PCB (printed circuit board) with 50-micron small blind holes

Abstract

The utility model discloses a printed circuit board (PCB) with small blind holes of 50 microns. The PCB comprises a board body, a plurality of small blind holes with the diameter of 50 microns are formed in the plate body; the plate body comprises a cover plate layer I, a prepreg layer I, a core plate layer, a prepreg layer II and a cover plate layer II which are arranged in sequence; a plurality of reinforcing grooves are formed in the upper end face and the lower end face of the core plate layer, and reinforcing protruding blocks matched with the reinforcing grooves are arranged on the lower end face of the first prepreg layer and the upper end face of the second prepreg layer respectively. The plate body is further provided with a heat dissipation assembly used for improving the heat dissipation performance. According to the utility model, a dielectric layer formed by heating the reinforcing grooves on the upper and lower end faces of the core plate layer and the reinforcing bumps on the prepreg layer I and the prepreg layer II is more stable and thinner, and the thickness is not uneven; and meanwhile, by arranging the heat dissipation assembly, the heat dissipation effect on the plate body can be improved.

Description

Technical Field

[0001] This utility model relates to the field of PCB board technology, specifically to a PCB board with 50µm small blind holes. Background Technology

[0002] Multilayer PCBs are key components in electronic devices. They enable electronic devices to function properly by providing mechanical support and electrical connections for electronic components.

[0003] However, during the manufacturing process of multilayer PCBs, uneven thickness of the upper and lower surfaces of the core board often occurs, resulting in poor control of the characteristic impedance of the entire PCB board. Furthermore, PCBs generate a lot of heat during use, and if this heat is not dissipated in time, it can affect the normal use of the PCB board. Utility Model Content

[0004] The problem to be solved by this utility model is to provide a PCB board with 50um small blind holes. The dielectric layer formed by the reinforcing grooves on the upper and lower end faces of the core board layer and the reinforcing protrusions on the semi-cured sheet layer one and the semi-cured sheet layer two after being heated is more stable and thinner, and there will be no uneven thickness. At the same time, by setting heat dissipation components, the heat dissipation effect of the board can be improved.

[0005] The technical solution provided by this utility model to solve the above problems is: a PCB board with 50um small blind holes, including a board body; the board body is provided with a plurality of small blind holes with a diameter of 50um;

[0006] The plate body includes a cover plate layer one, a semi-cured sheet layer one, a core plate layer, a semi-cured sheet layer two, and a cover plate layer two arranged in sequence;

[0007] The core board layer has several reinforcing grooves on its upper and lower end faces, and the lower end face of the first semi-cured sheet layer and the upper end face of the second semi-cured sheet layer are respectively provided with reinforcing protrusions that cooperate with the reinforcing grooves.

[0008] The plate is also equipped with heat dissipation components to improve heat dissipation performance.

[0009] Preferably, the plate further includes a first anti-corrosion rubber cover layer and a second anti-corrosion rubber cover layer, wherein the first anti-corrosion rubber cover layer and the second anti-corrosion rubber cover layer are respectively disposed on the upper end surface of the first cover layer and the lower end surface of the second cover layer.

[0010] Preferably, the reinforcing groove is a hexagonal groove, and the reinforcing protrusion is a hexagonal protrusion that matches the shape of the reinforcing groove.

[0011] Preferably, the heat dissipation assembly includes a heat pipe and several heat dissipation fins. The plate is provided with several fixing holes that cooperate with the heat pipe. The heat pipe is installed in the fixing holes, and the several heat dissipation fins are axially installed on the inner wall of the heat pipe.

[0012] Preferably, the heat pipe and the heat dissipation fins are integrally formed.

[0013] Preferably, a plurality of the heat dissipation fins are mounted in a ring array on the inner wall of the heat pipe.

[0014] Preferably, thermally conductive silicone grease is used to fill the space between the heat pipe and the fixing hole.

[0015] Compared with the prior art, the advantages of this utility model are: the medium layer formed by the reinforcing grooves on the upper and lower end faces of the core board layer and the reinforcing protrusions on the semi-cured sheet layer one and the semi-cured sheet layer two after being heated is more stable and thinner, and there will be no uneven thickness; at the same time, by setting heat dissipation components, the heat dissipation effect of the board can be improved. Attached Figure Description

[0016] The accompanying drawings, which are provided to further illustrate the present invention and constitute a part of the present invention, illustrate exemplary embodiments of the present invention and are used to explain the present invention, but do not constitute an undue limitation of the present invention.

[0017] Figure 1 This is a three-dimensional structural schematic diagram of the present invention;

[0018] Figure 2 This is a utility model Figure 1 Enlarged view of point A in the middle;

[0019] Figure 3 This is a schematic diagram of the core board layer of this utility model.

[0020] The attached diagram is labeled as follows: 1. Anti-corrosion rubber cover layer one, 2. Cover plate layer one, 3. Precursor layer one, 4. Core plate layer, 5. Reinforcing protrusion, 6. Precursor layer two, 7. Cover plate layer two, 8. Anti-corrosion rubber cover layer two, 9. Reinforcing groove, 10. Fixing hole, 11. Heat pipe, 12. Heat dissipation fins, 13. Small blind hole. Detailed Implementation

[0021] The following will describe in detail the implementation of this utility model with reference to the accompanying drawings and embodiments, so that the implementation of this utility model can be fully understood and carried out based on how technical means are used to solve technical problems and achieve technical effects.

[0022] In the description of this utility model, it should be noted that the directional terms such as "center", "horizontal", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", and "counterclockwise" are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. They should not be construed as limiting the specific protection scope of this utility model.

[0023] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. Thus, the use of "first" and "second" to define a feature may explicitly or implicitly include one or more of that feature. In this description of the utility model, "a number" means two or more, unless otherwise explicitly specified.

[0024] In this utility model, unless otherwise explicitly specified and limited, the terms "assembly," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can also refer to a mechanical connection; they can refer to a direct connection or a connection through an intermediate medium; or they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0025] It should be understood that, when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, integrals, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0026] It should also be understood that the terminology used in this specification of embodiments of the present invention is for the purpose of describing particular embodiments only and is not intended to limit the embodiments of the present invention. As used in this specification of embodiments of the present invention and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0027] As shown in the attached drawings, a PCB board with 50µm small blind holes includes a board body; the board body is provided with a plurality of small blind holes with a diameter of 50µm.

[0028] The plate body includes a cover plate layer 1 2, a semi-cured sheet layer 1 3, a core plate layer 4, a semi-cured sheet layer 2 6, and a cover plate layer 2 7 arranged sequentially.

[0029] The core board layer 4 has several reinforcing grooves 9 on its upper and lower end faces, and the lower end face of the semi-cured sheet layer 3 and the upper end face of the semi-cured sheet layer 6 are respectively provided with reinforcing protrusions 5 that cooperate with the reinforcing grooves 9.

[0030] The plate is also equipped with heat dissipation components to improve heat dissipation performance.

[0031] In the above solution, the dielectric layer formed by the reinforcing grooves on the upper and lower end faces of the core board layer and the reinforcing protrusions on the semi-cured sheet layer one and semi-cured sheet layer two after being heated is more stable, thinner, and will not have uneven thickness; at the same time, by setting heat dissipation components, the heat dissipation effect of the board can be improved.

[0032] In this embodiment, the plate further includes a first anti-corrosion rubber cover layer 1 and a second anti-corrosion rubber cover layer 8, which are respectively disposed on the upper end surface of the first cover layer 2 and the lower end surface of the second cover layer 7. The first and second anti-corrosion rubber cover layers 1 and 8 are used to shield the top and bottom of the plate, thereby preventing corrosive liquids from falling onto the plate and causing corrosion, thus further improving the corrosion resistance of the plate.

[0033] Specifically, the reinforcing groove 9 is a hexagonal groove, and the reinforcing protrusion 5 is a hexagonal protrusion that matches the shape of the reinforcing groove 9.

[0034] In another embodiment of this utility model, the heat dissipation assembly includes a heat pipe 11 and a plurality of heat dissipation fins 12. The plate body is provided with a plurality of fixing holes 10 that mate with the heat pipe 11. The heat pipe 11 is installed within the fixing holes 10, and the plurality of heat dissipation fins 12 are axially mounted on the inner wall of the heat pipe 11. Further, the heat pipe 11 and the heat dissipation fins 12 are integrally formed. The plurality of heat dissipation fins 12 are arranged in a ring array on the inner wall of the heat pipe 11. Specifically, to improve the heat conduction effect between the heat pipe and the fixing holes and reduce the installation gap between the heat pipe and the fixing holes, thermally conductive silicone grease is filled between the heat pipe 11 and the fixing holes 10.

[0035] The heat generated by the plate is collected and conducted to the heat pipe and heat dissipation fins, and then carried away by the gas flowing through the heat pipe. In this solution, the heat dissipation fins increase the heat dissipation area of ​​the heat pipe and improve the heat dissipation capacity of the heat dissipation component. On the other hand, they can also improve the bending resistance and strength of the heat pipe.

[0036] The above description only illustrates the preferred embodiment of this utility model and should not be construed as limiting the scope of the claims. This utility model is not limited to the above embodiments, and variations in its specific structure are permitted. All changes made within the scope of the independent claims of this utility model are also within the scope of protection of this utility model.

Claims

1. A PCB board with 50um small blind via, comprising a board body; characterized in that: The plate body is provided with a plurality of small blind holes (13) with a diameter of 50 um; The plate body comprises a cover plate layer one (2), a prepreg layer one (3), a core plate layer (4), a prepreg layer two (6) and a cover plate layer two (7) arranged in sequence; The core plate layer (4) is provided with a plurality of reinforcing grooves (9) on the upper and lower end faces, and the lower end face of the prepreg layer one (3) and the upper end face of the prepreg layer two (6) are respectively provided with reinforcing blocks (5) matched with the reinforcing grooves (9); The plate body is further provided with a heat dissipation assembly for improving heat dissipation performance.

2. The PCB board with 50um small blind via of claim 1, wherein: The plate body further comprises an anti-corrosion rubber cover layer one (1) and an anti-corrosion rubber cover layer two (8), and the anti-corrosion rubber cover layer one (1) and the anti-corrosion rubber cover layer two (8) are arranged on the upper end face of the cover plate layer one (2) and the lower end face of the cover plate layer two (7) respectively.

3. The PCB board with 50um small blind via of claim 1, wherein: The reinforcing grooves (9) are hexagonal grooves, and the reinforcing blocks (5) are hexagonal blocks matched with the reinforcing grooves (9).

4. The PCB board with 50um small blind via of claim 1, wherein: The heat dissipation assembly comprises a heat conducting pipe (11) and a plurality of heat dissipation fins (12), the plate body is provided with a plurality of fixing holes (10) matched with the heat conducting pipe (11), the heat conducting pipe (11) is installed in the fixing hole (10), and a plurality of heat dissipation fins (12) are axially installed on the inner wall of the heat conducting pipe (11).

5. The PCB board having a 50um small blind via according to claim 4, characterized in that: The heat conducting pipe (11) and the heat dissipation fin (12) are integrally formed.

6. The PCB board having a 50um small blind via according to claim 4, characterized in that: A plurality of heat dissipation fins (12) are annularly arranged on the inner wall of the heat conducting pipe (11).

7. The PCB board having a 50um small blind via according to claim 4, characterized in that: The heat conducting pipe (11) and the fixing hole (10) are filled with heat conducting silicone grease.

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