Silicon wafer material box
By setting anti-slip pads and limiting components on the carrier of the silicon wafer box, the problem of uneven silicon wafers caused by the slippage of sulfonate paper was solved, realizing neat stacking and automatic alignment of silicon wafers and avoiding damage to the silicon wafers.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-28
- Publication Date
- 2026-03-24
AI Technical Summary
In existing silicon wafer cassettes, the tracing paper slides along the inclined support surface of the cassette, causing the silicon wafers to not be stacked neatly and easily damaging them when removed.
Anti-slip pads are installed on the carrier of the material box. The adhesive or electrostatic attraction of the anti-slip pads makes the protective sheet adhere flatly to or adsorb onto the carrier. At the same time, limiting parts are set on both sides of the carrier to ensure that the sliding direction of the silicon wafer is consistent according to its own weight, so as to achieve automatic alignment.
This ensures that silicon wafers are neatly stacked in the cassette, preventing damage during removal, and achieves automatic alignment and stable stacking of silicon wafers.
Smart Images
Figure CN224037786U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of silicon wafer production equipment manufacturing, and in particular relates to a silicon wafer cassette. Background Technology
[0002] After the silicon wafers in the photovoltaic module are inspected by the sorting machine, the sorting machine sends the silicon wafers into the corresponding material boxes according to the inspection results. In order to protect the silicon wafers, a sheet of tracing paper is usually placed in the material box first, and the silicon wafers subsequently received by the material box are stacked on the tracing paper one on top of the other.
[0003] However, because tracing paper is lightweight and has a smooth surface, while the support surface of the cassette is generally angled, the tracing paper slides along this angled surface after being placed in the cassette. This creates a gap between the tracing paper and the support surface, and the tracing paper also bends and dents downwards. In this situation, the silicon wafers falling into the cassette slide along the uneven tracing paper, resulting in inconsistent placement of each wafer. This prevents the wafers from being neatly stacked in the cassette, making them more susceptible to damage when removed. Utility Model Content
[0004] The purpose of this application is to provide a silicon wafer cassette to solve the problem that the tracing paper in existing silicon wafer cassettes slides along the cassette's bearing surface.
[0005] To achieve this objective, the following technical solution is adopted in this application:
[0006] This application discloses a silicon wafer cassette, comprising a base, a carrier, a first limiting member, a second limiting member, and an anti-slip pad, wherein:
[0007] The carrier is mounted at an angle on the base. The angled upper surface of the carrier is used to receive the protective sheet and the silicon wafer. The two sides of the downward angled end of the carrier are a first side and a second side that are perpendicular to each other. A first limiting member is mounted vertically outside the first side of the carrier, and a second limiting member is mounted vertically outside the second side of the carrier. The first limiting member and the second limiting member are configured to prevent the silicon wafer from detaching from the carrier along the downward angled end of the carrier.
[0008] The anti-slip pad is attached to the upper surface of the support component. The anti-slip pad is used to support the protective sheet. The adhesive force and friction between the protective sheet and the anti-slip pad are greater than the component of the protective sheet's own weight in the direction parallel to the upper surface of the support component.
[0009] The silicon wafer box provided in the application is provided with an antiskid pad on the inclined upper surface of the bearing part, the protective sheet is carried by the antiskid pad and adheres to the antiskid pad by the adhesive effect of the antiskid pad itself, the adhesive force and friction force between the protective sheet and the antiskid pad are greater than the component force of the self-weight of the protective sheet in the direction parallel to the upper surface of the bearing part, so that the protective sheet can adhere flatly on the antiskid pad and cannot slide along the antiskid pad, the position of each silicon wafer falling into the box is uniform, the uniform stacking of the silicon wafers is ensured, and damage to the silicon wafers when the stacked wafers are taken out from the box subsequently is avoided; meanwhile, the upper surface of the bearing part is inclined, the two side edges of the end of the bearing part inclined downward are mutually perpendicular, the first limiting part and the second limiting part are arranged on the two side edges respectively, the silicon wafer slides along the end of the bearing part inclined downward by the self-weight after being put into the box, and the first limiting part and the second limiting part realize automatic alignment of the silicon wafer, further ensuring the uniform stacking of the silicon wafers in the box.
[0010] Optionally, the antiskid pad is a single silica gel pad, the lower surface of the silica gel pad is fixedly attached to the upper surface of the bearing part, and the protective sheet adheres flatly to the upper surface of the silica gel pad.
[0011] By setting the antiskid pad as a single silica gel pad, the protective sheet is adhered flatly to the upper surface of the silica gel pad by relying on the adhesive properties of the silica gel itself, thereby providing an antiskid pad with a large contact area and good adhesive properties.
[0012] Optionally, the antiskid pad includes a plurality of silica gel pieces, the plurality of silica gel pieces are arranged at a predetermined interval, the plurality of silica gel pieces cooperatively form a region for adhering the protective sheet, the lower surface of the silica gel piece is fixedly attached to the upper surface of the bearing part, and the upper surface of the silica gel piece adheres to the corresponding part of the protective sheet.
[0013] By setting the antiskid pad as a plurality of silica gel pieces arranged at a predetermined interval, a plurality of adhesive points are formed on the upper surface of the bearing part by relying on the adhesive properties of each silica gel piece, thereby providing an antiskid pad with less material and low cost while ensuring that the protective sheet is adhered flatly to the bearing part.
[0014] The application provides a silicon wafer box, which includes a base, a bearing part, a first limiting part, a second limiting part and an antiskid pad.
[0015] The bearing part is obliquely installed on the base, the obliquely upper surface of the bearing part is used for receiving the protective sheet and the silicon wafer, the two side edges of the end of the bearing part inclined downward are mutually perpendicular first and second side edges, the first limiting part is installed vertically outside the first side edge of the bearing part, the second limiting part is installed vertically outside the second side edge of the bearing part, and the first and second limiting parts are configured to block the silicon wafer from separating from the bearing part along the end of the bearing part inclined downward;
[0016] The anti-skid pad is arranged on the upper surface of the bearing member, and the surface of the anti-skid pad is provided with static electricity, and the electrostatic attraction and friction between the protective sheet and the anti-skid pad are greater than the component of the weight of the protective sheet in the direction parallel to the upper surface of the bearing member.
[0017] The silicon wafer box provided in the application is provided with an anti-skid pad on the inclined upper surface of the bearing member, and the anti-skid pad is provided with static electricity on the surface. The protective sheet is carried by the anti-skid pad, and the protective sheet is adsorbed on the anti-skid pad by the static electricity on the surface of the anti-skid pad. Because the electrostatic attraction and friction between the protective sheet and the anti-skid pad are greater than the component of the weight of the protective sheet in the direction parallel to the upper surface of the bearing member, the protective sheet can be adsorbed flat on the anti-skid pad and cannot slide along the anti-skid pad. Therefore, the position of each silicon wafer falling into the box is uniform, and the normal stacking of the silicon wafers is ensured, thereby avoiding damage to the silicon wafers when the stacked wafers are taken out of the box subsequently. Meanwhile, the upper surface of the bearing member is inclined, and the mutually perpendicular two sides of the end of the bearing member inclined downward are respectively provided with a first limiting member and a second limiting member. After the silicon wafer is placed in the box, the silicon wafer slides along the end of the bearing member inclined downward by gravity, and the first limiting member and the second limiting member are used to automatically align the silicon wafer, thereby further ensuring that the silicon wafers in the box are neatly stacked.
[0018] Optionally, the anti-skid pad comprises a plurality of pads with static electricity, and the plurality of pads are arranged at a predetermined interval. The plurality of pads cooperatively form a region for electrostatic adsorption of the protective sheet. The lower surface of the pad is fixed on the inclined surface of the bearing member, and the upper surface of the pad adsorbs and fixes the corresponding part of the protective sheet.
[0019] By arranging the anti-skid pad as a plurality of pads with static electricity at a predetermined interval, a plurality of electrostatic adsorption points are formed on the upper surface of the bearing member by the electrostatic adsorption characteristics of each pad. The plurality of pads cooperatively adsorb the protective sheet flat on the bearing member, thereby providing another kind of anti-skid pad with less material and low cost.
[0020] Optionally, the base comprises a base and a connecting member. The first end of the connecting member is mounted on the base, and the second end of the connecting member is formed with a mounting inclined surface. The bearing member is fixedly mounted on the mounting inclined surface, and the mounting inclined surface supports the bearing member, so that the upper surface of the bearing member is inclined.
[0021] By arranging the mounting inclined surface on the second end of the connecting member, the bearing member is inclined on the mounting inclined surface, so that the bearing member has an inclined upper surface. The structure is simple and easy to implement. Meanwhile, by replacing the connecting member with a mounting inclined surface of different inclination, the angle of the inclined surface can be adjusted, thereby being good in versatility.
[0022] Optionally, the bearing member comprises a bearing plate and a pad plate, wherein:
[0023] The bearing plate is fixedly installed on the installation slope, and the backing plate is detachably attached to the upper surface of the bearing plate and is matched with the silicon wafer carried by the bearing.
[0024] By setting the bearing as the bearing plate and the backing plate, the backing plate is detachably attached to the upper surface of the bearing plate, and quick adaptation and replacement can be performed according to different protective sheets and silicon wafer specifications, thereby providing a bearing with good universality and quick replacement.
[0025] Optionally, the raised end of the bearing plate and the backing plate is correspondingly provided with a relief gap, and the silicon wafer carried by the bearing protrudes from the relief gap.
[0026] By correspondingly providing the raised end of the bearing plate and the backing plate with the relief gap, the silicon wafer protrudes from the relief gap, which facilitates subsequent pickup of the magazine carrying mechanism.
[0027] Optionally, the base is provided with a plurality of pickup portions for facilitating the magazine carrying mechanism to carry the magazine.
[0028] By cooperation of the pickup portion and the magazine carrying mechanism, the magazine carrying mechanism can obtain and carry the magazine, thereby realizing automatic circulation of the magazine.
[0029] Optionally, the first limiting member includes at least two first blocking strips, and the at least two first blocking strips are spaced apart and installed at the first side edge; the second limiting member includes at least two second blocking strips, and the at least two second blocking strips are spaced apart and installed at the second side edge.
[0030] The first blocking strip and the second blocking strip are detachably provided with a flexible pad on the limiting surface facing the accommodation space.
[0031] By setting the first limiting member as the at least two first blocking strips spaced apart and installed at the first side edge and setting the second limiting member as the at least two second blocking strips spaced apart and installed at the second side edge, a first limiting member and a second limiting member with simple structure and stable and reliable support are provided, and the flexible pad is detachably installed on the limiting surface of the first blocking strip and the second blocking strip facing the accommodation space, thereby avoiding hard contact between the silicon wafer and the first blocking strip and the second blocking strip during loading and having good buffering effect and reducing the probability of damage to the silicon wafer. BRIEF DESCRIPTION OF DRAWINGS
[0032] Figure 1 is a schematic diagram of the three-dimensional structure of the silicon wafer magazine provided by the embodiment of the present application;
[0033] Figure 2 is a schematic diagram of the front view of the silicon wafer magazine provided by the embodiment of the present application;
[0034] Figure 3 is an exploded schematic diagram of the bearing of the silicon wafer magazine provided by the embodiment of the present application;
[0035] Figure 4 is a structural schematic view of a base plate of a wafer box provided by an embodiment of the present application, which is adapted to different sizes of wafers;
[0036] Figure 5 is a structural schematic view of the installation of a plurality of pads of a wafer box provided by an embodiment of the present application.
[0037] Figures 1 to 5 The following reference signs are included in the claims:
[0038] The base 10, the base 11, the connecting piece 12, the installation slope 120, the positioning piece 13, the pickup 14, the mounting block 140, the clamping column 141, the laminated sheet 100;
[0039] The carrier 20, the first side 21, the second side 22, the carrier plate 201, the base plate 202, the first base plate 202a, the second base plate 202b, the avoiding gap 203;
[0040] The first limiting piece 30, the first blocking strip 31, the flexible pad 310, the waist-shaped hole 311;
[0041] The second limiting piece 40, the second blocking strip 41;
[0042] The anti-skid pad 50, the silica gel pad 51, the pad 52. DETAILED DESCRIPTION
[0043] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the present application will be further described in detail below in combination with the drawings and specific embodiments.
[0044] After the wafer in the photovoltaic module is detected by the sorting machine, the sorting machine will send the wafer into the corresponding box according to the detection result of the wafer. In order to protect the wafer, a piece of sulfuric acid paper will be placed in the box first, and the wafers subsequently received by the box will be stacked on the sulfuric acid paper in turn.
[0045] However, since the sulfuric acid paper is light in quality and smooth in surface, and the bearing surface of the box is generally inclined, after the sulfuric acid paper is placed in the box, the sulfuric acid paper will slide along the inclined bearing surface in the box, there will be a gap between the sulfuric acid paper and the bearing surface, and the sulfuric acid paper will be bent and concave downward. In this case, the wafer will slide along the uneven sulfuric acid paper after falling into the box, and the position of each wafer falling into the box cannot be unified, resulting in that the wafers cannot be neatly stacked in the box, and the stacked wafers will be easily damaged when being taken out of the box.
[0046] Therefore, the present application provides a wafer box, please refer to Figure 1As shown, the silicon wafer box provided by the embodiment of the present application comprises a base 10, a bearing member 20, a first limiting member 30, a second limiting member 40 and an anti-skid pad 50, wherein: the bearing member 20 is obliquely installed on the base 10, the oblique upper surface of the bearing member 20 is used for receiving the protective sheet and the silicon wafer, the two side edges of the obliquely downward end of the bearing member 20 are a first side edge 21 and a second side edge 22 which are perpendicular to each other, the first limiting member 30 is vertically installed outside the first side edge 21 of the bearing member 20, the second limiting member 40 is vertically installed outside the second side edge 22 of the bearing member 20, the first limiting member 30 and the second limiting member 40 are configured to block the silicon wafer from escaping from the bearing member 20 along the obliquely downward end of the bearing member 20; the anti-skid pad 50 is attached to the upper surface of the bearing member 20, and the anti-skid pad 50 is used for bearing the protective sheet, and the adhesive force and the friction force between the protective sheet and the anti-skid pad 50 are greater than the component force of the weight of the protective sheet in the direction parallel to the upper surface of the bearing member 20.
[0047] Specifically, the protective sheet is sulfuric acid paper.
[0048] As can be seen, the silicon wafer box provided by the present application is provided with the anti-skid pad 50 on the oblique upper surface of the bearing member 20, the protective sheet is borne by the anti-skid pad 50 and adhered to the anti-skid pad 50 by the adhesive property of the anti-skid pad 50 itself, and the adhesive force and the friction force between the protective sheet and the anti-skid pad 50 are greater than the component force of the weight of the protective sheet in the direction parallel to the upper surface of the bearing member 20, so that the protective sheet can be adhered to the anti-skid pad 50 flatly and cannot slide along the anti-skid pad, so that the positions of the silicon wafers falling into the box are uniform, and the orderly stacking of the silicon wafers is ensured, and the damage to the silicon wafers caused by taking the stacked wafers out of the box subsequently is avoided; meanwhile, the upper surface of the bearing member 20 is obliquely arranged, the mutually perpendicular two side edges of the obliquely downward end of the bearing member 20 are respectively provided with the first limiting member 30 and the second limiting member 40, and the silicon wafers slide along the obliquely downward end of the bearing member 20 by the weight after being put into the box, and the first limiting member 30 and the second limiting member 40 are used to realize the automatic alignment of the silicon wafers, and the orderly stacking of the silicon wafers in the box is further ensured.
[0049] Please refer to Figures 1 to 3 As an embodiment, the anti-skid pad 50 is a single silica gel pad 51, the lower surface of the silica gel pad 51 is attached and fixed to the upper surface of the bearing member 20, and the protective sheet is adhered to the upper surface of the silica gel pad 51 flatly.
[0050] It should be noted that: the silica gel has soft texture, good anti-skid property and adhesive property on the surface, and can adhere to the protective sheet attached to the surface.
[0051] As can be seen, by arranging the anti-skid pad 50 as a single silica gel pad 51, the protective sheet is adhered to the upper surface of the silica gel pad 51 flatly by relying on the adhesive property of the silica gel itself, and the anti-skid pad 50 with large contact area and good adhesive property is provided.
[0052] As an implementation, the anti-skid pad 50 comprises a plurality of silica gel pieces arranged at a predetermined interval, the silica gel pieces cooperatively form an area for adhering the protective sheet, the lower surface of the silica gel pieces is fixedly attached to the upper surface of the carrier 20, and the upper surface of the silica gel pieces adheres the corresponding part of the protective sheet.
[0053] It can be seen that by arranging the anti-skid pad 50 as a plurality of silica gel pieces arranged at a predetermined interval, and relying on the adhesion characteristics of each silica gel piece, a plurality of adhesion points are formed on the upper surface of the carrier 20, which not only ensures the flat adhesion of the protective sheet on the carrier 20, but also provides an anti-skid pad 50 with less material and low cost.
[0054] Referring to FIGS. 1-4, Figure 1 and Figure 5 The present application also provides a silica piece storage box, and the silica piece storage box provided by the embodiments of the present application comprises a base 10, a carrier 20, a first limiting piece 30, a second limiting piece 40, and an anti-skid pad 50, wherein: the carrier 20 is obliquely installed on the base 10, the oblique upper surface of the carrier 20 is used for receiving the protective sheet and the silica piece, the two side edges of the obliquely downward end of the carrier 20 are a first side edge 21 and a second side edge 22 which are perpendicular to each other, the first limiting piece 30 is installed vertically outside the first side edge 21 of the carrier 20, the second limiting piece 40 is installed vertically outside the second side edge 22 of the carrier 20, and the first limiting piece 30 and the second limiting piece 40 are configured to block the silica piece from being separated from the carrier 20 along the obliquely downward end of the carrier 20; the anti-skid pad 50 is attached to the upper surface of the carrier 20, the anti-skid pad 50 is used for carrying the protective sheet, the surface of the anti-skid pad 50 has static electricity, and the static attraction and friction between the protective sheet and the anti-skid pad 50 are greater than the component force of the weight of the protective sheet in the direction parallel to the upper surface of the carrier 20.
[0055] It can be seen that the silicon wafer box provided in the application is provided with the anti-skid pad 50 on the inclined upper surface of the bearing part 20, and the anti-skid pad 50 is provided with static electricity on the surface. The protective sheet is carried by the anti-skid pad 50 and is adsorbed on the anti-skid pad 50 by the static electricity on the surface of the anti-skid pad 50. Because the static attraction and friction force between the protective sheet and the anti-skid pad 50 is greater than the component force of the self-weight of the protective sheet in the direction parallel to the upper surface of the bearing part 20, the protective sheet can be adsorbed flat on the anti-skid pad 50 and cannot slide along the anti-skid pad 50, so that the position of each silicon wafer falling into the box is uniform, thereby ensuring the normal stacking of the silicon wafers and avoiding damage to the silicon wafers when the stacked wafers are taken out from the box subsequently. Meanwhile, the upper surface of the bearing part 20 is arranged to be inclined, and the first limiting part 30 and the second limiting part 40 are arranged on the mutually perpendicular two sides of the end of the bearing part 20, which inclines downward. After the silicon wafer is put into the box, it slides along the end of the bearing part 20, which inclines downward, by the self-weight, and the automatic alignment of the silicon wafer is realized by the first limiting part 30 and the second limiting part 40, thereby further ensuring the neat stacking of the silicon wafers in the box.
[0056] As an embodiment, the anti-skid pad 50 includes a plurality of pad skins 52 with static electricity. The plurality of pad skins 52 are arranged at a predetermined interval. The plurality of pad skins 52 cooperatively form a region for electrostatic adsorption of the protective sheet. The lower surface of the pad skin 52 is fixedly attached to the inclined surface of the bearing part 20. The upper surface of the pad skin 52 adsorbs and fixes the corresponding part of the protective sheet.
[0057] It can be seen that by arranging the anti-skid pad 50 as a plurality of pad skins 52 with static electricity and at a predetermined interval, a plurality of electrostatic adsorption points are formed on the upper surface of the bearing part 20 by the electrostatic adsorption characteristics of each pad skin 52. The plurality of pad skins 52 cooperatively adsorb the protective sheet flat on the bearing part 20, thereby providing another anti-skid pad 50 with less material and low cost.
[0058] Please refer to Figures 2 to 4 As an embodiment, the base 10 further includes a base 11 and a connecting part 12. The first end of the connecting part 12 is mounted on the base 11. The second end of the connecting part 12 is formed with a mounting inclined surface 120. The bearing part 20 is fixedly mounted on the mounting inclined surface 120. The mounting inclined surface 120 supports the bearing part 20, so that the upper surface of the bearing part 20 is inclined.
[0059] Specifically, the base 11 is a flat plate structure. The connecting part 12 is a columnar structure. The connecting part 12 is fixed vertically at the central position of the upper plate surface of the base 11. The upper end surface of the connecting part 12 is the inclined mounting inclined surface 120. The bearing part 20 is an inclined plate.
[0060] It can be seen that by arranging the mounting slope 120 on the second end of the connecting piece 12, the mounting slope 120 is arranged in an inclined manner to make the bearing piece 20 have an inclined upper surface, which is simple in structure and easy to implement. Meanwhile, by replacing the connecting piece 12 with a mounting slope 120 having a different inclination, the angle of the inclined surface can be adjusted, which is good in versatility.
[0061] Please refer to Figures 3 to 5 As an embodiment, the bearing piece 20 includes a bearing plate 201 and a pad plate 202, wherein: the bearing plate 201 is fixedly arranged on the mounting slope 120, and the pad plate 202 is detachably arranged on the upper surface of the bearing plate 201, and the pad plate 202 is adapted to the silicon wafer carried by the bearing piece 20.
[0062] Specifically, the pad plate 202 is made of epoxy resin, and after the pad plate 202 is worn out, it only needs to be replaced, which is conducive to reducing the use cost of the magazine.
[0063] Specifically, in order to adapt to silicon wafers of different sizes, the pad plate 202 can be selected as a first pad plate 202a or a second pad plate 202b according to needs, the first pad plate 202a is used to carry the wafer 100 stacked by full-wafer first silicon wafers, and the second pad plate 202b is used to carry the wafer 100 stacked by full-wafer second silicon wafers, the size of the second silicon wafers being larger than that of the first silicon wafers. Moreover, the first pad plate 202a can also be used to carry the wafer 100 stacked by half-wafer first silicon wafers, and the second pad plate 202b can also be used to carry the wafer 100 stacked by half-wafer second silicon wafers.
[0064] Specifically, the base 11 is provided with a plurality of positioning pieces 13, the positioning pieces 13 cooperate with external guide pieces to realize positioning of the placement position of the silicon wafer magazine, and the positioning pieces 13 are a plurality of positioning holes opened in the base 11, and the external guide pieces are inserted into the corresponding positioning holes to realize positioning of the placement position of the silicon wafer magazine.
[0065] It can be seen that by arranging the bearing piece 20 as the bearing plate 201 and the pad plate 202, and detachably arranging the pad plate 202 on the upper surface of the bearing plate 201, the pad plate 202 can be quickly adapted and replaced according to different protective sheets and silicon wafer specifications, thereby providing a bearing piece 20 which is good in versatility and can be quickly changed.
[0066] As an embodiment, a raised end of the bearing plate 201 and the pad plate 202 is correspondingly provided with an avoiding gap 203, and the silicon wafer carried by the bearing piece 20 protrudes out of the avoiding gap 203.
[0067] It can be seen that by correspondingly arranging the avoiding gap 203 in the raised end of the bearing plate 201 and the pad plate 202, the silicon wafer protrudes out of the avoiding gap 203, which is convenient for subsequent picking up by the magazine carrying mechanism.
[0068] Please see Figures 1 to 3 As shown, in one embodiment, the base 11 is provided with a plurality of picking parts 14 to facilitate the material box handling mechanism to handle the material box.
[0069] Specifically, the base 11 is provided with four pickup parts 14 located around the support member 20. Each pickup part 14 includes a mounting block 140 and a locking post 141. The first end of the mounting block 140 is fixed to the base 11, and the locking post 141 is fixed to the second end of the mounting block 140 and extends outward relative to the support member 20. The material box conveying mechanism is provided with four hooks. When conveying the material box, each hook corresponds to a locking post 141. The material box is picked up by the four hooks of the material box conveying mechanism hooking the corresponding locking post 141.
[0070] It can be seen that by cooperating with the picking unit 14 and the box handling mechanism, the box handling mechanism can easily acquire and transport the boxes, thus realizing the automated circulation of the boxes.
[0071] Please see Figures 1 to 3 As shown, in one embodiment, the first limiting member 30 includes at least two first stop bars 31, which are spaced apart and installed at the first side 21. The second limiting member 40 includes at least two second stop bars 41, which are spaced apart and installed at the second side 22. Flexible pads 310 are detachably installed on the limiting surfaces of the first stop bars 31 and the second stop bars 41 facing the accommodating space.
[0072] Specifically, the first limiting member 30 includes two first stop bars 31, which are spaced apart along the first side 21, and the second limiting member 40 includes two second stop bars 41, which are spaced apart along the second side 22.
[0073] Of course, the number of the first stop bar 31 and the second stop bar 41 can be three or more, and the number of the first stop bar 31 and the second stop bar 41 will not be repeated here.
[0074] Specifically, the flexible pad 310 is detachably mounted on the first stop bar 31 and the second stop bar 41 by multiple screws. Both the first stop bar 31 and the second stop bar 41 are provided with waist-shaped holes 311 extending along the height direction. The flexible pad 310 is provided with multiple through holes, each through hole corresponding to a waist-shaped hole 311. Each screw passes through a through hole on the corresponding stop bar and is locked in the corresponding waist-shaped hole 311 to fix the flexible pad 310 on the first stop bar 31 and the second stop bar 41 respectively.
[0075] It can be seen that by arranging the first limiting member 30 to be spacedly installed at the at least two first blocking strips 31 of the first side edge 21 and arranging the second limiting member 40 to be spacedly installed at the at least two second blocking strips 41 of the second side edge 22, the first limiting member 30 and the second limiting member 40 are provided with simple structure and stable and reliable support, and the flexible pad 310 is detachably installed on the limiting surface of the first blocking strip 31 and the second blocking strip 41 towards the accommodating space, so that the hard contact of the silicon wafer with the first blocking strip 31 and the second blocking strip 41 is avoided during loading, the good buffering effect is achieved, and the probability of damage of the silicon wafer is reduced.
[0076] The silicon wafer box provided by the embodiment of the present application has the following advantages:
[0077] 1) The anti-skid pad 50 is arranged on the carrier, and the protective sheet can be flatly adhered to the anti-skid pad 50 and cannot slide along the anti-skid pad 50, so that the position of each silicon wafer falling into the box is uniform;
[0078] 2) The anti-skid pad 50 is arranged as a single silica gel pad or a plurality of silica gel sheets, and the flat adhesion of the protective sheet to the upper surface of the silica gel pad 51 is realized by relying on the adhesion characteristics of the silica gel itself;
[0079] 3) The anti-skid pad 50 is arranged as a plurality of pads 52 with static electricity, a plurality of static adsorption points are formed on the upper surface of the carrier 20 by relying on the static adsorption characteristics of each pad 52, and the protective sheet is flatly adsorbed on the carrier 20 by cooperation of the plurality of pads 52;
[0080] 4) The pad plate is arranged, and the pad plate is replaced to adapt to silicon wafers of different sizes, so that the rapid change of the box is realized;
[0081] 5) The upper surface of the carrier 20 is arranged to be inclined, and the automatic alignment of the silicon wafer is realized by cooperation of the first limiting member 30 and the second limiting member 40, so that the silicon wafers in the box are further ensured to be neatly stacked.
[0082] The above embodiments only illustrate the basic principles and characteristics of the present application, and the present application is not limited by the above examples. Various changes and changes of the present application are possible without departing from the spirit and scope of the present application, and these changes and changes fall within the scope of the claimed present application. The scope of protection claimed by the present application is defined by the appended claims and their equivalents.
Claims
1. A silicon wafer magazine characterized by, The silicon wafer box comprises a base, a bearing, a first limiting piece, a second limiting piece and an anti-skid pad, wherein: The bearing is obliquely installed on the base, the oblique upper surface of the bearing is used for receiving the protective sheet and the silicon wafer, the two side edges of the downward oblique end of the bearing are a first side edge and a second side edge perpendicular to each other, the first limiting piece is vertically installed outside the first side edge of the bearing, the second limiting piece is vertically installed outside the second side edge of the bearing, and the first limiting piece and the second limiting piece are configured to block the silicon wafer from being separated from the bearing along the downward oblique end of the bearing. The anti-skid pad is attached to the upper surface of the bearing, the anti-skid pad is used to carry the protective sheet, and the adhesion and friction between the protective sheet and the anti-skid pad are greater than the component force of the weight of the protective sheet in the direction parallel to the upper surface of the bearing.
2. The silicon wafer magazine of claim 1, wherein The anti-skid pad is a single silica gel pad, the lower surface of the silica gel pad is fixedly attached to the upper surface of the bearing, and the protective sheet is flatly attached to the upper surface of the silica gel pad.
3. The silicon wafer magazine of claim 1, wherein, The anti-skid pad comprises a plurality of silica gel pieces, the plurality of silica gel pieces are arranged at a predetermined interval, the plurality of silica gel pieces cooperatively form an area for attaching the protective sheet, the lower surface of the silica gel piece is fixedly attached to the upper surface of the bearing, and the upper surface of the silica gel piece attaches the corresponding part of the protective sheet.
4. A silicon wafer magazine characterized by, The silicon wafer box comprises a base, a bearing, a first limiting piece, a second limiting piece and an anti-skid pad, wherein: The bearing is obliquely installed on the base, the oblique upper surface of the bearing is used for receiving the protective sheet and the silicon wafer, the two side edges of the downward oblique end of the bearing are a first side edge and a second side edge perpendicular to each other, the first limiting piece is vertically installed outside the first side edge of the bearing, the second limiting piece is vertically installed outside the second side edge of the bearing, and the first limiting piece and the second limiting piece are configured to block the silicon wafer from being separated from the bearing along the downward oblique end of the bearing. The anti-skid pad is attached to the upper surface of the bearing, the anti-skid pad is used to carry the protective sheet, and the adhesion and friction between the protective sheet and the anti-skid pad are greater than the component force of the weight of the protective sheet in the direction parallel to the upper surface of the bearing.
5. The silicon wafer magazine of claim 4, wherein, The anti-skid pad comprises a plurality of silica gel pieces, the plurality of silica gel pieces are arranged at a predetermined interval, the plurality of silica gel pieces cooperatively form an area for attaching the protective sheet, the lower surface of the silica gel piece is fixedly attached to the upper surface of the bearing, and the upper surface of the silica gel piece attaches the corresponding part of the protective sheet.
6. The silicon wafer magazine according to claim 1 or 4, characterized in that The base comprises a base and a connecting piece, the first end of the connecting piece is installed on the base, the second end of the connecting piece is formed with an installation inclined surface, the bearing is fixedly installed on the installation inclined surface, and the installation inclined surface supports the bearing so that the upper surface of the bearing is inclined.
7. The silicon wafer magazine of claim 6 wherein, The bearing comprises a bearing plate and a pad plate, wherein: The bearing plate is fixedly installed on the installation slope, and the backing plate is detachably and tightly installed on the upper surface of the bearing plate and is matched with the silicon wafer carried by the bearing.
8. The silicon wafer magazine of claim 7, wherein, The bearing plate and the backing plate are correspondingly provided with avoiding notches at the upturned ends, and the silicon wafer carried by the bearing protrudes from the avoiding notches.
9. The silicon wafer magazine of claim 6 wherein, The base is provided with a plurality of pickup portions for facilitating the material box carrying mechanism to carry the material box.
10. The silicon wafer magazine according to claim 1 or 4, characterized in that The first limiting piece comprises at least two first blocking strips, and the at least two first blocking strips are installed at the first side edge in an interval manner. The first blocking strips and the second blocking strips are detachably installed with flexible pads on the limiting surfaces of the accommodating space.