Improved high-efficiency IGBT chip

Abstract

The utility model discloses an improved high-efficiency IGBT chip, which relates to the technical field of electronic chips, and comprises a protective shell, an intelligent control module, a heat dissipation assembly and an IGBT chip mounting plate capable of being quickly assembled and disassembled, the protective shell is internally provided with a mounting cavity, and the front end and the rear end of the protective shell are respectively provided with a front cavity opening and a rear cavity opening. A clamping groove guide rail is arranged at the bottom in the protective shell, the clamping groove guide rail is in a swallow tail shape, a matched clamping block is fixedly connected to the position, corresponding to the clamping groove guide rail, of the bottom of the IGBT chip mounting plate, the clamping block is in a swallow tail shape, and the clamping block and the mounting plate are integrally formed; according to the utility model, the dovetail-shaped clamping groove guide rails are matched with the clamping blocks, so that the IGBT chip mounting plate can be quickly and accurately inserted into the mounting cavity of the protective shell without complicated tools; and meanwhile, through a mechanical structure composed of the extrusion groove, the pressing plate, the sliding block and the like, the mounting plate is automatically locked during mounting, the mounting plate can be easily taken out only through simple operation for unlocking during dismounting, and the maintenance time is greatly shortened.

Description

Technical Field

[0001] This utility model relates to the field of electronic chip technology, specifically an improved high-efficiency IGBT chip. Background Technology

[0002] With the rapid development of power electronics technology, IGBT chips have been widely used in many fields such as new energy vehicles, industrial frequency converters, and smart grids. However, traditional IGBT chips have many shortcomings. On the one hand, the installation and removal process of the chips is complex and cumbersome, often requiring specialized tools and a lot of time, which is not conducive to the rapid maintenance and upgrading of equipment. On the other hand, heat dissipation has always been a key factor restricting the performance of IGBT chips. High temperatures can easily lead to chip aging and failure, reducing system reliability. In addition, the lack of intelligent monitoring and control methods makes it impossible to optimize and adjust the chip's operating parameters according to real-time operating conditions, making it difficult to achieve efficient operation.

[0003] Therefore, those skilled in the art have provided an improved high-efficiency IGBT chip to solve the problems mentioned in the background art. Summary of the Invention

[0004] The purpose of this invention is to provide an improved high-efficiency IGBT chip to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] An improved high-efficiency IGBT chip includes a protective housing, an intelligent control module, a heat dissipation component, and a quick-release IGBT chip mounting plate. The protective housing has an internal mounting cavity, with a front cavity opening and a rear cavity opening at the front and rear ends, respectively. A slot guide rail is provided at the bottom of the protective housing, and the slot guide rail is dovetail-shaped. A matching locking block is fixedly connected to the bottom of the IGBT chip mounting plate at a position corresponding to the slot guide rail. The locking block is dovetail-shaped and integrally formed with the mounting plate.

[0007] As a further embodiment of this utility model: extrusion grooves are provided on both the left and right sides of the protective shell near the front end, and a through groove is provided at the bottom of the extrusion groove to the mounting cavity.

[0008] As a further embodiment of this utility model: a pressure plate is slidably connected inside the extrusion groove, a pressure block is fixedly connected to the bottom of the pressure plate, and compression springs are fixedly connected to both sides of the bottom of the pressure plate, with the ends of the compression springs fixedly connected to the bottom of the extrusion groove.

[0009] As a further improvement of this utility model: the front and rear ends of the IGBT chip mounting plate are respectively fixedly connected to a front sealing plate and a rear sealing plate, and the front sealing plate and the rear sealing plate are respectively provided with an input interface and an output interface.

[0010] As a further embodiment of this utility model: sliding grooves are provided on both sides of the front sealing plate at positions corresponding to the through grooves, and a slider is slidably connected in the sliding groove. Two telescopic springs are fixedly connected to the bottom of the slider, and the ends of the telescopic springs are fixedly connected to the bottom of the sliding groove. The front end of the slider extends to the outside of the sliding groove and has an inclined surface.

[0011] As a further improvement of this utility model: the top of the protective shell is provided with heat dissipation fins, the bottom of the protective shell is fixedly connected to an air duct, a cooling fan is fixedly installed in the air duct, and the cooling fan is connected to the mounting cavity through the air duct.

[0012] As a further improvement of this utility model: an intelligent control module is fixedly installed on one side surface of the protective shell. The intelligent control module includes a microprocessor, a memory, and a communication interface. The cooling fan is electrically connected to the intelligent control module.

[0013] As a further improvement of this utility model: a temperature sensor is provided on the IGBT chip mounting plate, the temperature sensor is electrically connected to the intelligent control module, and a fixed support leg is fixedly connected to the bottom of the protective shell. There are two fixed support legs, which are located at the bottom of the protective shell near the front and rear ends respectively.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] Easy installation and removal: The dovetail-shaped guide rail and the locking block allow the IGBT chip mounting plate to be quickly and accurately inserted into the mounting cavity of the protective shell without complicated tools; at the same time, the mechanical structure composed of the extrusion groove, pressure plate, and slider automatically locks the mounting plate during installation, and can be easily removed by simply unlocking it during disassembly, which greatly shortens maintenance time.

[0016] High-efficiency heat dissipation: The heat sink fins and cooling fan are combined to form an active and passive heat dissipation mode; the intelligent control module adjusts the cooling fan in real time according to temperature sensor data to ensure that heat dissipation is enhanced in time when the chip temperature rises, effectively avoiding chip performance degradation or damage due to overheating and extending chip life.

[0017] Intelligent monitoring and control: The intelligent control module enables real-time monitoring of the chip's operating status. Through the communication interface, parameters such as chip temperature, operating current, and voltage can be remotely acquired. The microprocessor automatically adjusts the cooling fan speed and chip operating frequency according to preset strategies, ensuring that the chip always operates under optimal conditions and improving the overall system efficiency. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of an improved high-efficiency IGBT chip.

[0019] Figure 2 This is a schematic diagram of the air duct and fixed support leg in an improved high-efficiency IGBT chip.

[0020] Figure 3 This is a schematic diagram of the slot guide rail in an improved high-efficiency IGBT chip.

[0021] Figure 4 This is a schematic diagram of the IGBT chip mounting plate in an improved high-efficiency IGBT chip.

[0022] Figure 5 This is a schematic diagram of the extrusion groove structure in an improved high-efficiency IGBT chip.

[0023] Figure 6 This is a schematic diagram of the groove structure in an improved high-efficiency IGBT chip.

[0024] In the diagram: 1. Protective housing; 2. IGBT chip mounting plate; 3. Card slot guide rail; 4. Card block; 5. Slide groove; 6. Slider; 7. Telescopic spring; 8. Intelligent control module; 9. Extrusion groove; 10. Through groove; 11. Pressure plate; 12. Pressure block; 13. Extrusion spring; 14. Front sealing plate; 15. Rear sealing plate; 16. Input interface; 17. Output interface; 18. Temperature sensor; 19. Air duct; 20. Cooling fan; 21. Fixed support leg; 22. Front cavity opening; 23. Heat dissipation fins; 24. Rear cavity opening. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model. Example

[0026] Reference Figures 1-6This embodiment provides an improved high-efficiency IGBT chip, including a protective shell 1, an intelligent control module 8, a heat dissipation component, and a quick-release IGBT chip mounting plate 2. The protective shell 1 has an internal mounting cavity for accommodating the IGBT chip mounting plate 2. The front and rear ends of the protective shell 1 are respectively provided with a front cavity opening 22 and a rear cavity opening 24. A slot guide rail 3 is provided at the bottom of the protective shell 1. The slot guide rail 3 is dovetail-shaped. The bottom of the IGBT chip mounting plate 2 is fixedly connected to a matching locking block 4 at the position corresponding to the slot guide rail 3. The locking block 4 is dovetail-shaped and integrally formed with the mounting plate.

[0027] Furthermore, the left and right sides of the protective shell 1 are provided with extrusion grooves 9 near the front end, and the bottom of the extrusion grooves 9 is provided with through grooves 10 that extend to the mounting cavity.

[0028] Furthermore, a pressure plate 11 is slidably connected inside the extrusion groove 9, and a pressure block 12 is fixedly connected to the bottom of the pressure plate 11. Compression springs 13 are fixedly connected to the bottom of the pressure plate 11 near both sides, and the ends of the compression springs 13 are fixedly connected to the bottom of the extrusion groove 9.

[0029] Furthermore, the front sealing plate 14 and the rear sealing plate 15 are fixedly connected to the front and rear ends of the IGBT chip mounting plate 2, respectively. The front sealing plate 14 and the rear sealing plate 15 are respectively provided with an input interface 16 and an output interface 17.

[0030] Furthermore, on both sides of the front sealing plate 14, a sliding groove 5 is provided at the position corresponding to the through groove 10. A slider 6 is slidably connected in the sliding groove 5. Two telescopic springs 7 are fixedly connected to the bottom of the slider 6. The ends of the telescopic springs 7 are fixedly connected to the bottom of the sliding groove 5. The front end of the slider 6 extends to the outside of the sliding groove 5 and is provided with an inclined surface.

[0031] Install the IGBT chip onto the IGBT chip mounting plate 2, solder the circuitry, and ensure a secure connection between the chip and the input interface 16 and output interface 17 on the mounting plate. Holding the IGBT chip mounting plate 2, align the dovetail-shaped locking block 4 at the bottom with the slot guide rail 3 at the bottom of the protective housing 1, and slowly insert it into the mounting cavity. During insertion, the locking block 4 slides along the slot guide rail 3 to ensure the mounting plate enters smoothly. When the mounting plate is almost fully inserted, the inclined surfaces of the sliders 6 on both sides of the front sealing plate 14 of the mounting plate will be squeezed, thereby pushing the sliders... Block 6 is squeezed into the slide groove 5. As the mounting plate continues to advance, when the mounting plate is fully inserted, the slider 6 is reset under the elastic force of the telescopic spring 7, and part of the slider 6 will be stuck into the through groove 10. When it is necessary to disassemble the IGBT chip mounting plate 2, first press the pressure plate 11 in the squeezing grooves 9 on both sides of the protective shell 1 to overcome the elastic force of the squeezing spring 13, so that the pressure block 12 at the bottom of the pressure plate 11 pushes the slider 6 into the slide groove 5 through the through groove 10, thereby releasing the lock on the mounting plate, and the IGBT chip mounting plate 2 can be pulled out to complete the disassembly. Example

[0032] Reference Figures 1-6 The protective shell 1 is provided with heat dissipation fins 23 on the top and a wind duct 19 is fixedly connected to the bottom of the protective shell 1. A cooling fan 20 is fixedly installed in the wind duct 19 and the cooling fan 20 is connected to the mounting cavity through the wind duct 19.

[0033] Furthermore, an intelligent control module 8 is fixedly installed on one side surface of the protective shell 1. The intelligent control module 8 includes a microprocessor, a memory, and a communication interface. The cooling fan 20 is electrically connected to the intelligent control module 8.

[0034] Furthermore, a temperature sensor 18 is provided on the IGBT chip mounting plate 2, and the temperature sensor 18 is electrically connected to the intelligent control module 8. A fixed support leg 21 is fixedly connected to the bottom of the protective shell 1. There are two fixed support legs 21, which are located at the bottom of the protective shell 1 near the front and rear ends, respectively.

[0035] The microprocessor is responsible for receiving and processing signals from the temperature sensor 18, external control system, etc.; the memory stores preset operating parameters, control strategies, etc.; the communication interface realizes data interaction with external devices, which facilitates remote monitoring and control.

[0036] When the power is turned on, the intelligent control module 8 starts and performs initialization detection on the IGBT chip. At the same time, the temperature sensor 18 starts to monitor the chip temperature in real time. According to the instructions of the external device or the preset working mode, the IGBT chip starts to work normally, and the parameters such as current and voltage run stably. The intelligent control module 8 continuously receives data from the temperature sensor 18. When the chip temperature is detected to rise to the preset start-up threshold, the cooling fan 20 is automatically started to accelerate the air circulation between the air duct 19 and the mounting cavity. The heat dissipation fins 23 work together to dissipate the heat generated by the chip.

[0037] If external devices need to remotely monitor or adjust the chip, they can interact with the chip through the communication interface of the intelligent control module 8, and the microprocessor will adjust the chip's operating parameters accordingly based on the received instructions.

[0038] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0039] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. An improved high-efficiency IGBT chip, characterized in that, The device includes a protective housing (1), an intelligent control module (8), a heat dissipation component, and a quick-release IGBT chip mounting plate (2). The protective housing (1) has an internal mounting cavity. The front and rear ends of the protective housing (1) are respectively provided with a front cavity opening (22) and a rear cavity opening (24). The bottom of the protective housing (1) is provided with a card slot guide rail (3). The card slot guide rail (3) is dovetail-shaped. The bottom of the IGBT chip mounting plate (2) is fixedly connected with a matching card block (4) corresponding to the position of the card slot guide rail (3). The card block (4) is dovetail-shaped and integrally formed with the mounting plate.

2. The improved high-efficiency IGBT chip according to claim 1, characterized in that, The protective shell (1) has extrusion grooves (9) on both sides near the front end, and the bottom of the extrusion grooves (9) has a through groove (10) that extends to the mounting cavity.

3. An improved high-efficiency IGBT chip according to claim 2, characterized in that, A pressure plate (11) is slidably connected inside the extrusion groove (9). A pressure block (12) is fixedly connected to the bottom of the pressure plate (11). Extrusion springs (13) are fixedly connected to the bottom of the pressure plate (11) near both sides. The ends of the extrusion springs (13) are fixedly connected to the bottom of the extrusion groove (9).

4. An improved high-efficiency IGBT chip according to claim 1, characterized in that, The front and rear ends of the IGBT chip mounting plate (2) are fixedly connected to a front sealing plate (14) and a rear sealing plate (15), respectively. The front sealing plate (14) and the rear sealing plate (15) are respectively provided with an input interface (16) and an output interface (17).

5. An improved high-efficiency IGBT chip according to claim 4, characterized in that, The front sealing plate (14) has a sliding groove (5) on both sides of the end face corresponding to the through groove (10). A slider (6) is slidably connected in the sliding groove (5). Two telescopic springs (7) are fixedly connected to the bottom of the slider (6). The ends of the telescopic springs (7) are fixedly connected to the bottom of the sliding groove (5). The front end of the slider (6) extends to the outside of the sliding groove (5) and has an inclined surface.

6. An improved high-efficiency IGBT chip according to claim 1, characterized in that, The protective shell (1) has heat dissipation fins (23) on the top and a duct (19) fixedly connected to the bottom of the protective shell (1). A cooling fan (20) is fixedly installed in the duct (19) and the cooling fan (20) is connected to the mounting cavity through the duct (19).

7. An improved high-efficiency IGBT chip according to claim 6, characterized in that, The protective shell (1) has an intelligent control module (8) fixedly installed on one side surface. The intelligent control module (8) includes a microprocessor, a memory and a communication interface. The cooling fan (20) is electrically connected to the intelligent control module (8).

8. An improved high-efficiency IGBT chip according to claim 7, characterized in that, The IGBT chip mounting plate (2) is provided with a temperature sensor (18), which is electrically connected to the intelligent control module (8). The bottom of the protective shell (1) is fixedly connected with two fixed legs (21), which are located at the bottom of the protective shell (1) near the front and rear ends respectively.

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