Silicon wafer conveying mechanism for wafer reversing machine

Abstract

The utility model discloses a silicon wafer conveying mechanism for a wafer reversing machine. The silicon wafer conveying mechanism is provided with a silicon wafer clamping mechanism, a silicon wafer conveying mechanism and a silicon wafer conveying mechanism, wherein the silicon wafer clamping mechanism can clamp silicon wafers positioned above a wafer reversing machine basket; and the conveying frame seat can be positioned above the flower basket and slides on the wafer reversing machine, and the silicon wafer clamping mechanism is arranged on the conveying frame seat. The silicon wafer conveying mechanism is simple in structure, the silicon wafer clamping mechanism only clamps and supports the side bottom of the silicon wafer in the basket for horizontal conveying, the conveying time is short, and the silicon wafer is conveyed only by clamping and supporting the side edge of the bottom of the silicon wafer, so that the silicon wafer is not easy to damage, the structure is simple, the occupied space is small, and the working efficiency is high.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor equipment technology, and further relates to a silicon wafer transport mechanism for a wafer flipping machine. Background Technology

[0002] A silicon wafer is a silicon chip used in the fabrication of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. Silicon wafers are the carrier used in the production of integrated circuits, and generally refer to monocrystalline silicon wafers. Monocrystalline silicon wafers are made by drawing and refining ordinary silicon sand, followed by a series of processes including dissolution, purification, and distillation to produce monocrystalline silicon rods. After polishing and slicing, the monocrystalline silicon rods become silicon wafers. During the silicon wafer production process, the wafers typically need to be cleaned and dried. First, the silicon wafers are placed in a basket, then the basket is immersed in a cleaning solution according to the process specifications to clean the wafers. Finally, the cleaned silicon wafers are placed in an oven to bake and dry.

[0003] Silicon wafer baskets include PP baskets made of PP material and PFA baskets made of PFA material. PP baskets, due to their light weight, are typically used for transporting silicon wafers. However, PP baskets lack acid and alkali resistance or high-temperature resistance, making them unsuitable for direct use in wafer cleaning processes. PFA baskets, on the other hand, possess acid and alkali resistance and high-temperature resistance, allowing for cleaning processes even with silicon wafers inside. This necessitates transferring the silicon wafers from the PP baskets to the PFA baskets for subsequent cleaning. Current technology typically uses a robotic arm to clamp the silicon wafers on opposite sides, axially extracting them from the PP basket. A transport mechanism then removes the PP basket, and another transport mechanism brings in a PFA basket. The robotic arm then places the extracted wafers into the PFA basket. However, this process suffers from two drawbacks: the long dwell time in the air for the robotic arm results in low wafer turnover efficiency, and the prolonged air-holding of the wafers easily damages them. Utility Model Content

[0004] To address the technical problems of existing technologies that use robotic arms to grip silicon wafers, resulting in long wafer flipping times and easy damage to the wafers, the aim is to provide a silicon wafer transport mechanism for a wafer flipping machine.

[0005] This utility model provides a silicon wafer transport mechanism for a wafer flipping machine, the silicon wafer transport mechanism having:

[0006] A silicon wafer clamping mechanism capable of clamping silicon wafers located above the wafer flipping machine basket;

[0007] A transport frame seat that can be located above the flower basket and slide on the wafer flipping machine, wherein the silicon wafer clamping mechanism is disposed on the transport frame seat.

[0008] Preferably, the clamping mechanism has at least one pair of silicon wafer clamping members symmetrically arranged on both sides of the transport frame; preferably, each silicon wafer clamping member includes:

[0009] A clamping drive mechanism is provided on the transport frame;

[0010] Clamping plates: Two clamping plates of each pair of silicon wafer clamping components are symmetrically arranged on two opposite inner sides of the transport frame. The clamping drive mechanism is driven to drive the clamping plates to move relative to each other on the inner side of the transport frame to symmetrically clamp the silicon wafers above the basket.

[0011] Preferably, the transport frame is composed of one or more square frames connected side by side, the square frame comprising:

[0012] The outer side of the outer support plate of the two outer square frames is provided with several sliders that can slide and support on the film-turning machine.

[0013] The two fixed plates and the two support plates are arranged opposite each other to form the square frame, and the clamping plate of the silicon wafer clamping component is located on the inner side of the fixed plates.

[0014] Preferably, the silicon wafer clamping component further includes:

[0015] A push-pull shaft slidably passes through the fixed plate. The inner end of the push-pull shaft is fixedly connected to the clamping plate, and the outer end of the push-pull shaft is directly or indirectly connected to the drive shaft of the clamping drive mechanism.

[0016] Preferably, the silicon wafer clamping component further includes:

[0017] A pair of guide shafts are located on both sides of the push-pull shaft and slidably pass through the fixing plate, with the inner ends of the guide shafts fixedly connected to the clamping plate.

[0018] Preferably, the clamping drive mechanism is fixed to the fixed plate, and the drive shaft of the clamping drive mechanism is connected to the push-pull shaft by a connecting rod.

[0019] Preferably, the fixing plates between two adjacent square frames are fixedly connected by connecting plates.

[0020] Preferably, the clamp has an inclined clamp with several slots for holding silicon wafers.

[0021] Preferably, the film rewinding machine has slide rails on both sides, and the slider on the support plate is slidably engaged on the slide rails.

[0022] Preferably, the wafer turning machine is equipped with a cylinder linear guide rail that drives the silicon wafer transport mechanism to perform linear reciprocating motion, and a mounting plate connected to the cylinder linear guide rail is provided on the outer side of the support plate on one side of the silicon wafer transport mechanism.

[0023] Another objective of this utility model is to provide a silicon wafer flipping machine, which has the following features:

[0024] A workbench having a first opening for placing a flower basket of a first material and a second opening for placing a flower basket of a second material;

[0025] A first lifting mechanism that can lift silicon wafers upward in a first material basket and a second lifting mechanism that can receive silicon wafers and place them downward in a second material basket are located below the first opening and the second opening, respectively.

[0026] A silicon wafer transport mechanism is located above the worktable and can transport the silicon wafer held above the first opening position to the second opening position.

[0027] Preferably, the wafer turning machine also has:

[0028] Two parallel, spaced-apart slide rails are positioned above the worktable, with one end located above the first opening and the other end located above the second opening.

[0029] The silicon wafer transport mechanism moves back and forth between one end of the slide rail and the other end.

[0030] Preferably, the silicon wafer transport mechanism has:

[0031] A silicon wafer clamping mechanism that can clamp the silicon wafers lifted by the first lifting mechanism and place them onto the second lifting mechanism;

[0032] A transport frame seat that can be positioned above the flower basket and move back and forth on the slide rail, wherein the silicon wafer clamping mechanism is disposed on the transport frame seat.

[0033] Preferably, the clamping mechanism has at least one pair of silicon wafer clamping members symmetrically arranged on both sides of the transport frame; preferably, each silicon wafer clamping member includes:

[0034] A clamping drive mechanism is provided on the transport frame;

[0035] The clamping plates of each pair of silicon wafer clamping components are symmetrically arranged on two opposite inner sides of the transport frame. The clamping drive mechanism is driven to drive the clamping plates to move relative to each other on the inner side of the transport frame to symmetrically clamp the silicon wafers on the first lifting mechanism or place the silicon wafers on the second lifting mechanism.

[0036] Preferably, the transport frame is composed of one or more square frames connected side by side, the square frame comprising:

[0037] The outer side of the outer support plate of the two outer square frames is provided with several sliders, which slide and support on the slide rail of the film-turning machine.

[0038] The two fixed plates and the two support plates are arranged opposite each other to form the square frame, and the clamping plate of the silicon wafer clamping component is located on the inner side of the fixed plates.

[0039] Preferably, the silicon wafer clamping component further includes:

[0040] A push-pull shaft slidably passes through the fixed plate. The inner end of the push-pull shaft is fixedly connected to the clamping plate, and the outer end of the push-pull shaft is directly or indirectly connected to the drive shaft of the clamping drive mechanism.

[0041] A pair of guide shafts are located on both sides of the push-pull shaft and slidably pass through the fixing plate, with the inner ends of the guide shafts fixedly connected to the clamping plate.

[0042] Preferably, the clamping drive mechanism is fixed on the fixed plate, and the drive shaft of the clamping drive mechanism is connected to the push-pull shaft by a connecting rod;

[0043] Preferably, the fixing plates between two adjacent square frames are fixedly connected by connecting plates;

[0044] Preferably, the clamp has an inclined clamp, and the inclined clamp has a slot for holding the silicon wafer.

[0045] Preferably, the wafer turning machine also has a cylinder linear guide rail that drives the silicon wafer transport mechanism to perform linear reciprocating motion, and a mounting plate connected to the cylinder linear guide rail is provided on the outer side of the support plate on one side of the silicon wafer transport mechanism.

[0046] Preferably, the first and second lifting mechanisms respectively have:

[0047] A silicon wafer lifting mechanism, wherein the silicon wafer lifting mechanism is a longitudinally lifting screw slide module, and the slide is provided with a mounting platform that can follow the slide in lifting and lowering;

[0048] The silicon wafer carrier mechanism has a support rod fixed on the mounting platform and passing through the first and second openings, and a silicon wafer stage disposed at the top of the support rod. Preferably, the silicon wafer stage has an inclined clamp with several slots for holding silicon wafers.

[0049] Preferably, a flower basket made of a first material is provided at the first opening position, and a flower basket made of a second material is provided at the second opening position. More preferably, the flower basket made of a first material is a flower basket made of a common material, and the flower basket made of a second material is a flower basket made of an acid and alkali resistant and corrosion resistant. More preferably, the flower basket made of a first material is a PP flower basket, and the flower basket made of a second material is a PFA flower basket.

[0050] Another objective of this invention is to provide a silicon wafer flipping method, the method comprising the following steps:

[0051] Step S1: The silicon wafer stage of the first lifting mechanism lifts and raises the silicon wafer in the first material basket located at the first opening position upwards.

[0052] In step S2, the silicon wafer clamping component of the silicon wafer transport mechanism clamps the silicon wafer on the silicon wafer carrier platform of the first lifting mechanism, and the transport frame of the silicon wafer transport mechanism transports the silicon wafer clamping component with the silicon wafer clamped to the top of the second opening position.

[0053] Step S3: The silicon wafer gripper of the silicon wafer transport mechanism releases the silicon wafer onto the silicon wafer stage of the second lifting mechanism.

[0054] In step S4, the silicon wafer stage of the second lifting mechanism descends and places the silicon wafer into the second material basket at the second opening.

[0055] The positive and progressive effects of this utility model are as follows: The silicon wafer clamping mechanism of this utility model is located above the wafer tray of the wafer flipping machine and can clamp the silicon wafers lifted in the tray. The silicon wafer clamping mechanism is driven by the transport frame to transport the silicon wafers horizontally to the top of another tray. The silicon wafer transport mechanism has a simple structure, and the silicon wafer clamping mechanism only clamps and lifts the bottom side of the silicon wafer in the tray for horizontal transport. The transport time is short, only requiring the time of one round trip, and it is not easy to damage the silicon wafers. The wafer flipping efficiency is also improved. Moreover, the structure is simple and occupies little space. Attached Figure Description

[0056] Figure 1 This is a schematic diagram of the silicon wafer flipping machine of this utility model;

[0057] Figure 2 and Figure 3 This is a schematic diagram of the lifting mechanism of this utility model;

[0058] Figure 4 and Figure 5 This is a schematic diagram of the silicon wafer transport mechanism of this utility model. Detailed Implementation

[0059] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model. It should be noted that, unless otherwise specified, the following embodiments and features described therein can be combined with each other.

[0060] like Figure 1 As shown, the silicon wafer flipping machine of this utility model includes a frame, a worktable 10, a first lifting mechanism 20 and a second lifting mechanism 30 located below the worktable, and a silicon wafer transport mechanism 40 located above the worktable.

[0061] The workbench 10 has a first opening 11 and a second opening 12. The first opening 11 is used to place a flower basket 51 made of a first material. In this example, two flower baskets 51 made of the first material are placed side-by-side on the first opening 11. These flower baskets 51 are made of ordinary materials, such as PP flower baskets, or other materials different from the second material flower baskets. The second opening 12 is used to place a flower basket 52 made of a second material. In this example, two flower baskets 52 made of the second material are placed side-by-side on the second opening 12. These flower baskets 52 are acid and alkali resistant and corrosion-resistant, such as PFA flower baskets, or other materials different from the first material flower baskets. It should be noted that the number of first material flower baskets 51 and second material flower baskets 52 is not fixed; this example uses two flower baskets placed side-by-side for illustration.

[0062] The first lifting mechanism 20 and the second lifting mechanism 30 are respectively located below the first opening 11 and the second opening 12. Consequently, the first lifting mechanism 20 and the second lifting mechanism 30 are respectively located below the first material flower basket 51 at the first opening 11 and below the second material flower basket 52 at the second opening 12, and can be lifted and lowered through the bottom of the first material flower basket 51 and the second material flower basket 52, respectively.

[0063] In this example, the first lifting mechanism 20 lifts the silicon wafers in the first material basket 51 on the first opening 11 upwards, and the silicon wafer transport mechanism 40 picks up the silicon wafers lifted by the first lifting mechanism 20 and transports them above the second material basket 52 on the second opening 12. Then, the second lifting mechanism 30 receives the silicon wafers released by the silicon wafer transport mechanism 40 and places them downwards into the second material basket 52. Alternatively, the second lifting mechanism 30 can lift the silicon wafers in the second material basket 52 on the second opening 12 upwards, and the silicon wafer transport mechanism 40 picks up the silicon wafers lifted by the second lifting mechanism 30 and transports them above the first material basket 51 on the first opening 11. Then, the first lifting mechanism 20 receives the silicon wafers released by the silicon wafer transport mechanism 40 and places them downwards into the first material basket 51.

[0064] The wafer flipping machine is equipped with a guide cylinder 60 that drives the silicon wafer transport mechanism 40 to perform linear reciprocating motion. One side of the silicon wafer transport mechanism 40 is connected to the linear guide cylinder 60. Above the worktable 10 of the wafer flipping machine are two parallel, spaced-apart slide rails 70, one end of which is located above the first opening 11, and the other end above the second opening 12. The silicon wafer transport mechanism 40 is mounted on these slide rails 70. The linear guide cylinder 60 can drive the silicon wafer transport mechanism 40 to move back and forth between one end of the slide rail 70 and the other end, thereby transporting the silicon wafer above the first material basket 51 at the first opening 11 and above the second material basket 52 at the second opening 12.

[0065] In this example, the first lifting mechanism 20 and the second lifting mechanism 30 use the same lifting mechanism, such as... Figure 2 and Figure 3 As shown, the lifting mechanism includes a silicon wafer lifting mechanism 21 and a silicon wafer carrying mechanism 22. The silicon wafer lifting mechanism 21 is fixed below the worktable 10. Further, one side of the silicon wafer lifting mechanism 21 is fixed to the side wall below the worktable 11. The silicon wafer carrying mechanism 22 is located on the other side of the silicon wafer lifting mechanism 21 and is positioned below the first opening 11 and the second opening 12 for lifting and lowering movements. In this example, the silicon wafer lifting mechanism 21 is a longitudinally lifting screw slide module, but it could also be other longitudinally lifting mechanisms. A mounting platform 211 that can follow the slide's movement is provided on the screw linear slide. The silicon wafer carrying mechanism 22 is fixed to the mounting platform 211, and thus the mounting platform 211 of the silicon wafer lifting mechanism 21 drives the silicon wafer carrying mechanism 22 to move up and down below the first opening 11 and the second opening 12. The silicon wafer carrier mechanism 22 has a support rod 221 and a silicon wafer stage 222. The bottom end of the support rod 221 is fixed to the mounting platform 211, and the silicon wafer stage 222 is fixedly mounted on the top end of the support rod 221. Furthermore, two support rods 221 and silicon wafer stages 222 are arranged side-by-side on the mounting platform 211, and both silicon wafer stages 22 are located below either the first material basket 51 or the second material basket 52 arranged side-by-side. It should be noted that the number of silicon wafer stages 222 is not fixed, as long as it corresponds to the number of baskets on the worktable 10. The mounting platform 211 on the silicon wafer lifting mechanism 21 drives the silicon wafer carrier 222 on the support rod 221 to pass through the first opening 11 and the bottom of the first material basket 51 to lift the silicon wafers in the first material basket 51 upwards, or to pass through the second opening 12 and the bottom of the second material basket 52 to receive the silicon wafers above the second material basket 52 and place them downwards into the second material basket 52. Furthermore, the top of the silicon wafer carrier 222 has an inclined clamp with several slots for securing the silicon wafers, facilitating the fixing and support of the silicon wafers.

[0066] like Figure 4 and Figure 5 As shown, the silicon wafer transport mechanism 40 has a transport frame 41 and a silicon wafer clamping mechanism 42. The silicon wafer clamping mechanism 42 is disposed on the transport frame 41. The transport frame 41 is located above the first material basket 51 and the second material basket 52 and moves back and forth on the slide rail 70, which drives the silicon wafer clamping mechanism 42 to clamp the silicon wafers held on the silicon wafer stage 222 of the first lifting mechanism 20 and move them to place the silicon wafers on the silicon wafer stage 222 of the second lifting mechanism 30.

[0067] The transport frame 41 is composed of one or more square frames connected side by side. Here, we take two square frames connected side by side as an example, but it can also consist of one or more square frames, as long as the clamping mechanism 42 on the transport frame 41 can clamp and support all the silicon wafers in the first material basket 51 or the second material basket 52. Each square frame includes a support plate 411 and a fixing plate 412 arranged opposite each other. The two fixing plates 412 and the two support plates 411 together form a square frame. In this example, the fixing plates 412 between adjacent square frames are fixedly connected by a connecting plate 413 to form the transport frame 41. An mounting plate 414 is provided on the outer support plate 411 of the outer square frame of the transport frame 41. The transport frame 41 is connected to the cylinder linear guide rail 60 through the mounting plate 414. Several sliders 4111 are provided on the outer side of the outer support plate 411 of the two outer square frames of the transport frame 41. Furthermore, two sliders 4111 are provided on the outer side of the outer support plate 411 respectively. The sliders 4111 can slide and support on the slide rail 70, thereby realizing the movement of the transport frame 41 on the slide rail 70 by the cylinder linear guide rail 60.

[0068] The silicon wafer clamping mechanism 42 has at least one pair of silicon wafer clamping members symmetrically arranged on both sides of the transport frame 41. In this example, there are two pairs of silicon wafer clamping members symmetrically arranged on both sides of the two square frames. Each silicon wafer clamping member includes a clamping drive mechanism 421 and a clamping plate 422. The clamping drive mechanism 421 of each silicon wafer clamping member is drivenly connected to the clamping plate 422 to drive the clamping plate 422 to move relative to each other inside the transport frame 41 to clamp the silicon wafer on the silicon wafer stage 222 of the first lifting mechanism 20 or to place the silicon wafer on the silicon wafer stage 222 of the second lifting mechanism 30. The clamping drive mechanism 421 is fixedly arranged on the transport frame 41. Further, the clamping drive mechanism 421 is fixed on the fixing plate 412. The position of the clamping drive mechanism 421 is not fixed, as long as it can drive the clamping plate to move relative to each other to clamp the silicon wafer. In this example, the clamping drive mechanism 421 is described as a cylinder. The two clamping plates 422 of each pair of silicon wafer grippers are symmetrically arranged on opposite inner sides of the transport frame 41, and further on the inner side of the fixing plate 412. Furthermore, the clamping plates 422 have tilting clamps with slots for holding silicon wafers, facilitating the fixing and support of the bottom side of the silicon wafer and preventing damage. The silicon wafer grippers also include a push-pull shaft 423 and a pair of guide shafts 424. The push-pull shaft 423 slidably passes through the fixing plate 412. The inner end of the push-pull shaft 423 is fixedly connected to the clamping plate 422, and the outer end of the push-pull shaft 423 is directly or indirectly connected to the drive shaft of the gripping drive mechanism 421. Further, the outer end of the push-pull shaft 423 is connected to the drive shaft of the gripping drive mechanism 421 by a connecting rod; in this example, the connecting rod is a straight rod. In this example, the outer end of the push-pull shaft 423 is fixedly connected to the piston rod of the cylinder via a connecting rod. The piston rod of the cylinder drives the push-pull shaft 423 to slide through the fixed plate 412, thereby causing the clamping plate 422 to move back and forth inside the fixed plate 412. The inner end of the guide shaft 424 is fixedly connected to the clamping plate 422, and the outer end of the guide shaft 424 slides through the fixed plate 412, which can enhance the stability of the clamping plate 422 and prevent the clamping plate 422 from shaking or shifting during movement. It should be noted that the number and position of the guide shafts 424 are not limited. Here, we take two guide shafts 424 symmetrically located on both sides of the push-pull shaft 423 as an example for explanation.

[0069] This utility model also provides a silicon wafer flipping method, including the following steps:

[0070] Step S1: The silicon wafer in the first material basket 51 located at the first opening position 11 is lifted and raised upward by the silicon wafer stage 222 of the first lifting mechanism 20.

[0071] Step S2: The silicon wafer on the silicon wafer carrier platform 222 of the first lifting mechanism 20 is picked up by the silicon wafer clamping component of the silicon wafer transport mechanism 40, and the transport frame 41 of the silicon wafer transport mechanism 40, carrying the silicon wafer clamping component with the silicon wafer, is transported to above the second opening position 12.

[0072] Step S3: The silicon wafer is released from the silicon wafer holder of the silicon wafer transport mechanism 40 onto the silicon wafer stage 222 of the second lifting mechanism 30.

[0073] In step S4, the silicon wafer stage 222 of the second lifting mechanism 30 descends and places the silicon wafer in the second material basket 52 of the second opening position 12, waiting for subsequent process steps such as cleaning of the silicon wafer.

[0074] The present invention has been described in detail above with reference to the accompanying drawings and embodiments. Those skilled in the art can make various modifications to the present invention based on the above description. Therefore, certain details in the embodiments should not be construed as limiting the present invention, and the scope of protection of the present invention shall be defined by the appended claims.

Claims

1. A silicon wafer transport mechanism for a wafer flipping machine, characterized in that... The silicon wafer conveying mechanism has: a silicon wafer clamping mechanism capable of clamping the silicon wafer above the film stripper basket; a conveying frame capable of being located above the film stripper basket and sliding on the film stripper, and the silicon wafer clamping mechanism is arranged on the conveying frame; wherein the clamping mechanism has at least one pair of silicon wafer clamping members symmetrically arranged on both sides of the conveying frame, each silicon wafer clamping member comprises: a clamping driving mechanism arranged on the conveying frame; and clamping plates, two clamping plates of each pair of silicon wafer clamping members are symmetrically arranged on the inner sides of the conveying frame, and the clamping driving mechanism is drivingly connected with the clamping plates to drive the clamping plates to move relatively on the inner sides of the conveying frame to symmetrically clamp the silicon wafer above the film stripper basket.

2. The silicon wafer transport mechanism for a film processor as set forth in claim 1, wherein The conveying frame is composed of one or more side-by-side connected square frames, and the square frame comprises: oppositely arranged support plates, the outer sides of the outer support plates of the two square frames are provided with a plurality of sliders capable of slidingly supporting the film stripper; oppositely arranged fixed plates, the two fixed plates and the two support plates enclose the square frame, and the clamping plates of the silicon wafer clamping member are arranged on the inner sides of the fixed plates.

3. The silicon wafer transport mechanism for a film processor as set forth in claim 2, wherein The silicon wafer clamping member further comprises: a push-pull shaft which is slidably arranged through the fixed plate, the inner side end of the push-pull shaft is fixedly connected with the clamping plate, and the outer side end of the push-pull shaft is directly or indirectly connected with the driving shaft of the clamping driving mechanism.

4. The silicon wafer transport mechanism for a film processor as set forth in claim 3, wherein The silicon wafer clamping member further comprises: a pair of guide shafts which are located on both sides of the push-pull shaft and are slidably arranged through the fixed plate, and the inner side end of the guide shaft is fixedly connected with the clamping plate.

5. The silicon wafer transport mechanism for a film processor as set forth in claim 3, wherein The clamping driving mechanism is fixed on the fixed plate, and the driving shaft of the clamping driving mechanism is connected with the push-pull shaft by a connecting rod.

6. The silicon wafer transport mechanism for a film processor as set forth in claim 2, wherein The fixed plates between the two adjacent square frames are fixedly connected by connecting plates.

7. The silicon wafer transport mechanism for a film processor as set forth in claim 2, wherein The clamping plate is provided with an inclined clamp, and the inclined clamp is provided with a plurality of clamping grooves for clamping the silicon wafer.

8. The silicon wafer transport mechanism for a film processor as set forth in claim 2, wherein The film stripper is provided with slide rails on both sides, and the sliders on the support plates are slidably clamped on the slide rails.

9. The silicon wafer transport mechanism for a film processor as set forth in claim 1, wherein The film stripper is provided with a cylinder linear guide rail for driving the silicon wafer conveying mechanism to perform linear reciprocating motion, and the outer side of the support plate on one side of the silicon wafer conveying mechanism is provided with a mounting plate connected with the cylinder linear guide rail.

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