Optical package structure
By forming grooves on the circuit board to accommodate electronic components and using conductive vias to achieve a three-layer vertical stacking structure, the problems of large packaging device size, signal loss and insufficient fiber optic support in the prior art are solved, achieving efficient signal transmission and low-cost production.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-11
- Publication Date
- 2026-03-13
AI Technical Summary
In existing co-packaged optical devices, the optical chip and the conversion chip transmit signals through the circuits in the circuit board and substrate, resulting in an excessively large device size, an excessively long signal transmission path, and easy loss. In addition, the optical fiber has insufficient support and is at risk of breakage.
Electronic components are housed in recesses on a circuit board, and a three-layer vertical stacked structure is achieved through conductive vias between the electronic components, semiconductor components, and optical components. Direct electrical connection is used to shorten the signal transmission path, while optical accessories are supported by the circuit board to reduce the risk of breakage.
It achieves miniaturization of optical packaging structure, improves signal transmission rate, reduces the risk of optical element breakage, and has low production cost, making it suitable for existing semiconductor packaging processes.
Smart Images
Figure CN223993862U_ABST
Abstract
Description
Technical Field
[0001] This application relates to a semiconductor packaging structure, and more particularly to an optical packaging structure with optical elements. Background Technology
[0002] With the booming development of the electronics industry, electronic products are gradually moving towards multifunctionality and high performance. The application of fifth-generation (5G) communication technology has expanded to various fields such as the Internet of Things (IoT), Industrial Internet of Things (IIoT), cloud computing, artificial intelligence (AI), autonomous vehicles, and medical care. As applications expand, a massive amount of data needs to be efficiently transmitted, processed, and stored. The demand for data transmission, in particular, is surging, leading the industry to replace electricity with light as the data transmission medium. This aims to improve transmission capacity, efficiency, and distance while reducing energy consumption during transmission. Against this backdrop, co-packaged optical devices have become a future trend in semiconductor and packaging technologies.
[0003] Please see Figure 1 The diagram shows a cross-sectional view of an existing co-packaged optical device 1. It mainly consists of an optoelectronic module 11 mounted on a circuit board 10. The optoelectronic module 11 includes a semiconductor chip 112 formed in the packaging structure 111 and an optical chip 113 mounted on the packaging structure 111. One end of the optical chip 113 is connected to an optical fiber 14, and a shelf 15 is provided below the junction of the optical chip 113 and the optical fiber 14 to allow optical signals to be transmitted to the optoelectronic module 11 for communication. In addition, a switching chip 12 needs to be mounted on the circuit board 10 to be used in the terminal product. The switching chip 12 is first mounted on a substrate 13 and then mounted on the circuit board 10 through the substrate 13.
[0004] However, the optical chip and conversion chip in the aforementioned co-packaged optical device must transmit signals through the circuits in the circuit board and substrate. Not only is the overall size of the device too large and thick, which is not conducive to the miniaturization of electronic products, but its signal transmission path is also too long, which can easily lead to signal loss and cause problems in the application of end products. In addition, there is a risk that the bracket is suspended, resulting in insufficient support for the optical fiber and breakage.
[0005] Therefore, overcoming the problems of the existing technology has become an urgent issue that needs to be addressed. Utility Model Content
[0006] In view of the various deficiencies of the prior art, this application provides an optical packaging structure, including: a circuit board having opposing first sides and a second side, and a groove formed on the first side; an electronic component having opposing first surfaces and a second surface, and having a plurality of first conductive through-holes penetrating the first and second surfaces, so that the electronic component is disposed on the circuit board on the second surface and accommodated in the groove and electrically connected to the circuit board; a semiconductor component having opposing third and fourth surfaces, so that the semiconductor component is disposed on the electronic component on the fourth surface and electrically connected to the electronic component; and an optical component disposed on the semiconductor component and electrically connected to the semiconductor component.
[0007] This application also provides a method for manufacturing an optical packaging structure, comprising: providing a circuit board having opposing first and second sides, and forming a groove on the first side; disposing an electronic component in the groove of the circuit board, wherein the electronic component has opposing first and second surfaces, and forming a plurality of first conductive vias penetrating the first and second surfaces, so that the electronic component is disposed on the circuit board with the second surface and accommodated in the groove and electrically connected to the circuit board; disposing a semiconductor element on the electronic component, wherein the semiconductor element has opposing third and fourth surfaces, so that the semiconductor element is disposed on the electronic component with the fourth surface and electrically connected to the electronic component; and disposing an optical element on the semiconductor element and electrically connecting to the semiconductor element.
[0008] In the aforementioned optical packaging structure and its manufacturing method, the electronic component is a switching application-specific integrated circuit.
[0009] In the aforementioned optical packaging structure and its manufacturing method, the semiconductor element is an integrated circuit element.
[0010] In the aforementioned optical packaging structure and its manufacturing method, a plurality of second conductive vias are formed in the semiconductor element, penetrating the third surface and the fourth surface.
[0011] In the aforementioned optical packaging structure and its manufacturing method, the semiconductor element is placed on the circuit board and the electronic component with the fourth surface, and is electrically connected to the circuit board and the electronic component.
[0012] In the aforementioned optical packaging structure and its manufacturing method, the optical element is an optical chip or an optical module.
[0013] In the aforementioned optical packaging structure and its manufacturing method, the optical module includes a coupler, an optical chip, a total reflection mirror, and an optical fiber array unit.
[0014] In the aforementioned optical packaging structure and its manufacturing method, the optical element is provided with optical accessories, and the optical accessories are supported by the circuit board.
[0015] In the aforementioned optical packaging structure and its manufacturing method, a filling layer is formed between the optical element and the circuit board so that the filling layer covers the semiconductor element and the electronic element.
[0016] In the aforementioned optical packaging structure and its manufacturing method, the second side of the circuit board is provided with multiple conductive elements.
[0017] In the aforementioned optical packaging structure and its manufacturing method, the circuit board and the electronic component, the semiconductor component and the optical component disposed in the groove of the circuit board constitute a three-layer vertical stacked structure.
[0018] As can be seen from the above, the optical packaging structure of this application accommodates electronic components with multiple conductive vias in the grooves of the circuit board to shorten the overall structure size. Then, semiconductor components are stacked on the electronic components, and optical components are stacked on the semiconductor components to form a three-layer vertically stacked optical packaging structure. At the same time, through the multiple first conductive vias formed in the electronic components and the multiple second conductive vias formed in the semiconductor components, the optical components, the semiconductor components, the electronic components and the circuit board can be directly electrically connected to each other through the multiple first conductive vias and the multiple second conductive vias to shorten the signal transmission path between them and improve the transmission rate. In addition, the optical components can be supported by the circuit board to reduce the risk of optical component breakage. Attached Figure Description
[0019] Figure 1 This is a cross-sectional schematic diagram of an existing co-packaged optical device.
[0020] Figures 2A to 2E This is a cross-sectional schematic diagram of the optical packaging structure and its manufacturing method of this application.
[0021] Explanation of reference numerals in the attached figures
[0022] 1. Co-packaged optical devices
[0023] 10 Circuit Boards
[0024] 11 Optoelectronic Modules
[0025] 111 Package Structure
[0026] 112 Semiconductor Chips
[0027] 113 Optical Chip
[0028] 12 conversion chips
[0029] 13 substrate
[0030] 14 optical fibers
[0031] 15 brackets
[0032] 2. Optical Packaging Structure
[0033] 20 circuit boards
[0034] 20a First side
[0035] 20b Second side
[0036] 200 grooves
[0037] 201 Insulation Layer
[0038] 202 Line Layer
[0039] 21 Electronic Components
[0040] 21a First Surface
[0041] 21b Second Surface
[0042] 210 First conductive via
[0043] 22 Semiconductor Components
[0044] 22a Third Surface
[0045] 22b Fourth surface
[0046] 220 Second conductive via
[0047] 23 Optical Components
[0048] 24 Optical Components
[0049] 25 Filler layer
[0050] 26. Conductive elements. Detailed Implementation
[0051] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification.
[0052] It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the scope of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this application, should still fall within the scope of the technical content disclosed herein. Furthermore, the terms such as "above," "first," "second," "third," and "one" used in this specification are merely for clarity of description and are not intended to limit the scope of this application. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this application's implementation.
[0053] Please see Figures 2A to 2E This is a cross-sectional schematic diagram of the optical packaging structure and its manufacturing method of this application.
[0054] like Figure 2A As shown, a circuit board 20 is provided, and at least one recess 200 is formed in the circuit board 20.
[0055] In this embodiment, the circuit board 20 has opposing first sides 20a and second sides 20b, and includes an insulating layer 201 and a circuit layer 202 bonded to the insulating layer 201. The insulating layer 201 is made of dielectric materials such as polybenzoxazole (PBO), polyimide (PI), or prepreg (PP). The circuit layer 202 is, for example, a fan-out type redistributed circuit layer, and its material is, for example, metallic copper.
[0056] The groove 200 can be formed on the first side 20a by means of laser cutting or cutting with a tool, and a portion of the circuit layer 202 is exposed at the bottom of the groove 200. The groove 200 can also be formed by the circuit layer addition process of the circuit board without using the aforementioned cutting method.
[0057] like Figure 2B As shown, electronic component 21 is disposed in the recess 200 and electrically connected to the circuit board 20.
[0058] In this embodiment, the electronic component 21 is, for example, a switch ASIC, having opposing first surfaces 21a and second surfaces 21b, and having a plurality of first conductive vias 210 (e.g., conductive silicon vias) extending through the first surface 21a and the second surface 21b. The electronic component 21 is electrically connected to the circuit layer 202 at the bottom of the recess 200 of the circuit board 20 via the second surface 21b (through conductive elements such as solder bumps or copper bumps).
[0059] like Figure 2C As shown, at least one semiconductor element 22 (two semiconductor elements 22 are shown in this figure) is disposed on the circuit board 20 and the electronic component 21, and the semiconductor element 22 is electrically connected to the circuit board 20 and the electronic component 21.
[0060] In this embodiment, the semiconductor element 22 is, for example, an electronic integrated circuit (EIC), which has a third surface 22a and a fourth surface 22b opposite to each other. A plurality of second conductive vias 220 are formed in the semiconductor element 22, penetrating the third surface 22a and the fourth surface 22b. The semiconductor element 22 is electrically connected to the circuit board 20 and the electronic element 21 through the fourth surface 22b (via conductive elements such as solder bumps or copper bumps).
[0061] like Figure 2D As shown, an optical element 23 is disposed on the semiconductor element 22, and the optical element 23 is electrically connected to the semiconductor element 22 (through conductive parts such as solder bumps or copper bumps). An optical accessory 24 (such as a fiber optic slot, lens, or bracket) is disposed below the optical element 23, wherein the optical accessory 24 can be supported by the circuit board 20 to reduce the risk of breakage of the optical element 23 or the optical accessory 24.
[0062] The optical element 23 is, for example, an optical chip or an optical PIC module, which includes a coupler, an optical chip, a total reflection mirror, a fiber optic array unit (FAU), etc.
[0063] like Figure 2E As shown, a filling layer 25 is formed between the optical element 23 and the circuit board 20 to cover the semiconductor element 22 and the electronic element 21. Multiple conductive elements 26 (e.g., solder bumps or copper bumps) can be implanted on the second side 20b of the circuit board 20 to obtain the optical packaging structure 2 of this application. Subsequently, the optical packaging structure 2 can be electrically connected to an external device through the multiple conductive elements 26.
[0064] Through the aforementioned manufacturing method, this application also discloses an optical packaging structure 2, including: a circuit board 20 having a groove 200, an electronic component 21 disposed in the groove 200 of the circuit board 20, a semiconductor component 22 stacked on the circuit board 20 and the electronic component 21, and an optical component 23 stacked on the semiconductor component 22.
[0065] The circuit board 20 has a first side 20a and a second side 20b opposite to each other, and a groove 200 is formed on the first side 20a.
[0066] The electronic component 21 has a first surface 21a and a second surface 21b opposite to each other, and a plurality of first conductive through holes 210 are formed in the electronic component 21, penetrating the first surface 21a and the second surface 21b, so that the electronic component 21 is accommodated in the groove 200 of the circuit board 20 and electrically connected to the circuit board 20.
[0067] The semiconductor element 22 is disposed on both the first side 20a of the circuit board 20 and the first surface 21a of the electronic element 21, so that the semiconductor element 22 is electrically connected to the circuit board 20 and the electronic element 21, and the semiconductor element 22 can be directly electrically connected to the circuit board 20 through a plurality of first conductive through-holes 210 of the electronic element 21.
[0068] The semiconductor element 22 has opposing third surfaces 22a and fourth surfaces 22b, and a plurality of second conductive vias 220 are formed in the semiconductor element 22, penetrating the third surface 22a and the fourth surface 22b.
[0069] The optical element 23 is disposed on the semiconductor element 22 and can be directly electrically connected to the semiconductor element 22, the electronic element 21 and the circuit board 20 through the plurality of first conductive through-holes 210 and the plurality of second conductive through-holes 220.
[0070] In summary, the optical packaging structure of this application accommodates electronic components with multiple conductive vias in recesses of a circuit board, thereby reducing the overall size of the structure. Semiconductor components are then stacked on top of the electronic components, and optical components are stacked on top of the semiconductor components, forming a three-layer vertically stacked optical packaging structure. Simultaneously, through the multiple first conductive vias formed in the electronic components and the multiple second conductive vias formed in the semiconductor components, the optical components, semiconductor components, electronic components, and the circuit board can be directly electrically connected to each other through these multiple first and second conductive vias, shortening the signal transmission path and increasing the transmission rate. Furthermore, the optical components are supported by the circuit board, reducing the risk of optical component breakage. Moreover, this optical packaging structure technology is highly feasible and can be manufactured using existing semiconductor packaging processes, without the need to develop special processes or purchase special equipment, thus reducing product manufacturing costs.
[0071] The above embodiments are used to illustrate the principles and effects of this application, and are not intended to limit this application. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of this application. Therefore, the scope of protection of this application should be as set forth in the claims.
Claims
1. An optical package structure, characterized by, Comprising: a circuit board having opposite first and second sides, and a recess formed in the first side; an electronic component having opposite first and second surfaces, and a plurality of first conductive vias formed through the first and second surfaces to allow the electronic component to be received in the recess with the second surface and electrically connected to the circuit board; a semiconductor component having opposite third and fourth surfaces to allow the semiconductor component to be disposed on the electronic component with the fourth surface and electrically connected to the electronic component; and an optical component disposed on the semiconductor component and electrically connected to the semiconductor component. The electronic component is a conversion specific application integrated circuit.
2. The optical package structure of claim 1, wherein, The semiconductor component is an electronic integrated circuit component.
3. The optical package structure of claim 1, wherein, The semiconductor component has a plurality of second conductive vias formed through the third and fourth surfaces.
4. The optical package structure of claim 1, wherein, The semiconductor component is received on the circuit board and the electronic component with the fourth surface and electrically connected to the circuit board and the electronic component.
5. The optical package structure of claim 1, wherein, The optical component is an optical chip or an optical module.
6. The optical package structure of claim 1, wherein, The optical module includes a coupler, an optical chip, a total reflection mirror, and an optical fiber array unit.
7. The optical package structure of claim 6, wherein, The optical component is provided with an optical accessory, and the optical accessory is supported by the circuit board.
8. The optical packaging structure of claim 1, wherein, A filling layer is formed between the optical component and the circuit board to allow the filling layer to cover the semiconductor component and the electronic component.
9. The optical packaging structure of claim 1, wherein, The second side of the circuit board is provided with a plurality of conductive elements.
10. The optical packaging structure of claim 1, wherein, The circuit board, the electronic component, the semiconductor component, and the optical component disposed in the recess of the circuit board form a three-layer vertical stack structure.
11. The optical packaging structure of claim 1, wherein,