Electroplating device for production and processing of semiconductors

Abstract

The utility model discloses an electroplating device for production and processing of semiconductors, which belongs to the technical field of electroplating equipment and comprises an electroplating tank, a partition plate is fixedly connected in the electroplating tank, and a U-shaped support frame is fixedly connected at the upper end of the electroplating tank; and the immersion mechanism comprises a telescopic rod installed at the top in the U-shaped supporting frame, the telescopic end of the telescopic rod is fixedly connected with a U-shaped connecting plate, the lower end of the U-shaped connecting plate is fixedly connected with a lifting plate, a motor is installed at the upper end of the lifting plate, and an output shaft of the motor penetrates through the lifting plate and is fixedly connected with a circular connecting plate. Aiming at the use problem, the equipment can automatically immerse a semiconductor into an electrolyte for electroplating operation, can drive the semiconductor to rotate and stir the electrolyte so as to ensure the uniformity of a coating on the surface of the semiconductor and improve the electroplating quality, and is also provided with a circulating mechanism, so that the electrolyte can be recycled, and the production cost is reduced.

Description

Technical Field

[0001] This utility model relates to the field of electroplating equipment technology, and in particular to an electroplating device for semiconductor production and processing. Background Technology

[0002] Semiconductors are materials whose conductivity lies between that of conductors and insulators, and they have properties such as unidirectional conductivity. In the field of semiconductor manufacturing and processing, electroplating is an extremely critical process, and its quality directly affects the performance and reliability of semiconductors.

[0003] Currently, traditional electroplating equipment typically involves immersing semiconductor components in an electrolyte solution for electroplating. This process largely relies on manual operation, which is not only inefficient but also makes it difficult to ensure the uniformity of the plating layer on the semiconductor components' surface, thus affecting the electroplating quality. Furthermore, during the electroplating process, solid particles and other impurities gradually accumulate in the electrolyte. Existing equipment lacks a mechanism for recycling the electrolyte, resulting in its direct disposal once impurities are present, increasing production costs. Therefore, designing an electroplating device for semiconductor production and processing is a necessary consideration to address these issues. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a semiconductor electroplating device. This device automatically immerses the semiconductor in an electrolyte for electroplating, while simultaneously rotating the semiconductor and agitating the electrolyte to ensure uniformity of the plating layer on the semiconductor surface, thus improving electroplating quality. Furthermore, a circulation mechanism is included to enable the recycling of the electrolyte, thereby reducing production costs.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] An electroplating apparatus for semiconductor manufacturing includes an electroplating tank with a partition fixedly connected inside, and a U-shaped support frame fixedly connected to the upper end of the electroplating tank; an immersion mechanism including a telescopic rod installed at the top of the U-shaped support frame, a U-shaped connecting plate fixedly connected to the telescopic end of the telescopic rod, a lifting plate fixedly connected to the lower end of the U-shaped connecting plate, a motor mounted on the upper end of the lifting plate, the output shaft of the motor passing through the lifting plate and fixedly connected to a circular connecting plate, a mesh cylinder arranged below the circular connecting plate, and the mesh cylinder and the circular connecting plate fixedly connected by multiple connecting rods; and a circulation mechanism for recycling the electrolyte.

[0007] Preferably, a drain pipe is provided in the middle of the partition, and a solenoid valve is provided inside the drain pipe.

[0008] Preferably, the circulation mechanism includes a water pump installed on the right side of the electroplating tank, the inlet pipe of the water pump extending to the inner bottom of the electroplating tank, the outlet pipe of the water pump extending to the inner top of the electroplating tank, and a screen fixedly installed on the inner wall of the electroplating tank.

[0009] Preferably, the screen is located below the partition.

[0010] Preferably, a sealing door is provided on the front side of the electroplating tank, and the sealing door is located on the front side of the screen.

[0011] Preferably, the telescopic rod is a hydraulic telescopic rod, and a controller is installed on the right side of the U-shaped support frame.

[0012] Compared with the prior art, the advantages of this utility model are as follows:

[0013] An immersion mechanism is installed, which automatically immerses semiconductor components into the electrolyte for electroplating by controlling the telescopic rod to move the screen cylinder downward. At the same time, the motor drives the screen cylinder to rotate, which not only keeps the semiconductor components in a moving state, but also agitates the electrolyte, thereby ensuring full contact between the semiconductor components and the electrolyte and guaranteeing the electroplating quality of the semiconductor components. A circulation mechanism is also included, which, through the cooperation of a water pump, a drain pipe and a screen, can remove impurities from the electrolyte, enabling the electrolyte to be recycled and effectively reducing the actual production cost. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of an electroplating apparatus for semiconductor production and processing proposed in this utility model;

[0015] Figure 2 for Figure 1 A sectional view;

[0016] Figure 3 This is a schematic diagram of the immersion mechanism.

[0017] In the diagram: 1. Electroplating tank, 2. Baffle, 3. U-shaped support frame, 4. Telescopic rod, 5. U-shaped connecting plate, 6. Lifting plate, 7. Motor, 8. Circular connecting plate, 9. Mesh cylinder, 10. Connecting rod, 11. Drain pipe, 12. Water pump, 13. Screen, 14. Sealing door, 15. Controller. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0019] Reference Figures 1-3An electroplating apparatus for semiconductor manufacturing includes an electroplating tank 1. Initially, the bottom of the electroplating tank 1 and the screen 13 are filled with electrolyte. A partition 2 is fixedly connected inside the electroplating tank 1. A drain pipe 11 is provided in the middle of the partition 2. A solenoid valve (default closed state) is provided inside the drain pipe 11. A U-shaped support frame 3 is fixedly connected to the upper end of the electroplating tank 1. A controller 15 is installed on the right side of the U-shaped support frame 3. The controller 15 can control the normal operation of equipment such as the telescopic rod 4, motor 7, and water pump 12. A sealing door 14 is provided on the front side of the electroplating tank 1. The sealing door 14 is located in front of the screen 13. By opening the sealing door 14, tools can be used to clean and recycle the solid particles separated on the screen 13.

[0020] The system also includes an immersion mechanism, which includes a telescopic rod 4 installed at the top of the U-shaped support frame 3. The telescopic rod 4 is a hydraulic telescopic rod. The telescopic end of the telescopic rod 4 is fixedly connected to a U-shaped connecting plate 5. The lower end of the U-shaped connecting plate 5 is fixedly connected to a lifting plate 6. The upper end of the lifting plate 6 is equipped with a motor 7. The output shaft of the motor 7 passes through the lifting plate 6 and is fixedly connected to a circular connecting plate 8. A mesh cylinder 9 is set below the circular connecting plate 8. Semiconductor components to be electroplated can be placed in the mesh cylinder 9. By controlling the motor 7 to drive the mesh cylinder 9 to rotate, the semiconductor components can be driven to rotate synchronously. At the same time, the electrolyte in the electroplating tank 1 can be stirred, thereby ensuring full contact between the semiconductor components and the electrolyte and ensuring the electroplating quality of the semiconductor components. The mesh cylinder 9 and the circular connecting plate 8 are fixedly connected by multiple connecting rods 10.

[0021] The system also includes a circulation mechanism for recycling the electrolyte. The circulation mechanism includes a water pump 12 installed on the right side of the electroplating tank 1. The inlet pipe of the water pump 12 extends to the bottom of the electroplating tank 1, and the outlet pipe of the water pump 12 extends to the top of the electroplating tank 1. A screen 13 is fixedly installed on the inner wall of the electroplating tank 1, located below the partition 2. By starting the water pump 12, the electrolyte between the bottom of the electroplating tank 1 and the screen 13 can be pumped to the top of the partition 2 for electroplating. Subsequently, the solenoid valve in the drain pipe 11 is opened, and the screen 13 can be used to remove solid particles from the electrolyte for subsequent recycling.

[0022] In this utility model, during use, the water pump 12 is started by the controller 15 to pump the electrolyte between the bottom of the electroplating tank 1 and the screen 13 to the top of the partition 2, so that the electrolyte enters the electroplating operation area. Then, the semiconductor element to be electroplated is placed in the mesh cylinder 9. The controller 15 controls the telescopic rod 4 to drive the U-shaped connecting plate 5, the lifting plate 6, the circular connecting plate 8, and the mesh cylinder 9 to move downward together, so that the mesh cylinder 9 carries the semiconductor element into the electrolyte and performs the electroplating operation.

[0023] During the electroplating process, the controller 15 starts the motor 7 to drive the circular connecting plate 8 to rotate, which in turn drives the mesh cylinder 9 to rotate. This allows the semiconductor components inside the mesh cylinder 9 to rotate synchronously. At the same time, the mesh cylinder 9 can agitate the electrolyte in the electroplating tank 1, thus ensuring full contact between the semiconductor components and the electrolyte and guaranteeing the electroplating quality of the semiconductor components.

[0024] After electroplating is completed, the telescopic rod 4 is used to move the electrolyte out of the screen cylinder 9 and the semiconductor elements inside, and let it stand. After the excess electrolyte drips off the semiconductor elements, the semiconductor elements can be recycled (during this period, the motor 7 can drive the screen cylinder 9 to rotate and throw off the excess electrolyte to improve the recycling efficiency). At this time, the solenoid valve in the drain pipe 11 can be opened to allow the electrolyte to flow back into the bottom of the electroplating tank 1. When the electrolyte passes through the screen 13, the solid particles in the electrolyte will be separated by the screen 13, thereby removing impurities from the electrolyte so that it can be recycled. When it is necessary to clean and recycle the solid particles separated on the screen 13, the sealing door 14 can be opened, and then tools can be used to clean and recycle the solid particles on the screen 13.

[0025] It should be noted that the telescopic rod 4, motor 7, and water pump 12 in this utility model are all common knowledge in the field, and their working principles are known technologies. The appropriate model is selected according to the actual use. Therefore, the control method and wiring layout of the telescopic rod 4, motor 7, and water pump 12 will not be explained in detail.

[0026] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A semiconductor manufacturing and processing electroplating apparatus, characterized in that, Include: Electroplating tank (1), the baffle (2) is fixedly connected in the electroplating tank (1), the upper end of the electroplating tank (1) is fixedly connected with U-shaped support frame (3); Immersion mechanism, the telescopic rod (4) is installed in the top of U-shaped support frame (3), the telescopic end of telescopic rod (4) is fixedly connected with U-shaped connecting plate (5), the lower end of U-shaped connecting plate (5) is fixedly connected with lifting plate (6), the upper end of lifting plate (6) is installed with motor (7), the output shaft of motor (7) penetrates lifting plate (6), and is fixedly connected with circular connecting plate (8), the lower part of circular connecting plate (8) is provided with mesh tube (9), the mesh tube (9) and circular connecting plate (8) are fixedly connected through a plurality of connecting rods (10) between them; Circulation mechanism, the circulation mechanism is used to realize the circulation use of electrolyte.

2. The electroplating apparatus for semiconductor manufacturing according to claim 1, wherein The middle part of the baffle (2) is provided with a drain pipe (11), and the drain pipe (11) is provided with a solenoid valve.

3. The electroplating apparatus for semiconductor manufacturing according to claim 1, wherein The circulation mechanism includes a water pump (12) installed on the right side of the electroplating tank (1), the inlet pipe of the water pump (12) extends to the inner bottom of the electroplating tank (1), the outlet pipe of the water pump (12) extends to the inner top of the electroplating tank (1), and the inner wall of the electroplating tank (1) is fixedly provided with a screen (13).

4. The electroplating apparatus for semiconductor manufacturing according to claim 3, wherein The screen (13) is located below the baffle (2).

5. The apparatus according to claim 3, wherein The front side of the electroplating tank (1) is provided with a sealing door (14), and the sealing door (14) is located in front of the screen (13).

6. The apparatus according to claim 1, wherein The telescopic rod (4) is a hydraulic telescopic rod, and the right side of the U-shaped support frame (3) is provided with a controller (15).

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