Linear cutting equipment

Abstract

The embodiment of the utility model provides wire cutting equipment, which is used for cutting a crystal bar and comprises a plurality of wire shafts, a plurality of wire cutting devices, a plurality of wire cutting devices, a plurality of wire cutting devices, a plurality of wire cutting devices and a plurality of wire cutting devices, the supporting assemblies are used for supporting a plurality of cutting lines in a one-to-one correspondence mode, each supporting assembly comprises a plurality of line wheels, and the line wheels are arranged to be capable of jointly supporting the cutting lines corresponding to the supporting assemblies into a ring shape; the cutting line is arranged to be capable of reciprocating in the extending direction of the cutting line. Wherein each support assembly is arranged on the plurality of spools via the plurality of wire wheels, such that the plurality of cutting wires supported by the plurality of support assemblies are parallel to each other and spaced apart from each other. According to the linear cutting equipment, a plurality of crystal bar sections and / or wafers can be obtained through one-time cutting operation, so that the cutting efficiency and precision are improved, and the pollution risk in the operation process is reduced.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing, and in particular to a wire cutting device. Background Technology

[0002] Wire EDM is a precision manufacturing process widely used in crystal ingot processing. It is mainly used for high-precision cutting of crystal ingots to meet specific shape or thickness requirements. In actual production, wire EDM is often used in key process steps such as crystal ingot cutting, wafer processing, and sample cutting.

[0003] By cutting a whole crystal rod into multiple segments, not only is subsequent handling and processing easier, but cracks or defects caused by stress concentration during processing can also be effectively reduced, thereby improving product quality. Furthermore, since the physical and performance parameters of the crystal rod may differ along its axial direction, the resulting segments can be classified or used in batches according to specific application requirements, thereby improving material utilization and optimizing resource allocation.

[0004] To accurately evaluate the performance of crystal ingot segments, it is typically necessary to cut samples from each segment to test its key performance indicators. The test results of these samples can serve as a basis for evaluating the performance of their respective crystal ingot segments, providing data support for subsequent processes and applications.

[0005] However, currently, ingot cutting and sample cutting are usually performed as two separate processing steps, which means that two cutting operations are required. This method is not only time-consuming, but also limits production efficiency to some extent. Utility Model Content

[0006] To address the aforementioned technical problems, this utility model aims to provide a wire cutting device. This wire cutting device can obtain multiple crystal rod segments and / or wafers in a single cutting operation, which not only improves cutting efficiency and precision but also reduces the risk of contamination during operation.

[0007] The technical solution of this utility model is implemented as follows:

[0008] This utility model embodiment provides a wire cutting device for cutting crystal rods, the wire cutting device comprising:

[0009] Multiple spools, which are arranged parallel to each other and spaced apart;

[0010] Multiple support components are used to support multiple cutting lines in a one-to-one correspondence manner. Each support component includes multiple thread pulleys, which are configured to collectively support the cutting line corresponding to the support component into a ring, and the cutting line is configured to reciprocate in the extension direction of the cutting line.

[0011] Each support component is arranged on the plurality of spools via the plurality of spools, such that the plurality of cutting lines supported by the plurality of support components are parallel to each other and spaced apart.

[0012] In some optional examples, the wire cutting device further includes a first drive mechanism, wherein,

[0013] The first driving device is used to drive the first spool of the plurality of spools to rotate about the central axis of the first spool.

[0014] The first spool of the plurality of spools in each support assembly is coaxially fixed to the first spool so as to rotate together with the first spool.

[0015] The first reel is configured to drive the cutting wire to perform the reciprocating motion when it rotates.

[0016] In some optional examples, the wire cutting device further includes a second drive unit and an eccentric device, wherein,

[0017] The second driving device is used to drive the second spool of the plurality of spools to rotate about the central axis of the second spool.

[0018] The second spool of the plurality of spools in each support assembly is eccentrically fixed to the second spool via the eccentric device, such that when the second drive device drives the second spool to rotate, the second spool rotates eccentrically relative to the second spool, thereby adjusting the tension of the cutting wire supported by the support assembly.

[0019] In some alternative examples, a groove extending in a circumferential direction is formed on the outer peripheral surface of each spool, the groove being configured to accommodate the cutting wire to guide the reciprocating motion of the cutting wire.

[0020] In some optional examples, the spacing between two adjacent support components in the axial direction of the spool is adjustable, so that the spacing between adjacent cutting lines in the axial direction of the spool is adjustable.

[0021] In some optional examples, the spools located on the same spool are detachably connected to each other.

[0022] In some optional examples, the spools arranged on the same spool have the same radial dimension.

[0023] In some optional examples, the wire cutting device further includes a lifting mechanism for moving the cutting wire up and down by driving the plurality of spools and the plurality of support components.

[0024] In some optional examples, the wire cutting apparatus also includes a support platform for supporting the crystal rod below the cutting line.

[0025] In some alternative examples, the support platform includes a conveying device for moving the crystal rod along its axial direction.

[0026] This invention provides a wire cutting device comprising multiple spools and multiple support components for supporting multiple cutting wires in a one-to-one correspondence. By arranging multiple spools of each support component on different spools, the multiple support components can be arranged sequentially along the axial direction of the spools, thereby forming a cutting wire array with multiple cutting wires arranged side by side along the axial direction of the spools. This cutting wire array can simultaneously cut different axial positions of the same crystal ingot, thus obtaining multiple crystal ingot segments and / or wafers in a single cutting operation. This not only improves cutting efficiency and accuracy but also reduces the risk of contamination during operation. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of a conventional crystal rod and wafer.

[0028] Figure 2 This is a schematic diagram of a conventional wire EDM machine.

[0029] Figure 3 A perspective view of a wire cutting device provided for an embodiment of this utility model.

[0030] Figure 4 A perspective view of a portion of a wire cutting device provided in an embodiment of this utility model.

[0031] Figure 5 A top view schematic diagram of a part of a wire cutting device provided in another embodiment of the present invention.

[0032] Figure 6 A perspective view of a portion of a wire cutting device provided in another embodiment of the present invention.

[0033] Figure 7 A side view of a portion of a wire cutting device provided in another embodiment of the present invention.

[0034] Figure 8 A perspective view of a portion of a wire cutting device provided in another embodiment of the present invention. Detailed Implementation

[0035] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0036] The embodiments of this utility model are described in detail below with reference to the accompanying drawings.

[0037] like Figure 1 As shown, the crystal ingot S is typically cylindrical. Cutting the crystal ingot S along a direction perpendicular to its central axis directly yields the wafer W; alternatively, the crystal ingot S can be first cut into multiple segments, and then the wafer W can be cut from these segments. After subsequent processing such as grinding and polishing, the wafer can be used as a substrate for semiconductor products. Due to the relatively thin thickness of the final wafer, wire cutting is currently widely used in the semiconductor industry to process crystal ingots to obtain crystal ingot segments or wafers.

[0038] Wire EDM is a process that uses a wire-shaped cutting tool made of steel wire or other materials to cut crystal rods through high-speed reciprocating motion. A common technique in crystal rod cutting is single-wire ring cutting. In this process, a single cutting wire is supported in a ring shape by a spool or other support device to facilitate control of cutting force, direction, and speed. During cutting, the ring-shaped cutting wire is driven to reciprocate along its extension direction while simultaneously moving as a whole to approach the crystal rod. After contacting the crystal rod, the cutting wire moves along the diameter of the crystal rod, completing the cutting through continuous reciprocating motion, ultimately cutting a crystal rod segment from the rod.

[0039] Figure 2 A schematic diagram of a conventional wire EDM (Electrical Discharge Machining) apparatus 100 is shown. The wire EDM apparatus 100 may include a cutting wire 101, a wire roller 102, and a worktable 103. The cutting wire 101 is wound around the wire roller 102 to form a loop structure. The wire roller 102 is capable of driving the cutting wire 101 to perform high-speed reciprocating motion along its extension direction (e.g., ...). Figure 2 (As indicated by arrow D1), and is capable of moving the cutting line 101 in the vertical direction (as shown by arrow D1). Figure 2 (As indicated by arrow D2). The worktable 103 is located below the cutting line 101 and is used to support the crystal ingot S. When performing a wire cutting operation using the wire cutting equipment 100, the crystal ingot S is first placed on the worktable 103, and the position of the crystal ingot S is adjusted so that the cutting line 101 is aligned vertically with a predetermined cutting position on the crystal ingot S. The cutting position is determined based on the desired thickness of the crystal ingot segment or wafer. After preparation, the wire roller 102 drives the cutting line 101 in a reciprocating motion, simultaneously moving the cutting line 101 vertically until the cutting operation is completed. After processing, the cut crystal ingot segment or wafer can be removed from the wire cutting equipment 100, or the position of the crystal ingot segment on the worktable 103 can be readjusted for further cutting operations.

[0040] As mentioned above, in some cases, the obtained crystal rod segments need to be further cut into thin sheet-like samples for performance testing. This requires repeating the cutting operation described above on the crystal rod segments. Since the samples are usually thin, precise adjustments are needed to align the cutting line with the predetermined cutting position of the crystal rod segment. Furthermore, during the cutting process, the samples are prone to breakage due to being supported only on one side, thus affecting cutting accuracy and quality, resulting in low overall processing efficiency.

[0041] To address the aforementioned problems, some embodiments of this invention propose a wire cutting device. This cutting array can simultaneously cut different axial positions of the same crystal rod, thereby obtaining multiple crystal rod segments and / or wafers in a single cutting operation. This not only improves cutting efficiency and precision but also reduces the risk of contamination during operation.

[0042] Specifically, see Figure 3 It shows a wire cutting device 100 provided in some embodiments of the present invention, which can be used to cut crystal rods S.

[0043] See Figure 4 The wire cutting device 100 may include: a plurality of spools 1 arranged parallel to each other and spaced apart; and a plurality of support components 2 for supporting a plurality of cutting wires 101 in a one-to-one correspondence. Each support component 2 may include a plurality of rollers 21. The plurality of rollers 21 are configured to collectively support the cutting wire 101 corresponding to the support component 2 into a ring, and the cutting wire 101 is configured to reciprocate in its extension direction. Each support component 2 may be arranged on a plurality of spools 1 via the plurality of rollers 21, such that the plurality of cutting wires 101 supported by the plurality of support components 2 are parallel to each other and spaced apart.

[0044] The wire cutting equipment 100 may include two or more spools 1, and the central axes of the spools 1 are parallel to each other. Figure 3 and Figure 4 Taking the illustrated embodiment as an example, the wire cutting equipment 100 includes four spools 1. These spools 1 can be fixed on a substrate P and can be arranged such that their central axes are not only parallel to each other but also spaced apart in a rectangular pattern. Each spool 1 can be arranged such that its central axis is parallel to the horizontal direction, i.e., parallel to the horizontal plane, to facilitate the overall operation and arrangement of the wire cutting equipment 100.

[0045] The wire cutting equipment 100 may also include two or more support components 2. Figure 4For example, the wire cutting equipment 100 is configured with two support components 2. Each support component 2 can consist of two or more wire spools 21, for example, it can contain four wire spools 21. The multiple wire spools 21 of each support component 2 are arranged in a one-to-one correspondence on multiple wire spools 1, that is, each wire spool 21 is mounted on a wire spool 1, and different wire spools 21 within the same support component 2 are respectively arranged on different wire spools 1. Therefore, the number of wire spools 1 is greater than or equal to the number of wire spools 21 in any one support component 2. With the above configuration, each support component 2 can be arranged in a rectangular shape in the wire cutting equipment 100.

[0046] Each spool 21 of each support component 2 serves to support the same cutting wire 101. The cutting wire 101 can be a loop itself, as shown in the figure; or, the cutting wire 101 can form a loop by being wound sequentially around each spool 21 under the support of the spool 21. The cutting wire 101 can be kept taut by the action of the spool 21. During the cutting operation, the taut cutting wire 101 reciprocates along its extension direction (e.g., ...). Figure 3 (As indicated by arrow D1 in the diagram), to complete the cutting of the crystal rod S.

[0047] By arranging multiple spools 21 of each support assembly 2 on different spools 1, the multiple support assemblies 2 can be arranged sequentially along the axial direction of the spools 1. Correspondingly, the cutting lines 101 supported by each support assembly 2 are also arranged side-by-side along the axial direction of the spools 1, and adjacent cutting lines 101 are spaced apart, thus forming a line array. Figure 3 and Figure 4 In the embodiment shown, two independent cutting lines 101 form a linear array, enabling simultaneous cutting of different positions on the same crystal rod S. When processing the crystal rod S using this linear array, cutting can be completed at multiple positions in its axial direction at once, such as simultaneously cutting crystal rod segments and samples, thereby shortening the cutting time and improving cutting efficiency.

[0048] Specifically, each cutting wire 101 is independent of the others, avoiding potential mutual interference during the cutting process. This independence also allows for selective replacement of a single cutting wire 101 when its performance is affected by wear, without needing to replace the entire cutting wire assembly. Furthermore, the spacing between the cutting wires 101 can be precisely set to the sample thickness according to processing requirements, avoiding positioning errors caused by repeated ingot clamping and ensuring the dimensional accuracy of the ingot segment and the sample. The combination of multiple cutting wires 101 improves cutting efficiency, simplifies the maintenance of the wire EDM equipment 100, and further reduces the equipment's operating costs.

[0049] This design also offers a high degree of flexibility. The number of support components 2 and the spacing between adjacent support components 2 can be adjusted according to specific needs. For example, by increasing the number of support components 2, the linear array size can be expanded to meet the processing requirements of large-size crystal ingots; by adjusting the spacing between support components 2, the thickness of the cut sample can be precisely controlled to adapt to the needs of wafers of different thicknesses. Those skilled in the art can make simple modifications or substitutions to the structure and arrangement of the support components 2 according to specific application scenarios, and these adjustments are all within the protection scope of this utility model, which does not limit them.

[0050] Furthermore, the cutting wire 101 operates in a linear array under tension, effectively reducing vibration and deformation that may occur during the cutting process, thereby ensuring cutting stability. This design further reduces wear on the cutting wire 101 and the guide rollers, extending the service life of the equipment. Simultaneously, by completing the cutting of the crystal rod segment and sample in one operation, the generation of dust and debris is significantly reduced, lowering the risk of particulate contamination.

[0051] This invention provides a wire cutting device 100, which includes multiple spools 1 and multiple support components 2 for supporting multiple cutting wires 101 in a one-to-one correspondence. By arranging multiple rollers 21 of each support component 2 on different spools 1, the multiple support components 2 can be arranged sequentially along the axial direction of the spools 1, thereby forming a cutting wire array in which the multiple cutting wires 101 are arranged side by side along the axial direction of the spools 1. This cutting wire array can simultaneously cut different axial positions of the same crystal ingot S, thereby obtaining multiple crystal ingot segments and / or wafers in a single cutting operation. This not only improves cutting efficiency and accuracy but also reduces the risk of contamination during operation.

[0052] As mentioned above, the reciprocating motion of the cutting line 101 along its own extension direction is key to achieving the cutting operation. See also some embodiments of this invention. Figure 5 The wire cutting equipment 100 may also include a first drive device 3. The first drive device 3 can be used to drive a first spool 11 of a plurality of spools 1 to rotate around the central axis X1 of the first spool 11. The first wheel 211 of a plurality of wheel 21 of each support assembly 2 is coaxially fixed on the first spool 11 so as to rotate together with the first spool 11. The first wheel 211 can be configured to drive the cutting wire 101 to reciprocate during rotation, thereby realizing the cutting operation.

[0053] One end of the first spool 11 can be connected to the first drive device 3, and the other end can be connected to the first reel 211, serving as a transmission component between the first drive device 3 and the first reel 211. The first drive device 3 can be, for example, a rotary motor for converting electrical energy into rotational motion, and its output shaft can be coaxially fixedly connected to the first spool 11. The first reel 211 can be cylindrical and has a central connecting hole for coaxially connecting and fixing to one end of the first spool 11. This transmits the rotational power of the first drive device 3 to the first reel 211, achieving synchronous rotation of both around the same axis.

[0054] The cutting wire 101 can be wound around the outer circumferential surface of the first thread wheel 211, and reciprocates through the rotation of the first thread wheel 211. To enhance the stability of the cutting wire 101, the outer circumferential surface of the first thread wheel 211 can be designed as a rough surface to provide sufficient friction. As the first thread wheel 211 rotates with the first thread spool 11, this friction can effectively drive the cutting wire 101 to achieve stable reciprocating motion. Therefore, the first thread wheel 211 both supports the cutting wire 101 and acts as a drive wheel.

[0055] The required tension of the cutting wire 101 may vary depending on the cutting scenario. This mainly depends on factors such as the material being cut, the cutting thickness, the cutting speed, and the processing environment. For example, materials with different hardness and toughness have significantly different requirements for cutting wire tension. Harder materials require higher tension to reduce cutting wire deformation and ensure cutting accuracy and efficiency, while for brittle or softer materials, appropriately reducing tension can prevent excessive impact from the cutting wire and reduce the risk of breakage. For thicker workpieces, higher cutting wire tension is needed to ensure the straightness of the cutting path; while in cutting thin sheets or samples, lower tension is needed to reduce the risk of breakage caused by cutting force. Furthermore, high-speed cutting requires higher cutting wire tension to reduce vibration, while at low speeds, appropriately reducing tension can reduce friction and heat accumulation between the cutting wire and the workpiece, thereby extending the service life of the cutting wire. This diversity of cutting conditions necessitates flexible adjustment of the cutting wire tension.

[0056] To meet the above requirements and improve the applicability of the wire cutting equipment 100, in some embodiments of this utility model, see [reference needed]. Figure 5 , Figure 6 and Figure 7The wire cutting equipment 100 may also include a second drive device 4 and an eccentric device 5. The second drive device 4 can be used to drive the second spool 12 of the plurality of spools 1 to rotate about its central axis. The second spool 212 of the plurality of spools 21 in each support assembly 2 is eccentrically fixed to the second spool 12 via the eccentric device 5. When the second drive device 4 drives the second spool 12 to rotate, the second spool 212 rotates eccentrically relative to the second spool 12, thereby adjusting the tension of the cutting wire 101 supported by the support assembly 2.

[0057] In the above embodiments, each support component 2 includes a second thread pulley 212. Specifically, the second thread pulley 212 is connected to the second spool 12 via an eccentric device 5. As an example, the eccentric device 5 may include a plate-shaped body, one side of which is connected to the second drive device 4 via the second spool 12, and the other side is connected to the second thread pulley 212. It should be particularly noted that the central axis X2 of the second thread pulley 212 and the central axis X1 of the second spool 12 are not on the same straight line, but are parallel to each other and maintain a certain eccentric distance. When the second drive device 4 drives the second spool 12 to rotate around its central axis X1, the second thread pulley 212 also rotates around the central axis X1 of the second spool 12 under the action of the eccentric device 5.

[0058] During the rotation of the second reel 212, due to the eccentricity between its central axis X2 and the central axis X1 of the second spool 12, the distance of the second reel 212 relative to other spools also changes. This change also alters the relative distance between the reels in the same support assembly 2, thereby causing a change in the tension of the cutting wire 101 supported by the support assembly 2. For example, when the distance between the second reel 212 and other reels in the same support assembly 2 decreases, the tension of the cutting wire 101 supported by the support assembly 2 decreases; conversely, when the distance between the second reel 212 and other reels increases, the tension of the cutting wire 101 increases.

[0059] Through the above settings, precise adjustment of the tension of the cutting wire 101 can be achieved. Specifically, the tension of the cutting wire 101 can directly correspond to the specific angle of the rotation position of the second wire wheel 212, thereby providing adaptive tension for different cutting scenarios by controlling the operating state of the second drive device 4. This flexible tension adjustment capability can further improve the applicability and processing quality of the wire cutting equipment 100.

[0060] To further optimize the motion trajectory of the cutting line 101, see [link / reference]. Figure 7In some embodiments of this invention, a groove GV extending in the circumferential direction is formed on the outer peripheral surface of each wire wheel 21. The groove GV is configured to accommodate the cutting wire 101 and guide its reciprocating motion. Through the constraint of the groove GV, slippage or deviation of the cutting wire 101 during high-speed reciprocating motion can be prevented, ensuring that it always runs along a predetermined trajectory. This design significantly improves the stability and accuracy of the cutting operation, especially important for high-precision cutting of workpieces such as crystal rods.

[0061] Furthermore, for the spools in support assembly 2, except for the first spool 211 which serves as the drive wheel, the grooves GV of the other spools all have relatively smooth surfaces. This design allows the cutting wire 101 to slide on the non-drive wheels, thereby significantly reducing the frictional resistance between the cutting wire 101 and the groove surface. On the one hand, this smooth surface design can effectively reduce the resistance experienced by the cutting wire 101 during high-speed operation, thereby reducing the tension burden on the cutting wire and improving the operating efficiency of the equipment; on the other hand, this design can also reduce the wear between the cutting wire 101 and the spool surface, significantly extending the service life of the cutting wire, and reducing the maintenance frequency and operating costs of the equipment.

[0062] To meet different cutting requirements, in some embodiments of this disclosure, the spacing between two adjacent support components 2 in the axial direction of the linear shaft 1 is adjustable, so that the spacing between adjacent cutting lines in the axial direction of the linear shaft 1 is adjustable to accommodate ingots or samples of different sizes.

[0063] Each spool 21 can be directly mounted on its corresponding spool 1. Alternatively, multiple spools 21 that need to be mounted on the same spool 1 can be connected side-by-side, and then connected to the spool 1 through one or more of the outermost spools 21. In this arrangement, some spools 21 are directly and fixedly connected to the spool 1, while others are indirectly connected to the spool 1. Figure 8 As shown, one spool 21 is directly fixed to one end of the spool 1, while the other spool 21 is connected to the spool 21 fixed to the spool 1 via a threaded connector 6, thus both are fixed to the spool 1.

[0064] To achieve the above arrangement, multiple threaded holes 7 can be pre-drilled on the spool 21. The engagement of the threaded connector 6 with the threaded holes 7 not only ensures a secure connection between the spool 21 and the spool 1, but also allows for convenient adjustment of the spacing between the spools 21. This flexible adjustability allows the equipment to quickly adapt to different cutting tasks. For example, by adjusting the position of each spool 21 in the support assembly 2 along the axial direction of the spool 1, the spacing between adjacent cutting lines 101 can be flexibly changed. Before starting the cutting operation, the layout of the spools 21 can be pre-adjusted according to the specifications of the target ingot segment or sample to ensure that the spacing of the cutting line array meets the processing requirements.

[0065] Furthermore, the detachable engagement of the threaded connector 6 and the threaded hole 7 allows for quick separation of the connected wire spools 21. The arrangement of the wire spools 21 can be easily adjusted or the spools replaced without damaging any components, thus simplifying equipment maintenance. Through this flexible adjustment method, the wire EDM equipment 100 can not only adapt to the processing needs of workpieces of different sizes but also effectively reduce setup and maintenance time.

[0066] It is understood that the above-described threaded connection method is merely exemplary, and the connection between the spools 21 and between the spool 21 and the bobbin 1 can also be achieved in other ways. For example, other mechanical connection methods such as snap-fit ​​connections and pin connections can be used, as long as a firm connection between the spool 21 and the bobbin 1 can be ensured, and the spacing between the spools 21 can be easily adjusted. These alternative connection methods can also achieve flexible adjustment of the arrangement of the spools 21, thereby meeting the needs of different cutting tasks. In addition, the specific connection method can be selected according to the actual usage scenario, equipment design requirements, and material properties.

[0067] To achieve synchronous cutting, in some embodiments of this disclosure, the wire wheels 21 arranged on the same spool 1 have the same radial dimension. Specifically, the radial dimension of the wire wheel 21 refers to the radius or the distance from the outer circumference of the wire wheel 21 to its axis of rotation. By ensuring that all wire wheels 21 on the same spool 1 have the same radial dimension, asynchrony in the movement trajectory and speed of the cutting wire 101 caused by differences in wire wheel size can be effectively avoided. In a further embodiment, all wire wheels 21 in the wire cutting device 100 have the same radial dimension.

[0068] When the radial dimensions of the spools 21 are consistent, the spools 1 can drive the spools 21 at the same linear speed when rotating, thereby causing the cutting wires 101 supported on the spools 21 to perform cutting operations at a consistent reciprocating speed. This significantly improves the synchronization of the cutting operations performed by the cutting wire array, ensuring that the cutting wires 101 can perform cutting operations at different positions simultaneously when processing crystal rods, thereby improving processing efficiency and cutting accuracy.

[0069] Furthermore, the wire reels 21 with the same radial dimensions can maintain uniform tension distribution on the cutting wire 101, thereby reducing wire slippage, vibration, or breakage caused by uneven tension during the cutting process. This not only improves the operational stability of the equipment but also extends the service life of the cutting wire, reducing consumable costs and equipment maintenance frequency.

[0070] In some embodiments of this invention, the cutting wire 101 in the wire cutting device 100 can be arranged directly above the crystal rod S to be cut. The cutting operation is achieved by driving the cutting wire 101 to feed towards the crystal rod S. For this purpose, see [link to relevant documentation]. Figure 3 The wire cutting equipment 100 may include a lifting mechanism 8, which is used to realize the lifting movement of the cutting wire 101 by driving the spool 1 and the support assembly 2.

[0071] Specifically, the lifting mechanism 8 can drive multiple spools 1 to move vertically as a whole, thereby synchronously raising and lowering the support assembly 2 and the supporting cutting wire 101. During the cutting operation, in the direction indicated by arrow D2, by controlling the lifting mechanism 8 to gradually lower the height of the cutting wire 101, the cutting wire can contact the crystal rod S at a precise feed rate and gradually complete the cutting along the diameter direction of the crystal rod S. Furthermore, after the cutting is completed, the lifting mechanism 8 can drive the cutting wire 101 to rise away from the crystal rod S for subsequent processing steps or maintenance operations of the cutting wire.

[0072] The lifting mechanism 8 may include a transmission device (not shown in the figure), such as a gear-rack transmission mechanism, a lead screw-nut transmission mechanism, or a hydraulic / pneumatic drive mechanism. This invention does not specifically limit this type of mechanism. These designs ensure the accuracy and smoothness of the lifting motion while providing sufficient driving force to meet the processing requirements of ingots of different sizes and materials.

[0073] To precisely control the cutting dimensions and ensure the stability of the crystal ingot during the cutting process, the wire EDM equipment 100 includes a support platform 9. The support platform 9 supports the crystal ingot S below the cutting wire 101 and provides reliable support for the crystal ingot during cutting. The stabilizing effect of the support platform 9 effectively prevents positional displacement or vibration of the crystal ingot during cutting, thereby ensuring that the cutting wire cuts the crystal ingot along a predetermined path. Furthermore, the support platform 9 can accommodate crystal ingots S of different specifications, including those with varying diameters, lengths, or weights, thus significantly improving the applicability and versatility of the wire EDM equipment 100.

[0074] In other embodiments of this utility model, such as Figure 3As shown, the upper surface of the support platform 9 is designed with a V-shaped structure to further enhance the stability of the crystal rod. The V-shaped upper surface provides multi-point contact for the crystal rod S through the inclined support surfaces on both sides, thereby limiting the displacement and rolling tendency of the crystal rod S in the lateral direction. This allows the support platform 9 to precisely fit the cylindrical outer surface of the crystal rod S, and by increasing the uniformity of the distribution of support points, the placement stability of the crystal rod S is improved. Especially during the application of cutting force by the cutting line 101, the V-shaped upper surface can effectively prevent the crystal rod from rolling or shaking due to the force, thereby ensuring the smooth progress of the cutting operation.

[0075] Furthermore, the V-shaped upper surface also features automatic centering. During crystal ingot placement, the V-shaped structure guides the central axis of the ingot into the plane of motion of the cutting line, thereby reducing adjustment work during placement and debugging, and further improving operational efficiency. Simultaneously, the tilt angle and depth of the V-shaped upper surface can be optimized according to the dimensions of crystal ingots of different specifications to accommodate the needs of crystal ingots with varying diameters and lengths.

[0076] In some embodiments of this disclosure, in order to achieve multiple consecutive cuts of the crystal rod S, see [reference needed]. Figure 3 The support platform 9 may include a conveying device 91 for moving the crystal rod S along its axial direction. The conveying device 91 can precisely control the moving position and distance of the crystal rod S, so that the target cutting position is accurately aligned with the cutting line 101, so as to complete multiple consecutive cutting operations.

[0077] Specifically, the conveying device 91 can employ roller drive, chain drive, belt drive, screw drive, or other linear drive mechanisms. For example, the conveying device 91 can be in the form of rollers and arranged along the axial direction of the crystal rod. The rotation of the conveying device 91 can drive the crystal rod to move in the axial direction. The conveying device 91 can also be linked with a control system (not shown in the figure) to automatically adjust the moving step distance and speed of the crystal rod based on a preset cutting path and target size, thereby achieving precise alignment and efficient cutting.

[0078] The conveyor 91 significantly improves the efficiency and accuracy of multiple cutting operations, making it particularly suitable for scenarios requiring continuous cutting of ingot segments and / or samples. By smoothly moving the ingot S along the axial direction, it not only reduces manual alignment operations before cutting but also avoids positioning errors caused by repeatedly clamping the ingot S. Furthermore, the adjustable design of the conveyor 91 allows it to accommodate ingots of different lengths and diameters, further enhancing the applicability and flexibility of the wire EDM equipment 100.

[0079] It should be noted that the technical solutions described in the embodiments of this utility model can be combined arbitrarily without conflict.

[0080] The above are merely specific embodiments of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A wire cutting device, said wire cutting device being used for cutting crystal rods, characterized in that, The wire cutting equipment includes: Multiple spools, which are arranged parallel to each other and spaced apart; Multiple support components are used to support multiple cutting lines in a one-to-one correspondence manner. Each support component includes multiple thread pulleys, which are configured to collectively support the cutting line corresponding to the support component into a ring, and the cutting line is configured to reciprocate in the extension direction of the cutting line. Each support component is arranged on the plurality of spools via the plurality of spools, such that the plurality of cutting lines supported by the plurality of support components are parallel to each other and spaced apart.

2. The wire cutting equipment according to claim 1, characterized in that, The wire cutting equipment also includes a first driving device, wherein... The first driving device is used to drive the first spool of the plurality of spools to rotate about the central axis of the first spool. The first spool of the plurality of spools in each support assembly is coaxially fixed to the first spool so as to rotate together with the first spool. The first reel is configured to drive the cutting wire to perform the reciprocating motion when it rotates.

3. The wire cutting equipment according to claim 1, characterized in that, The wire cutting equipment also includes a second drive unit and an eccentric device, wherein... The second driving device is used to drive the second spool of the plurality of spools to rotate about the central axis of the second spool. The second spool of the plurality of spools in each support assembly is eccentrically fixed to the second spool via the eccentric device, such that when the second drive device drives the second spool to rotate, the second spool rotates eccentrically relative to the second spool, thereby adjusting the tension of the cutting wire supported by the support assembly.

4. The wire cutting equipment according to any one of claims 1 to 3, characterized in that, Each spool has a groove formed on its outer peripheral surface that extends in the circumferential direction. The groove is configured to accommodate the cutting wire and guide the reciprocating motion of the cutting wire.

5. The wire cutting equipment according to any one of claims 1 to 3, characterized in that, The spacing between two adjacent support components in the axial direction of the spool is adjustable, so that the spacing between adjacent cutting lines in the axial direction of the spool is adjustable.

6. The wire cutting equipment according to claim 5, characterized in that, The spools, which are mounted on the same spool, are detachably connected to each other.

7. The wire cutting equipment according to any one of claims 1 to 3, characterized in that, The spools arranged on the same spool have the same radial dimension.

8. The wire cutting equipment according to any one of claims 1 to 3, characterized in that, The wire cutting equipment also includes a lifting mechanism, which is used to realize the lifting movement of the cutting wire by driving the plurality of spools and the plurality of support components.

9. The wire cutting equipment according to any one of claims 1 to 3, characterized in that, The wire cutting equipment also includes a support platform for supporting the crystal rod below the cutting line.

10. The wire cutting equipment according to claim 9, characterized in that, The support platform includes a conveying device for moving the crystal rod along its axial direction.

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