Special vacuumizing mechanism for sensitive sensor chip

Abstract

The utility model discloses a special vacuumizing mechanism for a sensitive sensor chip, and relates to the technical field of sensor production. The special vacuumizing mechanism for the sensitive sensor chip comprises a box body and further comprises a top cover and an upper port rotationally installed on the box body, a vacuum pump is fixedly installed in the box body, a partition plate is fixedly connected to the inner wall of the upper end of the box body, and a lower pressing strip and an upper pressing strip are installed on the upper end face of the partition plate and the lower end face of the top cover respectively; the supporting plate is arranged in the upper end opening of the box body; an adjusting part for driving the supporting plate to lift up and down is arranged on the partition plate; the two sides of the bag opening of the film can be sealed by more symmetrical hot melting, so that the vacuumized film is easier to flatten, and the operation is more convenient and accurate.

Description

Technical Field

[0001] This utility model belongs to the field of sensor manufacturing technology, specifically, it relates to a vacuum pumping mechanism for sensitive sensor chips. Background Technology

[0002] Sensor chips are miniature integrated circuits that convert physical, chemical, or biological signals into electrical signals, and are widely used in environmental monitoring, industrial control, medical diagnostics, and other fields. For example, nitrogen oxide sensors (NOx sensors) are mainly used for vehicle exhaust detection and industrial emission monitoring. By measuring the concentration of nitrogen oxides (NO and NO2) in exhaust gases, they help optimize combustion efficiency and meet environmental standards. Their core typically uses zirconium oxide (ZrO2) or metal oxide semiconductor materials, detecting gas composition through electrochemical reactions or changes in resistance, and feeding the data back to the control system for real-time pollution control.

[0003] In the production of sensor chips, vacuum packaging equipment is needed to seal plate-shaped raw materials in plastic film. Since the thickness of various raw materials is not necessarily the same, it is often necessary to use pads of different thicknesses inside the packaging equipment to keep the opening of the plastic film bag and the sealing strip basically parallel, so as to prevent the plastic film from having obvious wrinkles and curling edges after vacuum packaging. However, constantly changing the pads is not convenient and the height is difficult to control. Utility Model Content

[0004] The technical problem to be solved by this utility model is to overcome the shortcomings of the prior art and provide a vacuum pumping mechanism for sensitive sensor chips that can overcome or at least partially solve the above problems.

[0005] To solve the above-mentioned technical problems, the basic concept of the technical solution adopted by this utility model is as follows:

[0006] A vacuum pumping mechanism for sensitive sensor chips includes a housing and a top cover rotatably mounted on the upper port of the housing. A vacuum pump is fixedly installed inside the housing. A partition is fixedly connected to the upper inner wall of the housing. A lower pressure strip and an upper pressure strip are respectively installed on the upper surface of the partition and the lower surface of the top cover. A support plate is disposed inside the upper port of the housing, and the partition is provided with an adjustment part for driving the support plate to move up and down.

[0007] Preferably, the adjustment part includes a mounting groove disposed on the top of the partition plate, a base plate is longitudinally slidably mounted in the mounting groove, the support plate is connected to the base plate, a stud is rotatably connected in the mounting groove, and the base plate is threadedly connected to the outer wall of the stud.

[0008] Furthermore, a drive motor is fixedly installed at the lower end of the partition, and transmission gears are fixedly installed on both the output shaft of the drive motor and the lower end of the stud, with the two transmission gears meshing together.

[0009] Furthermore, multiple vertical plates are fixedly connected to the top of the substrate, and the top of the support plate is provided with a slot, which is fitted onto the outer wall of the vertical plate. A spring is installed between the support plate and the top surface of the substrate.

[0010] Furthermore, magnets are fixedly connected to the side walls of the vertical plate, and metal strips with magnets aligned vertically are fixedly connected to the bottom of the tray.

[0011] Furthermore, a limiting plate is fixedly connected to the top of the vertical plate, and a storage groove aligned with the limiting plate is provided on the top of the tray.

[0012] Preferably, the tray has evenly distributed holes.

[0013] Preferably, a sealing ring is fixedly installed around the lower end of the top cover.

[0014] By adopting the above technical solution, the present invention has the following beneficial effects compared with the prior art:

[0015] 1. This utility model uses a stud to drive the substrate to slide towards the bottom of the mounting groove. The substrate then moves the support plate downwards, reducing the encapsulation height of the plastic film containing the sensor chip material. This allows for more symmetrical heat melting on both sides of the film's opening, making the film easier to flatten after vacuuming. Furthermore, the operation is more convenient and precise.

[0016] 2. By pressing down on the tray, the tray slides down along the outer wall of the vertical plate, so the raw material is supported on multiple vertical plates. At this time, the tray is less likely to block the bottom plate of the raw material, making it easier to pick up thinner chip raw materials and reducing the occurrence of picking up raw materials with fingers.

[0017] 3. With this invention, after pressing the tray downwards, the metal strip at the lower end of the tray will be attracted to the magnet, so the tray can be positioned in the downward-pressed state, making it more labor-saving and convenient to use.

[0018] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings. Attached Figure Description

[0019] In the attached diagram:

[0020] Figure 1 This is a first-view isometric structural diagram of the vacuum pumping mechanism for the sensitive sensor chip proposed in this utility model.

[0021] Figure 2This is a second-view isometric structural diagram of the vacuum pumping mechanism for the sensitive sensor chip proposed in this utility model.

[0022] Figure 3 This is a cross-sectional schematic diagram of the vacuum pumping mechanism for the sensitive sensor chip proposed in this utility model;

[0023] Figure 4 A partial burst image of the vacuum pumping mechanism for the sensitive sensor chip proposed in this utility model;

[0024] Figure 5 This is a schematic diagram of the tray structure of the vacuum pumping mechanism for the sensitive sensor chip proposed in this utility model.

[0025] In the diagram: 1. Box body; 2. Top cover; 3. Partition; 4. Vacuum pump; 5. Lower pressure strip; 6. Upper pressure strip; 7. Support plate; 8. Hole; 9. Mounting slot; 10. Stud; 11. Base plate; 12. Drive motor; 13. Transmission gear; 14. Vertical plate; 15. Slot; 16. Spring; 17. Magnet; 18. Metal strip; 19. Storage slot; 20. Limiting plate. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions in the embodiments will be clearly and completely described below with reference to the accompanying drawings. The following embodiments are used to illustrate this utility model, but are not intended to limit the scope of this utility model.

[0027] Example: Refer to Figures 1-5 A vacuum pump mechanism for sensitive sensor chips includes a housing 1 and a substantially transparent top cover 2, rotatably mounted on the upper port of the housing 1. A sealing ring for improving sealing performance is fixedly installed around the lower end of the top cover 2. A vacuum pump 4 for vacuuming is fixedly installed inside the housing 1. A partition 3 is fixedly connected to the upper inner wall of the housing 1. A lower pressure strip 5 and an upper pressure strip 6 are respectively installed on the upper surface of the partition 3 and the lower surface of the top cover 2. The lower pressure strip 5 and the upper pressure strip 6 are used to press the port of the film and to heat-melt the plastic film to complete the sealing work. A support plate 7 is set inside the upper port of the housing 1. The support plate 7 has evenly distributed holes 8. The partition 3 has an adjustment part for driving the support plate 7 to move up and down. The adjustment part includes a mounting groove 9 on the top of the partition 3. A substrate 11 is longitudinally slidably mounted in the mounting groove 9. The support plate 7 is connected to the substrate 11. A stud 10 is rotatably connected in the mounting groove 9. The substrate 11 and the outer wall of the stud 10 are threadedly connected.

[0028] In use, place the plastic film containing the sensor chip material inside the housing 1, and position the opening of the film bag on the lower pressure strip 5. Then close the top cover 2, and position the upper pressure strip 6 below the top cover 2 on the lower pressure strip 5. Next, use the vacuum pump 4 to evacuate the housing 1 into a vacuum. Then, heat-seal the ends of the film between the lower pressure strip 5 and the upper pressure strip 6 to complete the vacuuming of the sensor chip material. Before use, the plastic film containing the sensor chip material can be placed on the tray 7. When the material is thick, rotate the stud 10. The stud 10 will drive the substrate 11 to slide towards the bottom of the mounting groove 9. The substrate 11 will drive the tray 7 to move downward, which will reduce the packaging height of the plastic film containing the sensor chip material. This allows for more symmetrical heat fusion on both sides of the film bag opening, making the vacuumed film easier to flatten. Conversely, when the material is thin, simply reverse the stud 10. The operation is simple, convenient, and precise.

[0029] A drive motor 12 is fixedly installed at the lower end of the aforementioned partition 3. A transmission gear 13 is fixedly installed on both the output shaft of the drive motor 12 and the lower end of the stud 10. The two transmission gears 13 are meshed and connected.

[0030] Specifically, when it is necessary to adjust the height of the tray 7, the drive motor 12 is started. The drive motor 12 will drive the stud 10 to rotate through two meshing transmission gears 13. The stud 10 will drive the base plate 11 to slide towards the bottom of the mounting groove 9. The base plate 11 will drive the tray 7 to move downward. Conversely, by reversing the drive motor 12, the tray 7 can be moved upward.

[0031] The top of the substrate 11 is fixedly connected to multiple vertical plates 14, which are equally spaced. The top of the support plate 7 is provided with a slot 15, which is fitted onto the outer wall of the vertical plate 14. A spring 16 is installed between the support plate 7 and the top surface of the substrate 11. A magnet 17 is fixedly connected to the side wall of the vertical plate 14. A metal strip 18 aligned vertically with the magnet 17 is fixedly connected to the bottom of the support plate 7. The metal strip 18 can be attracted by the magnet 17.

[0032] When it is necessary to remove the vacuum-sealed raw material, press down on the tray 7. The tray 7 will slide down along the outer wall of the vertical plate 14, so the raw material will be supported on multiple vertical plates 14. At this time, the tray 7 will not easily block the bottom plate of the raw material, making it easier to pick up the thinner chip raw material and reducing the occurrence of picking up the raw material with fingers. After the raw material is removed, release the tray 7. The spring 16 will drive the tray 7 to move upward and reset, so that the next set of raw materials can be placed on the tray 7, so that the flat tray 7 can support the raw material more evenly.

[0033] After pressing down on the tray 7, the metal strip 18 at the lower end of the tray 7 will be attracted to the magnet 17, so the tray 7 can be positioned in the downward pressing state, making it easier and more convenient to use. When the tray 7 needs to be reset upward, simply lift the tray 7 upward.

[0034] The top of the vertical plate 14 is fixedly connected to a limiting plate 20. The top of the support plate 7 is provided with a storage groove 19 aligned with the limiting plate 20. After the support plate 7 is reset upward, the limiting plate 20 can limit the extreme position of the support plate 7 moving upward. The storage groove 19 can store the limiting plate 20, thereby making the upper surface of the support plate 7 flatter.

[0035] In use, the vacuuming mechanism for this sensitive sensor chip involves placing a plastic film containing the sensor chip material inside the housing 1, with the opening of the film bag positioned on the lower pressure strip 5. Then, the top cover 2 is closed, and the upper pressure strip 6 below the top cover 2 is positioned on the lower pressure strip 5. The housing 1 is then evacuated using a vacuum pump 4. Finally, the ports of the film are heat-fused between the lower pressure strip 5 and the upper pressure strip 6, thus completing the vacuuming process for the sensor chip material.

[0036] Before use, the plastic film containing the sensor chip material can be placed on the tray 7. When the material is thick, the drive motor 12 is started. The drive motor 12 will drive the stud 10 to rotate through two meshing transmission gears 13. The stud 10 will drive the substrate 11 to slide towards the bottom of the mounting groove 9. The substrate 11 will drive the tray 7 to move downward, which will reduce the packaging height of the plastic film containing the sensor chip material. This allows the two sides of the film bag opening to be heated more symmetrically, making the film easier to flatten after vacuuming. Conversely, when the material is thin, the drive motor 12 can be reversed. The operation is simple and convenient.

[0037] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some modifications or alterations to the above-described technical content to create equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the scope of the present utility model shall still fall within the scope of the present utility model.

Claims

1. A dedicated evacuation mechanism for a sensitive sensor chip, comprising a housing (1), characterized in that Also include: The top cover (2), rotating installation in the upper end of the box (1), Wherein, the box (1) is fixedly installed with a vacuum pump (4), the upper end wall of the box (1) is fixedly connected with a partition (3), the upper end face of the partition (3) and the lower end face of the top cover (2) are respectively installed with a lower pressing strip (5) and an upper pressing strip (6); The supporting plate (7) arranged in the upper end of the box (1), the partition (3) is provided with an adjusting part for driving the supporting plate (7) to rise and fall.

2. The dedicated evacuation mechanism for a sensitive sensor chip according to claim 1, characterized in that The adjusting part includes a mounting groove (9) arranged at the top of the partition (3), a base plate (11) is slidably arranged in the mounting groove (9), the supporting plate (7) is connected to the base plate (11), a stud (10) is rotatably connected in the mounting groove (9), and the base plate (11) is threadedly connected with the outer wall of the stud (10).

3. The dedicated evacuation mechanism for a sensitive sensor chip according to claim 2, characterized in that The lower end of the partition (3) is fixedly installed with a driving motor (12), the output shaft of the driving motor (12) and the lower end of the stud (10) are fixedly installed with a transmission gear (13), and the two transmission gears (13) are meshedly connected.

4. The dedicated evacuation mechanism for a sensitive sensor chip according to claim 2, characterized in that The top of the base plate (11) is fixedly connected with a plurality of vertical plates (14), the top of the supporting plate (7) is provided with a slot (15), the slot (15) is sleeved on the outer wall of the vertical plate (14), and the spring (16) is arranged between the top surface of the supporting plate (7) and the base plate (11).

5. The dedicated evacuation mechanism for a sensitive sensor chip according to claim 4, characterized in that The side wall of the vertical plate (14) is fixedly connected with a magnet (17), and the bottom of the supporting plate (7) is fixedly connected with a metal strip (18) aligned with the magnet (17).

6. The sensitive sensor chip dedicated evacuation mechanism according to claim 4, characterized in that The top of the vertical plate (14) is fixedly connected with a limiting plate (20), and the top of the supporting plate (7) is provided with a receiving groove (19) aligned with the limiting plate (20).

7. The dedicated evacuation mechanism for a sensitive sensor chip according to claim 1, characterized in that The supporting plate (7) is provided with uniformly distributed holes (8).

8. The dedicated evacuation mechanism for a sensitive sensor chip according to claim 1, characterized in that The lower end of the top cover (2) is fixedly installed with a sealing ring.

Images