Spraying device for cleaning wafer polishing pad and chemical mechanical polishing device

Abstract

The utility model provides a spraying device for cleaning a wafer grinding pad and a chemical mechanical grinding device. The spraying device comprises a connecting pipe, the cleaning part is provided with a connecting part and a cleaning part, a first channel is formed in the connecting part in the axial direction of the connecting part, part of the connecting part is rotatably arranged in the connecting pipe, a second channel is formed in the cleaning part in the axial direction of the cleaning part, the second channel communicates with the first channel, and a cleaning hole is further formed in the side wall of the cleaning part and communicates with the second channel; when the liquid supply source conveys cleaning liquid into the connecting pipe, the cleaning piece is driven to rotate. According to the spraying device, the cleaning piece is rotatably arranged in the connecting pipe, when cleaning liquid is conveyed into the connecting pipe and the cleaning piece, the cleaning piece can rotate under the action of water pressure of water flow, the spraying area of the cleaning holes can be increased in the rotating process of the cleaning piece, and therefore the cleaning effect on grinding scraps on a grinding pad is improved, and the cleaning efficiency is improved. And the wafer grinding reliability is improved.

Description

Technical Field

[0001] This utility model relates to the field of wafer planarization technology, and in particular to a spray device and a chemical mechanical polishing device for cleaning wafer polishing pads. Background Technology

[0002] Chemical mechanical planarization (CMP), also known as chemical mechanical polishing, is a technique in semiconductor device manufacturing that uses chemical etching and mechanical force to planarize silicon wafers or substrate materials during processing.

[0003] During the chemical mechanical planarization process, the polishing fluid arm sprays high-pressure water onto the polishing pad to remove the grinding debris remaining on the pad. Since the polishing fluid arm cannot swing while spraying high-pressure water, the sprayed high-pressure water can only cover a certain area. As a result, the grinding debris in other uncovered areas cannot be cleaned in time and remains on the polishing pad. This not only affects the polishing effect on the wafer but may also cause defects on the wafer surface. Utility Model Content

[0004] The purpose of this invention is to provide a spray device and a chemical mechanical polishing device for cleaning wafer polishing pads, which improves the cleaning effect of polishing debris on the polishing pads, thereby increasing the reliability of wafer polishing.

[0005] To achieve the above objectives, in a first aspect, this utility model provides a spray device for cleaning wafer polishing pads, comprising:

[0006] The connecting tube has one end for connecting to the liquid supply source;

[0007] A cleaning component has a connecting part and a cleaning part. The connecting part has a first channel opened along its axial direction. A portion of the connecting part is rotatably disposed inside a connecting tube. The cleaning part has a second channel opened along its axial direction. The second channel communicates with the first channel. A cleaning hole is also opened on the side wall of the cleaning part. The cleaning hole communicates with the second channel.

[0008] When the liquid supply source delivers cleaning fluid into the connecting pipe, the cleaning fluid will pass through the first channel and the second channel in sequence, and finally be discharged through the cleaning hole. During the flow of the cleaning fluid, the cleaning component will be rotated.

[0009] The spraying device for cleaning the wafer grinding pad has the advantages that: the cleaning part is rotatably arranged in the connecting pipe, when the cleaning liquid is conveyed into the connecting pipe and the cleaning part, the cleaning part is rotated due to the water pressure of the water flow, the area of the cleaning hole is increased during the rotation of the cleaning part, the cleaning effect of the grinding debris on the grinding pad is improved, and the reliability of the wafer grinding is improved.

[0010] In some embodiments, the end of the connecting part away from the cleaning part is provided with a plurality of fan blade structures, and the plurality of fan blade structures are arranged in the first channel.

[0011] In some embodiments, the spraying device for cleaning the wafer grinding pad further comprises a rotating sealing ring fixedly arranged in the connecting pipe.

[0012] The connecting part is arranged in the inner ring wall of the rotating sealing ring and is fixedly connected with the rotating sealing ring.

[0013] In some embodiments, the end of the connecting part away from the cleaning part is provided with a limiting gasket, and the diameter of the limiting gasket is smaller than the inner diameter of the connecting pipe.

[0014] In some embodiments, the cleaning part further has an intermediate part, the connecting part and the cleaning part are communicated through the intermediate part, a cavity is arranged in the intermediate part, and a plurality of fan blade structures are arranged in the cavity.

[0015] The first channel and the second channel are communicated with the cavity.

[0016] In some embodiments, the intermediate part separates the cleaning part into a first cleaning section and a second cleaning section which are symmetrically distributed.

[0017] The first cleaning section and the second cleaning section are both provided with a plurality of cleaning holes at intervals.

[0018] In some embodiments, the spray device for cleaning the wafer polishing pad further comprises a connecting arm;

[0019] The connecting arm is provided with a liquid supply channel along its axial direction, which is used to connect the liquid supply source.

[0020] One end of the connecting pipe is fixedly connected with the connecting arm and communicates with the liquid supply channel.

[0021] In some embodiments, the spray device for cleaning the wafer polishing pad further comprises a nozzle.

[0022] The number of the nozzles is the same as that of the cleaning holes, and each nozzle communicates with a corresponding cleaning hole.

[0023] In the second aspect, the utility model provides a chemical mechanical polishing device, including the spray device, bearing table, polishing head and polishing pad;

[0024] The bearing table is provided with the polishing pad;

[0025] The polishing head is used for contacting the wafer with the polishing pad.

[0026] The spray device is arranged close to the polishing pad and is used for spraying cleaning liquid on the polishing pad.

[0027] The chemical mechanical polishing device has the advantages that: by adopting the spray device provided by the utility model on the chemical polishing device, the cleaning effect of the polishing scraps on the polishing pad is improved, and the reliability of wafer polishing is increased. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 The utility model provides the front view of the spray device for cleaning the wafer polishing pad of embodiment;

[0029] Figure 2 For Figure 1 The section view along A-A;

[0030] Figure 3 The bottom view of the cleaning piece of the embodiment provided by the utility model;

[0031] Figure 4 The front view of the spray device for cleaning the wafer polishing pad of another embodiment provided by the utility model;

[0032] Figure 5 A schematic diagram of the chemical mechanical grinding device provided by this utility model.

[0033] Figure label:

[0034] 1. Connecting pipe; 2. Cleaning component; 21. Connecting part; 211. First channel; 22. Cleaning part; 221. Second channel; 222. Cleaning hole; 222. Middle part; 23. Cavity; 231. Rotary sealing ring; 3. Limiting gasket; 4. Connecting arm; 5. Nozzle; 6. Support platform; 7. Grinding head; 8. Grinding pad; 9. Spraying device; 10. Detailed Implementation

[0035] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions in the embodiments of this utility model will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art to which this utility model pertains. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed following the word and its equivalents, but does not exclude other elements or objects.

[0036] This utility model embodiment provides a spray device for cleaning wafer polishing pads, see reference. Figures 1 to 3 As shown, the spraying device includes a connecting pipe 1 and a cleaning component 2. The connecting pipe 1 is a hollow tubular structure, and one end of the connecting pipe 1 can be connected to an external liquid supply source through a liquid supply pipe. The cleaning component 2 has a connecting part 21 and a cleaning part 22, with the connecting part 21 and the cleaning part 22 arranged perpendicularly to each other, giving the cleaning component 2 a "T" shape. The connecting part 21 has a first channel 211 along its axial direction, and a portion of the connecting part 21 is rotatably disposed within the connecting pipe 1. The cleaning part 22 has a second channel 221 along its axial direction, which communicates with the first channel 211. A cleaning hole 222 is also provided on the side wall of the cleaning part 22, communicating with the second channel 221. A nozzle 6 is detachably provided on the cleaning hole 222.

[0037] When the liquid supply source delivers cleaning fluid into the connecting pipe 1, the cleaning fluid will pass through the first channel 211 and the second channel 221 in sequence, and finally be discharged through the cleaning hole. During the flow of the cleaning fluid, the cleaning component 2 will be rotated to increase the area of ​​the sprayed cleaning fluid.

[0038] In this embodiment, by rotatably placing the cleaning component 2 inside the connecting pipe 1, when cleaning fluid is supplied to the connecting pipe 1 and the cleaning component 2, the cleaning component 2 will rotate due to the water flow and water pressure. During the rotation, the cleaning component 2 will increase the area of ​​the cleaning hole sprayed on the polishing pad, thereby improving the cleaning effect of polishing debris on the polishing pad and increasing the reliability of wafer polishing.

[0039] refer to Figure 1 and Figure 2 As shown, in some embodiments, the end of the connecting portion 21 away from the cleaning portion 22 has a plurality of fan-blade structures, and the plurality of fan-blade structures are spaced apart inside the first channel 211.

[0040] In this embodiment, a plurality of fan-blade structures are arranged in a ring on the inner wall of the first channel 211 at intervals. By setting a plurality of fan-blade structures inside the first channel 211, the cleaning fluid will rotate when it flows through the first channel 211, thereby improving the reliability of the rotation of the cleaning component 2 and thus improving the cleaning effect on the grinding debris on the grinding pad.

[0041] refer to Figure 1 and Figure 2 As shown, in some embodiments, the spray device for cleaning the wafer polishing pad further includes a rotary sealing ring 3 fixedly disposed in the connecting pipe 1, and the connecting part 21 passes through the inner wall of the rotary sealing ring 3 and is fixedly connected to the rotary sealing ring 3.

[0042] In this embodiment, the rotary sealing ring 3 can be any type of existing dynamic sealing ring. By using the rotary sealing ring 3 to rotary seal the connection between the connecting pipe 1 and the cleaning component 2, it is ensured that the cleaning component 2 can rotate while also ensuring the sealing of the connection between the connecting pipe 1 and the cleaning component 2.

[0043] In some embodiments, a limiting pad 4 is provided at the end of the connecting portion 21 away from the cleaning portion 22, and the diameter of the limiting pad 4 is smaller than the inner diameter of the first channel 211.

[0044] In this embodiment, by providing the limiting gasket 4 at the end of the connecting portion 21 away from the cleaning portion 22, the cleaning component 2 can be prevented from detaching from the connecting pipe 1. Furthermore, the diameter of the limiting gasket 4 is set to be smaller than the inner diameter of the first channel 211 to avoid interference between the limiting gasket 4 and the inner wall of the connecting pipe 1, thereby ensuring the reliability of the rotation of the cleaning component 2.

[0045] refer to Figure 1 and Figure 2As shown, in some embodiments, the cleaning component 2 further has a middle part 23, the hollow part has a cylindrical structure, the connecting part 21 and the cleaning part 22 are connected through the middle part 23, a cavity 231 is provided in the middle part 23, and a plurality of spaced fan blade structures are provided in the cavity 231, and the first channel 211 and the second channel 221 are both connected to the cavity 231.

[0046] In this example, by opening the cavity 231 in the middle part 23 and arranging fan-blade structures at intervals in the cavity 231, it is further ensured that the cleaning component 2 can rotate quickly when the liquid flows through it.

[0047] In some embodiments, the intermediate portion 23 divides the cleaning portion 22 into a symmetrically distributed first cleaning segment and a second cleaning segment, and a plurality of cleaning holes are provided at intervals on both the first cleaning segment and the second cleaning segment.

[0048] In this embodiment, the middle part 23 divides the cleaning part 22 into a symmetrically distributed first cleaning section and a second cleaning section to ensure the stability of the cleaning component 2 during rotation and to avoid shaking.

[0049] refer to Figure 4 As shown, in some specific embodiments, the spray device for cleaning the wafer polishing pad further includes a connecting arm 5, which is a long rod-shaped structure. The connecting arm 5 has a liquid supply channel along its axial direction. One end of the liquid supply channel is connected to the liquid supply source through a liquid supply pipe. One end of the connecting pipe 1 is fixedly connected to the other end of the connecting arm 5 and communicates with the liquid supply channel.

[0050] When the surface of the abrasive pad needs to be cleaned, the connecting arm 5 is moved so that the cleaning component 2 is positioned above the abrasive pad.

[0051] In another embodiment of this utility model, a chemical mechanical grinding apparatus is provided, as shown in the reference. Figure 5 As shown, the chemical mechanical polishing apparatus includes the aforementioned spray device 10, a support platform 7, a polishing head 8, and a polishing pad 9. The polishing pad 9 is mounted on the support platform 7. The polishing head 8 is used to contact the wafer with the polishing pad 9 and apply a certain pressure to the wafer. The spray device 10 is positioned close to the polishing pad 9 and is used to spray cleaning fluid onto the polishing pad 9.

[0052] In this embodiment, by setting the spray device 10 provided by this invention on the chemical polishing apparatus, the cleaning effect of polishing debris on the polishing pad 9 is improved, thereby increasing the reliability of wafer polishing.

[0053] Although the embodiments of this utility model have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations fall within the scope and spirit of this utility model. Moreover, the utility model described herein may have other embodiments and can be implemented or realized in various ways.

Claims

1. A spray device for cleaning wafer polishing pads, characterized in that, include: The connecting tube has one end for connecting to the liquid supply source; A cleaning component has a connecting part and a cleaning part. The connecting part has a first channel opened along its axial direction. A portion of the connecting part is rotatably disposed inside a connecting tube. The cleaning part has a second channel opened along its axial direction. The second channel communicates with the first channel. A cleaning hole is also opened on the side wall of the cleaning part. The cleaning hole communicates with the second channel. When the liquid supply source delivers cleaning fluid into the connecting pipe, the cleaning fluid will pass through the first channel and the second channel in sequence, and finally be discharged through the cleaning hole. During the flow of the cleaning fluid, the cleaning component will be rotated.

2. The spray apparatus for cleaning a wafer polishing pad of claim 1, wherein, The end of the connecting portion away from the cleaning portion has several fan-blade structures, and the several fan-blade structures are spaced apart inside the first channel.

3. The spray apparatus for cleaning a wafer polishing pad of claim 1, wherein, It also includes a rotary sealing ring fixedly disposed inside the connecting pipe; The connecting part passes through the inner wall of the rotary sealing ring and is fixedly connected to the rotary sealing ring.

4. The spray apparatus for cleaning a wafer polishing pad of claim 1, wherein, The end of the connecting part away from the cleaning part is provided with a limiting gasket, and the diameter of the limiting gasket is smaller than the inner diameter of the connecting tube.

5. The spray apparatus for cleaning a wafer polishing pad according to any one of claims 1 to 4, wherein The cleaning component also has a middle section, and the connecting part is connected to the cleaning part through the middle section. A cavity is opened in the middle section, and a plurality of spaced fan blade structures are provided in the cavity. Both the first channel and the second channel are connected to the cavity.

6. The spray apparatus for cleaning a wafer polishing pad of claim 5, wherein, The middle section divides the cleaning portion into a symmetrically distributed first cleaning section and a second cleaning section. Both the first cleaning section and the second cleaning section are provided with a plurality of cleaning holes at intervals.

7. The spray apparatus for cleaning a wafer polishing pad of claim 1, wherein, It also includes a connecting arm; The connecting arm has a liquid supply channel along its axial direction, and the liquid supply channel is used to connect to the liquid supply source; One end of the connecting tube is fixedly connected to the connecting arm and communicates with the liquid supply channel.

8. The spray apparatus for cleaning a wafer polishing pad of claim 1, wherein, It also includes nozzles; The number of nozzles is the same as the number of cleaning holes, and each nozzle is connected to a corresponding cleaning hole.

9. A chemical mechanical polishing apparatus characterized by comprising: Includes the spraying device, support platform, grinding head, and grinding pad as described in any one of claims 1 to 8; The grinding pad is provided on the support platform; The grinding head is used to bring the wafer into contact with the grinding pad; The spraying device is positioned close to the abrasive pad and is used to spray cleaning fluid onto the abrasive pad.

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