Wafer cutting equipment

Abstract

The utility model relates to the technical field of wafer cutting, and discloses wafer cutting equipment which comprises a machining table, a guide rail is fixedly connected to the upper surface of the machining table, two symmetrical cutter bodies are slidably connected to the outer surface of the guide rail, a switching assembly is arranged on the upper surface of the machining table, and a first protective cover is fixedly connected to the upper surface of the machining table. And two symmetrical access holes are formed in the outer surface of the first protective cover. According to the wafer cutting equipment, through the cooperation effect between the two cutter bodies and the switching assembly, the first cutter body and the second cutter body can conduct construction alternately, when one cutter body needs to be maintained, the other cutter body can replace work immediately, equipment shutdown caused by cutter maintenance is avoided, and the service life of the equipment is prolonged. And the two groups of cutter main bodies work alternately, so that the replacement and adjustment time of the cutter main bodies is shortened, the wafer cutting process is more continuous and efficient, and the overall cutting efficiency is improved.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of wafer cutting, in particular to a wafer cutting device. BACKGROUND

[0002] In the semiconductor production process, a cylindrical single crystal silicon is usually cut into multiple wafers from a circular cross section, then the edges of the wafers are cut and polished to remove burrs, and then the wafers are separated into multiple wafer particles, and then the wafer particles are subjected to electroplating and other operations to form semiconductor chips.

[0003] At present, the existing wafer cutting device generally uses a single set of cutters to complete the cutting operation of the wafer. However, this design of a single set of cutters has obvious limitations. Since only one set of cutters is used for cutting, the cutter position needs to be frequently adjusted, the cutters need to be replaced, or other auxiliary operations need to be performed during the cutting process, resulting in a complicated cutting process, a long cutting time, and a limited cutting efficiency. CONTENT OF THE UTILITY MODEL

[0004] In view of the deficiencies of the prior art, the application provides a wafer cutting device which has the advantages of improving wafer cutting efficiency and meeting the needs of large-scale semiconductor production, and solves the problems raised in the background art.

[0005] To achieve the above-mentioned purpose, the application provides the following technical scheme: a wafer cutting device, comprising a machining table, the upper surface of the machining table is fixedly connected with a guide rail, the outer surface of the guide rail is slidably connected with two symmetrical cutter bodies, the upper surface of the machining table is provided with a switching assembly, the upper surface of the machining table is fixedly connected with a first protective cover, two symmetrical maintenance openings are formed in the outer surface of the first protective cover, the inner walls of the two maintenance openings are both hingedly connected with a baffle, the upper surface of the machining table is fixedly connected with a support, the inner side surface of the support is fixedly connected with a protective plate, and the outer surface of the support is hingedly connected with a second protective cover.

[0006] Through the cooperation between the two cutter bodies and the switching assembly, the first cutter body and the second cutter body can be alternately used for construction. When one of the cutter bodies needs to be maintained, the other cutter body can immediately take over the work, avoiding equipment downtime caused by cutter maintenance, greatly improving the construction efficiency, and reducing the time for replacing and adjusting the cutter bodies, so that the wafer cutting process is more continuous and efficient, thereby improving the overall cutting efficiency.

[0007] Further, the inner wall of the machining table is provided with a driving assembly, the driving assembly comprises a moving seat slidably connected to the inner wall of the machining table, the upper surface of the moving seat is fixedly installed with a suction platform, and the upper surface of the suction platform is placed with multiple wafer bodies.

[0008] Through the above scheme, through the action of setting the driving assembly, the adsorption platform can be moved, so that the wafer body can be moved to the lower side of the cutter body for cutting, thereby realizing the automation of wafer cutting and improving the practicability of the device.

[0009] Further, the outer surface of the adsorption platform is fixedly installed with a control power supply.

[0010] Through the above scheme, through the action of setting the control power supply, electrostatic attraction can be generated between the wafer body and the adsorption platform, thereby realizing fixation and improving the processing stability of the wafer body.

[0011] Further, the driving assembly further comprises a cavity, a second lead screw and two second guide rods, the inner wall of the cavity is opened on the outer surface of the machining table, the second servo motor is fixedly embedded on the inner wall of the cavity, and the maintenance plate is installed on the inner wall of the cavity.

[0012] Through the above scheme, the maintenance plate is fixedly connected to the inner wall of the cavity through bolts, so that the maintenance plate can be quickly disassembled, the second servo motor can be quickly maintained, and the practicability is improved.

[0013] Further, the two ends of the second lead screw are rotatably connected to the inner wall of the machining table, one end of the second lead screw is fixedly connected to the output end of the second servo motor, the two ends of the two second guide rods are fixedly connected to the inner wall of the machining table, the outer surface of the second guide rod is slidably connected to the inner wall of the moving seat, and the outer surface of the second lead screw is threadedly connected to the inner wall of the moving seat.

[0014] Through the above scheme, the second servo motor drives the second lead screw to rotate, which can drive the moving seat to move stably, thereby driving the adsorption platform and the wafer body to adjust the horizontal position, so that they can quickly move to the lower side of the cutter body to cut the wafer body, and the processing efficiency is improved.

[0015] Further, the two side surfaces of the moving seat are fixedly connected with organ guards, and the side surface of the organ guard away from the outer surface of the moving seat is fixedly connected to the inner wall of the machining table.

[0016] Through the above scheme, through the action of setting the organ guard, the slot on the machining table can be covered, so that the debris generated by cutting can be prevented from falling into the interior and causing damage to the equipment.

[0017] Further, the switching assembly comprises an assembly box, the bottom surface of the assembly box is fixedly connected to the upper surface of the machining table, two symmetrical guide grooves are formed in the inner wall of the assembly box, a first lead screw is rotatably connected to the inner wall of the assembly box, a first servo motor is fixedly embedded on one side surface of the assembly box, and the output end of the first servo motor is fixedly connected to one end of the first lead screw, a moving frame is threadedly connected to the outer surface of the first lead screw, and the outer surface of the moving frame is slidably connected to the inner wall of the guide groove, and two cutter mounting frames are fixedly connected to the upper surface of the cutter body.

[0018] Through the above scheme, the first servo motor can drive the first lead screw to rotate, thereby driving the moving frame to move, so as to drive the cutter mounting frame and the cutter body to move, thereby realizing the switching between the two cutter bodies, avoiding the equipment downtime caused by cutter body maintenance, and greatly improving the construction efficiency.

[0019] Further, the inner wall of the assembly box is fixedly connected with a first guide rod, and the inner wall of the moving frame is slidably connected to the outer surface of the first guide rod.

[0020] Through the above scheme, through the action of the first guide rod, the movement of the moving frame can be limited and guided, thereby ensuring the stable movement of the moving frame, and the first guide rod can assist in supporting the moving frame, further improving the movement stability of the moving frame.

[0021] Compared with the prior art, the technical scheme of the present application has the following advantages:

[0022] The wafer cutting equipment can realize the alternate construction of the first cutter body and the second cutter body through the cooperation between the two cutter bodies and the switching assembly, and when one of the cutter bodies needs to be maintained, the other cutter body can immediately take over the work, avoiding the equipment downtime caused by cutter maintenance, greatly improving the construction efficiency, and the two cutter bodies work alternately, reducing the time for replacing and adjusting the cutter bodies, making the wafer cutting process more continuous and efficient, and thereby improving the overall cutting efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 It is a three-dimensional structural schematic view of the machining table, guide rail and cutter body of the present application;

[0024] Figure 2 It is a three-dimensional structural schematic view of the present application as a whole;

[0025] Figure 3 It is a three-dimensional structural schematic view of the machining table and driving assembly of the present application;

[0026] Figure 4Fig. 1 is a schematic view of the cross-sectional structure of the processing table and the driving assembly of the present application;

[0027] Figure 5 Fig. 4 is a schematic view of the internal structure of the switching assembly of the present application.

[0028] Fig. 1 is a schematic view of the cross-sectional structure of the processing table and the driving assembly of the present application;

[0029] 1, processing table; 2, guide rail; 3, cutter main body; 4, switching assembly; 401, assembly box; 402, guide groove; 403, first screw rod; 404, first guide rod; 405, first servo motor; 406, moving frame; 407, cutter mounting frame; 5, first protective cover; 6, access hole; 7, baffle; 8, support; 9, protective plate; 10, second protective cover; 11, driving assembly; 1101, cavity; 1102, second servo motor; 1103, access plate; 1104, second screw rod; 1105, second guide rod; 1106, moving seat; 12, adsorption platform; 13, control power supply; 14, wafer main body; 15, organ protective cover. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all the other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0031] Please refer to Figure 1 and Figure 5The wafer cutting equipment in this embodiment comprises a machining table 1, the upper surface of the machining table 1 is fixedly connected with a guide rail 2, the guide rail 2 can position and guide the movement of a cutter body 3, thereby further improving the movement stability of the cutter body 3, ensuring that the cutter body 3 stably cuts the wafer, the outer surface of the guide rail 2 is slidably connected with two symmetrical cutter bodies 3, the upper surface of the machining table 1 is provided with a switching assembly 4, the switching assembly 4 comprises an assembly box 401, the bottom surface of the assembly box 401 is fixedly connected to the upper surface of the machining table 1, two symmetrical guide grooves 402 are formed in the inner wall of the assembly box 401, a first lead screw 403 is rotatably connected to the inner wall of the assembly box 401, a first servo motor 405 is fixedly embedded on one side surface of the assembly box 401, the output end of the first servo motor 405 is fixedly connected to one end of the first lead screw 403, a moving frame 406 is threadedly connected to the outer surface of the first lead screw 403, the outer surface of the moving frame 406 is slidably connected to the inner wall of the guide groove 402, two cutter mounting frames 407 are fixedly connected to the outer surface of the moving frame 406, the bottom surface of the cutter mounting frame 407 is fixedly connected to the upper surface of the cutter body 3, the first servo motor 405 can drive the first lead screw 403 to rotate, thereby driving the moving frame 406 to move, thereby driving the cutter mounting frame 407 and the cutter body 3 to move, thereby realizing the switching between the two cutter bodies 3, avoiding the equipment downtime caused by the maintenance of the cutter body 3, and greatly improving the construction efficiency, the inner wall of the assembly box 401 is fixedly connected with a first guide rod 404, the inner wall of the moving frame 406 is slidably connected to the outer surface of the first guide rod 404, the first guide rod 404 can limit and guide the movement of the moving frame 406, thereby ensuring the stable movement of the moving frame 406, and the first guide rod 404 can assist in supporting the moving frame 406, further improving the movement stability of the moving frame 406.

[0032] Please refer to Figure 1 and Figure 2The upper surface of the machining table 1 is fixedly connected with a first protective cover 5. The first protective cover 5 can block the cutting debris and avoid the splashing of the debris. The outer surface of the first protective cover 5 is provided with two symmetrical maintenance openings 6. The maintenance openings 6 can facilitate the cleaning and maintenance of the corresponding cutter body 3 by the workers. The inner walls of the two maintenance openings 6 are hingedly connected with baffles 7. The upper surface of the machining table 1 is fixedly connected with a support 8. The inner side of the support 8 is fixedly connected with a protective plate 9. The outer surface of the support 8 is hingedly connected with a second protective cover 10. The cooperation between the two cutter bodies 3 and the switching assembly 4 can realize the alternate construction of the first cutter body 3 and the second cutter body 3. When one of the cutter bodies 3 needs to be maintained, the other cutter body 3 can immediately replace the work, avoiding the equipment downtime caused by cutter maintenance, greatly improving the construction efficiency. The alternate work of the two cutter bodies 3 reduces the time for replacing and adjusting the cutter body 3, makes the wafer cutting process more continuous and efficient, and thus improves the overall cutting efficiency.

[0033] Please refer to Figure 1 and Figure 3 The inner wall of the machining table 1 is provided with a driving assembly 11. The driving assembly 11 includes a moving seat 1106 which is slidingly connected to the inner wall of the machining table 1. The upper surface of the moving seat 1106 is fixedly installed with a suction platform 12. The upper surface of the suction platform 12 is placed with a plurality of wafer bodies 14. The driving assembly 11 can move the suction platform 12, so as to move the wafer body 14 to the lower side of the cutter body 3 for cutting, thereby realizing the automation of wafer cutting and improving the practicability of the device. The outer surface of the suction platform 12 is fixedly installed with a control power supply 13. The control power supply 13 can generate an electrostatic attraction force between the wafer body 14 and the suction platform 12, thereby realizing the fixation and improving the processing stability of the wafer body 14.

[0034] Please refer to Figure 1 , Figure 3 and Figure 4The driving assembly 11 further comprises a cavity 1101, a second lead screw 1104 and two second guide rods 1105, the inner wall of the cavity 1101 is arranged on the outer surface of the machining table 1, the second servo motor 1102 is fixedly embedded in the inner wall of the cavity 1101, and the maintenance plate 1103 is arranged on the inner wall of the cavity 1101 and connected to the inner wall of the cavity 1101 by bolts, so that the maintenance plate 1103 can be quickly disassembled, the second servo motor 1102 can be quickly maintained, and the practicability is improved. The two ends of the second lead screw 1104 are rotatably connected to the inner wall of the machining table 1, and one end of the second lead screw 1104 is fixedly connected to the output end of the second servo motor 1102. The two ends of the two second guide rods 1105 are fixedly connected to the inner wall of the machining table 1, and the outer surface of the second guide rod 1105 is slidably connected to the inner wall of the moving seat 1106. The outer surface of the second lead screw 1104 is threadedly connected to the inner wall of the moving seat 1106. The second servo motor 1102 drives the second lead screw 1104 to rotate, which can drive the moving seat 1106 to move stably, thereby driving the adsorption platform 12 and the wafer body 14 to adjust the horizontal position, so that they can quickly move to the lower side of the cutter body 3 to cut the wafer body 14, improve the processing efficiency, and the two sides of the moving seat 1106 are fixedly connected with the organ cover 15, and the side of the organ cover 15 away from the outer surface of the moving seat 1106 is fixedly connected to the inner wall of the machining table 1. Through the arrangement of the organ cover 15, the slot on the machining table 1 can be covered, so that the debris generated by cutting can be prevented from falling into the interior and damaging the equipment.

[0035] The wafer cutting equipment in the embodiment can realize the alternate construction of the first cutter body 3 and the second cutter body 3 through the cooperation between the two cutter bodies 3 and the switching assembly 4. When one of the cutter bodies 3 needs to be maintained, the other cutter body 3 can immediately replace the work, avoiding the equipment downtime caused by cutter maintenance, greatly improving the construction efficiency, and reducing the time for replacing and adjusting the cutter body 3, so that the wafer cutting process is more continuous and efficient, thereby improving the overall cutting efficiency.

[0036] The working principle of the above embodiment is that: firstly, the wafer body 14 is placed on the adsorption platform 12, and under the action of the control power supply 13, the adsorption platform 12 and the wafer body 14 are electrostatically adsorbed, then the starting of the second servo motor 1102 can drive the second lead screw 1104 to rotate, thereby driving the moving seat 1106 to move, so that the wafer body 14 can be moved to the lower side of the cutter body 3 for cutting, then the first servo motor 405 is started to drive the first lead screw 403 to rotate, at this time the rotation of the first lead screw 403 can drive the moving frame 406 and the cutter mounting frame 407 to move, thereby driving the two cutter bodies 3 to move synchronously, and one of the cutter bodies 3 cuts the wafer body 14, finally, if one of the cutter bodies 3 needs to be overhauled, at this time the first lead screw 403 reversely rotates to drive the moving frame 406 and the cutter mounting frame 407 to reversely move, thereby the other cutter body 3 continues to cut, the other cutter body 3 can be moved to the corresponding maintenance opening 6, at this time the turnover baffle 7 can open the maintenance opening 6, so that the cutter body 3 can be overhauled, thereby the two cutter bodies 3 can work alternately, the time for replacing and adjusting the cutter body 3 is reduced, the wafer cutting process is more continuous and efficient, and the overall cutting efficiency is improved.

[0037] It should be noted that, in this document, the terms“first” and“second” and the like are used merely to distinguish one entity or action from another, without necessarily requiring or implying any actual relationship or order between such entities or actions. Moreover, the terms“comprises,”“comprising,” or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element preceded by“comprises a” does not, without more constraints, foreclose the existence of additional identical elements in the process, method, article, or apparatus that comprises the element.

[0038] Although embodiments of the present application have been shown and described, it is to be understood that various modifications, substitutions, replacements and changes can be made to these embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A wafer dicing apparatus, comprising a processing table (1), characterized in that: The upper surface of the processing table (1) is fixedly connected to a guide rail (2), and two symmetrical tool bodies (3) are slidably connected to the outer surface of the guide rail (2). The upper surface of the processing table (1) is provided with a switching component (4). The upper surface of the processing table (1) is fixedly connected to a first protective cover (5). The outer surface of the first protective cover (5) has two symmetrical inspection ports (6). The inner walls of the two inspection ports (6) are hinged with baffles (7). The upper surface of the processing table (1) is fixedly connected to a bracket (8). The inner side of the bracket (8) is fixedly connected to a protective plate (9). The outer surface of the bracket (8) is hinged with a second protective cover (10).

2. The wafer dicing equipment according to claim 1, characterized in that: The inner wall of the processing table (1) is provided with a drive assembly (11). The drive assembly (11) includes a movable seat (1106) that is slidably connected to the inner wall of the processing table (1). An adsorption platform (12) is fixedly installed on the upper surface of the movable seat (1106). Multiple wafer bodies (14) are placed on the upper surface of the adsorption platform (12).

3. The wafer dicing equipment according to claim 2, characterized in that: A control power supply (13) is fixedly installed on the outer surface of the adsorption platform (12).

4. A wafer dicing apparatus according to claim 2, characterized in that: The drive assembly (11) further includes a cavity (1101), a second lead screw (1104) and two second guide rods (1105). The inner wall of the cavity (1101) is opened on the outer surface of the processing table (1). A second servo motor (1102) is fixedly embedded in the inner wall of the cavity (1101). A maintenance plate (1103) is installed on the inner wall of the cavity (1101).

5. A wafer dicing apparatus according to claim 4, characterized in that: The two ends of the second lead screw (1104) are rotatably connected to the inner wall of the processing table (1), and one end of the second lead screw (1104) is fixedly connected to the output end of the second servo motor (1102). The two ends of the two second guide rods (1105) are fixedly connected to the inner wall of the processing table (1), and the outer surface of the second guide rod (1105) is slidably connected to the inner wall of the moving seat (1106). The outer surface of the second lead screw (1104) is threadedly connected to the inner wall of the moving seat (1106).

6. A wafer dicing apparatus according to claim 5, characterized in that: Both sides of the movable seat (1106) are fixedly connected to the accordion cover (15), and the side of the accordion cover (15) away from the outer surface of the movable seat (1106) is fixedly connected to the inner wall of the processing table (1).

7. A wafer dicing apparatus according to claim 1, characterized in that: The switching component (4) includes a component box (401), the bottom surface of which is fixedly connected to the upper surface of the processing table (1). The inner wall of the component box (401) has two symmetrical guide grooves (402). The inner wall of the component box (401) is rotatably connected to a first lead screw (403). A first servo motor (405) is fixedly embedded on one side of the component box (401), and the output end of the first servo motor (405) is fixedly connected to one end of the first lead screw (403). The outer surface of the first lead screw (403) is threadedly connected to a moving frame (406), and the outer surface of the moving frame (406) is slidably connected to the inner wall of the guide groove (402). The outer surface of the moving frame (406) is fixedly connected to two tool mounting frames (407), and the bottom surface of the tool mounting frame (407) is fixedly connected to the upper surface of the tool body (3).

8. A wafer dicing apparatus according to claim 7, characterized in that: The inner wall of the component box (401) is fixedly connected to a first guide rod (404), and the inner wall of the movable frame (406) is slidably connected to the outer surface of the first guide rod (404).

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