Liquid cooling radiator and electronic equipment comprising same

Abstract

The utility model discloses a liquid cooling radiator and an electronic device comprising the liquid cooling radiator, the liquid cooling radiator comprises at least one liquid cooling plate, at least one micropump and a vapor chamber, and the vapor chamber is connected with each liquid cooling plate, so that one side of each liquid cooling plate and one side of the vapor chamber are coplanar and respectively form a fluid channel; each micropump is provided with a water inlet and a water outlet, each fluid channel is correspondingly connected with one micropump, a first interface end of each fluid channel is communicated with the water inlet of the corresponding micropump, and a second interface end of each fluid channel is communicated with the water outlet of the corresponding micropump. A fluid channel capable of containing a liquid cooling working medium is formed through connection of a temperature uniforming plate and a liquid cooling plate, the liquid cooling working medium in the fluid channel circularly flows through driving of a micropump, and the circularly flowing liquid cooling working medium is in direct contact with the temperature uniforming plate, so that the liquid cooling working medium is not prone to falling off. Therefore, the heat conduction path of the vapor chamber-liquid cooling working medium-liquid cooling plate can fully take away heat, and efficient heat dissipation of the electronic equipment is realized.

Description

Technical Field

[0001] This utility model relates to the field of radiator technology, and in particular to a liquid-cooled radiator and an electronic device including the liquid-cooled radiator. Background Technology

[0002] Vapor chambers (VCs) achieve rapid lateral heat conduction through the phase change heat transfer principle (liquid evaporation-vapor diffusion-condensation reflux), and are widely used in heat dissipation modules of electronic devices (such as mobile phones, laptops, and mainframe servers). With the performance improvement of electronic devices (such as mobile phones, laptops, and mainframe servers) (such as high-performance computing chips, 5G modules, etc.), the heat flux density per unit area is increasing exponentially.

[0003] In traditional heat dissipation solutions, combined with... Figure 12 As shown, the vapor chamber and fins are often joined by soldering with solder paste to fill the gap between them, and the electronic equipment is cooled by forced air cooling from a fan. However, the following problems exist:

[0004] 1. The heat spreader transfers heat to the fins through solder paste, which results in a high thermal resistance at the interface between the heat spreader and the fins. This makes it difficult to meet the requirements for efficient heat dissipation, leading to limited equipment performance or even shutdown due to high temperature.

[0005] 2. The fan is quite noisy, making it difficult to balance efficient heat dissipation with user experience.

[0006] 3. Electronic devices (such as laptops and mobile phones) have compact internal spaces. With the increasing demand for thinner and lighter electronic devices, existing heat dissipation modules with vapor chambers and fins are difficult to balance thinness and efficient heat dissipation. For example, increasing the height of the fins can increase the contact area with airflow and thus remove more heat. However, if the fins are too high, the heat dissipation module will be too thick, affecting its thinness and portability.

[0007] This utility model solves at least one of the above problems. Summary of the Invention

[0008] The purpose of this utility model is to provide a liquid-cooled heat sink, which is based on a vapor chamber for liquid cooling design, in order to solve at least one of the above-mentioned problems of traditional heat dissipation solutions. The heat sink of this application directly contacts the heat conducted from the vapor chamber with the liquid cooling medium for heat exchange, thereby reducing the thermal resistance and enabling the heat conduction path of vapor chamber-liquid cooling medium-liquid cooling plate to fully remove heat, improve heat exchange efficiency, and achieve efficient heat dissipation and thinner and lighter applications for electronic devices.

[0009] The objective of this utility model is achieved through the following technical solution:

[0010] A first aspect of this utility model provides a liquid-cooled heat sink, comprising:

[0011] At least one liquid cooling plate;

[0012] A heat spreader is connected to each of the liquid cooling plates such that one side of each liquid cooling plate is coplanar with one side of the heat spreader, and each forms a fluid channel, the fluid channel having a first interface end and a second interface end that are connected.

[0013] At least one micropump, each micropump having an inlet and an outlet, and each fluid channel correspondingly connected to one micropump, wherein a first interface end of the fluid channel is connected to the inlet of the micropump, and a second interface end of the fluid channel is connected to the outlet of the micropump.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows: By connecting the heat spreader and the liquid cooling plate, one side of each liquid cooling plate is coplanar with one side of the heat spreader, forming a fluid channel that can accommodate the liquid cooling medium. Driven by a micro-pump, the liquid cooling medium in the fluid channel circulates. Since the circulating liquid cooling medium is in direct contact with the heat spreader, the heat conducted by the heat spreader can directly exchange with the liquid cooling medium, thereby reducing the thermal resistance and allowing the heat conduction path of heat spreader-liquid cooling medium-liquid cooling plate to fully remove heat, improving heat exchange efficiency and achieving efficient heat dissipation for electronic devices. At the same time, compared with a fan, the micro-pump operates with less noise, so it can effectively balance efficient heat dissipation and user experience. Compared with the height of the fins, the liquid cooling plate can be made thinner and lighter due to the liquid cooling method, achieving both thinness and efficient heat dissipation.

[0015] In some possible embodiments of the first aspect, the heat exchange plate includes two cover plates: an upper cover plate and a lower cover plate;

[0016] The upper cover plate and the lower cover plate are connected to form a cavity, which is used to contain a heat-conducting working fluid;

[0017] The cavity is provided with a capillary structure, one side of which abuts against the upper cover plate and the other side of which abuts against the lower cover plate;

[0018] At least one of the cover plates is connected to one or more of the liquid cooling plates.

[0019] In some possible embodiments of the first aspect, the liquid cooling plate has a first through groove, and the cover plate and the first through groove of the liquid cooling plate form the fluid channel.

[0020] In some possible embodiments of the first aspect, the bottom of the first channel is provided with a plurality of first protrusions located within the fluid channel.

[0021] In some possible embodiments of the first aspect, at least one of the cover plates is provided with a second through groove, and the liquid cooling plate and the second through groove of the cover plate form the fluid channel.

[0022] In some possible embodiments of the first aspect, the bottom of the second channel is provided with a plurality of second protrusions located within the fluid channel.

[0023] In some possible embodiments of the first aspect, the liquid cooling plate has a first through groove, and a second through groove of the cover plate corresponds to the first through groove of the liquid cooling plate and forms the fluid channel.

[0024] In some possible embodiments of the first aspect, the capillary structure is a copper mesh, a mesh fabric, or sintered copper powder.

[0025] In some possible implementations of the first aspect, the fluid channel is shaped like a "V" or a snake.

[0026] A second aspect of this invention provides an electronic device, which includes the liquid-cooled heat sink described above. Attached Figure Description

[0027] Figure 1 This is a three-dimensional structural diagram of the liquid cooling heat sink in the laptop usage scenario of this embodiment;

[0028] Figure 2 This is an exploded structural diagram of the liquid cooling radiator in the laptop usage scenario of this embodiment;

[0029] Figure 3 This is a three-dimensional structural diagram of the liquid cooling heat sink in the mobile phone usage scenario of this embodiment;

[0030] Figure 4 This is an exploded structural diagram of the liquid cooling radiator in the mobile phone usage scenario of this embodiment;

[0031] Figure 5 This is a three-dimensional structural diagram of the liquid cooling radiator in the host server usage scenario of this embodiment;

[0032] Figure 6 This is an exploded structural diagram of the liquid cooling radiator in the host server usage scenario of this embodiment;

[0033] Figure 7 A three-dimensional structural diagram showing the first protrusion of the first through slot of the liquid cooling plate in the laptop usage scenario of this embodiment;

[0034] Figure 8 An exploded view of the second protrusion provided in the second through slot of the cover plate in the laptop usage scenario of this embodiment;

[0035] Figure 9 A three-dimensional structural diagram showing the first protrusion in the first through slot of the liquid cooling plate and the first protrusion in the first through slot of the liquid cooling plate in the laptop usage scenario of this embodiment;

[0036] Figure 10 This is a three-dimensional structural diagram of the "V"-shaped fluid channel in the laptop usage scenario of this embodiment;

[0037] Figure 11 This is an exploded structural diagram of the "V"-shaped fluid channel in the laptop usage scenario of this embodiment;

[0038] Figure 12 This diagram illustrates how, in traditional heat dissipation solutions, the vapor chamber and fins are typically joined using solder paste.

[0039] In the figure, 1 is the liquid cooling plate; 11 is the first through groove; 110 is the first protrusion; 2 is the heat spreader; 20 is the cover plate; 21 is the capillary structure; 22 is the second through groove; and 220 is the second protrusion. Detailed Implementation

[0040] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided to make the present invention more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore repeated descriptions of them will be omitted.

[0041] In a first aspect of this embodiment, a liquid-cooled heat sink is provided, comprising at least one liquid cooling plate 1, a vapor chamber 2, and at least one micropump (not shown in the figure). The liquid-cooled heat sink of this application can be used in electronic devices, such as mobile phones, laptops, and mainframe servers, etc., and this application does not limit its use thereto. Figure 1-6 As shown, this embodiment takes laptop usage scenarios, mobile phone usage scenarios, and host server usage scenarios as examples.

[0042] The heat spreader 2 is connected to each liquid cooling plate 1 so that one side of each liquid cooling plate 1 is coplanar with one side of the heat spreader 2, forming a fluid channel. Specifically, the fluid channel has a first interface end and a second interface end that are connected. For example, the liquid cooling plate 1 is made of copper, but this application does not limit the material of the liquid cooling plate 1.

[0043] In some specific embodiments, the heat spreader 2 includes two cover plates 20: an upper cover plate and a lower cover plate.

[0044] The upper and lower cover plates are connected and fitted together to form a cavity for containing a heat-conducting working fluid. The heat-conducting working fluid is a liquid phase change material, such as liquid water, ethanol, or acetone. For example, the cover plate 20 is made of copper; however, this application does not limit the material of the cover plate 20.

[0045] A capillary structure 21 is provided inside the cavity. One side of the capillary structure 21 abuts against the upper cover plate 20, and the other side of the capillary structure 21 abuts against the lower cover plate 20. For example, the capillary structure 21 can be a copper mesh, a mesh fabric, or sintered copper powder. This application does not limit the structure and material of the capillary structure 21.

[0046] The heat is rapidly dissipated through the transformation of the heat-conducting working medium within the heat spreader 2 from liquid to gas and back to liquid, thus maximizing the heat conduction and dissipation effect of the heat spreader 2. To ensure that the transformation process of the heat-conducting working medium from liquid to gas and back to liquid is not affected by impurities, the cavity is generally in a closed vacuum state, thereby improving the heat conduction and dissipation effect of the heat spreader 2. The heat dissipation principle of the heat spreader 2 is well known to those skilled in the art and will not be elaborated here.

[0047] It should be noted that at least one cover plate 20 is connected to one or more liquid cooling plates 1 to meet different usage scenarios.

[0048] Furthermore, in a preferred embodiment of this application, the liquid cooling plate 1 has a first through groove 11, and the cover plate 20 forms a fluid channel with the first through groove 11 of the liquid cooling plate 1. The first through groove 11 not only forms a fluid channel, but also increases the contact surface area between the liquid cooling plate 1 and the liquid cooling working fluid, thereby transferring more heat through the heat conduction path of the liquid cooling working fluid-liquid cooling plate 1 and further improving the heat dissipation efficiency.

[0049] The materials of the heat spreader 2 and the liquid cooling plate 1 can be metals with good thermal conductivity, such as copper, aluminum, or stainless steel; this application does not limit the materials used. The heat spreader 2 and the liquid cooling plate 1 can be joined together by welding.

[0050] Each micropump has an inlet and an outlet, and each fluid channel is connected to a micropump. The first interface end of the fluid channel is connected to the inlet of the micropump, and the second interface end of the fluid channel is connected to the outlet of the micropump.

[0051] It should be noted that one end of the fluid channel is connected to the inlet of the micro pump through a first connecting pipe (not shown in the figure), and the other end of the fluid channel is connected to the outlet of the micro pump through a second connecting pipe (not shown in the figure).

[0052] The first and second connecting pipes can be made of materials such as nylon, PVC, PU, ​​PTEE, or PI, or stainless steel, copper, or aluminum; this application does not limit the materials used. The first and second connecting pipes are designed to fit the two ends of the fluid channel, facilitating connection with the micro-pump and ensuring a tight seal.

[0053] By connecting the heat exchange plate 2 and the liquid cooling plate 1, one side of each liquid cooling plate 1 is coplanar with one side of the heat exchange plate 2, forming a fluid channel that can accommodate the liquid cooling medium. Driven by a micro pump, the liquid cooling medium in the fluid channel circulates. Since the circulating liquid cooling medium is in direct contact with the heat exchange plate 2, the heat conducted from the heat exchange plate 2 can directly exchange with the liquid cooling medium, thereby reducing the thermal resistance and ensuring that the heat conduction path of heat exchange plate 2-liquid cooling medium-liquid cooling plate 1 can fully remove heat, improve heat exchange efficiency, and achieve efficient heat dissipation for electronic equipment.

[0054] It should be noted that the liquid cooling medium is a liquid phase change material, such as liquid water, ethanol, and acetone.

[0055] It should be further noted that compared to fans, micro-pumps operate with less noise, thus achieving a good balance between efficient heat dissipation and user experience. Compared to the height of the fins, the liquid cooling plate 1 can be made thinner and lighter due to the liquid cooling system, achieving both a slim profile and efficient heat dissipation.

[0056] In some specific implementation methods, in conjunction with the appendix Figure 1-2 As shown in Figures 10-11, the shape of the fluid channel (equivalent to the shape of the first channel 11 and the second channel 22) is "V" or serpentine. The "V" or serpentine flow channel can further increase the contact surface area between the liquid cooling plate 1 and / or the heat spreader 2 and the liquid cooling medium, so that the heat conduction path of heat spreader 2-liquid cooling medium-liquid cooling plate 1 can transfer more heat and further improve the heat dissipation efficiency.

[0057] Furthermore, taking laptop usage scenarios as an example, combined with the attached... Figure 7 As shown, the bottom of the first channel 11 is provided with a plurality of first protrusions 110 located within the fluid channel. The first protrusions 110 are used to increase the contact surface area between the liquid cooling plate 1 and the liquid cooling medium, so that the liquid cooling plate 1 can remove more heat from the liquid cooling medium and improve the heat dissipation efficiency.

[0058] Alternatively, a protrusion may be provided on the outer side of the cover plate 20. The protrusion is located inside the fluid channel and is used to increase the contact surface area between the cover plate 20 and the liquid cooling medium, so that the liquid cooling medium can remove more heat from the heat exchange plate 2 and improve the heat dissipation efficiency.

[0059] As another preferred embodiment of this application, taking a laptop usage scenario as an example, in conjunction with the appendix... Figure 8As shown, at least one cover plate 20 (for example, an upper cover plate is provided with a second through groove 22) forms a fluid channel between the liquid cooling plate 1 and the cover plate 20. The second through groove 22 not only forms a fluid channel, but also increases the contact surface area between the heat spreader 2 and the liquid cooling medium, so that the liquid cooling medium can remove more heat from the heat spreader 2 and improve the heat dissipation efficiency.

[0060] Furthermore, the bottom of the second channel 22 is provided with a plurality of second protrusions 220 located within the fluid channel.

[0061] The second protrusion 220 is used to increase the contact surface area between the heat exchange plate 2 and the liquid cooling medium, so that the liquid cooling medium can carry away more heat from the heat exchange plate 2 and improve the heat dissipation efficiency.

[0062] As another preferred embodiment of this application, taking a laptop usage scenario as an example, in conjunction with the appendix... Figure 9 As shown, the second through groove 22 of the cover plate 20 corresponds to the first through groove 11 of the liquid cooling plate 1, forming a fluid channel. The fluid channel formed by the first through groove 11 and the second through groove 22 not only increases the space of the fluid channel to accommodate more liquid cooling fluid, but also increases the contact surface area between the liquid cooling fluid and the heat spreader 2 and the liquid cooling plate 1, so that the heat conduction path of heat spreader 2-liquid cooling fluid-liquid cooling plate 1 can transfer more heat and improve heat dissipation efficiency.

[0063] It should be noted that the first through groove 11 and the second through groove 22 can be formed by etching or stamping.

[0064] In a second aspect of this embodiment, an electronic device is provided, which includes the liquid-cooled heat sink described above.

[0065] Electronic devices can be mobile phones, laptops, or mainframe servers. Using this liquid cooling system in these devices not only achieves efficient heat dissipation but also allows for a slim and lightweight design.

[0066] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and alterations to the above embodiments within the scope of the present invention without departing from the principles and spirit of the present invention, and all such changes should fall within the protection scope of the claims of the present invention.

Claims

1. A liquid-cooled heat spreader, characterized by, The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator.

2. The liquid-cooled heat spreader of claim 1, wherein, The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator.

3. The liquid-cooled heat spreader of claim 2, wherein, The application relates to an electronic device with a liquid cooling radiator.

4. The liquid-cooled heat spreader of claim 3, wherein, The application relates to an electronic device with a liquid cooling radiator.

5. The liquid-cooled heat spreader of claim 2, wherein, The application relates to an electronic device with a liquid cooling radiator.

6. The liquid-cooled heat spreader of claim 5, wherein, The application relates to an electronic device with a liquid cooling radiator.

7. The liquid-cooled heat spreader of claim 2, wherein, The application relates to an electronic device with a liquid cooling radiator.

8. The liquid-cooled heat spreader of claim 4, wherein, The application relates to an electronic device with a liquid cooling radiator.

9. The liquid-cooled heat spreader of any of claims 1-8, wherein, The application relates to an electronic device with a liquid cooling radiator.

10. An electronic device, comprising: The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator. The application relates to an electronic device with a liquid cooling radiator

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