Liquid cooling plate and liquid cooling heat dissipation type controller

Abstract

The utility model belongs to the technical field of heat dissipation, and particularly relates to a liquid cooling plate and a liquid cooling heat dissipation type controller. The liquid cooling plate comprises a liquid cooling plate main body, a liquid flow channel is arranged in the liquid cooling plate main body, a water inlet, a water outlet and an open slot are formed in the surface of the liquid cooling plate main body, the water inlet, the water outlet and the open slot are respectively communicated with the liquid flow channel, and the open slot is arranged along the liquid flow channel. After the heat dissipation piece is installed, sealing cavities communicated with the water inlet and the water outlet respectively are formed by the heat dissipation piece and the liquid flow channel. According to the utility model, the liquid cooling plate is in sealed connection with the to-be-cooled piece through the open slot and the sealing device, so that the liquid flow channel in the liquid cooling plate forms a sealed cavity, and the heat of the radiator unit of the to-be-cooled piece is conveniently taken away through the liquid circulating in the liquid flow channel, thereby achieving the purpose of cooling and cooling the to-be-cooled piece, especially a controller; the to-be-cooled part is controlled within a certain working temperature range, and normal working of the to-be-cooled part is guaranteed.

Description

Technical Field

[0001] This utility model belongs to the field of heat dissipation technology, specifically relating to a liquid cooling plate and a liquid cooling heat dissipation controller. Background Technology

[0002] Currently, there are various heat dissipation technologies for controllers, including natural air cooling and axial fan forced air cooling. These methods are mainly suitable for controllers with low power and low heat generation.

[0003] Another liquid cooling method involves attaching the controller's heat-generating units (such as power modules, MOS modules, IGBT modules, or silicon carbide modules) to the outer surface of a liquid cooling plate, using thermal grease to transfer heat to the plate. However, this technology has limitations because the heat conduction efficiency of the heat-generating units is limited, and it cannot achieve maximum heat exchange with the liquid. Utility Model Content

[0004] The present invention addresses the above-mentioned technical problems by providing a liquid cooling plate and a liquid cooling heat dissipation controller.

[0005] A liquid cooling plate includes a liquid cooling plate body with a liquid flow channel inside. The surface of the liquid cooling plate body is provided with an inlet, an outlet, and an opening groove for installing a component to be scald. The inlet, the outlet, and the opening groove are respectively connected to the liquid flow channel. The opening groove is arranged along the liquid flow channel. After the component to be scald is installed, it forms a sealed cavity with the liquid flow channel that is respectively connected to the inlet and the outlet.

[0006] Optionally, the edge of the opening groove is provided with a sealing device for sealing connection with the heat dissipation component.

[0007] Optionally, the liquid flow channel includes a liquid inlet flow channel and a liquid outlet flow channel that are interconnected, the inlet is connected to the liquid inlet flow channel, the outlet is connected to the liquid outlet flow channel, and the opening groove is connected to the liquid inlet flow channel and the liquid outlet flow channel respectively.

[0008] Optionally, at least one of the opening slots is provided along the liquid inlet channel and / or the liquid outlet channel.

[0009] Optionally, the liquid inlet channel and the liquid outlet channel are arranged side by side.

[0010] Optionally, the length direction of the liquid inlet channel and the length direction of the liquid outlet channel are consistent with the length direction of the liquid cooling plate body;

[0011] The water inlet and the water outlet are respectively located on the end side of the liquid cooling plate body in the width direction.

[0012] Optionally, each of the opening slots is provided with a connecting plate at both ends, which are respectively connected between any two opposite ends of the liquid flow channel.

[0013] Optionally, the opening slots on the liquid cooling plate body are a pair of several, and the two pairs of opening slots are disposed opposite each other on opposite side surfaces of the liquid cooling plate body and are interconnected. After the pair of several heat dissipation components are installed, they form the sealed cavity with the liquid flow channel.

[0014] The liquid flow channels at the locations of the paired opening slots share a single connecting plate.

[0015] Optionally, the water inlet and the water outlet are respectively disposed on one end of the liquid cooling plate body, and the opening groove is disposed on one side of the liquid cooling plate body that is perpendicular to the end of the water inlet and the water outlet.

[0016] Optionally, the liquid cooling plate body has several opening slots.

[0017] Optionally, the opening slots on the liquid cooling plate body are a pair of several, and the two opening slots in a pair are disposed opposite each other on opposite side surfaces of the liquid cooling plate body and are interconnected. After the pair of several heat dissipation components are installed, they form the sealed cavity with the liquid flow channel.

[0018] Optionally, the sealing device employs a sealing gasket, which is arranged around the edge of the opening groove.

[0019] Optionally, the liquid cooling plate further includes several pressure plates for connecting the heat dissipation component to the opening groove, and the pressure plates are detachably connected to the main body of the liquid cooling plate.

[0020] Optionally, the opening slot is provided with a pressure plate on two opposite sides of the same side of the liquid cooling plate body. When there are multiple opening slots, adjacent sides of two adjacent opening slots share the same pressure plate.

[0021] Optionally, the pressure plate adopts at least one of an inverted L-shaped and a T-shaped structure.

[0022] Optionally, the liquid cooling plate may further include a plurality of positioning holes.

[0023] Optionally, the liquid cooling plate may further include a positioning post that matches the positioning hole and is used for positioning and mounting the heat-dissipating component.

[0024] A liquid-cooled heat dissipation controller includes a module unit to be cooled, the module unit having a heating unit and a heat sink unit connected to the heating unit, the module unit being sealed to the opening groove of the liquid cooling plate, and at least a portion of the heat sink unit extending into the liquid flow channel, such that the module unit and the liquid flow channel form a sealed cavity communicating with the inlet and outlet respectively.

[0025] Optionally, the heat sink unit includes a heat-conducting base that is matched with the opening slot for installation and heat dissipation fins disposed on the heat-conducting base. When the heat-conducting base is sealed to the opening slot, the heat dissipation fins extend into the liquid flow channel.

[0026] Optionally, when the liquid cooling plate has a connecting plate, the portion of the heat dissipation fins extending into the liquid flow channel is located on one side of the connecting plate. Preferably, there is a gap between this portion of the heat dissipation fins and the connecting plate.

[0027] Optionally, the liquid-cooled heat dissipation controller has several module units, and the liquid cooling plate also has several opening slots, with each module unit connected to a corresponding opening slot.

[0028] Optionally, the heating unit and the heat sink unit are integrated. Preferably, the liquid cooling plate and the heat sink unit are made of aluminum.

[0029] Optionally, the module unit further includes a PCB board, which is disposed on the side of the heat-generating unit away from the heat sink unit.

[0030] Optionally, the opening slots are a pair of several, and the two opening slots in a pair are disposed opposite each other on opposite side surfaces of the liquid cooling plate body and are interconnected; the module units are a pair of several, and the two module units in a pair are respectively disposed on the two opposite opening slots, so that the two module units in a pair and the liquid flow channel form a sealed cavity that is respectively connected to the inlet and the outlet.

[0031] Optionally, there are six opening slots, and the six opening slots are arranged in pairs along the liquid flow channel on two opposite sides of the liquid cooling plate body;

[0032] The module unit comprises six units, each of which is sealed and connected to a corresponding opening slot.

[0033] Optionally, the liquid flow channel is aligned with the length direction of the liquid cooling plate body.

[0034] Beneficial effects: This utility model has at least one or more of the following advantages:

[0035] 1. This utility model can be applied to scenarios with high power, high heat generation, concentrated heat-generating modules, and poor system heat dissipation, where effective heat dissipation cannot be achieved using existing market technologies.

[0036] 2. This invention achieves excellent thermal conductivity by immersing the heat sink unit on the component to be cooled into a liquid channel, allowing direct heat exchange with the heat exchange liquid within the channel. Specifically, the liquid cooling plate of this invention achieves a sealed connection with the component to be cooled through an opening groove and a sealing device, forming a sealed cavity within the liquid channel. The heat sink unit extends into the liquid channel, allowing the circulating liquid to easily remove heat from the heat sink unit, thus cooling the component, especially the controller, and keeping it within a certain operating temperature range to ensure normal operation. Furthermore, the increased heat dissipation area of ​​the heat sink unit further facilitates heat conduction. Therefore, this immersion liquid cooling method can be the preferred heat dissipation method for high power density components such as silicon carbide modules. Moreover, this liquid cooling method has advantages such as high heat dissipation efficiency, large heat capacity, and precise temperature control, meeting the heat dissipation requirements of heating elements in silicon carbide modules under high load conditions.

[0037] 3. This utility model divides the controller into several independent module units. The heat sink units of the several module units connected to the heating unit are embedded in the liquid flow channel, which disperses the heat source and is more conducive to heat conduction.

[0038] 4. Furthermore, in the controller of this utility model, the heating unit and heat sink unit of each module unit are integrated into one unit, that is, an integrated design, thereby:

[0039] I. Increase power density

[0040] By integrating the heat-generating unit, such as a silicon carbide module, with the heat sink unit, the additional space and components required in traditional designs, such as heat sink brackets and thermal interface materials, can be effectively reduced. This design makes the entire system more compact, thereby increasing power density.

[0041] II. Improve heat dissipation efficiency

[0042] For example, the integrated design of the heating element and heat sink unit in a silicon carbide module helps optimize the heat dissipation path and reduce thermal resistance. Due to the high thermal conductivity of the heating element material, heat can be transferred to the heat sink more quickly through the module and then rapidly dissipated into the liquid cooling channels through the heat sink's fins. This design not only improves heat dissipation efficiency but also reduces the system's operating temperature, thereby extending the lifespan of the heating element and the entire system.

[0043] III. Enhancing System Reliability

[0044] Traditional connections between the heating element and heat sink unit in silicon carbide modules typically rely on bolts, thermally conductive interface materials, etc., which can be prone to loosening or poor thermal conductivity. An integrated design eliminates these potential points of failure, improving the overall reliability of the system. Furthermore, the tight fit between the heat sink unit and the silicon carbide module reduces mechanical stress caused by vibration or impact, further enhancing the system's stability and durability.

[0045] IV. Simplify manufacturing and assembly processes

[0046] The integrated design of the heating element and heat sink unit simplifies the manufacturing and assembly process. Traditional designs require the separate fabrication of the silicon carbide module and heat sink unit, followed by assembly and testing. The integrated design, however, combines the silicon carbide module and heat sink unit directly during manufacturing, reducing manufacturing steps and assembly time. This not only lowers production costs but also improves production efficiency.

[0047] V. Achieving Better Thermal Management

[0048] For example, the integrated design of the heating element and heat sink unit in a silicon carbide module can achieve better thermal management. By optimizing the structure and layout of the heat sink unit, the operating temperature of the silicon carbide module can be controlled more precisely. This not only helps improve system performance but also reduces malfunctions and damage caused by overheating. Attached Figure Description

[0049] Figure 1 This is a schematic diagram of the structure of this utility model;

[0050] Figure 2 for Figure 1 Partial top view (AA section view);

[0051] Figure 3 for Figure 1 Partial right-side BB section view;

[0052] Figure 4 for Figure 1 A bottom view;

[0053] Figure 5 for Figure 1 The right view;

[0054] Figure 6 for Figure 1 A sectional view;

[0055] Figure 7 This is a schematic diagram of a module unit of this utility model;

[0056] Figure 8This is a schematic diagram of the main structure of the liquid cooling plate of this utility model;

[0057] Figure 9 for Figure 8 Another perspective diagram. Detailed Implementation

[0058] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, so as to better understand the purpose, features and advantages of the present invention. It should be understood that the embodiments shown in the drawings are not intended to limit the scope of the present invention, but are only for illustrating the essential spirit of the technical solution of the present invention.

[0059] In the following description, certain specific details are set forth for the purpose of illustrating various disclosed embodiments in order to provide a thorough understanding of the various disclosed embodiments. However, those skilled in the art will recognize that embodiments may be practiced without one or more of these specific details. In other instances, well-known apparatuses, structures, and techniques associated with this application may not have been shown or described in detail to avoid unnecessarily obscuring the description of the embodiments.

[0060] Throughout this specification, references to "an embodiment" or "an embodiment" indicate that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Therefore, the appearance of "in an embodiment" or "an embodiment" in various places throughout the specification does not necessarily refer to the same embodiment. Furthermore, a particular feature, structure, or characteristic may be combined in any manner in one or more embodiments.

[0061] In the following description, in order to clearly demonstrate the structure and working method of this utility model, a number of directional terms will be used. However, terms such as "front", "back", "left", "right", "outside", "inside", "outward", "inward", "up", and "down" should be understood as convenient terms and not as limiting terms.

[0062] Reference Figures 1 to 9 This utility model provides a liquid cooling plate. The heat exchange liquid in the liquid flow channel of the liquid cooling plate can directly exchange heat with the heat sink unit on the component to be cooled, thereby removing the heat generated by the heat-generating unit on the component to be cooled, achieving the purpose of heat dissipation and cooling. Specifically, the component to be cooled refers to the heat-generating unit on the controller, such as a power module, a MOS module, an IGBT module, or a silicon carbide module, etc. Figure 7 The heating unit 82 is a silicon carbide module.

[0063] The liquid cooling plate includes a liquid cooling plate body 10, the liquid cooling plate body 10 has a liquid flow channel 20 inside, and the surface of the liquid cooling plate body 10 is provided with an inlet 30, an outlet 40 and an opening groove 50, the inlet 30, the outlet 40 and the opening groove 50 are respectively connected to the liquid flow channel 20.

[0064] The opening groove 50 is actually a slot provided on the liquid flow channel 20 for installing the heat dissipation component. The opening groove 50 is provided along the liquid flow channel 20 and is used to install the heat dissipation component. After the heat dissipation component is installed, it forms a sealed cavity with the liquid flow channel that is connected to the inlet and outlet of the water respectively.

[0065] The heat-dissipating component of this invention is connected to the open slot 50, and a radiator unit is connected to the heat-dissipating component. The radiator unit is at least partially embedded in the liquid flow channel 20, so that each component forms a sealed cavity. In use, the inlet 30 is connected to an external circulation pipeline via an inlet interface 31, and the outlet 40 is connected to an external circulation pipeline via an outlet interface 41. When fluid enters the liquid flow channel 20 through the inlet 30, the liquid comes into contact with the radiator unit, transferring the high temperature of the radiator unit to the low temperature liquid. The liquid circulates through the liquid flow channel 20 and flows out from the outlet 40, circulating in sequence to carry away heat and achieve the purpose of heat dissipation and cooling.

[0066] In one embodiment, the liquid flow channel 20 includes a liquid inlet flow channel 21 and a liquid outlet flow channel 22 that are interconnected. The inlet 30 is connected to the liquid inlet flow channel 21, the outlet 40 is connected to the liquid outlet flow channel 22, and the opening groove 50 is connected to the liquid inlet flow channel 21 and the liquid outlet flow channel 22 respectively.

[0067] In one embodiment, at least one opening groove 50 is provided along the liquid inlet channel 21 and / or the liquid outlet channel 22.

[0068] In one embodiment, the liquid inlet channel 21 and the liquid outlet channel 22 are arranged side by side.

[0069] In one embodiment, the length direction of the liquid inlet channel 21 and the length direction of the liquid outlet channel 22 are consistent with the length direction of the liquid cooling plate body 10. That is, both the liquid inlet channel 21 and the liquid outlet channel 22 are elongated channels, such as... Figure 1 As shown by the arrows, the left side indicates the liquid flow direction of the liquid inlet channel 21, and the right side indicates the fluid flow direction of the liquid outlet channel 22.

[0070] The inlet 30 and outlet 40 are respectively located on the end side of the liquid cooling plate body 10 in the width direction. For example, Figure 1 As shown, when the length direction is up and down, the width direction is left and right. At this time, the inlet 30 and the outlet 40 are respectively located on the upper side of the liquid cooling plate body 10.

[0071] Of course, the positions of the liquid inlet channel 21, the liquid outlet channel 22, the inlet 30, and the outlet 40 can be adapted to meet actual needs.

[0072] In one embodiment, a connecting plate 23 is provided in the liquid flow channel 20 at the location of the opening slot 50, with its two ends respectively connected between any two opposite ends of the liquid flow channel.

[0073] In this embodiment, the connecting plate 23 serves a supporting function, preventing structural instability caused by the complete hollowing out of the opening groove 50. However, the entering and exiting liquids are still mixed within this sealed cavity. Figure 1 The direction of liquid flow can also be seen; within each sealed cavity, some liquid flows from left to right, and some flows from right to left.

[0074] In one embodiment, the liquid channels at the locations of the pairs of opening slots 50 share a common connecting plate 23.

[0075] In one embodiment, the inlet 30 and the outlet 40 are respectively disposed on one end of the liquid cooling plate body 10, and the opening groove 50 is disposed on one side of the liquid cooling plate body 10 perpendicular to the end of the inlet and the outlet.

[0076] In one embodiment, the liquid cooling plate body 10 has several opening slots 50.

[0077] In this embodiment, multiple heat-dissipating components can be installed simultaneously on the liquid cooling plate body 10, and each heat-dissipating component is installed in a corresponding opening slot 50.

[0078] In one embodiment, the opening slots 50 on the liquid cooling plate body 10 are a plurality of pairs. The two pairs of opening slots 50 are disposed opposite to each other on opposite side surfaces of the liquid cooling plate body 10. The two pairs of opening slots 50 are interconnected and form a sealed cavity with the liquid flow channel 20 after the pair of heat dissipation components are installed.

[0079] In one embodiment, the edge of the opening groove 50 is provided with a sealing device 51 for sealing connection with the heat dissipation component.

[0080] In one embodiment, the sealing device 51 employs a sealing gasket, which is arranged around the edge of the opening groove 50.

[0081] Of course, the sealing device 51 can also adopt other structures, such as sealing rings.

[0082] In one embodiment, reference is made to Figure 1 , Figure 2 and Figure 4 The liquid cooling plate also includes several pressure plates 60 for connecting the heat dissipation components to the opening slots 50, and the pressure plates 60 are detachably connected to the liquid cooling plate body 10.

[0083] The pressure plate 60 allows for the removable sealing of the heat-dissipating component onto the opening slot 50. In use, the pressure plate 60 can be used to press down on the side of the heat-dissipating component for fixation.

[0084] The pressure plate 60 and the liquid cooling plate body 10 can be detachably connected by fasteners 61, such as bolts or screws.

[0085] In one embodiment, a pressure plate 60 is provided on two opposite sides of the opening slot 50 on the same side of the liquid cooling plate body 10. When there are several opening slots 50, the adjacent sides of two adjacent opening slots 50 share the same pressure plate 60.

[0086] In one embodiment, the pressure plate 60 adopts an inverted L-shaped or T-shaped structure.

[0087] Depending on the structure of the pressure plate 60, the independent pressure plate and the shared pressure plate can have the same or different structures.

[0088] like Figure 2 and Figure 6 As shown, the independent pressure plate structures differ from the shared pressure plate structures. For example, the independent pressure plate structures employ an L-shaped structure, while the shared pressure plate structures employ a T-shaped structure.

[0089] In one embodiment, reference is made to Figure 8 and Figure 9 The liquid cooling plate also includes several positioning holes 71.

[0090] Several positioning holes 71 are preferably detachably connected to the liquid cooling plate body 10 on the side of the opening slot 50.

[0091] In one embodiment, reference is made to Figure 4 The liquid cooling plate also includes several positioning posts 72 that match the positioning holes 71. The positioning posts 72 are used for positioning and installation with the heat dissipation components.

[0092] The positioning post 72 can be used to guide and position the heat sink during installation.

[0093] In practice, one end of the positioning pin 72 is inserted into the positioning hole 71. Alternatively, another positioning hole can be drilled in the heat dissipation component so that the other end of the positioning pin 72 is inserted into the other positioning hole.

[0094] This invention provides a liquid-cooled heat dissipation controller, which includes a module unit 80 to be cooled. The module unit 80 has a radiator unit 81 and a heating unit 82, which are connected to each other. The module unit 80 is sealed to the opening groove 50 of the liquid cooling plate. At least a portion of the radiator unit 81 extends into the liquid flow channel 20, so that the module unit 80 and the liquid flow channel 20 form a sealed cavity that communicates with the inlet and outlet of the water respectively.

[0095] In this embodiment, the component to be cooled refers to a module unit 80 of the controller that requires heat dissipation. Specifically, the component requiring heat dissipation is the heat-generating unit 82 on the PCB board, namely the power module, MOS module, or IGBT module mentioned above.

[0096] In one embodiment, the heat sink unit 81 includes a heat-conducting base 81a and heat dissipation fins 81b. The heat-conducting base 81a is connected to the heat-generating unit 82 and can be installed in the opening slot 50. The heat dissipation fins 81b are disposed on the heat-conducting base 81a. When the heat-conducting base 81a is sealed and connected to the opening slot 50, the heat dissipation fins 81b extend into the liquid flow channel 20.

[0097] In one embodiment, when the liquid cooling plate has a connecting plate 23, a portion of the heat dissipation fins 81b extending into the liquid flow channel 20 is located on one side of the connecting plate 23. Preferably, there is a gap between the portion of the heat dissipation fins 81b and the connecting plate 23 to facilitate better liquid flow.

[0098] In one embodiment, in order to better transfer heat, the liquid cooling plate and the heat sink unit are both made of thermally conductive materials such as aluminum. Specifically, the heat-generating unit on each PCB board can be integrated into the heat sink unit made of thermally conductive material, thereby achieving better heat exchange by introducing at least part of the heat sink unit into the liquid flow channel. That is, the heat-generating unit 82 and the heat sink unit 81 are integrated, for example, the heat-generating unit 82 and the heat sink unit 81 of the silicon carbide module are integrated.

[0099] In one embodiment, the module unit 80 further includes a PCB board 83, each PCB board 83 being disposed on the side of the heat-generating unit 82 away from the heat sink unit 81.

[0100] In one embodiment, the liquid-cooled heat dissipation controller has several module units 80, and the liquid cooling plate also has several opening slots 50, with each module unit 80 connected to a corresponding opening slot 50.

[0101] This invention divides the controller into several independent module units 80. Each heat sink unit 81 of the several module units 80 is at least partially embedded in the liquid flow channel 20, which disperses the heat source and is more conducive to heat conduction.

[0102] In one embodiment, there are several pairs of opening slots 50, and the two pairs of opening slots 50 are disposed opposite each other on opposite surfaces of the liquid cooling plate body 10 and are interconnected; there are several pairs of module units 80, and the two pairs of module units 80 are respectively disposed on the two opposite opening slots 50, so that the two pairs of module units 80 and the liquid flow channel 20 form a sealed cavity that is connected to the inlet 30 and the outlet 40 respectively.

[0103] For example, Figure 4 As shown, the liquid cooling plate body 10 is provided with six opening slots 50. The six opening slots 50 are arranged in pairs and are interconnected. Each opening slot 50 is equipped with a module unit 80. Each module unit 80 and the liquid flow channel 20 form a sealed cavity that is connected to the inlet 30 and the outlet 40 respectively.

[0104] In one embodiment, there are six opening slots 50, which are arranged in pairs along the liquid flow channel 20 on two opposite sides of the liquid cooling plate body 10. There are also six module units 80, which are sealed and connected to a corresponding opening slot 50.

[0105] Reference Figure 4 The six module units 80 are module unit 84, module unit 85, module unit 86, module unit 87, module unit 88 and module unit 89 respectively. Module unit 84, module unit 85 and module unit 86 are respectively sealed and connected to each opening slot 50 on one side of the liquid cooling plate body 10, and module unit 87, module unit 88 and module unit 89 are respectively sealed and connected to each opening slot 50 on the opposite side of the liquid cooling plate body 10.

[0106] In this embodiment, the controller is divided into six independent module units, dispersing the heat source. Each module unit is embedded in an open slot 50. The liquid cooling plate connects the heat sink units of the six module units in series or in parallel. The heat sink units are at least partially embedded in the liquid flow channel, which forms a sealed cavity. When the heat-generating unit of the module unit 80 generates heat, it is conducted to the heat sink unit in the liquid extending into the liquid flow channel. The liquid flow channel has circulating liquid, which facilitates the liquid to carry away the heat from the heat sink unit, thereby cooling and dissipating the heat-generating unit and keeping it within a certain operating temperature range to ensure its normal operation.

[0107] In one embodiment, the liquid flow channel 20 is aligned with the length direction of the liquid cooling plate body 10.

[0108] The preferred embodiments of this utility model have been described in detail above. However, it should be understood that after reading the above teachings, those skilled in the art can make various alterations or modifications to this utility model. These equivalent forms also fall within the scope defined by the appended claims.

Claims

1. A liquid-cooled plate, characterized in that, The device includes a liquid cooling plate body, which has a liquid flow channel inside. The surface of the liquid cooling plate body is provided with an inlet, an outlet, and an opening groove for installing a component to be scald. The inlet, the outlet, and the opening groove are respectively connected to the liquid flow channel. The opening groove is arranged along the liquid flow channel. After the component to be scald is installed, it forms a sealed cavity with the liquid flow channel that is respectively connected to the inlet and the outlet.

2. The liquid cooling plate as described in claim 1, characterized in that, The water inlet and the water outlet are respectively located on one end of the liquid cooling plate body, and the opening groove is located on one side of the liquid cooling plate body that is perpendicular to the end of the water inlet and the water outlet. And / or, the opening slots on the liquid cooling plate body are a plurality of; And / or, the opening slots on the liquid cooling plate body are a pair of several, and the two pairs of opening slots are disposed opposite to each other on opposite side surfaces of the liquid cooling plate body and are interconnected. After the pair of several heat dissipation components are installed, they form the sealed cavity with the liquid flow channel. And / or, the edge of the opening groove is provided with a sealing device for sealing connection with the heat dissipation component.

3. The liquid cooling plate as described in claim 2, characterized in that, The sealing device uses a sealing gasket, which is arranged around the edge of the opening groove.

4. The liquid cooling plate as described in claim 1, characterized in that, The liquid flow channel includes a liquid inlet flow channel and a liquid outlet flow channel that are interconnected. The inlet is connected to the liquid inlet flow channel, the outlet is connected to the liquid outlet flow channel, and the opening groove is connected to both the liquid inlet flow channel and the liquid outlet flow channel. And / or, the liquid inlet channel and the liquid outlet channel are arranged side by side.

5. The liquid cooling plate as described in claim 4, characterized in that, At least one of the opening slots is provided along the liquid inlet channel and / or the liquid outlet channel.

6. The liquid cooling plate as described in claim 4, characterized in that, The length direction of the liquid inlet channel and the length direction of the liquid outlet channel are consistent with the length direction of the liquid cooling plate body. The water inlet and the water outlet are respectively located on the end side of the liquid cooling plate body in the width direction. And / or, each of the opening slots is provided with a connecting plate at both ends, which are respectively connected between any two opposite ends of the liquid flow channel.

7. The liquid cooling plate as described in claim 6, characterized in that, The liquid flow channels at the locations of the paired opening slots share a single connecting plate.

8. The liquid-cooled plate according to any one of claims 1 to 7, characterized in that, The liquid cooling plate also includes several pressure plates for connecting the heat dissipation component to the opening groove, and the pressure plates are detachably connected to the main body of the liquid cooling plate. And / or, the liquid cooling plate further includes a plurality of positioning holes; And / or, the liquid cooling plate further includes a positioning post that matches the positioning hole for positioning and mounting the heat-dissipating component.

9. The liquid cooling plate as described in claim 8, characterized in that, The opening slot is provided with a pressure plate on two opposite sides of the same side of the liquid cooling plate body. When there are several opening slots, the adjacent sides of two adjacent opening slots share the same pressure plate. And / or, the pressure plate adopts at least one of an inverted L-shaped and a T-shaped structure.

10. A liquid-cooled heat dissipation controller, comprising a module unit to be cooled, characterized in that, The module unit has a heating unit and a radiator unit connected to the heating unit. The module unit is sealed to the opening groove of the liquid cooling plate according to any one of claims 1 to 9. At least a portion of the radiator unit extends into the liquid flow channel, such that the module unit and the liquid flow channel form a sealed cavity that communicates with the inlet and outlet respectively.

11. The liquid-cooled heat dissipation controller as described in claim 10, characterized in that, The heat sink unit includes a heat-conducting base that is installed to match the opening slot and heat-dissipating fins disposed on the heat-conducting base. When the heat-conducting base is sealed to the opening slot, the heat-dissipating fins extend into the liquid flow channel. And / or, the liquid-cooled heat dissipation controller has several module units, and the liquid cooling plate also has several opening slots, with each module unit connected to a corresponding opening slot; And / or, the heating unit is integrated with the heat sink unit; And / or, the module unit further includes a PCB board, which is disposed on the side of the heating unit opposite to the heat sink unit.

12. The liquid-cooled heat dissipation controller as described in claim 11, characterized in that, When the liquid cooling plate has a connecting plate, the portion of the heat dissipation fins extending into the liquid flow channel is located on one side of the connecting plate.

13. The liquid-cooled heat dissipation controller as described in claim 12, characterized in that, The portion of the heat dissipation fin extending into the liquid flow channel has a gap between it and the connecting plate.

14. The liquid-cooled heat dissipation controller as described in claim 11, characterized in that, The liquid cooling plate and the heat sink unit are made of aluminum.

15. The liquid-cooled heat dissipation controller as described in claim 11, characterized in that, The opening slots are a pair of several, and the two opening slots in a pair are disposed opposite each other on opposite side surfaces of the liquid cooling plate body and are interconnected; the module units are a pair of several, and the two module units in a pair are respectively disposed on the two opposite opening slots, so that the two module units in a pair and the liquid flow channel form a sealed cavity that is respectively connected to the inlet and the outlet. Alternatively, there are six opening slots, which are arranged in pairs along the liquid flow channel on two opposite sides of the liquid cooling plate body; there are six module units, which are respectively sealed and connected to one of the corresponding opening slots.

16. The liquid-cooled heat dissipation controller as described in claim 15, characterized in that, The liquid flow channel is aligned with the length direction of the liquid cooling plate body.

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