first heat dissipation part is mounted on the base and arranged in the mounting area in the length direction; the second heat dissipation parts are installed on the base and located on the two sides of the first heat dissipation part in the length direction respectively; the first heat dissipation part divides the installation area into a first installation area and a second installation area in the width direction, the first installation area is used for being connected with a circuit board in an installation mode, and a third heat dissipation part is arranged in the second installation area; the beneficial effects of the utility model are that the first heat dissipation part, the second heat dissipation part and the third heat dissipation part are arranged on the heat dissipation sheet, so that the contact area between the heat dissipation sheet and the air is increased, heat generated by electronic components on the circuit board can be discharged more quickly and timely, the heat dissipation performance is effectively improved, and the service life of the circuit board is prolonged. Therefore, the protection effect on the circuit board can be enhanced.

Description

Technical Field

[0001] This utility model belongs to the field of heat sink technology, and particularly relates to a heat sink for circuit boards. Background Technology

[0002] With the continuous development of electronic technology, electronic devices are being used more and more widely. Electronic devices generate heat during operation, and if they are not cooled in time, it will affect their normal operation. The most common heat dissipation method is to install heat sinks on the circuit boards of electronic devices, and to dissipate heat and cool down the devices by contacting the electronic components on the circuit boards.

[0003] In the existing technology, most heat sinks used for heat dissipation of circuit boards only have heat dissipation fins. The structure is simple, and when the power of electronic devices is high, they are prone to not being able to dissipate heat in time, which will affect the normal operation of electronic devices. Utility Model Content

[0004] The purpose of this invention is to address the aforementioned technical problems by providing a heat sink for circuit boards, thereby solving these problems.

[0005] In view of this, the present invention provides a heat sink for a circuit board, comprising a plurality of heat dissipation units connected sequentially along the length direction, wherein the heat dissipation unit includes:

[0006] The base has an installation area.

[0007] The first heat dissipation part is mounted on the base and is disposed in the mounting area along the length direction;

[0008] The second heat dissipation part is mounted on the base and is located on both sides of the first heat dissipation part along its length.

[0009] The first heat dissipation part divides the mounting area into a first mounting area and a second mounting area along the width direction. The first mounting area is used for mounting and connecting with the circuit board, and the second mounting area is provided with a third heat dissipation part.

[0010] Furthermore, the first heat dissipation part is provided with a first connection hole, which is used to connect and fix it to the circuit board.

[0011] Furthermore, the base has several weight-reducing grooves arranged along the width direction.

[0012] Furthermore, the first heat dissipation unit is integrally connected to the base.

[0013] Furthermore, the second heat dissipation unit is integrally connected to the base.

[0014] Furthermore, both the first heat dissipation unit and the base are integrally connected to the third heat dissipation unit.

[0015] Furthermore, the base is also provided with several second connection holes arranged along the width direction.

[0016] Furthermore, several heat dissipation units are connected as a single unit.

[0017] The beneficial effects of this utility model are:

[0018] By setting a first heat dissipation part, a second heat dissipation part, and a third heat dissipation part on the heat sink, the contact area between the heat sink and the air is increased, so that the heat generated by the electronic components on the circuit board can be dissipated more quickly and in a more timely manner, effectively improving the heat dissipation performance and thus strengthening the protection of the circuit board. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural schematic diagram of the present invention;

[0020] Figure 2 This is a three-dimensional structural schematic diagram of the present invention from another perspective;

[0021] Figure 3 This is a top view of the structure of this utility model;

[0022] The markings in the diagram are as follows:

[0023] 1. Base; 11. First mounting area; 12. Second mounting area; 13. Weight reduction groove; 14. Second connecting hole; 2. First heat dissipation part; 21. First connecting hole; 3. Second heat dissipation part; 4. Third heat dissipation part. Detailed Implementation

[0024] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0025] In the description of this application, it should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. For ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0026] Example 1:

[0027] This embodiment provides a heat sink for a circuit board, including a plurality of heat dissipation units connected sequentially along the length direction X. Each heat dissipation unit includes:

[0028] Base 1, with an installation area provided on base 1;

[0029] The first heat dissipation part 2 is mounted on the base 1 and is disposed in the mounting area along the length direction X.

[0030] The second heat dissipation part 3 is mounted on the base 1 and is located on both sides of the first heat dissipation part 2 along the length direction X.

[0031] The first heat dissipation part 2 divides the mounting area into a first mounting area 11 and a second mounting area 12 along the width direction Y. The first mounting area 11 is used for mounting and connecting with the circuit board, and the second mounting area 12 is provided with a third heat dissipation part 4.

[0032] In this technical solution, the heat sink is made of aluminum alloy and can be composed of multiple heat dissipation units arranged and connected together along the length direction X, such as... Figure 1 As shown, two heat dissipation units are used as an example for explanation. The first heat dissipation unit 2 is plate-shaped and disposed along the length X on the mounting area of ​​the base 1, dividing the mounting area into a first mounting area 11 and a second mounting area 12. The first mounting area 11 is used for placing electronic components on the circuit board. The second mounting area 12 is provided with a third heat dissipation unit 4 connected to the base 1, and the third heat dissipation unit 4 is provided with multiple heat dissipation pillars. The second heat dissipation unit 3 is disposed on the base 1 and located on both sides of the first heat dissipation unit 2 along the length X, and the second heat dissipation unit 3 is also provided with multiple heat dissipation pillars.

[0033] When the heat sink is working, the electronic components on the circuit board come into contact with the base 1 and the first heat sink 2. The heat generated by the electronic components is absorbed by the base 1 and the first heat sink 2. Then the heat is conducted through the base 1 to the second heat sink 3 and the third heat sink 4, and then the heat is dissipated through the multiple heat sink columns on the first heat sink 2, the second heat sink 3 and the third heat sink 4.

[0034] It is worth mentioning that the first mounting area 11 of two adjacent heat dissipation units connected along the length direction can be designed to be on the same side or to be arranged in a staggered manner.

[0035] In summary, by setting the first heat dissipation part 2, the second heat dissipation part 3, and the third heat dissipation part 4 on the heat sink, the contact area between the heat sink and the air is increased, so that the heat generated by the electronic components on the circuit board can be dissipated more quickly and in a timely manner, effectively improving the heat dissipation performance and thus strengthening the protection of the circuit board.

[0036] Example 2:

[0037] This embodiment provides a heat sink for a circuit board, which, in addition to the technical solutions of the above embodiments, also has the following technical features.

[0038] Furthermore, the first heat dissipation part 2 is provided with a first connection hole 21, which is used to connect and fix with the circuit board.

[0039] In this technical solution, by opening mounting holes on the electronic components of the circuit board, fasteners can be set to pass through the first connection hole 21 and the mounting hole to tightly connect the first heat dissipation part 2 to the electronic components. This ensures that the heat sink is firmly connected to the circuit board, while also allowing the heat from the electronic components to be transferred to the heat sink more quickly, effectively improving the heat dissipation efficiency.

[0040] Example 3:

[0041] This embodiment provides a heat sink for a circuit board, which, in addition to the technical solutions of the above embodiments, also has the following technical features.

[0042] Furthermore, the base 1 has several weight-reducing grooves 13 arranged along the width direction Y.

[0043] In this technical solution, by creating the weight-reduction groove 13, the overall weight of the heat sink and the input of production materials can be reduced, thereby reducing costs and improving economic efficiency. On the other hand, it can increase the contact area between the base 1 and the air, allowing the heat on the heat sink to dissipate more quickly and improving heat dissipation performance.

[0044] Example 4:

[0045] This embodiment provides a heat sink for a circuit board, which, in addition to the technical solutions of the above embodiments, also has the following technical features.

[0046] Furthermore, the first heat dissipation unit 2 is integrally connected to the base 1.

[0047] Furthermore, the second heat dissipation unit 3 is integrally connected to the base 1.

[0048] Furthermore, both the first heat dissipation part 2 and the base 1 are integrally connected to the third heat dissipation part 4.

[0049] In this technical solution, the first heat dissipation part 2 and the base 1, the second heat dissipation part 3 and the base 1, the third heat dissipation part 4 and the base 1, and the third heat dissipation part 4 and the first heat dissipation part 2 can be connected by using thermally conductive adhesive, or they can be designed as an integral connection. Preferably, an integral connection is adopted to ensure the heat dissipation performance of the heat sink while ensuring the structural stability of the heat sink.

[0050] Example 5:

[0051] This embodiment provides a heat sink for a circuit board, which, in addition to the technical solutions of the above embodiments, also has the following technical features.

[0052] Furthermore, the base 1 is also provided with several second connection holes 14 arranged along the width direction Y.

[0053] In this technical solution, multiple heat sinks can be installed on the circuit board along the width direction Y. By opening a second connecting hole 14 and then setting fasteners to pass through the multiple second connecting holes 14, multiple heat sinks can be tightly connected together along the width direction Y, thereby effectively enhancing heat dissipation performance and making it highly practical.

[0054] Example 6

[0055] This embodiment provides a heat sink for a circuit board, which, in addition to the technical solutions of the above embodiments, also has the following technical features.

[0056] Furthermore, several heat dissipation units are connected as a single unit.

[0057] In this technical solution, several heat dissipation units can be connected together by using thermally conductive adhesive, or they can be designed as a single integrated structure. Preferably, the heat dissipation units are connected as a single unit. This integrated connection ensures the heat dissipation performance of the heat sink while effectively improving its structural strength.

[0058] The embodiments of this application have been described above with reference to the accompanying drawings. Unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other. This application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A heat sink for a circuit board, characterized in that, It includes several heat dissipation units connected sequentially along the length direction (X), and the heat dissipation unit includes: A base (1) having an installation area provided thereon; The first heat dissipation part (2) is mounted on the base (1) and is disposed in the mounting area along the length direction (X); The second heat dissipation part (3) is mounted on the base (1) and is located on both sides of the first heat dissipation part (2) along the length direction (X); The first heat dissipation part (2) divides the mounting area into a first mounting area (11) and a second mounting area (12) along the width direction (Y). The first mounting area (11) is used for mounting and connecting with the circuit board, and the second mounting area (12) is provided with a third heat dissipation part (4).

2. A heat sink for a circuit board according to claim 1, characterized in that, The first heat dissipation part (2) is provided with a first connection hole (21), which is used to connect and fix with the circuit board.

3. A heat sink for a circuit board according to claim 1, characterized in that, The base (1) has several weight-reducing grooves (13) arranged along the width direction (Y).

4. A heat sink for a circuit board according to claim 1, characterized in that, The first heat dissipation part (2) is integrally connected to the base (1).

5. A heat sink for a circuit board according to claim 1, characterized in that, The second heat dissipation part (3) is integrally connected to the base (1).

6. A heat sink for a circuit board according to claim 4, characterized in that, The first heat dissipation part (2) and the base (1) are both integrally connected to the third heat dissipation part (4).

7. A heat sink for a circuit board according to claim 1, characterized in that, The base (1) is also provided with several second connecting holes (14) arranged along the width direction (Y).

8. A heat sink for a circuit board according to claim 1, characterized in that, Several of the aforementioned heat dissipation units are integrally connected.

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