Surface foreign matter removing device based on chip molding process

Abstract

The utility model relates to the technical field of chip surface foreign matter removal, in particular to a surface foreign matter removal device based on a chip molding procedure, which comprises a rack, a conveying mechanism, a box body, two foreign matter removal mechanisms, a storage box and an exhaust mechanism, the conveying mechanism is mounted on the rack and used for bearing and conveying a chip, the box body penetrates through the rack and the conveying mechanism, and the two foreign matter removal mechanisms are mounted on the box body. The two foreign matter removing mechanisms are located on the two sides of the interior of the box body respectively, the two foreign matter removing mechanisms conduct foreign matter removing treatment on the surface of a chip from the two sides of the chip respectively, the storage box is located outside the box body and used for storing nitrogen, and the exhaust mechanism is connected with the inlet end of the storage box so that treated nitrogen can flow back into the storage box. Therefore, the nitrogen can be recycled. According to the utility model, by designing the two opposite foreign matter removal mechanisms, foreign matter removal processing can be carried out on the two sides of the chip at the same time, the chip surface foreign matter removal step can be simplified, and the chip surface foreign matter removal efficiency can be improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip surface foreign matter removal technical field especially a surface foreign matter removal device based on chip molding procedure. BACKGROUND

[0002] Molding procedure is an important link in semiconductor package, it mainly is with plastic sealed inside element such as chip and gold wire, to protect them from the influence of external environment and fail. When carrying out molding treatment to chip, if foreign matter falls on the surface of chip, these foreign matters will be wrapped in the chip, resulting in chip bad, influence the reliability of chip, for this, we urgently need a surface foreign matter removal device based on chip molding procedure.

[0003] At present, the surface foreign matter removal process of chip molding procedure is: chip is placed to input track, nitrogen is blown out by using blower and the other side of blower is provided with absorption end to remove the foreign matter on the surface of chip, however, since blower is oppositely arranged with absorption end, only the foreign matter on one side of chip surface can be removed, if the foreign matter of whole chip needs to be removed completely, chip needs to be turned over 180 DEG, and then pass through blower again, thus, the removal efficiency of chip surface foreign matter can be influenced. SUMMARY

[0004] The applicant provides a surface foreign matter removal device based on chip molding procedure aiming at the defects in the prior production technology, which can simplify the chip surface foreign matter removal step and improve the removal efficiency of chip surface foreign matter by improving the structure of foreign matter removal device.

[0005] The technical scheme adopted by the utility model is as follows:

[0006] A surface foreign matter removal device based on chip molding procedure, which comprises a rack, a conveying mechanism, a box body, two foreign matter removal mechanisms, a storage box and an exhaust mechanism, the conveying mechanism is installed on the rack and is used for carrying and conveying chips, the box body penetrates through the rack and the conveying mechanism, the two foreign matter removal mechanisms are located on the two sides of the inside of the box body respectively, the two foreign matter removal mechanisms remove foreign matter on the surface of the chip from the two sides of the chip respectively, the storage box is located outside the box body and is used for storing nitrogen, the storage box is located inside the box body and above the foreign matter removal mechanisms, the foreign matter removal mechanisms are connected with the outlet end of the storage box in communication to extract the nitrogen stored in the storage box and remove foreign matter on the surface of the chip, and the exhaust mechanism is connected with the inlet end of the storage box to return the treated nitrogen to the storage box to realize the recycling of nitrogen.

[0007] Therefore, by designing two opposite designed foreign matter removing mechanisms, the two sides of the chip can be simultaneously subjected to foreign matter removing treatment, compared with the prior single design, the method has simple structure and is convenient to operate, can simplify the foreign matter removing step of the chip surface and improve the removing efficiency of the foreign matter on the chip surface.

[0008] As a further improvement of the above technical solution: the single foreign matter removing mechanism comprises an air inlet pipe, a fan and an air inlet pump, two ends of the air inlet pipe are respectively connected with the outlet end of the storage box and the fan, the air inlet pump is installed on the air inlet pipe, and the air inlet pump is connected with the box body. Therefore, by starting the air pump and the fan, the nitrogen in the storage box is extracted by the air pump, and is blown to the chip by the fan to remove the foreign matter on the surface of the chip. In addition, by changing the air extraction speed and air extraction amount of the air pump and the rotating speed of the fan, the air blowing amount acting on the chip can be controlled to avoid the air blowing amount being too large to bend the solder wire of the chip, thereby avoiding the damage of the chip.

[0009] As a further improvement of the above technical solution: the single foreign matter removing mechanism further comprises a driving member, the driving member is connected with the inner wall of the box body, and the telescopic end of the driving member is connected with the fan. Therefore, the position of the fan relative to the chip can be controlled by the driving member to ensure that the nitrogen blown by the fan better acts on the surface of the chip, thereby improving the removing effect of the foreign matter on the surface of the chip. In addition, the fan can be fixed on the box body by the driving member.

[0010] As a further improvement of the above technical solution: the air exhaust mechanism comprises an air exhaust pipe and an air exhaust pump, two ends of the air exhaust pipe are respectively connected with the box body and the inlet end of the storage box, the air exhaust pump is installed on the air exhaust pipe, and the air exhaust pump is connected with the box body. Therefore, the nitrogen treated by the foreign matter is extracted into the storage box by the air exhaust pump to realize the recycling of the nitrogen, thereby reducing the waste of the nitrogen.

[0011] As a further improvement of the above technical solution: further comprising a filter screen and a foreign matter cleaning mechanism, the filter screen is installed between the foreign matter removing mechanism and the air exhaust mechanism, the filter screen is used to block the foreign matter to prevent the foreign matter from being sucked into the storage box through the air exhaust mechanism, and the foreign matter cleaning mechanism is located on the side of the filter screen close to the foreign matter removing mechanism, and the foreign matter cleaning mechanism is used to remove the foreign matter on the filter screen. Therefore, in the recycling process of the nitrogen, the foreign matter removed from the surface of the chip is adsorbed on the filter screen, if not cleaned in time, the foreign matter adsorbed on the filter screen will become more and more, thus affecting the extraction effect of the nitrogen. In addition, if the foreign matter is not blocked by the filter screen, the recycled nitrogen will have foreign matter, thereby affecting the removing effect of the foreign matter on the surface of the subsequent chip and causing damage to the air inlet pump and the air exhaust pump.

[0012] As a further improvement of the above technical solution: the foreign matter cleaning mechanism comprises a foreign matter cleaning block and two connecting blocks, the two connecting blocks are located on the two sides of the foreign matter cleaning block respectively, and each connecting block penetrates through the box and is in sliding connection with the box.

[0013] As a further improvement of the above technical solution: the box is provided with a sliding groove at the position relative to the connecting block, and each connecting block penetrates through the sliding groove and is in sliding connection with the box.

[0014] As a further improvement of the above technical solution: the box is further provided with a foreign matter discharging plate, and the foreign matter discharging plate is used for discharging foreign matters. Thus, the foreign matters adsorbed on the filter screen are cleaned to the position of the foreign matter discharging plate by pulling the foreign matter cleaning block to the side close to the foreign matter discharging plate, and finally discharged through the foreign matter discharging plate, so as to realize the discharge of the foreign matters adsorbed on the filter screen.

[0015] As a further improvement of the above technical solution: further comprising a fixing block, the fixing block is located on the upper surface of the conveying mechanism and is used for mounting the chip.

[0016] As a further improvement of the above technical solution: further comprising two guide parts, the two guide parts are located on the two sides of the fixing block, one end of each guide part is in abutment with the fixing block and in sliding connection with the fixing block, and the other end of each guide part is connected with the rack. Thus, the mutual cooperation of the fixing block and the two guide parts ensures that the chip remains stable on the conveying mechanism and cannot be tilted, so as to further improve the removal efficiency and effect of the foreign matters on the surface of the chip.

[0017] The beneficial effects of the utility model are as follows:

[0018] Through the design of the two opposite foreign matter removal mechanisms, the foreign matters on the two sides of the chip can be removed at the same time, compared with the existing single design mode, the mode has simple structure and is convenient to operate, can simplify the foreign matter removal steps on the surface of the chip, and improves the removal efficiency of the foreign matters on the surface of the chip.

[0019] The utility model also has the following advantages:

[0020] 1. The utility model changes the air pumping speed and air pumping capacity of the air pump and the rotating speed of the fan, can control the blowing air volume acting on the chip, avoids the bending of the solder wire of the chip due to excessive blowing air volume, and avoids the damage of the chip.

[0021] 2. The utility model reextracts the nitrogen treated by the foreign matter into the storage tank through the exhaust pump, realizes the recycling of the nitrogen, and reduces the waste of the nitrogen.

[0022] 3、The utility model discloses in the circulation process of nitrogen, the foreign matter of chip surface removal is adsorbed in filter screen, if not cleaning in time, will lead to the foreign matter adsorbed on filter screen more and more, thus, will influence the extraction effect of nitrogen, in addition, if not through filter screen to the foreign matter is kept out, the nitrogen of circulation can have foreign matter, thereby can influence the removal effect of subsequent chip surface foreign matter, and can cause damage to the air inlet pump and exhaust pump. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 It is the structure schematic drawing of the surface foreign matter removal device based on chip molding procedure first visual angle of the utility model;

[0024] Figure 2 It is the structure schematic drawing of the surface foreign matter removal device based on chip molding procedure second visual angle of the utility model;

[0025] Figure 3 It is the left view of the surface foreign matter removal device based on chip molding procedure of the utility model;

[0026] Figure 4 It is the partial cross section structure schematic drawing of the surface foreign matter removal device based on chip molding procedure first visual angle of the utility model;

[0027] Figure 5 It is the partial cross section structure schematic drawing of the surface foreign matter removal device based on chip molding procedure second visual angle of the utility model;

[0028] Figure 6 It is the structure schematic drawing of the foreign matter removal mechanism, storage box, exhaust mechanism, filter screen and foreign matter cleaning mechanism installation first visual angle of the utility model;

[0029] Figure 7 It is the structure schematic drawing of the foreign matter removal mechanism, storage box, exhaust mechanism, filter screen and foreign matter cleaning mechanism installation second visual angle of the utility model;

[0030] Figure 8 It is the structure schematic drawing of the foreign matter removal mechanism of the utility model;

[0031] Figure 9 It is the structure schematic drawing of the exhaust mechanism, filter screen and foreign matter cleaning mechanism installation of the utility model.

[0032] Wherein: 1, rack;

[0033] 2, conveying mechanism;

[0034] 3, box;

[0035] 301, chute; 302, foreign matter discharge plate;

[0036] 4. Foreign object removal mechanism;

[0037] 401. Intake pipe; 402. Fan; 403. Intake pump; 404. Drive components;

[0038] 5. Storage box;

[0039] 6. Exhaust mechanism;

[0040] 601. Exhaust pipe; 602. Exhaust pump;

[0041] 7. Filter screen;

[0042] 8. Foreign object removal mechanism;

[0043] 801. Foreign object removal block; 802. Connecting block;

[0044] 9. Fixing block;

[0045] 10. Guiding Department. Detailed Implementation

[0046] The specific embodiments of this utility model are described below with reference to the accompanying drawings.

[0047] like Figures 1 to 9 The diagram shows the preferred embodiment of this utility model. This embodiment of the surface foreign matter removal device based on the chip molding process includes: a frame 1, a conveying mechanism 2, a housing 3, two foreign matter removal mechanisms 4, a storage tank 5, and an exhaust mechanism 6. The conveying mechanism 2 is mounted on the frame 1 and is used to carry and convey the chip. The housing 3 passes through the frame 1 and the conveying mechanism 2. The two foreign matter removal mechanisms 4 are located on opposite sides inside the housing 3, and each mechanism removes foreign matter from the chip surface from both sides. The storage tank 5 is located outside the housing 3 and is used to store nitrogen gas. The storage tank 5 is located inside the housing 3 and above the foreign matter removal mechanisms 4. The foreign matter removal mechanisms 4 are connected to the outlet end of the storage tank 5 to extract the nitrogen gas stored in the storage tank 5 and use it for foreign matter removal on the chip surface. The exhaust mechanism 6 is connected to the inlet end of the storage tank 5 to return the treated nitrogen gas to the storage tank 5, thereby achieving nitrogen gas recycling. Therefore, by designing two opposing foreign object removal mechanisms 4, foreign object removal can be performed on both sides of the chip simultaneously. Compared with the existing single design, this method is simple in structure, easy to operate, and can simplify the foreign object removal steps on the chip surface, thereby improving the removal efficiency of foreign objects on the chip surface.

[0048] In other words, the prior art can only remove the foreign matter on one side of the chip, and the foreign matter on the two sides of the chip is adsorbed, and if the foreign matter on the two sides of the chip is to be completely removed, two operations have to be performed. The present application can remove the foreign matter adsorbed on the two sides of the chip at the same time, thereby simplifying the process of removing the foreign matter on the chip and improving the efficiency of removing the foreign matter on the chip.

[0049] In the present embodiment, the single foreign matter removing mechanism 4 comprises an air inlet pipe 401, a fan 402, an air inlet pump 403 and a driving member 404. The two ends of the air inlet pipe 401 are respectively connected to the outlet end of the storage tank 5 and the fan 402. The air inlet pump 403 is installed on the air inlet pipe 401 and connected to the tank body 3. The driving member 404 is connected to the inner wall of the tank body 3, and the telescopic end of the driving member 404 is connected to the fan 402. Thus, the air pump and the fan 402 are started, the nitrogen gas in the storage tank 5 is extracted by the air pump, and the nitrogen gas is blown to the chip by the fan 402 to remove the foreign matter on the surface of the chip. In addition, the air volume acting on the chip can be controlled by changing the air extraction speed and the air extraction amount of the air pump and the rotating speed of the fan 402, so as to avoid the air volume being too large to bend the solder wire of the chip and thus avoid damaging the chip. The position of the fan 402 relative to the chip can be controlled by the driving member 404, so as to ensure that the nitrogen gas blown by the fan 402 better acts on the surface of the chip, thereby improving the removal effect of the foreign matter on the surface of the chip. In addition, the fan 402 can be fixed on the tank body 3 by the driving member 404.

[0050] Specifically, the driving member 404 is a pneumatic cylinder.

[0051] In the present embodiment, the air exhaust mechanism 6 comprises an air exhaust pipe 601 and an air exhaust pump 602. The two ends of the air exhaust pipe 601 are respectively connected to the tank body 3 and the inlet end of the storage tank 5. The air exhaust pump 602 is installed on the air exhaust pipe 601 and connected to the tank body 3. Thus, the nitrogen gas after the foreign matter treatment is extracted into the storage tank 5 by the air exhaust pump 602, so as to realize the recycling of the nitrogen gas and thus reduce the waste of the nitrogen gas.

[0052] In the embodiment, the filter screen 7 is installed between the foreign matter removing mechanism 4 and the exhaust mechanism 6, and is used to block the foreign matter to prevent the foreign matter from being sucked into the storage box 5 through the exhaust mechanism 6; the foreign matter cleaning mechanism 8 is located on the side of the filter screen 7 close to the foreign matter removing mechanism 4, and is used to remove the foreign matter on the filter screen 7; the foreign matter cleaning mechanism 8 comprises a foreign matter cleaning block 801 and two connecting blocks 802, the two connecting blocks 802 are respectively located on the two sides of the foreign matter cleaning block 801, and each connecting block 802 penetrates through the box body 3 and is in sliding connection with the box body 3.

[0053] The box body 3 is provided with a sliding groove 301 at the position relative to the connecting block 802, each connecting block 802 penetrates through the sliding groove 301 and is in sliding connection with the box body 3; the box body 3 is further provided with a foreign matter discharging plate 302, and the foreign matter discharging plate 302 is used to discharge the foreign matter.

[0054] In the embodiment, the fixing block 9 is located on the upper surface of the conveying mechanism 2 and is used to install the chip.

[0055] In the embodiment, the two guide portions 10 are located on the two sides of the fixing block 9, one end of each guide portion 10 abuts against and is in sliding connection with the fixing block 9, and the other end of each guide portion 10 is connected with the rack 1. Thus, the fixing block 9 and the two guide portions are matched with each other to ensure that the chip is kept stable on the conveying mechanism 2 and cannot be tilted, thereby further improving the removal efficiency and effect of the foreign matter on the chip surface.

[0056] The removal process of the foreign matter on the chip surface is as follows: first, the chip to be removed of the foreign matter is installed on the fixing block 9, and the chip and the fixing block 9 are placed on the upper surface of the conveying mechanism 2, then the fixing block 9 is clamped and fixed by the two guide portions 10 to ensure that the chip is kept stable relative to the conveying mechanism 2.

[0057] Then, the position of the fan 402 relative to the chip is adjusted by the driving member 404.

[0058] Then, the conveying mechanism 2, the fan 402, the air inlet pump 403 and the air outlet pump 602 are started, the chip is conveyed into the box 3 through the conveying mechanism 2, the nitrogen in the storage box 5 is extracted through the air inlet pump 403, the fan 402 of the two foreign matter removing mechanisms 4 acts on the surfaces on both sides of the chip to simultaneously remove the foreign matters on the surfaces on both sides of the chip, the removed foreign matters are adsorbed on the filter screen 7 under the cooperation of the air outlet pump, the removed nitrogen is reflowed into the storage box 5 through the air outlet pipe 601 to realize the recycling of the nitrogen.

[0059] Finally, the chip after the foreign matters are removed is conveyed out of the box 3 through the conveying mechanism 2, the removal of the foreign matters on the surface of the chip is realized, at the same time, the foreign matter cleaning block 801 is pushed to the side close to the foreign matter discharging plate 302 at regular intervals to push the foreign matters adsorbed on the filter screen 7 to the position of the foreign matter discharging plate 302 and discharge through the foreign matter discharging plate 302.

[0060] As described above, the two oppositely designed foreign matter removing mechanisms 4 can simultaneously remove the foreign matters on both sides of the chip, compared with the prior single design, the method has simple structure and is convenient to operate, can simplify the removal steps of the foreign matters on the surface of the chip and improve the removal efficiency of the foreign matters on the surface of the chip.

[0061] The above description is the explanation of the utility model and is not the limitation of the utility model, the range defined by the utility model is referred to the claims, any form of modification within the protection range of the utility model can be made.

Claims

1. A surface foreign matter removal device based on chip molding process, characterized in that, include: rack (1), and A conveying mechanism (2) is mounted on the frame (1) and is used to carry and convey chips; The housing (3) and two foreign object removal mechanisms (4) are provided. The housing (3) passes through the frame (1) and the conveying mechanism (2). The two foreign object removal mechanisms (4) are located on both sides inside the housing (3). The two foreign object removal mechanisms (4) remove foreign objects from the chip surface from both sides of the chip. Storage box (5) and exhaust mechanism (6): The storage box (5) is located outside the box body (3) and is used to store nitrogen. The storage box (5) is located inside the box body (3) and above the foreign matter removal mechanism (4). The foreign matter removal mechanism (4) is connected to the outlet end of the storage box (5) to extract the nitrogen stored in the storage box (5) and use it for foreign matter removal treatment on the chip surface. The exhaust mechanism (6) is connected to the inlet end of the storage box (5) to return the treated nitrogen to the storage box (5) to realize the recycling of nitrogen.

2. The surface foreign matter removal device based on the chip molding process as described in claim 1, characterized in that: The single foreign object removal mechanism (4) includes: The air intake pipe (401), fan (402), and air intake pump (403) are provided. The two ends of the air intake pipe (401) are connected to the outlet end of the storage box (5) and the fan (402), respectively. The air intake pump (403) is installed on the air intake pipe (401) and is connected to the box body (3).

3. The surface foreign matter removal device based on the chip molding process as described in claim 2, characterized in that: Each of the foreign object removal mechanisms (4) further includes: A drive unit (404) is connected to the inner wall of the housing (3), and the telescopic end of the drive unit (404) is connected to the fan (402).

4. The surface foreign matter removal device based on the chip molding process as described in claim 1, characterized in that: The exhaust mechanism (6) includes: An exhaust pipe (601) and an exhaust pump (602) are provided. The two ends of the exhaust pipe (601) are connected to the inlet ends of the housing (3) and the storage box (5), respectively. The exhaust pump (602) is installed on the exhaust pipe (601) and is connected to the housing (3).

5. The surface foreign matter removal device based on the chip molding process as described in claim 1, characterized in that: Also includes: A filter screen (7) and a foreign object removal mechanism (8) are provided. The filter screen (7) is installed between the foreign object removal mechanism (4) and the exhaust mechanism (6). The filter screen (7) is used to block foreign objects so as to prevent foreign objects from being drawn into the storage box (5) through the exhaust mechanism (6). The foreign object removal mechanism (8) is located on the side of the filter screen (7) close to the foreign object removal mechanism (4). The foreign object removal mechanism (8) is used to remove foreign objects from the filter screen (7).

6. The surface foreign matter removal device based on the chip molding process as described in claim 5, characterized in that: The foreign object removal mechanism (8) includes: The foreign object cleaning block (801) and two connecting blocks (802) are respectively located on both sides of the foreign object cleaning block (801). A single connecting block (802) penetrates the box body (3) and is slidably connected to the box body (3).

7. The surface foreign matter removal device based on the chip molding process as described in claim 6, characterized in that: The housing (3) has a groove (301) at a position relative to the connecting block (802), and a single connecting block (802) passes through the groove (301) and is slidably connected to the housing (3).

8. The surface foreign matter removal device based on the chip molding process as described in claim 1, characterized in that: The box (3) is also provided with a foreign object discharge plate (302), which is used to discharge foreign objects.

9. The surface foreign matter removal device based on the chip molding process as described in claim 1, characterized in that: Also includes: A fixing block (9) is located on the upper surface of the conveying mechanism (2) and is used to mount the chip.

10. The surface foreign matter removal device based on the chip molding process as described in claim 9, characterized in that: Also includes: Two guides (10) are located on both sides of the fixing block (9). One end of each guide (10) abuts against the fixing block (9) and is slidably connected to the fixing block (9). The other end of each guide (10) is connected to the frame (1).

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