Chip anti-explosion packaging structure

Abstract

The utility model provides a chip anti-explosion packaging structure. The chip anti-explosion packaging structure comprises a precise breakdown thyristor chip; the first surface of the precise breakdown thyristor chip is provided with a cathode assembly, the second surface of the precise breakdown thyristor chip is provided with an anode assembly, an anti-explosion ring is installed between the cathode assembly and the anode assembly, and the anode assembly, the cathode assembly and the anti-explosion ring form a first cavity space; a ceramic umbrella skirt is arranged between the cathode assembly and the anode assembly, a first anode welding ring and a first cathode connecting ring are welded outside the anode assembly, and a first cathode welding ring is welded outside the cathode assembly. The anode assembly, the first anode welding ring, the ceramic umbrella skirt, the first cathode connecting ring, the first cathode welding ring and the cathode assembly form a second cavity space, the chip anti-explosion packaging structure provided by the utility model provides enough cavity space in the packaging while ensuring the through-current capability, the anti-explosion ring is arranged in the packaging structure, and the anti-explosion performance of the chip is greatly improved by arranging the anti-explosion ring in the packaging structure. And the anti-explosion capability of the precise breakdown thyristor is improved.

Description

Technical Field

[0001] This utility model belongs to the field of power semiconductor device technology, and specifically relates to a chip explosion-proof packaging structure. Background Technology

[0002] With the development of industrial technology, some special applications require a device that can accurately break down at a specific high voltage and carry a large current. Thus, precision breakdown thyristors have emerged. These devices are often derived by improving the materials and structure of traditional thyristors. For example, in high-energy pulse systems, the breakdown characteristics of such devices may be utilized to achieve rapid energy release or signal conversion.

[0003] However, due to its unique operating conditions (breakdown at a specified high voltage value and current exceeding hundreds of kiloamperes), traditional thyristor packaging technology faces significant challenges. Traditional packaging structures are not designed to account for such a high-energy instantaneous release. When such devices operate under these conditions, the enormous energy generated causes a rapid increase in internal temperature, and the resulting thermal stress may cause the ceramic package to crack or the connection between the metal leads and the chip to break. Simultaneously, the electromagnetic force generated by the high current may also compromise the mechanical stability of the packaging structure. Utility Model Content

[0004] To achieve the above objectives, the technical solution adopted by this utility model is: a chip explosion-proof packaging structure, comprising: a precisely penetrated thyristor chip; a cathode assembly is provided on the first surface of the precisely penetrated thyristor chip, and an anode assembly is provided on the second surface of the precisely penetrated thyristor chip; the precisely penetrated thyristor chip is located between the anode assembly and the cathode assembly and is tightly connected to both; an explosion-proof ring is installed between the cathode assembly and the anode assembly; and a first cavity space is formed between the anode assembly, the cathode assembly, and the explosion-proof ring.

[0005] A ceramic umbrella skirt is provided between the cathode assembly and the anode assembly. The ceramic umbrella skirt is located outside the explosion-proof ring. A first anode welding ring is welded to the outside of the anode assembly. A first cathode welding ring is welded to the outside of the cathode assembly. A first cathode connecting ring is welded to the outside of the first cathode welding ring. The anode assembly, the first anode welding ring, the ceramic umbrella skirt, the first cathode connecting ring, the first cathode welding ring, and the cathode assembly form a second cavity space.

[0006] Furthermore, the anode assembly includes an anode molybdenum sheet and an anode copper block, with the anode copper block located below the anode molybdenum sheet. One surface of the anode molybdenum sheet is bonded to the second surface of the precisely broken thyristor chip, and the other surface of the anode molybdenum sheet is bonded to one end face of the anode copper block. The cathode assembly includes a cathode molybdenum sheet and a cathode copper block, with the cathode copper block located above the cathode molybdenum sheet. One surface of the cathode molybdenum sheet is bonded to the first surface of the precisely broken thyristor chip, and the other surface of the cathode molybdenum sheet is bonded to one end face of the cathode copper block.

[0007] Furthermore, the cathode copper block has the same structure as the anode copper block, with a groove on its edge and several blind holes on its inner side. The depth of the blind holes is less than the width of the groove, and a fixing ring is provided in the groove. The height of the fixing ring is lower than the height of the blind holes.

[0008] Furthermore, an anode spring pad is provided in the groove of the cathode copper block. The anode spring pad is fixed in the groove by a fixing ring. The anode spring pad is lower than the fixing ring. The other end of the anode spring pad is in contact with the end face of the anode copper block and is placed in the groove of the anode copper block. It is also fixed in the groove by a fixing ring.

[0009] Furthermore, the feature is that the cathode copper block, the first cathode welding ring, the ceramic umbrella skirt, the first cathode connecting ring, the first anode welding ring, and the anode copper block are connected in an airtight manner, and the airtight connection is welding.

[0010] Furthermore, the feature is that the cathode molybdenum sheet, cathode copper block, anode molybdenum sheet, and anode copper block are connected by pressure.

[0011] Furthermore, the cathode copper block, anode copper block, explosion-proof ring, and anode spring pad are connected under pressure by the deformation of the spring pad.

[0012] Furthermore, the anode spring pad is made of metal spring steel, and the explosion-proof ring is made of high-strength insulating material.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows: This utility model patent sets a cathode molybdenum sheet on the first surface of the thyristor chip through precise penetration, sets a cathode copper block on the cathode molybdenum sheet, and provides a groove on the outer ring of the cathode copper block. An anti-explosion ring is set on the top of the anode spring pad. The anode copper block, anode spring pad, anti-explosion ring, and cathode copper block constitute a first cavity space. Furthermore, by setting an anode molybdenum sheet on the second surface of the thyristor chip through precise penetration, setting an anode copper block on the anode molybdenum sheet, setting a ceramic umbrella skirt between the anode copper block and the cathode copper block, welding a first anode welding ring to the outside of the anode copper block, welding a first cathode welding ring to the outside of the cathode copper block, and welding a first cathode connecting ring to the outside of the first cathode welding ring, the anode copper block, first anode welding ring, ceramic umbrella skirt, first cathode connecting ring, first cathode welding ring, and cathode copper block constitute a second cavity space. The first cavity space and the second cavity space form a double layer of protection, giving the structure stronger anti-explosion characteristics.

[0014] The explosion-proof chip packaging structure of this utility model provides sufficient internal space in the precise breakdown thyristor packaging structure and ensures the current carrying capacity of the chip. At the same time, through the internal explosion-proof ring, it achieves the explosion-proof capability of the chip to withstand extremely high intensity current impacts when the high voltage breakdown occurs. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a front view schematic diagram of the chip explosion-proof packaging structure of this utility model;

[0017] Figure 2 This is a cross-sectional schematic diagram of the explosion-proof chip packaging structure of this utility model;

[0018] Figure 3 This is a disassembly diagram and structural schematic diagram of the explosion-proof chip packaging structure of this utility model;

[0019] Figure 4 This is a schematic diagram of the explosion-proof chip packaging structure of this utility model;

[0020] Among them, 1-precisely penetrates the thyristor chip, 2-anode molybdenum sheet, 3-cathode molybdenum sheet, 4-anode copper block, 5-cathode copper block, 6-anode spring pad, 7-explosion-proof ring, 8-first anode welding ring, 9-first cathode welding ring, 10-first cathode connecting ring, 11-ceramic umbrella skirt. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. It should be understood that the preferred embodiments described herein are only for illustration and explanation of the present utility model and are not intended to limit the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. The components of the embodiments of the present utility model described and shown in the accompanying drawings can be arranged and designed in various different configurations. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model. In the embodiments, the components of the embodiments of the present application described and shown in the accompanying drawings can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of the present application.

[0022] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection; they can refer to an electrical connection; they can refer to a hydraulic connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0023] See Figure 1-4 As shown, where Figure 3 and Figure 2 A cross-sectional schematic diagram and an exploded schematic diagram of a novel precision breakdown thyristor device packaging structure with enhanced explosion-proof characteristics according to an embodiment of the present invention are shown. Figure 2 In the diagram, 1 is the precision-broken thyristor chip, 2 is the anode molybdenum sheet, 3 is the cathode molybdenum sheet, 4 is the anode copper block, 5 is the cathode copper block, 6 is the anode spring pad, 7 is the explosion-proof ring, 8 is the first anode welding ring, 9 is the first cathode welding ring, 10 is the first cathode connecting ring, and 11 is the ceramic umbrella skirt.

[0024] This utility model is a high-strength explosion-proof chip packaging structure, including a stacked structure. The stacked structure includes an anode copper block 4, an anode molybdenum sheet 2, a precision-broken thyristor chip 1, a cathode molybdenum sheet 3, and a cathode copper block 5 stacked sequentially. The stacked structure is tightly connected.

[0025] The aforementioned precision-broken thyristor chip has a circular structure. A first electrode is provided on the first surface of the precision-broken thyristor chip 1, and a cathode molybdenum sheet 3 is provided on the first electrode. A second electrode is provided on the second surface of the precision-broken thyristor chip 1, and an anode molybdenum sheet 2 is provided on the second electrode. The cathode molybdenum sheet 3 and the anode molybdenum sheet 2 have the same structure and are both circular. A cathode copper block 5 is provided on the cathode molybdenum sheet 3. The two surfaces of the cathode molybdenum sheet 3 are flat. One surface of the cathode molybdenum sheet 3 is attached to the first electrode on the first surface of the precision-broken thyristor chip 1, and the other surface of the cathode molybdenum sheet 3 is attached to one end face of the cathode copper block 5. An anode copper block 4 is provided on the anode molybdenum sheet 2. The two surfaces of the anode molybdenum sheet 2 are flat. One surface of the anode molybdenum sheet 2 is attached to the second electrode on the second surface of the precision-broken thyristor chip 1, and the other surface of the anode molybdenum sheet 2 is attached to one end face of the anode copper block 4.

[0026] The outer ring of the anode copper block 4 has a groove, within which a fixing ring is installed. A circular anode spring pad 6, made of metal spring steel, is installed within the groove of the anode copper block 4. The anode spring pad 6 is fixed to the groove by the fixing ring, and its height is lower than the fixing ring. The outer ring of the cathode copper block 5 also has a groove. An explosion-proof ring 7 is placed on top of the anode spring pad 6. The explosion-proof ring 7 is a ring-shaped structure made of high-strength insulating material and is positioned between the grooves of the anode copper block 4 and the cathode copper block 5, forming a first cavity space. The anode copper block 4, anode spring pad 6, cathode copper block 5, and explosion-proof ring 7 are pressure-connected by the deformation of the anode spring pad 6.

[0027] A ceramic umbrella skirt 11 is disposed between the anode copper block 4 and the cathode copper block 5. A first anode welding ring 8 is fixed to the outside of the anode copper block 4, and the other end of the first anode welding ring 8 is welded and fixed to one end of the ceramic umbrella skirt 11. A first cathode welding ring 9 is fixed to the outside of the cathode copper block 5, and a first cathode connecting ring 10 is fixedly welded to the outside of the first cathode welding ring 9. The first cathode connecting ring 10 is fixed to the edge of one end of the ceramic umbrella skirt 11. The anode copper block 4, the first anode welding ring 8, the ceramic umbrella skirt 11, the first cathode welding ring 9, the first cathode connecting ring 10, and the cathode copper block 5 constitute the second cavity space.

[0028] It should be noted that in the packaging structure of this utility model, the anode copper block 4, the first anode welding ring 8, the ceramic umbrella skirt 11, and the first cathode connecting ring 10 are welded together to achieve a hermetic connection, and the cathode copper block 5 is welded to the second cathode welding ring to achieve a hermetic connection. During packaging, the anode molybdenum sheet 2, the precisely penetrated thyristor chip 1, the cathode molybdenum sheet 3, the anode spring pad 6, and the explosion-proof ring 7 are placed in sequence, and then the first cathode welding ring 9 and the first cathode connecting ring 10 are fixedly welded to ensure the hermeticity of the cavity. In addition, 16 blind holes are opened around the sides of the anode copper block 4 and the cathode copper block 5. The height of the explosion-proof ring 7 is lower than the height of the blind holes, and the height of the fixing ring is lower than the height of the blind holes. The blind holes provide sufficient cavity space while ensuring the current carrying capacity of the chip.

[0029] This utility model patent establishes a first cavity space by precisely penetrating the first surface of a thyristor chip, placing a molybdenum cathode sheet 3, a copper cathode block 5 on the molybdenum cathode sheet 3, and a groove on the outer ring of the copper cathode block 5. An explosion-proof ring 7 is placed on top of an anode spring pad 6. The copper cathode block 4, anode spring pad 6, explosion-proof ring 7, and copper cathode block 5 together form a first cavity space. A molybdenum anode sheet 2 is then placed on the second surface of the precisely penetrating thyristor chip 1, with a copper anode block 4 on the molybdenum cathode sheet 2. A ceramic umbrella skirt is placed between the copper anode block 4 and the copper cathode block 5. A first anode welding ring 8 is welded to the outside of the copper anode block 4, a first cathode welding ring 9 is welded to the outside of the copper cathode block 5, and a first cathode connecting ring 10 is welded to the outside of the first cathode welding ring 9. The copper anode block 4, first anode welding ring 8, ceramic umbrella skirt 11, first cathode connecting ring 10, first cathode welding ring 9, and copper cathode block 5 together form a second cavity space. This double-layer protection between the first and second cavity spaces provides stronger explosion-proof characteristics.

[0030] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be primarily defined by the scope of the claims.

Claims

1. A chip anti-blowout packaging structure, characterized in that, The application relates to a precision breakdown thyristor chip, which comprises a first surface provided with a cathode assembly and a second surface provided with an anode assembly; the precision breakdown thyristor chip is located between the anode assembly and the cathode assembly and is tightly connected with the two assemblies; an anti-explosion ring and a ceramic umbrella skirt are arranged between the cathode assembly and the anode assembly, and the anti-explosion ring and the ceramic umbrella skirt divide the space between the anode assembly and the cathode assembly into a first cavity space and a second cavity space. The cathode assembly is connected with a first cathode connecting ring, and the first cathode connecting ring is matched with the anode assembly to clamp and position the ceramic umbrella skirt.

2. The chip anti-explosion packaging structure according to claim 1, wherein: The anode assembly and the cathode assembly both comprise molybdenum sheets, copper blocks and welding rings; the molybdenum sheets are located between the copper blocks and the precision breakdown thyristor chip; and the welding rings are butted at the edges of the copper blocks.

3. The chip anti-explosive package structure according to claim 2, wherein, The edges of the copper blocks are provided with grooves, and the inner sides of the grooves are provided with a plurality of blind holes; the depth of the blind holes is smaller than the width of the grooves.

4. The chip anti-explosive package structure according to claim 3, wherein: The grooves are provided with fixing rings, and the height of the fixing rings is lower than the height of the blind holes.

5. The chip anti-explosion packaging structure according to claim 4, characterized in that: The grooves are provided with elastic pads, and the anti-explosion ring is located in the grooves and is in close contact with the elastic pads.

6. The chip anti-explosive package structure according to claim 4, wherein, ​

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