Wafer thinning and polishing mechanism

Abstract

The utility model discloses a wafer thinning and polishing mechanism, which relates to the technical field of wafer processing and has the technical key points that the wafer thinning and polishing mechanism comprises a wafer polishing machine, the polishing machine comprises a working table, a water spraying assembly is arranged on the working table, a plurality of collecting holes are formed in the working table, a collecting box is arranged below the working table, and a filter screen is arranged in the collecting box. The collecting box is provided with a material pushing assembly above the filter screen, and the collecting box is connected with a drainage pipe below the filter screen; the utility model has the function of recycling, and reduces the possibility of blockage of the filter screen.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, and in particular to a wafer thinning and polishing mechanism. Background Technology

[0002] Semiconductor wafers are the basic materials for manufacturing semiconductor devices. They are usually thin wafers made of silicon or other semiconductor materials. Wafers undergo a series of processing steps, such as doping, photolithography, and etching, to form the desired semiconductor devices, such as transistors, diodes, and integrated circuits. In the semiconductor processing industry, wafers are usually thinned and polished during the wafer fabrication process. The thinning process can reduce the wafer to a certain thickness, while the polishing process can remove the damaged layer on the surface of the thinned wafer and improve the wafer yield.

[0003] A utility model patent for a wafer thinning and polishing mechanism (CN202421303968.7) points out that the existing technology cannot collect and reuse wafer debris after polishing. However, this utility model does not have an anti-clogging design for the filter screen. After long-term use, the filter screen is easily clogged, which affects recycling. Summary of the Invention

[0004] In order to solve the above-mentioned technical problems, the purpose of this utility model is to provide a wafer thinning and polishing mechanism that has the function of recycling and reduces the possibility of filter clogging.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] A wafer thinning and polishing mechanism includes a wafer polishing machine. The polishing machine includes a worktable, a water spraying component is provided on the worktable, a plurality of collection holes are provided on the worktable, a collection box is provided below the worktable, a filter screen is provided inside the collection box, a pusher component is provided above the filter screen in the collection box, and a drain pipe is connected to the collection box below the filter screen.

[0007] Preferably, the collection box has a discharge port on the side above the filter screen away from the feeding assembly, and a sealing plate for closing the discharge port is connected above the discharge port.

[0008] Preferably, a discharge slide is provided on the side of the discharge port away from the collection box, and the height of the discharge slide decreases as it is further away from the collection box.

[0009] Preferably, the water spray assembly includes a water inlet pipe connected to an external water supply device, a water pump is installed on the water inlet pipe, and a high-pressure nozzle is connected to the water inlet pipe for spraying water toward the workbench.

[0010] Preferably, the drain pipe is connected to the inlet pipe.

[0011] Preferably, the feeding assembly includes a feeding electric cylinder, the fixed part of the feeding electric cylinder is fixedly connected to the collection box, and the movable part of the feeding electric cylinder is provided with a feeding plate, the lower side of the feeding plate slidingly adhering to the upper surface of the filter screen.

[0012] This utility model has the following beneficial effects:

[0013] Collection box and filter design: Multiple collection holes on the worktable allow waste generated during polishing (such as polishing fluid, debris, etc.) to fall into the collection box below. A filter inside the collection box separates liquids (such as polishing fluid) from solid waste (such as debris). The filter is designed so that liquids can flow through the filter into the drain pipe, while solid waste remains above the filter.

[0014] Drain connection: The drain pipe is connected to the inlet pipe (if the design allows for recycling) to reintroduce the filtered polishing slurry into the polishing process, enabling resource recovery. Even without a direct connection to the inlet pipe, the drain pipe can discharge the polishing slurry into a designated recovery container for subsequent processing.

[0015] Function of the feeding assembly: The feeding assembly includes a feeding electric cylinder and a feeding plate. The lower side of the feeding plate slides and fits against the upper surface of the filter screen.

[0016] The pusher cylinder can periodically push the pusher plate to push the solid waste accumulated on the filter screen to one side (usually the side away from the pusher assembly), thereby preventing the filter screen from being completely blocked.

[0017] Design of the discharge port and sealing plate: The collection box has a discharge port on the side above the filter screen away from the pusher assembly, for discharging solid waste pushed to one side by the pusher plate. Above the discharge port is a sealing plate for closing the discharge port, which can keep it closed when waste discharge is not required to prevent liquid loss.

[0018] The auxiliary function of the discharge slide: A discharge slide is installed on the side of the discharge port away from the collection box. The design of the slide allows the waste to slide smoothly to the outside of the collection box, further reducing the risk of filter clogging. The height of the discharge slide gradually decreases, which helps the waste to slide smoothly under the action of gravity.

[0019] Through the above design, this wafer thinning and polishing mechanism not only achieves effective collection and separation of waste generated during the polishing process, but also significantly reduces the possibility of filter clogging through the synergistic effect of components such as the pusher assembly, discharge port, sealing plate, and discharge slide. Simultaneously, the drainage pipe connection design enables the recycling of polishing slurry, improving resource utilization efficiency. Therefore, this technical solution demonstrates significant beneficial effects in both recycling and reducing filter clogging. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a cross-sectional view of an embodiment of the present utility model.

[0022] In the diagram: 1. Wafer polishing machine; 101. Worktable; 102. Collection hole; 2. Collection box; 201. Filter screen; 202. Drain pipe; 203. Feed port; 204. Sealing plate; 205. Feed slide; 301. Water inlet pipe; 302. Water pump; 303. High-pressure nozzle; 401. Pusher cylinder; 402. Pusher plate. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0024] A wafer thinning and polishing mechanism, such as Figure 1 As shown, the device includes a wafer polishing machine. The polishing machine includes a worktable, a water spraying assembly on the worktable, multiple collection holes on the worktable, a collection box below the worktable, a filter screen inside the collection box, a material pushing assembly above the filter screen in the collection box, and a drain pipe connected to the collection box below the filter screen.

[0025] The wafer is placed on the polishing machine's worktable. After positioning, the wafer polisher performs thinning polishing on the wafer. The water spray assembly is activated, spraying water onto the worktable through high-pressure nozzles. The water spray may contain abrasive particles or other polishing media to thin and polish the wafer. Waste generated during polishing (such as polishing slurry and debris) falls into a collection box below through multiple collection holes on the worktable. A filter screen inside the collection box separates liquid waste (such as polishing slurry) from solid waste (such as debris). Liquid waste flows through the filter screen into a drain pipe at the bottom of the collection box, where it can be discharged into a designated recycling container or directly connected to the water inlet pipe (if the design allows) to achieve the recycling of polishing slurry. Solid waste remains above the filter screen and gradually accumulates as the polishing process continues. When the accumulated solid waste on the filter screen reaches a certain amount, the pusher assembly is activated. The pusher assembly (such as a pusher cylinder and pusher plate) pushes the accumulated solid waste on the filter screen to one side (usually the side away from the pusher assembly). This helps prevent the filter from becoming completely clogged, while ensuring the polishing process continues.

[0026] like Figure 1 As shown, a sealing plate is connected above the discharge port to close it. The sealing plate remains closed when waste discharge is not required, preventing liquid waste (such as grinding fluid) from flowing out of the discharge port and ensuring that liquid waste in the collection tank can smoothly pass through the filter screen into the drain pipe. When the solid waste accumulated on the filter screen reaches a certain amount and the pushing component pushes it to one side, the sealing plate can be opened to allow the solid waste to be discharged from the discharge port.

[0027] like Figure 1 As shown, a discharge slide is located on the side of the discharge port away from the collection box. The slide's design facilitates the smooth sliding of solid waste to the outside of the collection box. The height of the discharge slide gradually decreases to utilize gravity, allowing the waste to slide down more smoothly. As the waste slides from a higher to a lower point on the slide, its speed gradually increases, making it easier to discharge to the outside of the collection box. This design not only improves the efficiency of waste discharge but also reduces the possibility of waste accumulating on the slide, further reducing the risk of filter clogging.

[0028] like Figure 1 As shown, the water spray assembly is connected to an external water supply device through an inlet pipe to ensure a stable water supply.

[0029] A water pump is installed on the inlet pipe. The function of the water pump is to pressurize the water entering the water spray assembly so that it can reach a high pressure state.

[0030] Pressurized water flows into the high-pressure nozzle through the inlet pipe. The high-pressure nozzle is designed to spray water at high speed and pressure toward the worktable. The water spray may also contain abrasive particles or other polishing media to thin and polish the wafer placed on the worktable.

[0031] like Figure 1 As shown, the drain pipe is connected to the inlet pipe, which means that there is a circulation system. The drain pipe and the inlet pipe form a circulation system, so the liquid waste (such as grinding fluid) filtered by the filter screen can be reintroduced into the water spray assembly to realize the recycling of resources.

[0032] like Figure 1 As shown, the feeding assembly includes a feeding electric cylinder, the fixed part of which is fixedly connected to the collection box to ensure stable operation of the feeding assembly. The movable part of the feeding electric cylinder is equipped with a feeding plate, the lower side of which slides against the upper surface of the filter screen. When the accumulated solid waste on the filter screen reaches a certain amount, the feeding electric cylinder is activated, pushing the feeding plate to slide on the filter screen and pushing the waste to one side. The regular operation of the feeding assembly helps prevent the filter screen from being completely clogged by solid waste, ensuring that the waste generated during polishing can continuously pass through the filter screen into the drain pipe (or collection container). This not only ensures the smooth progress of the polishing process but also extends the service life of the filter screen.

[0033] The above are merely specific embodiments of this utility model, but the technical features of this utility model are not limited thereto. Any simple changes, equivalent substitutions, or modifications made based on this utility model to solve essentially the same technical problems and achieve essentially the same technical effects are all covered within the protection scope of this utility model.

Claims

1. A wafer thinning and polishing mechanism comprising a wafer polishing machine, the polishing machine comprising a worktable, characterized in that: The workbench is provided with a water spraying assembly, a plurality of collecting holes are formed in the workbench, a collecting box is arranged below the workbench, a filter screen is arranged in the collecting box, a pushing assembly is arranged above the filter screen in the collecting box, and a drain pipe is connected below the filter screen in the collecting box.

2. The wafer thinning and polishing mechanism according to claim 1, wherein: A discharging port is formed on one side of the collecting box above the filter screen and away from the pushing assembly, and a closing plate for closing the discharging port is arranged above the discharging port.

3. The wafer thinning and polishing mechanism according to claim 2, wherein: A discharging chute is arranged on one side of the discharging port away from the collecting box, and the farther the discharging chute is from the collecting box, the lower the height of the discharging chute.

4. The wafer thinning and polishing mechanism according to claim 3, wherein: The water spraying assembly comprises a water inlet pipe connected with an external water supply device, a water pump is arranged on the water inlet pipe, and a high-pressure nozzle is connected to the water inlet pipe, which is used for spraying water towards the workbench.

5. The wafer thinning and polishing mechanism according to claim 4, wherein: The drain pipe is in communication with the water inlet pipe.

6. The wafer thinning and polishing mechanism according to claim 5, wherein: The pushing assembly comprises a pushing electric cylinder, a fixed part of the pushing electric cylinder is fixedly connected with the collecting box, a movable part of the pushing electric cylinder is provided with a pushing plate, and the lower side of the pushing plate is in sliding fit with the upper surface of the filter screen.

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