Double-group TLVR high-coupling inductor used on module power supply
By optimizing the core and coil structure of TLVR inductors, the stability and space optimization of highly coupled inductors were achieved, solving the problem of low coupling efficiency of TLVR inductors in high-density PCBs, and improving the circuit's operating environment and hardware performance.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-03
- Publication Date
- 2026-03-10
AI Technical Summary
In high-density PCBs, the coupling efficiency between the two coils of a TLVR inductor is low, and the components occupy a large space, making it difficult to achieve efficient integration in a limited space.
A dual-stage TLVR high-coupling inductor for modular power supplies is designed. By optimizing the structure of the primary and secondary magnetic cores and the prefabricated shape of the coils, and using C-shaped clamps for fastening and thermoforming, the stability and isolation of the two-stage coils are ensured, the coupling coefficient is improved, and the space occupation is reduced.
The coupling coefficient of the TLVR inductor is improved, the space occupied by components in high-density PCBs is reduced, and the operating stability and anti-interference ability of the circuit are enhanced, making it suitable for scenarios such as artificial intelligence AI servers, data centers and autonomous driving.
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Figure CN223986470U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to an inductor device, especially to a multi-integrated inductor device for improving the coupling performance between two-stage coils, and belongs to the technical field of basic electronic components. BACKGROUND
[0002] Inductors are the most commonly used components in electronic devices, which are widely used in various circuits to achieve the functions of filtering, energy storage, matching and resonance. With the miniaturization and high-density assembly of electronic products, inductors have developed rapidly. In addition, considering electromagnetic compatibility, the anti-electromagnetic interference capability of electronic products has become a basic design requirement, which increases the demand and application of inductors.
[0003] TLVR (Trans-Inductor Voltage Regulator) architecture is a rising VR (Voltage Regulator) power supply architecture. The biggest difference between it and traditional DC to DC Buck and DC architectures is that the traditional single-winding ordinary inductor is improved to a TLVR inductor with double-winding similar to a transformer. The ordinary inductor has only one set of winding matched with two pins, while the TLVR inductor has two sets of mutually coupled windings matched with four pins. There is a great difference in structure between the two.
[0004] Currently, in the industry, when designing the structure of TLVR inductors, in addition to the main goal of coupling efficiency between two-stage coils, the number of components and the occupied space in high-density PCBs are also the focus of attention. Therefore, the multi-group integration and coupling coefficient optimization of TLVR inductors in limited space have become a technical gap that needs to be filled in the industry. SUMMARY
[0005] The utility model aims at providing a double-group TLVR high-coupling inductor for module power supply, which is committed to improving the performance of inductor devices and optimizing the occupied space of components in high-density PCBs.
[0006] The technical solution of this utility model to achieve the above-mentioned objective is: a dual-group TLVR high-coupling inductor for modular power supplies, comprising a primary magnetic core, a secondary magnetic core, a primary coil, and a secondary coil. The primary magnetic core is formed into a cube, and its top surface has two parallel and spaced horizontal slots. One end of each horizontal slot is flush with one side of the primary magnetic core, and the other end extends to the bottom surface of the primary magnetic core. A pair of spaced first vertical slots are arranged on opposite sides of the horizontal slots of the primary magnetic core, and the bottom end of any one of the first vertical slots extends towards the bottom surface of the primary magnetic core. The coil surface is insulated and embedded one-to-one in the horizontal slot; the secondary magnetic core is formed into a cube with an outer contour matching the primary magnetic core and has two parallel and spaced non-closed loop slots. The secondary magnetic core has a pair of side surfaces opposite the non-closed loop slots with a row of spaced second vertical slots. The top of any second vertical slot extends toward the top surface of the secondary magnetic core; the secondary coil is wrapped one-to-one along the non-closed loop slots. When the two magnetic cores are joined at the same edge, the first vertical slot and the second vertical slot are aligned and connected, and all are inserted with C-shaped clips and heat-pressed into a whole. The surface of the package has several electrode pads corresponding to each coil.
[0007] Furthermore, in the aforementioned dual-TLVR high-coupling inductor used in the module power supply, the width of the transverse slot in the primary magnetic core corresponds to the width of the primary coil. In the pre-assembled state, the downward end face of the primary coil protrudes from the bottom surface of the primary magnetic core, and the bottom side of the horizontal section of the primary coil in the transverse slot has a larger clearance than the top side clearance. The upward end face of the primary coil protrudes from the top surface of the secondary magnetic core in the packaged state.
[0008] Furthermore, in the aforementioned dual-group TLVR high-coupling inductor used in the module power supply, the width of the non-closed loop slot in the secondary magnetic core corresponds to the width of the secondary coil, and the depth of the non-closed loop slot is segmented and staggered, so that the top of the wrapped secondary coil protrudes from the top surface of the secondary magnetic core, the bottom end and one side end face of the secondary coil are flush with the bottom surface and side surface of the secondary magnetic core, and the other side end face of the secondary coil is recessed to the bottom of the side surface of the secondary magnetic core by a distance corresponding to the thickness of the primary coil.
[0009] Furthermore, in the aforementioned dual-TLVR high-coupling inductor used in modular power supplies, both the primary and secondary magnetic cores are thermoformed bodies made of powder material based on a custom mold.
[0010] Furthermore, in the aforementioned dual-TLVR high-coupling inductor used in a modular power supply, the primary coil is an embedded component formed by cutting and continuously bending a flat copper strip, and the surface of the primary coil is coated with an epoxy resin insulating layer. The middle section of the primary coil is linearly horizontally arranged, and the two ends of the primary coil are bent at right angles in opposite directions.
[0011] Furthermore, in the aforementioned dual-TLVR high-coupling inductor used in the module power supply, the secondary coil is a wrapping accessory formed by cutting and bending flat enameled wire, and a gap is left between the secondary coil and the non-closed-loop slot.
[0012] Furthermore, the aforementioned dual-group TLVR high-coupling inductor used in the module power supply has four electrode pads for the secondary coil on the top surface of the package, and two electrode pads for the primary coil on the top and bottom surfaces of the package, respectively. Additionally, a stripping process is performed to increase the insulation distance between the two coils.
[0013] Compared with existing technologies, the advantages of this inductor are as follows: By optimizing the prefabricated shape of the two-stage magnetic core and coil, and improving the assembly structure using C-shaped clamps, the product assembly stability and manufacturing consistency are ensured, which helps to reduce the space occupied by the inductor in high-density PCBs and its interference to the surrounding environment. Furthermore, each group of coils and the two-stage coils within each group are reliably isolated, improving the withstand voltage between the two-stage coils and the device performance. This results in a coupling coefficient greater than 0.94 for a single TLVR and a mutual coupling coefficient less than 0.1 between two TLVRs. This further improves the circuit's operating environment and promotes the development of hardware performance in applications such as AI servers / data centers / autonomous driving, and smart city transportation. Attached Figure Description
[0014] Figure 1 This is a close-up structural diagram of the primary magnetic core in a preferred embodiment of the inductor of this utility model.
[0015] Figure 2 This is a close-up structural diagram of the secondary magnetic core in a preferred embodiment of the inductor of this utility model.
[0016] Figure 3 This is a close-up structural diagram of the primary coil in a preferred embodiment of the inductor of this utility model.
[0017] Figure 4 This is a close-up structural schematic diagram of the secondary coil in a preferred embodiment of the inductor of this utility model.
[0018] Figure 5 This is a schematic diagram showing the evolution of the external shape of the inductor according to a preferred embodiment of this utility model. Detailed Implementation
[0019] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings.
[0020] This invention proposes a dual-group TLVR high-coupling inductor for modular power supplies, aiming to improve the performance of inductor devices and optimize the space occupied by components in high-density PCBs. Figures 1 to 5 As shown, the basic structure of this inductor is assembled from pre-formed primary magnetic core 1, secondary magnetic core 2, primary coil 3, and secondary coil 4, and obtained through a series of manufacturing processes including hot-pressing encapsulation, spraying, partial paint stripping, and electroplating. In summary, the primary magnetic core 1 has a cube-shaped body with a flat bottom surface and two parallel and spaced horizontal slots 11 on its top surface. One end of each slot is flush with one side of the primary magnetic core, and the other end 111 extends to the bottom surface of the primary magnetic core. A pair of spaced first vertical slots 13a are arranged on the opposite side of the horizontal slots of the primary magnetic core. The bottom end of any first vertical slot extends towards the bottom surface of the primary magnetic core to allow one end of a C-shaped clamp to engage. And as... Figure 3 The primary coil 3, whose prefabricated shape matches the primary magnetic core, has an insulated surface and is embedded one-to-one in the horizontal slot 11. The secondary magnetic core 2 is formed as a cube with an outer contour matching the primary magnetic core 1 and has two parallel and spaced non-closed-loop slots 21. A pair of spaced second vertical slots 13b are provided on the sides of the secondary magnetic core opposite to the non-closed-loop slots. The top of any second vertical slot extends towards the top surface of the secondary magnetic core, also to facilitate the engagement of the other end of the C-shaped clamping strip. And as... Figure 4 The secondary coil shown is continuously bent and cut along the non-closed loop groove, and wound one-to-one. With the two magnetic cores aligned and joined, the first vertical groove 13a and the second vertical groove 13b are aligned and connected, and all are inserted with C-shaped clamps (…). Figure 5 (The rightmost part is omitted from the diagram, but can be seen) This clamps the two magnetic cores together, and then they are thermo-pressed into a single unit. As the basis for the inductor to connect to the PCB, several electrode pads are also required on the surface of the package corresponding to each coil. The specific distribution and shape will be detailed later.
[0021] For the design considerations of integrating two sets into one and mass production, both the aforementioned two-stage magnetic cores and two-stage coils can be prefabricated and reused in batches. Based on the overview of this technical solution and the illustrations of preferred embodiments, the detailed features of each functional component of this inductor also include: Figure 3 The primary coil shown is an insert component formed by cutting and continuously bending a flat copper strip, and the surface of the primary coil is coated with an epoxy resin insulating layer to achieve isolation towards the secondary coil. The middle section 31 of the primary coil is linearly horizontally arranged, and the two ends of the primary coil are bent at right angles in opposite directions. Figure 4The secondary coil shown is a wrapping component formed by cutting flat enameled wire and continuously bending it along a non-closed-loop groove. The middle section 41 of this secondary coil also lies linearly horizontally, with both sides bent and folded upwards to form an opening. In the actual pre-assembled state, the two ends 42 of the secondary coil rest against the two recesses 21a on the top side of the non-closed-loop groove, with the ends protruding. A slight gap remains between the middle section of the secondary coil and the non-closed-loop groove. One side wall 43 of the secondary coil is flush with the side of the secondary core (while also leaving a slight gap with the non-closed-loop groove), while the other side wall of the secondary coil wraps around the non-closed-loop groove, forming a section that is recessed to the bottom relative to the other side of the secondary core, with enough space to accommodate the upward bending of the primary core. That is, the entire secondary coil is a movable wrapping of the secondary core, with the gaps filled and the coil pressed tightly together only during the thermo-press packaging process. As can be seen from the illustration, the thickness of the primary coil is greater than the thickness of the secondary coil.
[0022] The two transverse slots on the primary core are each sized to accommodate the primary coil. The depth of each slot satisfies the following conditions: in the pre-assembled state, the downward-facing end face 33 of the primary coil (near the other end of the slot) protrudes from the bottom surface of the primary core, and the bottom side clearance of the middle section of the primary coil in the slot is greater than the top side clearance (i.e., the narrow gap between the two side surfaces). The upward-facing end face 32 of the primary coil protrudes from the top surface of the secondary core in the packaged state. Similarly, the width of the non-closed-loop slots in the secondary core corresponds to the width of the secondary coil, and the depth of the non-closed-loop slots is segmented and staggered, so that the top of the wrapped secondary coil protrudes from the top surface of the secondary core, the bottom end and one side end face of the secondary coil are flush with the bottom and side surfaces of the secondary core, and the other side end face of the secondary coil is recessed below the side surface of the secondary core by a distance corresponding to the thickness of the primary coil.
[0023] The two-stage magnetic cores of the aforementioned preferred embodiment are both prefabricated assemblies based on powder materials and customized molds, specifically using a cold pressing molding process. The powder material used for the magnetic core can be one or more mixtures of Fe-based / FeSiCr / FeSiAl / FeNi / FeSi / amorphous / nanocrystalline materials, with one of epoxy resin, silicone resin, or acrylic resin added and stirred evenly before being injected into a customized mold conforming to the device's shape. The molding pressure range is 6-12 Tons / cm².
[0024] This invention aims to optimize the high coupling performance of dual-TLVR inductors in modular power supply applications. Based on the aforementioned primary coil surface coating, edge-to-edge splicing of the two-stage magnetic cores, and thermo-press packaging, the gap Q between the two-stage magnetic cores is close to zero, which is beneficial to improving the coupling coefficient of a single TLVR. On the other hand, the two-stage coils are partially stripped of their enamel on both sides of the package and electroplated to form electrode pads, and the enamel stripping treatment is performed to increase the insulation distance at the adjacent areas of the two-stage coils. The upward end face 32 (including the downward end face 33) of the primary coil is stripped of its entire length and electroplated to form the primary electrode 52, while the exposed portion on one side of the secondary coil is stripped of its entire length, and the exposed portion on the other side is only stripped in a portion away from the primary coil. A certain distance is maintained between the two stripped portions for isolation, and then electroplating is performed to form the secondary electrode 51.
[0025] like Figure 5 As shown in the diagram, the complete manufacturing process of this inductor is as follows: First, primary magnetic cores, secondary magnetic cores, primary coils, and secondary coils are prefabricated in the required proportions. Then, two primary coils 3 are pre-assembled with primary magnetic core 1 to obtain a partial semi-finished assembly A. Simultaneously or asynchronously, two secondary coils 4 are pre-assembled with secondary magnetic core 2 to obtain another partial semi-finished assembly B. Next, the two semi-finished assemblies are joined together with the coils back to back, and C-shaped clips of the same material as the magnetic cores are used to connect the vertical slots of the joint. Then, the pre-assembled inductor C is transferred into a thermoforming mold, and all gaps are filled with one or more mixtures of Fe-based / FeSiCr / FeNi / FeSiAl / amorphous or nanocrystalline materials. The mold is then held at a molding temperature range of 100-200℃ and a molding pressure of 4-12 Tons / cm² for 30-180 seconds to obtain a thermo-pressed encapsulated body. After the thermo-pressed encapsulated body is cooled, it is painted to cover the entire surface with an insulating varnish film. Then, partial varnish peeling is performed to form exposed but unconnected conductor contacts at both ends of the primary and secondary coils. Finally, the TLVR inductor is formed by electroplating and distributed on several electrode pads on the top and bottom surfaces. The semi-finished product D is then subjected to external inspection, testing, quality inspection, packaging, and shipment.
[0026] In summary, the preferred embodiment of the inductor integrating two sets of TLVRs of this utility model, as detailed above, demonstrates the following technical advantages compared to existing technologies: By optimizing the prefabricated shape and assembly structure of the two-stage magnetic core and coils, product assembly stability and manufacturing consistency are ensured, helping to reduce the space occupied by the inductor in high-density PCBs and its interference to the surrounding environment. Furthermore, reliable isolation is achieved between each set of coils and between each set of two-stage coils, improving the withstand voltage between the two-stage coils and the device performance. Simultaneously, the coupling coefficient of a single TLVR is greater than 0.94, while the mutual coupling coefficient between two TLVRs is less than 0.1 (as obtained through Ansys Maxwell simulation). This further improves the circuit's operating environment and promotes the development of hardware performance in application scenarios such as AI servers / data centers / autonomous driving, and smart city transportation.
[0027] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the principles of this application should be included within the protection scope of this application.
Claims
1. Dual set of TLVR high coupling inductors for use on a modular power supply, characterized by: The inductor is combined by a primary magnetic core, a secondary magnetic core, a primary coil and a secondary coil, the primary magnetic core is shaped as a square block, the top surface of the primary magnetic core is provided with two parallel and spaced transverse grooves, one end of the transverse groove is flush with one side surface of the primary magnetic core, the other end of the transverse groove extends to the bottom surface of the primary magnetic core, and the opposite side surfaces of the primary magnetic core relative to the sides of the transverse groove are provided with a plurality of first vertical grooves arranged in rows and spaced, the bottom end of any first vertical groove extends to the bottom surface of the primary magnetic core; the surface of the primary coil is insulated and embedded in the transverse groove one by one; the secondary magnetic core is shaped as a square block with an outer contour matched with the primary magnetic core and is provided with two parallel and spaced non-closed loop grooves, the opposite side surfaces of the secondary magnetic core relative to the sides of the non-closed loop grooves are provided with second vertical grooves arranged in rows and spaced, the top end of any second vertical groove extends to the top surface of the secondary magnetic core; the secondary coil is arranged along the non-closed loop groove one by one, the first vertical grooves and the second vertical grooves are aligned and connected in series in the abutting state of the two magnetic cores, and are all inserted into C-shaped clamping strips and hot-pressed to be integrated into one body, and the surface of the packaging body is provided with a plurality of electrode pads corresponding to each coil.
2. The dual set of TLVR high coupling inductors on a module power supply of claim 1, wherein: The width of the transverse groove in the primary magnetic core corresponds to the width of the primary coil, the downward end surface of the primary coil protrudes from the bottom surface of the primary magnetic core in the pre-assembled state, and the bottom side of the horizontal section of the primary coil in the transverse groove is left empty more than the top side, and the upward end surface of the primary coil protrudes from the top surface of the secondary magnetic core in the packaged state.
3. The dual set of TLVR high coupling inductors on a module power supply of claim 1, wherein: The width of the non-closed loop groove in the secondary magnetic core corresponds to the width of the secondary coil, and the depth of the non-closed loop groove is arranged in sections and unevenly, so that the top end of the wrapped secondary coil protrudes from the top surface of the secondary magnetic core, the bottom end and one side end surface of the secondary coil are flush with the bottom surface and the side surface of the secondary magnetic core, and the other side end surface of the secondary coil is sunken by a distance corresponding to the thickness of the primary coil relative to the side surface of the secondary magnetic core.
4. The dual set of TLVR high coupling inductors on a module power supply of claim 1, 2 or 3, wherein: The primary magnetic core and the secondary magnetic core are both hot-pressed bodies based on a customized mold from a powder material.
5. The dual-group TLVR high-coupling inductor for a modular power supply according to claim 1, characterized in that: The primary coil is an embedded assembly formed by cutting and continuously bending a flat copper strip, and the surface of the primary coil is sprayed with an epoxy resin insulation layer, the middle section of the primary coil is arranged linearly horizontally, and the two ends of the primary coil are arranged at right angles and bent in opposite directions.
6. The dual set of TLVR high coupling inductors on a module power supply of claim 1, wherein: The secondary coil is a wrapped assembly formed by cutting and bending a flat enameled wire, and a gap is left between the secondary coil and the non-closed loop groove.
7. The dual set of TLVR high coupling inductors on a module power supply of claim 1, wherein: Four electrode pads of the secondary coil are arranged on the top surface of the packaging body, and two electrode pads of the primary coil are respectively arranged on the top surface and the bottom surface of the packaging body, and a paint stripping treatment is performed to increase the insulation distance near the two-stage coils.