Pressing mechanism capable of being folded and unfolded and LDI equipment

Abstract

The utility model discloses a foldable pressing mechanism and LD I equipment, and the mechanism comprises an installation assembly which is disposed on the bottom surface of an adsorption platform. A folding and unfolding assembly; the rotary pressing assembly is arranged at one end, far away from the mounting assembly, of the folding and unfolding assembly; the rotary pressing assembly applies pressure perpendicular to the top surface of the adsorption platform to the PCB; the mounting assembly, the folding and unfolding assembly and the rotary pressing assembly jointly form a double-rocker mechanism, the mounting assembly is a rack of the double-rocker mechanism, the folding and unfolding assembly is double rockers of the double-rocker mechanism, and the rotary pressing assembly is a connecting rod of the double-rocker mechanism. The mounting assembly, the folding and unfolding assembly and the rotary pressing assembly form a double-rocker four-rod structure, so that the folding and unfolding assembly can drive the rotary pressing assembly to swing relative to the mounting assembly and further swing relative to the adsorption platform, the rotary pressing assembly can quickly move to the bottom surface of the adsorption platform in a non-detachable manner, and when LD I equipment is used for processing a large-size PCB (Printed Circuit Board), the assembly efficiency is improved. And the pressing mechanism can be quickly separated from the adsorption platform, so that the double-adsorption platform is quickly spliced, and the processing efficiency of the large-size PCB is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of photoetching machine, concretely relates to a foldable compression mechanism and LDI device. BACKGROUND

[0002] Direct writing photoetching machine refers to all mask-free photoetching equipment that forms patterns on substrate surface directly through computer control of light beam, and LDI device refers to direct writing photoetching equipment that uses laser as light source, which is mainly applied to exposure link in PCB (printed circuit board) manufacturing, and directly transfers circuit pattern to substrate through ultraviolet laser scanning. LDI device includes a compression mechanism for compressing PCB on adsorption platform to maintain its flatness and positional stability, thereby ensuring imaging accuracy and avoiding errors caused by displacement or vibration, and the common compression mechanism includes vacuum adsorption compression mechanism, which generates negative pressure on the surface of adsorption platform through vacuum pump to adsorb and fix PCB on the platform, but PCB may be warped due to handling or storage, so that PCB cannot be tightly attached to the adsorption platform, and therefore mechanical clamp compression mechanism is needed to compress PCB around or in key areas to meet high-precision exposure requirements.

[0003] In the process of PCB manufacturing, large-size PCBs need to combine multiple adsorption platforms into a large-area adsorption platform to support large-size PCBs, but the mechanical clamp compression mechanism installed around the adsorption platform affects the combination of adsorption platforms, and the operator needs to remove it before combining the adsorption platforms, so the existing fixed installation type mechanical clamp compression mechanism has the following problems: it needs to rely on manual disassembly, which is contrary to the development trend of industry intelligence and automation; the disassembly process occupies a lot of production time, and may cause equipment precision to decrease due to operation errors, affecting the imaging quality of the equipment. UTILITY MODEL CONTENTS

[0004] The utility model discloses a foldable compression mechanism and LDI device to solve the problem that fixed installation type mechanical clamp compression mechanism cannot meet the production requirements of large-size PCB and the convenience of operation, and the specific technical scheme is as follows:

[0005] A foldable compression mechanism can compress PCB on the top surface of the adsorption platform of LDI device, which comprises: an installation assembly arranged on the bottom surface of the adsorption platform; a folding assembly rotating around the installation assembly; a rotary compression assembly arranged at one end of the folding assembly away from the installation assembly, which can exert a vertical pressure on the top surface of the adsorption platform; the installation assembly, folding assembly and rotary compression assembly form a double rocker mechanism, the installation assembly is the frame of the double rocker mechanism, the folding assembly is the double rocker of the double rocker mechanism, and the rotary compression assembly is the connecting rod of the double rocker mechanism.

[0006] Further, the folding and unfolding assembly comprises a first connecting plate connected to the side of the mounting assembly and the side of the rotating and pressing assembly respectively, and a second connecting plate connected to the side of the mounting assembly and the side of the rotating and pressing assembly respectively; when the second connecting plate and the first connecting plate rotate away from the adsorption platform, the rotating and pressing assembly rotates relative to the first connecting plate, the second connecting plate and the mounting assembly.

[0007] Preferably, the connecting point of the first connecting plate and the mounting assembly is connecting point A, the connecting point of the first connecting plate and the rotating and pressing assembly is connecting point B, the connecting point of the second connecting plate and the mounting assembly is connecting point C, the connecting point of the second connecting plate and the rotating and pressing assembly is connecting point D, the first connecting plate is a straight plate, the second connecting plate is an L-shaped plate, connecting point A is closer to the adsorption platform than connecting point C, and connecting point D is closer to the adsorption platform than connecting point B; the folding and unfolding assembly further comprises a rotating air cylinder rotating around the mounting assembly, a telescopic end of the rotating air cylinder is connected to the second connecting plate through an air cylinder connecting plate, the rotating air cylinder can drive the connecting point D of the second connecting plate to rotate around the connecting point B away from the adsorption platform, and then the connecting point B drives the first connecting plate to rotate around the mounting assembly away from the adsorption platform; and a stretching spring arranged at the mounting assembly and the rotating and pressing assembly respectively, the stretching spring can drive the rotating and pressing assembly to rotate towards the adsorption platform.

[0008] Preferably, the mounting assembly comprises a mounting horizontal plate arranged on the bottom surface of the adsorption platform, a supporting vertical plate arranged at each end of the mounting horizontal plate and vertically arranged on the bottom surface of the adsorption platform, and a limiting protrusion arranged at the side of the supporting vertical plate close to the rotating and pressing assembly, the limiting protrusion can limit the movement of the rotating and pressing assembly towards the adsorption platform, and when the limiting protrusion contacts the folding and unfolding assembly, the rotating and pressing assembly can exert a pressure on the PCB vertically directed to the top surface of the adsorption platform.

[0009] Preferably, the rotating and pressing assembly comprises a cylinder mounting frame connected to the first connecting plate and the second connecting plate away from the mounting assembly, the cylinder mounting frame is a connecting rod of a double rocker mechanism, the connecting rod can rotate relative to the mounting assembly, the bottom surface of the cylinder mounting frame forms a limiting plate, and the limiting plate can limit the movement of the second connecting plate away from the adsorption platform; a pressing air cylinder arranged at each end of the cylinder mounting frame, the telescopic end of the pressing air cylinder moves vertically to the top surface of the cylinder mounting frame; and a pressing plate connected to the telescopic end of the pressing air cylinder, the bottom surface of the pressing plate is perpendicular to the movement direction of the pressing air cylinder, and the bottom surface of the pressing plate can completely adhere to the PCB placed on the top surface of the adsorption platform.

[0010] The LDI device comprises a pressing mechanism and an adsorption platform.

[0011] According to the above technical scheme, the utility model has the following beneficial effects:

[0012] This invention forms a double rocker four-bar structure by using an installation component, a folding component, and a rotary clamping component. This allows the folding component to drive the rotary clamping component to swing relative to the installation component, and then relative to the adsorption platform. This enables the rotary clamping component to move quickly and non-disassemble to the bottom surface of the adsorption platform. When the LDI equipment processes large-size PCBs, the clamping mechanism can quickly separate from the adsorption platform and then quickly assemble into a double adsorption platform, improving the processing efficiency of large-size PCBs. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of an embodiment of the clamping mechanism;

[0014] Figure 2 This is a schematic diagram of a dual-rocker mechanism;

[0015] Figure 3 shows side view a and side view b of the clamping mechanism in conjunction with the adsorption platform;

[0016] Figure 4 This is a schematic diagram of an embodiment of the clamping mechanism.

[0017] In the diagram: 1. Mounting assembly; 11. Mounting horizontal plate; 12. Supporting vertical plate; 13. Limiting protrusion; 2. Folding assembly; 21. Rotary cylinder; 22. Cylinder connecting plate; 23. First connecting plate; 24. Second connecting plate; 25. Tension spring; 3. Rotary clamping assembly; 31. Cylinder mounting bracket; 32. Clamping cylinder; 33. Pressure plate; 34. Rotary bracket. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] In the description of the embodiments of this utility model, it should be noted that the terms "inner", "outer", "upper", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the utility model product is usually placed when in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0020] Example 1

[0021] As is commonly known, an LDI device includes an adsorption platform, on which the PCB is laid flat. The mechanical clamping plate 33 mechanism of the LDI device includes a pressure plate 33, which can apply pressure perpendicular to the top surface of the adsorption platform to the edge of the PCB. Together with the vacuum adsorption pressure plate 33 mechanism, it completely fits the warped PCB with the top surface of the adsorption platform, so that it can meet the requirements of high-precision exposure.

[0022] like Figure 1 and Figure 2 As shown, this embodiment is a mechanical pressure plate 33 mechanism, which includes: a mounting component 1, which is disposed on the bottom surface of the adsorption platform; a folding component 2 that rotates around the mounting component 1; and a rotary pressing component 3 disposed at the end of the folding component 2 away from the mounting component 1, which can apply pressure to the PCB perpendicularly pointing to the top surface of the adsorption platform; the mounting component 1, the folding component 2, and the rotary pressing component 3 together form a double rocker mechanism, the mounting component 1 is the frame of the double rocker mechanism, the folding component 2 is the double rocker of the double rocker mechanism, and the rotary pressing component 3 is the connecting rod of the double rocker mechanism.

[0023] Specifically, the top surface of mounting component 1 is fixedly connected to the bottom surface of the adsorption platform by bolts, so that the mounting component 1 is relatively fixed relative to the PCB placed on the adsorption platform; secondly, the folding component 2 is rotatably connected to the side of mounting component 1 by pins, so that it can rotate relative to mounting component 1, and thus rotate relative to the adsorption platform and the PCB; thirdly, the rotating clamping component 3 is rotatably connected to the folding component 2 by two pins, so that the folding component 2 can drive the rotating clamping component 3 to rotate relative to mounting component 1, and thus rotate relative to the adsorption platform. The moving end of the rotating clamping component 3 is located on the top surface of the adsorption component, which can apply downward pressure to the PCB, so that it can be tightly attached to the adsorption platform.

[0024] Secondly, the dual rocker mechanism is a special form of the hinged four-bar linkage. Its core feature is that both connecting rods are rockers, which can only oscillate back and forth rather than rotate a full circle. It consists of a frame, two rockers and a connecting rod. The two rockers are connected by the connecting rod and neither can complete a full circle of rotation, but it can achieve precise oscillation control. This allows the unfolding component 2 to precisely control the oscillation angle of the rotating clamping component 3 relative to the mounting component 1. As a result, the rotating clamping component 3 can apply vertical pressure to the PCB and also move away from the adsorption platform, allowing the adsorption platform to quickly merge into a dual adsorption platform, thereby processing large-size PCBs.

[0025] Secondly, the four links in the dual rocker mechanism need to meet one of the following conditions: 1. The length of the longest link plus the length of the shortest link is not greater than the sum of the lengths of the other two links, where the connecting link is the shortest link; 2. The length of the longest link plus the length of the shortest link is greater than the sum of the lengths of the other two links. In this case, regardless of which link is used as the frame, it is a dual rocker mechanism.

[0026] In this embodiment, the lengths of the four rods satisfy condition one, namely, the lengths of the frame formed by the mounting component 1, the lengths of the rocker arms formed by the folding and unfolding components 2, and the lengths of the frame formed by the rotating and pressing components 3 satisfy condition one. The specific lengths are determined according to the production site.

[0027] Furthermore, the folding assembly 2 includes: a first connecting plate 23 whose two ends are respectively connected to the side of the mounting assembly 1 and the side of the rotary pressing assembly 3, and a second connecting plate 24 whose two ends are respectively connected to the side of the mounting assembly 1 and the side of the rotary pressing assembly 3; when the second connecting plate 24 and the first connecting plate 23 rotate away from the adsorption platform, the rotary pressing assembly 3 rotates relative to the first connecting plate 23, the second connecting plate 24 and the mounting assembly 1.

[0028] Specifically, both the first connecting plate 23 and the second connecting plate 24 are rockers, which are shown in the figure as one of the limiting positions of the unfolding component 2. At this time, the movement direction of the rotating pressing component 3 is perpendicular to the adsorption platform. When the first connecting plate 23 and the second connecting plate 24 rotate counterclockwise, the second connecting plate 24 can drive the rotating pressing component 3 to rotate counterclockwise, so that the rotating pressing component 3 rotates relative to the adsorption platform and the mounting component 1, thereby allowing the rotating pressing component 3 to move away from the top surface of the adsorption platform, improving the ease of operation of the rotating pressing component 3 when it is suitable for large-size PCBs.

[0029] Furthermore, the connection point between the first connecting plate 23 and the mounting component 1 is connection point A, the connection point between the first connecting plate 23 and the rotary pressing component 3 is connection point B, the connection point between the second connecting plate 24 and the mounting component 1 is connection point C, and the connection point between the second connecting plate 24 and the rotary pressing component 3 is connection point D. The first connecting plate 23 is a straight plate, and the second connecting plate 24 is an L-shaped plate. Connection point A is closer to the adsorption platform than connection point C, and connection point D is closer to the adsorption platform than connection point B. The folding and unfolding component 2 also includes: a rotary cylinder 21 that rotates around the mounting component 1 at one end. The telescopic end of the rotary cylinder 21 is connected to the second connecting plate 24 through a cylinder connecting plate 22. The rotary cylinder 21 can drive the connection point D of the second connecting plate 24 to rotate around the connection point B in a direction away from the adsorption platform, and then the connection point B drives the first connecting plate 23 to rotate around the mounting component 1 in a direction away from the adsorption platform. Tension springs 25 are respectively set at both ends of the mounting component 1 and the rotary pressing component 3. The tension springs 25 can drive the rotary pressing component 3 to rotate in a direction closer to the adsorption platform.

[0030] Specifically, the connection point A between the first connecting plate 23 and the mounting assembly 1 is higher than the connection point C between the second connecting plate 24 and the mounting assembly 1. When the rotating clamping assembly 3 is in the position... Figure 2When the first connecting plate 23 is in the middle position, the connection point B between the straight first connecting plate 23 and the rotary clamping assembly 3 is lower than the connection point D between the L-shaped second connecting plate 24 and the rotary clamping assembly 3. Secondly, the bottom end of the rotary cylinder 21 is rotatably connected to the side plate of the mounting assembly 1, and its telescopic end is rotatably connected between the connection points C and D of the cylinder connecting plate 22 and the second connecting plate 24. The cylinder connecting plate 22 is also an L-shaped plate, with one side perpendicular to the axis of the rotary cylinder 21 and the other side rotatably connected to the second connecting plate 24. This allows the telescopic movement of the telescopic end of the rotary cylinder 21 to be converted into the rotation of the second connecting plate 24 relative to the mounting assembly 1. Consequently, the second connecting plate 24 drives the rotary clamping assembly 3 to rotate relative to the first connecting plate 23, which in turn drives the first connecting plate 23 to rotate relative to the mounting assembly 1. This allows the rotary clamping assembly 3 to rotate away from the adsorption platform, thereby enabling arbitrary changes in the position of the rotary clamping assembly 3 and balancing the production requirements and operational convenience of large-size PCB boards.

[0031] Secondly, the two ends of the tension spring 25 are rotatably connected to the sides of the mounting assembly 1 and the rotary clamping assembly 3, respectively. When the rotary cylinder 21 extends and drives the rotary clamping assembly 3 away from the adsorption platform, the two ends of the tension spring 25 are stretched to generate elastic force. When the telescopic end of the rotary cylinder 21 retracts or the air pressure inside the rotary cylinder 21 decreases, the tension spring 25 can drive the rotary clamping assembly 3 back through the first connecting plate 23 and the second connecting plate 24. Figure 2 The position of the cylinder 21 is adjusted to apply pressure to the PCB, thereby reducing the gas usage of the rotary cylinder 21, reducing energy loss, and lowering production costs.

[0032] Furthermore, the mounting assembly 1 includes: a mounting horizontal plate 11 disposed on the bottom surface of the adsorption platform; support vertical plates 12 disposed at both ends of the mounting horizontal plate 11, the support vertical plates 12 being perpendicular to the bottom surface of the adsorption platform; and limiting protrusions 13 disposed on the sides of the support vertical plates 12 near the rotating pressing assembly 3, the limiting protrusions 13 being able to restrict the folding assembly 2 from driving the rotating pressing assembly 3 toward the adsorption platform, and when the limiting protrusions 13 contact the folding assembly 2, the rotating pressing assembly 3 being able to apply pressure to the PCB perpendicularly pointing toward the top surface of the adsorption platform.

[0033] Specifically, the mounting plate 11 is bolted to the edge of the adsorption platform, and its two ends are fixedly connected to two supporting vertical plates 12 by bolts. The opposite sides of the supporting vertical plates 12 are rotatably connected to the first connecting plate 23 and the second connecting plate 24. The rotation center lines of the first connecting plate 23 and the second connecting plate 24 are perpendicular to the opposite sides of the supporting vertical plates 12 and parallel to the side of the adsorption platform. This ensures that when the rotating clamping assembly 3 rotates relative to the mounting assembly 1, the plane of its rotation trajectory is perpendicular to the bottom surface of the adsorption platform. Consequently, during the rotation process, the intersection line between the surface of the rotating clamping assembly 3 that contacts the PCB and the top surface of the adsorption platform is always parallel to the side of the adsorption platform, thus ensuring its clamping effect on the PCB.

[0034] Secondly, a limiting protrusion 13 is formed on a vertical side of the supporting vertical plate 12 relative to the rotating clamping assembly 3. The limiting protrusion 13 can contact the side of the rotating clamping assembly 3, thereby restricting its rotation toward the mounting assembly 1. This allows the rotating clamping assembly 3 to apply vertical downward pressure to the PCB, thereby ensuring its clamping effect while improving operational convenience, so that the warped PCB edge can fit against the top surface of the adsorption platform.

[0035] like Figure 3a , Figure 3b and Figure 4 As shown, Figure 3a This refers to the extreme position where the rotating clamping assembly 3 is restricted by the limiting protrusion 13 to apply pressure to the PCB. Figure 3b This refers to the extreme position where the unfolding component 2 drives the rotating pressing component 3 to rotate away from the adsorption platform.

[0036] The rotary clamping assembly 3 includes: a cylinder mounting bracket 31 connected to the ends of the first connecting plate 23 and the second connecting plate 24 away from the mounting assembly 1; the cylinder mounting bracket 31 is a connecting rod of a double rocker mechanism, which can rotate relative to the mounting assembly 1; the bottom surface of the cylinder mounting bracket 31 forms a limiting plate, which can limit the second connecting plate 24 away from the adsorption platform; clamping cylinders 32 respectively disposed at both ends of the cylinder mounting bracket 31, the telescopic end of the clamping cylinder 32 moving in a direction perpendicular to the top surface of the cylinder mounting bracket 31; and a pressure plate 33 connected to the telescopic ends of the clamping cylinders 32 at both ends, the bottom surface of the pressure plate 33 being perpendicular to the direction of movement of the clamping cylinders 32, and the bottom surface of the pressure plate 33 being able to completely fit against the PCB placed on the top surface of the adsorption platform.

[0037] Specifically, two vertical plates are fixedly connected to the side of the cylinder mounting bracket 31 near the folding assembly 2. The first connecting plate 23 and the second connecting plate 24 are rotatably connected to the two vertical plates. That is, connection point B and connection point D are located on the two vertical plates, and the part between them is the connecting rod of the double rocker mechanism. That is, the second connecting plate 24 drives the vertical plate to rotate relative to the first connecting plate 23, and the vertical plate drives the first connecting plate 23 to rotate relative to the supporting vertical plate 12, so as to realize the movement of the cylinder mounting bracket 31 relative to the adsorption platform. Secondly, the second connecting plate 24 is an L-shaped plate. When the side plate connected to the vertical plate rotates relative to the bottom surface of the cylinder mounting bracket 31, it can contact the bottom surface, so that the bottom surface of the cylinder mounting bracket 31 can limit the second connecting plate 24 from moving away from the adsorption platform. This limits the position of the rotating pressing assembly 3 away from the mounting assembly 1, and allows the rotating pressing assembly 3 to have a swing stroke. This allows it to move the minimum distance to achieve the effect of separating from the adsorption platform, thereby reducing the movement time and improving production efficiency.

[0038] Secondly, the movement direction of the clamping cylinder 32 is perpendicular to the bottom surface of the cylinder mounting bracket 31, so that when the bottom surface of the cylinder mounting bracket 31 is parallel to the top surface of the adsorption platform, the movement direction of the clamping cylinder 32 is perpendicular to the top surface of the adsorption platform, thereby enabling it to apply a vertical downward pressure to the PCB. The side of the adsorption platform near the clamping cylinder 32 has a U-shaped opening groove that allows the telescopic rod of the clamping cylinder 32 to pass through, so that the pressure plate 33, which is fixedly connected to the telescopic end of the clamping cylinder 32 by bolts, can contact the PCB placed in the middle of the adsorption platform.

[0039] In this embodiment, the bottom surface of the pressure plate 33 is connected to the end of the telescopic rod of the clamping cylinder 32 by bolts. The bottom surface of the pressure plate 33 has an area on the side near the PCB that does not interfere with the telescopic rod of the clamping cylinder 32. This area is the rectangular area where the pressure plate 33 presses down on the PCB in this embodiment. The length of this rectangular area is parallel to the side of the PCB, ensuring that the force-bearing area on the side of the PCB is uniform, thereby improving the pressing effect.

[0040] Furthermore, the rotary clamping assembly 3 also includes a rotary bracket 34 with the clamping cylinder 32 and the pressure plate 33 connected to its two ends respectively. The clamping cylinder 32, the pressure plate 33 and the two rotary brackets 34 form a double crank mechanism.

[0041] Specifically, one end of the rotating bracket 34 has a through hole for coaxial connection with the telescopic rod of the clamping cylinder 32, allowing the clamping cylinder 32 to drive the rotating bracket 34 to rotate. The other end of the rotating bracket 34 is rotatably connected to the pressure plate 33 via bolts, allowing the rotating bracket 34 to drive the pressure plate 33 to move relative to the edge of the PCB. The two clamping cylinders 32, fixed on the cylinder mounting bracket 31, form a frame, and their rotatable telescopic rods are the power source for the double crank mechanism. The two rotating brackets 34 are cranks, and the pressure plate 33 is a connecting rod. The double crank mechanism allows the clamping cylinder 32 to extend its telescopic rod to drive the rotating bracket 34 and the pressure plate 33 away from the PCB in the vertical direction when replacing a small-sized PCB. Then, the telescopic rod rotates, causing the rotating bracket 34 to rotate. The rotating bracket 34 then drives the pressure plate 33 to move away from the edge of the PCB, thus achieving rapid separation of the rotating clamping assembly 3 from the PCB, thereby increasing the PCB replacement rate and improving production efficiency.

[0042] Example 2

[0043] This second embodiment is an LDI device, which includes the first embodiment and the adsorption platform.

[0044] Specifically, the PCB is placed on the top surface of the adsorption platform. In Embodiment 1, it is installed on the bottom surface of the adsorption platform. The rotating clamping component 3 used to press the PCB is placed above the top surface of the adsorption platform. When processing large-size PCBs in Embodiment 2, the rotating clamping component 3 moves away from the side of the adsorption platform and moves below it, so that the two adsorption platforms can be merged into a large-area adsorption platform, thereby improving the efficiency of processing large-size PCBs.

[0045] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

[0046] The technologies, shapes, and structures not described in detail in this utility model are all known technologies.

Claims

1. A collapsible hold-down mechanism capable of holding down a PCB on a top surface of a suction platform of an LDI apparatus, characterized by, The application relates to a compression mechanism for a PCB (Printed Circuit Board) adsorption platform. The compression mechanism comprises: a mounting assembly (1) arranged at the bottom surface of the adsorption platform; a rotating compression assembly (3) capable of applying a vertical pressure to the PCB and pointing to the top surface of the adsorption platform; and 2. The holdback mechanism of claim 1, wherein: a folding and unfolding assembly (2) rotatably connected to the mounting assembly (1) and the rotating compression assembly (3) at two ends, wherein the mounting assembly (1), the folding and unfolding assembly (2) and the rotating compression assembly (3) form a double rocker mechanism, and the folding and unfolding assembly (2) can drive the rotating compression assembly (3) to move away from or close to the top surface of the adsorption platform.

3. The holdback mechanism of claim 1, wherein: The mounting assembly (1) is the frame of the double rocker mechanism, the folding and unfolding assembly (2) is the double rocker of the double rocker mechanism, and the rotating compression assembly (3) is the connecting rod of the double rocker mechanism. The folding and unfolding assembly (2) comprises: a first connecting plate (23) connected to the side surface of the mounting assembly (1) and the side surface of the rotating compression assembly (3) at two ends and a second connecting plate (24) connected to the side surface of the mounting assembly (1) and the side surface of the rotating compression assembly (3) at two ends; when the second connecting plate (24) and the first connecting plate (23) rotate away from the adsorption platform, the rotating compression assembly (3) rotates relative to the first connecting plate (23), the second connecting plate (24) and the mounting assembly (1).

4. The compression mechanism according to claim 3, wherein: the connecting point of the first connecting plate (23) and the mounting assembly (1) is connecting point A, the connecting point of the first connecting plate (23) and the rotating compression assembly (3) is connecting point B, the connecting point of the second connecting plate (24) and the mounting assembly (1) is connecting point C, the connecting point of the second connecting plate (24) and the rotating compression assembly (3) is connecting point D, the first connecting plate (23) is a straight plate, the second connecting plate (24) is an L-shaped plate, the connecting point A is closer to the adsorption platform than the connecting point C, and the connecting point D is closer to the adsorption platform than the connecting point B; the folding and unfolding assembly (2) further comprises: a rotating air cylinder (21) rotatable around the mounting assembly (1), wherein the telescopic end of the rotating air cylinder (21) is connected to the second connecting plate (24) through an air cylinder connecting plate (22), the rotating air cylinder (21) can drive the connecting point D of the second connecting plate (24) to rotate away from the adsorption platform around the connecting point B, and then the connecting point B drives the first connecting plate (23) to rotate away from the adsorption platform around the mounting assembly (1); 5. The holdback mechanism of claim 1, wherein: a tension spring (25) arranged at the mounting assembly (1) and the rotating compression assembly (3) at two ends, wherein the tension spring (25) can drive the rotating compression assembly (3) to rotate towards the adsorption platform. The mounting assembly (1) comprises: a mounting horizontal plate (11) arranged at the bottom surface of the adsorption platform. Support vertical plates (12) are respectively arranged at two ends of the mounting horizontal plate (11), and are perpendicular to the bottom surface of the adsorption platform; Limiting protrusions (13) are respectively arranged at the sides of the support vertical plates (12) close to the rotating and pressing assembly (3), and the limiting protrusions (13) can limit the rotating and pressing assembly (3) from moving towards the adsorption platform driven by the folding and unfolding assembly (2), and when the limiting protrusions (13) are in contact with the folding and unfolding assembly (2), the rotating and pressing assembly (3) can exert a pressure on the PCB vertically to the top surface of the adsorption platform.

6. The holdback mechanism of claim 3 wherein: The rotating and pressing assembly (3) comprises: A cylinder mounting frame (31) is connected to the first connecting plate (23) and the second connecting plate (24) at an end away from the mounting assembly (1), the cylinder mounting frame (31) is a connecting rod of the double rocker mechanism, the connecting rod can rotate relative to the mounting assembly (1), and the bottom surface of the cylinder mounting frame (31) forms a limiting plate, the limiting plate can limit the second connecting plate (24) from moving away from the adsorption platform; A pressing cylinder (32) is respectively arranged at two ends of the cylinder mounting frame (31), and the movement direction of the telescopic end of the pressing cylinder (32) is perpendicular to the top surface of the cylinder mounting frame (31); and A pressing plate (33) is respectively connected to the telescopic end of the pressing cylinder (32) at two ends, the bottom surface of the pressing plate (33) is perpendicular to the movement direction of the pressing cylinder (32), and the bottom surface of the pressing plate (33) can completely adhere to the PCB placed on the top surface of the adsorption platform.

7. The holdback mechanism of claim 6, wherein: The rotating and pressing assembly (3) further comprises two rotating supports (34) respectively connected to the pressing cylinder (32) and the pressing plate (33) at two ends, and the pressing cylinder (32), the pressing plate (33) and the two rotating supports (34) form a double crank mechanism.

8. An LDI apparatus, characterized by, The application further discloses a pressing mechanism comprising the pressing mechanism and the adsorption platform. The application further discloses a PCB folding and unfolding device comprising the PCB folding and unfolding device and the adsorption platform.

Images