Power amplifier for microwave processing

Abstract

The utility model relates to a power amplifier for microwave processing, which comprises a shell forming an isolation cavity, an inverted L-shaped partition plate is arranged in a seat shell of the shell, and a support frame is further arranged on the inverted L-shaped partition plate; the opening end of the seat shell is further buckled with a cover plate which can be matched with the opening end of the seat shell to form an isolation containing cavity, and an inserting partition plate which can be matched with the inverted-L-shaped partition plate to partition the isolation containing cavity is arranged in the cover plate. The inverted-L-shaped partition plate and the inserting partition plate are provided with air guide units for driving air flow to circularly flow in the isolation containing cavity. The inner bottom face of the seat shell is further provided with a heat dissipation assembly capable of cooling circulating airflow flowing in a directional mode. According to the utility model, the crossed gas-liquid double-circulation loop is constructed to improve the transfer efficiency of the working heat and effectively separate the electronic component from the external environment so as to prevent the electronic component from being damaged.

Description

Technical Field

[0001] This utility model relates to the field of power amplifier technology, and in particular to a power amplifier for microwave processing. Background Technology

[0002] A microwave power amplifier is an electronic device used to amplify microwave signals. Microwave power amplifiers are commonly used in wireless communication systems, radar systems, satellite communications, and other applications requiring the processing of microwave frequency signals. They can enhance input microwave signals to higher power levels, enabling longer transmission distances, wider signal coverage, or higher signal-to-noise ratios. As a crucial component of microwave equipment, a malfunction in a microwave power amplifier can cause single-channel circuit interruption, affecting the reliability of microwave communication. Currently, one common cause of failure is that the heat generated during operation accumulates in the amplifier's cavity, leading to excessively high operating temperatures and ultimately damaging the integrated circuits and related electronic components that make up the power amplifier.

[0003] For example, patent document CN215582192U discloses a microwave power amplifier, which includes multiple side plates enclosing a cabinet. A cavity is provided within the cabinet, and a power amplifier module and a dust removal structure are disposed within the cavity and spaced apart from each other. At least one side plate has heat dissipation holes for heat dissipation. The dust removal structure includes a dust removal mechanism and a drive mechanism. The dust removal mechanism has dust removal components for cleaning the heat dissipation holes; the drive mechanism is disposed on the side plate with the heat dissipation holes, and the dust removal mechanism is connected to the drive mechanism so that the dust removal mechanism is movably disposed on the side plate. This utility model cleans the heat dissipation holes on the cabinet by setting a dust removal structure, thereby ensuring the airflow through the heat dissipation holes and maintaining the unobstructed flow of external air into the cabinet, thus avoiding the problem of reduced heat dissipation efficiency due to blockage of the heat dissipation holes. However, existing microwave power amplifiers often cannot guarantee that the heat dissipation airflow entering the cabinet can effectively pass through the area where electronic components such as the power amplifier module are located, and cannot efficiently remove the heat diffused from the surface of the electronic components, resulting in poor heat dissipation. In particular, existing heat dissipation methods require the introduction of external airflow into the device, which makes it easy for tiny dust particles that are not intercepted by the heat dissipation holes to enter the device with the airflow and gradually accumulate on the surface of electronic components. Over time, the accumulation of dust will form a film structure on the surface of electronic components, which will hinder the speed and efficiency of heat dissipation from the inside of the electronic components. This can easily lead to heat accumulation and damage inside the electronic components. In addition, the moisture carried by the external airflow will increase the humidity inside the device, making electronic components more susceptible to corrosion and damage under high temperature and high humidity conditions, which will shorten the life of electronic components such as power amplifier modules to a certain extent. Utility Model Content

[0004] The purpose of this invention is to provide a microwave power amplifier that improves the heat transfer efficiency by constructing a cross-linked gas-liquid dual circulation loop, while effectively isolating electronic components from the external environment to avoid damage to the electronic components. This solves the problem that the heat dissipation effect of the existing microwave power amplifier's internal and external air exchange method is poor, and the introduced air carries dust and moisture. The dust that accumulates inside the device for a long time will reduce the heat diffusion capacity of the electronic components, causing internal heat to accumulate, and the components are easily corroded by water vapor under high temperature and high humidity conditions, resulting in damage to the electronic components and a shortened lifespan.

[0005] The technical solution adopted by this utility model is as follows: a power amplifier for microwave processing includes a housing forming an isolation cavity, an inverted L-shaped partition is provided inside the housing, and a support frame is also provided on the inverted L-shaped partition; a cover plate that can cooperate with the open end of the housing to form an isolation cavity is also fastened to it, an insert partition that can cooperate with the inverted L-shaped partition to separate the isolation cavity is provided inside the cover plate, and an air guiding unit that drives the airflow to circulate in the isolation cavity is provided on the inverted L-shaped partition and the insert partition; a heat dissipation component that can cool the directional circulating airflow is also provided on the inner bottom surface of the housing.

[0006] According to a preferred embodiment, the heat dissipation assembly includes an insert base, a cooling shell plate, an inlet pipe, and an outlet pipe. The insert base is mounted on the housing by penetrating the bottom surface of the housing, and a plurality of cooling shell plates are spaced apart on the surface of the insert base inside the housing, located below the inverted L-shaped partition. The inlet pipe and the outlet pipe are respectively provided on both sides of the cooling shell plate to guide the coolant into and out of their respective plate cavities. The ends of the inlet pipe and the outlet pipe away from the cooling shell plate both penetrate the insert base and are connected to the circulating cooling module through connecting pipes.

[0007] According to a preferred embodiment, the cooling shell plate is configured with a serpentine curved shape in such a way that the circulating airflow traveling directionally through the heat exchange gap between two adjacent cooling shell plates can continuously change its flow state, and a bent flat body flow channel with the same outer contour is provided inside the cooling shell plate.

[0008] According to a preferred embodiment, heat transfer plates are embedded on both parallel plate surfaces that define the heat transfer gap in the cooling shell plate.

[0009] According to a preferred embodiment, a plurality of parallel inlet branch pipes of the inlet pipe are connected to the upper edge of the end side of the cooling shell plate in a manner corresponding to the cooling shell plate, and the ends of the plurality of inlet branch pipes away from the cooling shell plate are all connected to the branch pipe, and the branch pipe is also connected to the coolant supply pipe through the main inlet pipe that passes through the mounting body.

[0010] According to a preferred embodiment, a plurality of outflow branch pipes of the outflow pipe are connected to the lower edge of the end side of the cooling shell plate in a manner corresponding to the cooling shell plate, and the plurality of outflow branch pipes are also connected to the main outflow pipe inserted in the mounting body through a manifold.

[0011] According to a preferred embodiment, the vertical plate of the inverted L-shaped partition is supported on the inner bottom surface of the housing, and a horizontal plate is provided on the top side of the vertical plate.

[0012] According to a preferred embodiment, a docking slot for engaging the insert partition is provided on the side of the horizontal plate away from the vertical plate, and a filling pad capable of filling the assembly gap is provided in the docking slot.

[0013] According to a preferred embodiment, the hollow frame plate of the support frame is supported on the transverse plate by support rods.

[0014] According to a preferred embodiment, a first guide fan capable of guiding airflow to flow into the heat exchange gap defined by the plurality of cooling shell plates is embedded in the vertical plate; a second guide fan driving the gas in the area where the support frame is located is embedded in the insert partition.

[0015] The beneficial effects of this utility model are:

[0016] The inverted L-shaped baffle and insert baffle provided in this application can effectively construct an airflow channel within the isolation cavity of the housing, allowing efficient flow across the surface of electronic components. This enables the airflow driven by the air guide unit to fully transfer the heat diffused from the electronic components, maintaining a lower air temperature on the surface of the electronic components and ensuring their operational stability. The airflow channel constructed in this application forms a loop that intersects with the coolant loop, allowing the heat dissipation component to effectively cool the airflow flowing across its surface. This allows the circulating airflow to continuously dissipate heat from the electronic components. The heat dissipation component 7 provided in this application can promote heat exchange between the airflow and coolant by defining the curved airflow and coolant channels, improving the sufficiency and efficiency of heat transfer and ensuring the effectiveness of secondary heat dissipation. The airflow and coolant circulation loops with intersecting areas in this application achieve efficient heat transfer within the isolation cavity of the housing, avoiding dust deposition and moisture corrosion caused by the introduction of external air. This improves the stability of environmental parameters and operational safety of the electronic components, effectively extending their service life and continuous operational stability. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of a preferred microwave processing power amplifier proposed in this utility model;

[0018] Figure 2 This is a plan view of a preferred heat dissipation component for a microwave processing power amplifier proposed in this utility model.

[0019] List of reference numerals

[0020] 1: Outer shell; 2: Limiting frame; 3: Inverted L-shaped partition; 4: Support frame; 5: Inserted partition; 6: Air guide unit; 7: Heat dissipation component; 8: Connecting pipe; 9: Circulating cooling module; 11: Base shell; 12: Cover plate; 21: Heat insulation pad; 31: Vertical plate; 32: Horizontal plate; 321: Docking slot; 322: Filler pad; 323: Auxiliary support column; 41: Hollow frame plate; 42: Support rod; 61: First guide fan; 62: Second guide fan; 71: Embedded base; 72: Cooling shell plate; 73: Inlet pipe; 74: Outlet pipe; 721: Bent flat flow channel; 722: Heat transfer plate; 731: Inlet branch pipe; 732: Diverter pipe; 733: Inlet main pipe; 741: Outlet branch pipe; 742: Manifold; 743: Outlet main pipe. Detailed Implementation

[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the present utility model will be briefly introduced below in conjunction with the accompanying drawings and descriptions of the embodiments or the prior art. Obviously, the following description of the structure of the drawings is only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] The technical solutions provided by this utility model will be described in detail below with reference to the accompanying drawings and through embodiments. It should be noted that the descriptions of these embodiments are intended to aid in understanding this utility model, but do not constitute a limitation thereof. In some examples, because some implementation methods belong to existing or conventional technology, they are not described or are not described in detail.

[0023] The following is a detailed explanation with reference to the accompanying drawings. Example

[0024] This application provides a power amplifier for microwave processing, which includes a housing 1, a limiting frame 2, an inverted L-shaped partition 3, a support frame 4, an insert partition 5, an air guiding unit 6, a heat dissipation assembly 7, a connecting pipe 8, and a circulating cooling module 9.

[0025] according to Figure 1-2In one specific embodiment shown, the outer casing 1 is constructed to isolate the electronic components from the external environment. A limiting frame 2 is provided at the bottom of the outer casing 1. An inverted L-shaped partition 3 is provided inside the base 11 of the outer casing 1. A support frame 4 is also provided on the inverted L-shaped partition 3. A cover plate 12 that cooperates with the open end of the base 11 to construct the isolation cavity is also fastened. An insert partition 5 is provided inside the cover plate 12 to cooperate with the inverted L-shaped partition 3 to divide the isolation cavity into two non-communicating sub-chambers. An air guiding unit 6 is provided on the inverted L-shaped partition 3 and the insert partition 5 to drive the airflow to circulate in the isolation cavity. A heat dissipation component 7 that can cool the directional circulating airflow is also provided on the inner bottom surface of the base 11. A circulating cooling module 9 that can continuously cool the heat-absorbing coolant is provided within the hollow frame structure constructed by the limiting frame 2. The heat dissipation assembly 7 is also connected to the circulating cooling module 9 via a connecting pipe 8, thus forming a coolant circulation loop. This allows the coolant to continuously transfer heat from the circulating airflow. The inverted L-shaped baffle 3 and the insert baffle 5 provided in this application effectively create an airflow channel within the isolation cavity of the housing 1, allowing the airflow driven by the air guide unit 6 to fully transfer the heat diffused from the electronic components. This maintains a low air temperature on the surface of the electronic components, ensuring their operational stability. The airflow channel constructed in this application forms a circulation loop that intersects with the coolant loop, enabling the heat dissipation assembly 7 to effectively cool the airflow flowing over its surface. This allows the circulating airflow to repeatedly dissipate heat from the electronic components. The heat dissipation assembly 7 in this application promotes heat exchange between the airflow and coolant by defining the curved airflow and coolant channels, improving the sufficiency and efficiency of heat transfer and ensuring the effectiveness of secondary heat dissipation. The present application establishes an airflow circulation loop and a coolant circulation loop with intersecting areas to achieve efficient heat transfer within the isolation cavity of the outer casing 1. This avoids dust deposition and water vapor corrosion caused by the introduction of external air, improves the stability of environmental parameters and operational safety of electronic components, and effectively enhances the service life and continuous operational stability of electronic components.

[0026] Preferably, the housing 11 of the outer casing 1 has several wire holes on its side that can be sealed with plugs, so that electronic components such as power amplifier modules installed inside can be connected to external microwave equipment, other electronic accessories, and power supplies through wires passing through the wire holes. Preferably, a transparent plate penetrating the cover plate 12 is inlaid on the cover plate 12 to form an observation window.

[0027] Preferably, a heat insulation pad 21 is provided on the top surface of the limiting frame 2 to block heat conduction, so as to prevent the circulating cooling module 9 from conducting heat to the outer shell 1 for the second time.

[0028] Preferably, the vertical plate 31 of the inverted L-shaped partition 3 is supported on the inner bottom surface of the housing 11 such that its two ends abut against the inner side surface of the housing 11. More preferably, a transverse plate 32 is provided on the top side of the vertical plate 31, with both sides also abutting against the inner side surface of the housing 11. Preferably, a mating groove 321 for mating the insert partition 5 is provided on the side of the transverse plate 32 away from the vertical plate 31. More preferably, a filling pad 322 capable of filling the assembly gap is provided in the mating groove 321. Preferably, an auxiliary support column 323 is also provided on the lower surface of the transverse plate 32. Specifically, the auxiliary support column 323 is aligned with the vertical plate 31, thereby stably limiting the transverse plate 32 in the working position. The inverted L-shaped partition 3 provided in this application can cooperate with the insert partition 5 to divide the isolation cavity, and the two divided sub-cavities are connected end to end through the air guiding unit 6, thereby forming a gas circulation loop that allows airflow to circulate in the isolation cavity, so as to ensure that the airflow can effectively flow over the surface of the electronic components and quickly transfer the heat generated during their operation, thereby achieving efficient and continuous heat dissipation for the electronic components.

[0029] Preferably, the hollow frame plate 41 of the support frame 4 is supported on the transverse plate 32 by support rods 42. Preferably, a conventional circuit board capable of connecting to and interconnecting several electronic components is embedded in the hollow frame plate 41. Specifically, the electronic components constituting the power amplifier may include a coupling module, a control module, a power amplification module, a filtering module, and a power supply unit, etc., wherein the signal input terminals of the power amplification module and the coupling module can both receive input signals; the signal output terminal of the coupling module is connected to the signal input terminal of the control module; the signal output terminal of the control module is connected to the input terminal of the filtering module, and all the above modules are connected to the power supply unit through circuit lines in the circuit board. The coupling module is used to extract the input signal; the control module is used to analyze and judge the frequency information of the input signal and obtain the frequency information of the input signal; and to generate a state switching signal for the filtering module according to the frequency information of the input signal, and filter the input signal through a corresponding filter. The frequency information of the input signal can be the frequency band of the input signal or the accurate frequency value of the input signal. When the input signal is input to the power amplifier from the signal input terminal of the power amplifier module, the coupling module extracts the input signal. For example, the coupling module can process the input signal according to a preset ratio to obtain a coupled signal, which is then input to the control module. The control module analyzes and judges the frequency information of the input signal to obtain a state switching signal. The filtering module switches its state according to the state switching signal, connecting the filter whose passband corresponds to the frequency information of the input signal to the signal output terminal of the power amplifier module, while the other filters are switched to the off state. After the input signal is amplified by the power amplifier circuit, it is filtered by the filter whose passband corresponds to the frequency information of the input signal, thereby reducing interference. Preferably, the coupling module can be a SYDC2062HP; the control module can be an ARM microprocessor; the power amplifier module can be a YPM04074; the filtering module can be a DPV1543SF; and the power supply unit can be a TBD15CS. The hollow frame plate 41 provided in this application can effectively expose the non-connected surfaces of the electronic components on the circuit board substrate, so that the airflow flowing from above and below the hollow frame plate 41 can effectively carry away the heat generated by the power amplifier module and other electronic components during operation, reduce the blocked area, and enable the airflow to effectively make heat transfer contact with the surface of the electronic components, thereby improving the efficiency and effect of heat transfer of the electronic components and improving the heat dissipation effect.

[0030] Preferably, the air guiding unit 6 includes a first guide fan 61 and a second guide fan 62 capable of driving directional airflow. Preferably, a first guide fan 61 capable of guiding airflow into the heat exchange gap defined by a plurality of cooling shell plates 72 is embedded in the vertical plate 31. Preferably, a second guide fan 62 is embedded in the insert partition 5 to drive directional airflow in the area where the support frame 4 is located, thereby accelerating the rapid transfer of heat generated during the operation of electronic components. Preferably, the first guide fan 61 and the second guide fan 62 can be centrifugal fans of the PFR2657 series to form directional airflow in the circulation channel, thereby driving the airflow to effectively pass through the surface of the electronic components and enabling the heat-absorbing airflow to effectively pass through the heat exchange gap, thereby making full contact with the cooling shell plate 72 and effectively completing airflow cooling.

[0031] Preferably, the heat dissipation assembly 7 includes an insert base 71, a cooling shell plate 72, an inlet pipe 73, and an outlet pipe 74. Preferably, the insert base 71 is mounted on the housing 11 by penetrating the bottom surface of the housing 11. More preferably, a plurality of cooling shell plates 72 are spaced apart on the surface of the insert base 71 inside the housing 11, positioned below the inverted L-shaped partition 3. Preferably, an inlet pipe 73 and an outlet pipe 74 are respectively provided on both sides of the cooling shell plate 72 to guide the coolant into and out of its cavity. Specifically, the ends of the inlet pipe 73 and the outlet pipe 74 away from the cooling shell plate 72 both penetrate the insert base 71 and are connected to the circulating cooling module 9 through a connecting pipe 8, thereby forming a coolant circulation loop between the cooling shell plate 72 and the circulating cooling module 9. The cooling shell plate 72 provided in this application can transfer and cool the circulating airflow that flows through its layout gap, so that the circulating airflow can be effectively cooled and can circulate to the layout area of ​​the electronic components, thereby absorbing and transferring the working heat of the electronic components a second time.

[0032] Preferably, the cooling shell plate 72 is configured with a serpentine curved shape so that the circulating airflow directionally passing through the heat exchange gap between two adjacent cooling shell plates 72 can continuously change its flow state, thereby ensuring sufficient contact between the circulating airflow and the surface of the cooling shell plate 72, in order to accelerate the transfer of heat from the circulating airflow to the cooling shell plate 72. More preferably, a bent flat flow channel 721 with the same outer contour is provided inside the cooling shell plate 72. Preferably, heat transfer plates 722 are embedded on the two parallel plate surfaces of the cooling shell plate 72 that define the heat exchange gap, which can actively transfer the heat contained in the circulating airflow flowing through the heat exchange gap to the coolant in the bent flat flow channel 721. Preferably, the heat transfer plate 722 provided in this application is a semiconductor heat exchange plate capable of actively transferring heat, which can continuously transfer the heat contained in the circulating airflow in contact with it to the coolant flowing in the bent flat flow channel 721, thereby efficiently reducing the temperature of the circulating airflow and enabling the circulating airflow to perform secondary heat dissipation. Preferably, the curved path heat exchange gap provided in this application allows the circulating airflow to be continuously changed in direction, causing gas molecules to move relative to each other without interruption. This ensures that the gas molecules in the airflow can fully contact the heat transfer plate 722 to complete the cooling process, improving cooling efficiency and quality. The curved flat flow channel 721 provided in this application can also simultaneously change the flow state of the coolant molecules, allowing the liquid molecules to continuously move relative to each other and more fully absorb the transferred heat, improving the sufficiency and efficiency of heat absorption.

[0033] Preferably, the inlet pipe 73 is installed on the right side of the cooling shell plate 72, that is, the inlet pipe 73 is located on the side where the circulating gas flows out of the heat exchange gap. Preferably, a plurality of parallel inlet branch pipes 731 of the inlet pipe 73 are connected to the upper edge of the end side of the cooling shell plate 72 in a manner corresponding to the cooling shell plate 72. More preferably, the ends of the plurality of inlet branch pipes 731 away from the cooling shell plate 72 are all connected to the branch pipe 732. More preferably, the branch pipe 732 is also connected to the coolant supply pipe 8 through the main inlet pipe 733 that penetrates the mounting base 71.

[0034] Preferably, the outlet pipe 74 is installed on the left side of the cooling shell plate 72, that is, the outlet pipe 74 is located on the side where the circulating airflow flows into the heat exchange gap. Preferably, a plurality of parallel outlet branch pipes 741 of the outlet pipe 74 are connected to the lower edge of the end side of the cooling shell plate 72 in a manner corresponding to the cooling shell plate 72. More preferably, the plurality of outlet branch pipes 741 are also connected to the outlet main pipe 743 inserted into the mounting base 71 through a manifold 742. More preferably, one end of the outlet main pipe 743 extending to the outside of the housing 11 is connected to the circulating cooling module 9 through a coolant recovery connection pipe 8. Preferably, the coolant supply connection pipe 8 and the coolant recovery connection pipe 8 are respectively connected to the output port and the input port of the circulating cooling module 9, and the output port and the input port of the circulating cooling module 9 are provided with one-way valves and drive pumps for directional output and input of coolant. Preferably, the circulating cooling module 9 can be a DL series low-temperature circulating water cooler, which has high temperature control accuracy, is suitable for circulating heat dissipation of low-power devices, and can effectively achieve constant temperature cooling of the coolant after heat absorption.

[0035] Preferably, the air guiding unit 6, the heat transfer plate 722 and other electrical components are all electrically connected to the controller and the power supply. The control method of this application is controlled by the controller. The control circuit of the controller can be implemented by simple programming by those skilled in the art. The power supply is also common knowledge in the art. Furthermore, this utility model is only used to protect the mechanical device and its mechanical structural features. Therefore, this utility model will not explain the control method and circuit connection in detail.

[0036] This utility model is not limited to the above-described optional embodiments. Anyone can derive other various forms of products under the guidance of this utility model. However, regardless of any changes in shape or structure, any technical solution falling within the scope of the claims of this utility model is within the protection scope of this utility model. Those skilled in the art should understand that this utility model specification and its drawings are illustrative and do not constitute a limitation on the claims. The protection scope of this utility model is defined by the claims and their equivalents. Throughout the text, features introduced by "preferred" are merely optional and should not be construed as mandatory. Therefore, the applicant reserves the right to abandon or delete relevant preferred features at any time.

Claims

1. A power amplifier for microwave processing, comprising a housing (1) forming an isolation cavity, characterized in that, An inverted L-shaped partition (3) is provided inside the base shell (11) of the outer shell (1), and a support frame (4) is also provided on the inverted L-shaped partition (3). The opening end of the housing (11) is also fastened with a cover plate (12) that can cooperate with it to form an isolation cavity. Inside the cover plate (12) is an insert partition plate (5) that can cooperate with the inverted L-shaped partition plate (3) to divide the isolation cavity. Furthermore, an air guide unit (6) that drives the airflow to circulate in the isolation cavity is provided on the inverted L-shaped partition plate (3) and the insert partition plate (5). A heat dissipation component (7) capable of cooling the directional circulating airflow is also provided on the inner bottom surface of the housing (11).

2. The power amplifier for microwave processing according to claim 1, wherein The heat dissipation assembly (7) includes a mounting base (71), a cooling shell plate (72), an inlet pipe (73), and an outlet pipe (74), wherein, The mounting base (71) is mounted on the housing (11) through the bottom surface of the housing (11), and a plurality of cooling shell plates (72) located below the inverted L-shaped partition (3) are arranged at intervals on the surface of the mounting base (71) inside the housing (11). On both sides of the cooling shell plate (72), there are respectively an inlet pipe (73) and an outlet pipe (74) for guiding the coolant into and out of its cavity. The ends of the inlet pipe (73) and the outlet pipe (74) away from the cooling shell plate (72) both pass through the mounting base (71) and are connected to the circulating cooling module (9) through the connecting pipe (8).

3. The power amplifier for microwave processing according to claim 2, wherein The cooling shell plate (72) is configured with a serpentine curved shape in such a way that the circulating airflow traveling in the direction of heat exchange gap between two adjacent cooling shell plates (72) can continuously change the flow state, and a bent flat body flow channel (721) with the same outer contour is provided in the cooling shell plate (72).

4. The power amplifier for microwave processing according to claim 3, wherein Heat transfer plates (722) are embedded on both parallel plate surfaces that define the heat transfer gap in the cooling shell plate (72).

5. The power amplifier for microwave processing according to claim 4, wherein The inlet pipe (73) has several parallel inlet branch pipes (731) connected to the upper edge of the cooling shell plate (72) in a manner corresponding to the cooling shell plate (72), and the ends of the several inlet branch pipes (731) away from the cooling shell plate (72) are all connected to the branch pipe (732). The branch pipe (732) is also connected to the coolant supply pipe (8) through the inlet main pipe (733) that passes through the mounting body (71).

6. The power amplifier for microwave processing according to claim 5, wherein The outflow branch pipes (741) of the outflow pipe (74) are connected to the lower edge of the end side of the cooling shell plate (72) in a manner corresponding to the cooling shell plate (72), and the outflow branch pipes (741) are also connected to the outflow main pipe (743) inserted on the mounting base (71) through the manifold (742).

7. The microwave processing power amplifier of claim 6 wherein, The vertical plate body (31) of the inverted L-shaped partition plate (3) is supported on the inner bottom surface of the seat shell (11), and the top side of the vertical plate body (31) is provided with a transverse plate body (32).

8. The microwave processing power amplifier of claim 7, wherein, A butt joint clamping groove (321) for butt jointing the plug-in partition plate (5) is formed on the side of the transverse plate body (32) away from the vertical plate body (31), and a filling pad (322) capable of filling the assembly gap is arranged in the butt joint clamping groove (321).

9. The microwave processing power amplifier of claim 8, wherein, The hollow frame plate (41) of the support frame (4) is supported on the transverse plate body (32) through a support rod (42).

10. The microwave processing power amplifier of claim 9, wherein, A first flow guide fan (61) capable of guiding the airflow to flow through the flow guide heat exchange gaps defined by the cooling shell plates (72) is embedded on the vertical plate body (31); A second flow guide fan (62) for driving the directional flow of the gas in the area where the support frame (4) is located is embedded on the plug-in partition plate (5).

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