Semiconductor chip test fixing device
By designing a semiconductor chip testing and fixing device with a stepped placement area and adsorption holes, the problem of placing and removing chips of different sizes was solved, achieving convenient operation and cost reduction.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-13
- Publication Date
- 2026-03-27
AI Technical Summary
Existing technologies lack a device for inserting, removing, and securing chips of different sizes, resulting in high development costs.
A semiconductor chip testing and fixing device was designed. It adopts a stepped placement area and adsorption holes in the base, combined with the initial, loading and unloading states of the top plate, and uses an air pump to achieve chip adsorption and fixing. The operation is automated through a driving component and a weight sensing module.
It enables convenient insertion, removal, and fixation of chips of different sizes, reduces development costs, and is suitable for large-scale application.
Smart Images
Figure CN224052235U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of semiconductor testing, especially to a semiconductor chip test fixing device. BACKGROUND
[0002] The necessity of chip testing not only comes from its complex manufacturing process, but also relates to product quality control and market competitiveness. Chip production involves dozens or even hundreds of steps, and any minor oversight can cause chip malfunction. Testing ensures the quality of chips on the market by screening products that deviate from standards. At the same time, chip testing helps improve product reliability, allowing it to last longer in users' hands.
[0003] Existing chips need to be fixed during testing, but different sizes of chips require different sizes of fixing devices, resulting in high development costs.
[0004] Therefore, there is a lack of a device on the market that can meet the needs of placing, removing, and fixing different sizes of chips. SUMMARY
[0005] The utility model aims at providing a semiconductor chip test fixing device that can meet the needs of placing, removing, and fixing different sizes of chips, thereby effectively reducing development costs.
[0006] The utility model achieves the following technical solutions:
[0007] A semiconductor chip test fixing device includes:
[0008] A base is provided with a loading port on the top, and multiple loading areas for placing different sizes of chips are arranged in the loading port in steps. The cross-sectional area of each loading area gradually decreases from top to bottom. Multiple suction holes are formed in each loading area, and the suction holes are connected to an external air pump through a pipeline.
[0009] A top plate is movably arranged in the loading port.
[0010] A driving member is arranged below the top plate, and the driving member can move the top plate from below the base to above the base.
[0011] Preferably, the driving member includes two electric push rods, which are symmetrically arranged at both ends below the top plate, and the piston end of the electric push rod is hinged to the lower side of the top plate.
[0012] Preferably, the top plate comprises a fixed layer and a rotating layer, the rotating layer is arranged above the fixed layer, the fixed layer is hinged with the piston end of the electric push rod, a rotating shaft is arranged between the fixed layer and the rotating layer, and the rotating layer can rotate along the central axis thereof through the rotating shaft.
[0013] Preferably, the number of the pipes corresponds to the number of the placing areas, each pipe is communicated with the adsorption holes of the corresponding placing area, the pipes are not communicated with each other, and an electromagnetic valve is arranged on each pipe.
[0014] Preferably, the semiconductor chip test fixing device comprises a weight sensing module, at least one weight sensing module is arranged in each placing area, and the weight sensing module is signal-connected with the electromagnetic valve through a controller.
[0015] Preferably, the top plate is in a cylindrical structure.
[0016] Preferably, the top of the base is surrounded by a smooth transition structure.
[0017] Compared with the prior art, the semiconductor chip test fixing device has at least the following beneficial effects:
[0018] The top plate has an initial state, a loading state and an unloading state, when the top plate is in the initial state, the top plate is located above the base;
[0019] When the top plate is in the loading state, the top plate moves from below the base to above the base, after the chip is placed on the top plate, the top plate moves from above the base to below the base, when the chip moves to the placing area matching the size of the chip, the chip is stopped on the corresponding placing area, and then the air pump is started to suck air to adsorb and fix the chip on the placing area through the adsorption hole;
[0020] When the top plate is in the unloading state, the top plate moves from below the base to above the base, at this time, the upward movement of the top plate lifts the chip to above the base, and then the chip can be taken out, thereby meeting the needs of placing, taking out and fixing chips of different sizes, and the operation is convenient, and the development cost for responding to chips of different sizes for testing is effectively reduced. BRIEF DESCRIPTION OF DRAWINGS
[0021] Figure 1 is a perspective view of the semiconductor chip test fixing device according to an embodiment of the utility model;
[0022] Figure 2 is a top view of the semiconductor chip test fixing device according to an embodiment of the utility model;
[0023] Figure 3 is Figure 3 a sectional view of A-A in FIG.
[0024] Figure 4 is a flowchart of the semiconductor chip test fixing device of the embodiment of the utility model.
[0025] In the figure: 1, base; 2, put in mouth; 3, place area; 4, adsorption hole; 5, pipeline; 6, top plate; 600, rotating layer; 601, fixed layer; 7, driving part; 700, electric push rod; 8, weight induction module; 9, round smooth transition structure. DETAILED DESCRIPTION
[0026] Example implementations will now be described more fully with reference to the accompanying drawings. Example implementations may, however, be implemented in many different forms and should not be construed as limited to the implementations set forth herein; rather, these implementations are provided so that this disclosure will be thorough and complete, and fully convey the inventive aspects of example implementations to those skilled in the art. Like reference numerals refer to like elements throughout the figures, and descriptions of the same elements will not be repeated.
[0027] The words expressing position and direction described in the utility model are all explained by taking the drawings as examples, but changes can also be made according to needs, and the changes made are all included in the protection scope of the utility model.
[0028] A semiconductor chip test fixing device, including base 1, top plate 6, driving part 7 and air pump.
[0029] As shown in Figures 1 to 4 Base 1, the top of base 1 is provided with put in mouth 2, and a plurality of place areas 3 for placing chips of different sizes are arranged in the put in mouth 2 in a stepped manner, the cross-sectional area of the place area 3 gradually decreases from top to bottom, and a plurality of adsorption holes 4 are formed in each place area 3, and the adsorption holes 4 are communicated with the external air pump through the pipeline 5;
[0030] Top plate 6, the top plate 6 is movably arranged in the put in mouth 2;
[0031] Driving part 7, the driving part 7 is arranged below the top plate 6, and the driving part 7 can drive the top plate 6 to move from below in the base 1 to above in the base 1;
[0032] Specifically, the top plate 6 has an initial state, a feeding state and a discharging state;
[0033] When the top plate 6 is in the initial state, the top plate 6 is located above the base 1, at which time the chip can be placed on the upper surface of the top plate 6; then the top plate 6 moves from above the base 1 to below the base 1, at which time the top plate 6 is in the loading state; when the top plate 6 moves, the chip moves downward with the top plate 6 until it reaches the placement area 3 of the same size, and then stops on the corresponding placement area 3; then the air pump is started to suck air and fix the chip on the placement area 3 through the adsorption hole 4, at which time the corresponding test of the chip can be started, including but not limited to observing the fine structure and defects of the chip.
[0034] When the top plate 6 is in the unloading state, the top plate 6 moves from below the base 1 to above the base 1, at which time the upward movement of the top plate 6 lifts the chip to above the base 1, and then the tested chip can be removed. The fixing device meets the needs of loading, removing and fixing chips of different sizes, is convenient to operate, effectively reduces the development cost of testing chips of different sizes, and is suitable for large-scale promotion and application.
[0035] As a further embodiment of the present embodiment, as shown in Figure 3 The driving member 7 includes two electric push rods 700, which are symmetrically arranged at both ends below the top plate 6, and the piston end of the electric push rod 700 is hinged to the lower side of the top plate 6. Specifically, when the chip is tested and the top plate 6 moves the chip to above the base 1, one of the electric push rods 700 continues to push the top plate 6 upward to tilt the top plate 6 by a certain angle, so as to overcome the attraction between the smooth back of the chip and the smooth surface of the top plate 6, facilitating the removal of the chip by the staff.
[0036] As a further embodiment of the present embodiment, as shown in Figure 3 The top plate 6 includes a fixed layer 601 and a rotating layer 600, the rotating layer 600 is arranged above the fixed layer 601, the fixed layer 601 is hinged to the piston end of the electric push rod 700, and a rotating shaft is arranged between the fixed layer 601 and the rotating layer 600. The rotating layer 600 can rotate along its own central axis through the rotating shaft, and an anti-skid thread is arranged on the side wall of the rotating layer 600. Specifically, in order to facilitate the staff to test the chip, since the placement angle of the chip is different each time the chip is placed on the top plate 6, the rotating layer 600 is rotated to make the chip at the required angle, avoiding the staff from directly contacting the chip for placement.
[0037] As a further embodiment of the present embodiment, as shown in Figure 3 and Figure 4As shown, the number of pipes 5 corresponds to the number of placement areas 3, and each pipe 5 is in communication with the adsorption hole 4 of the corresponding placement area 3, and the pipes 5 are not in communication with each other, and each pipe 5 is provided with a solenoid valve, specifically, when the chip is placed in different placement areas 3, the solenoid valve corresponding to the adsorption hole 4 in the placement area 3 is started by the external air pump, so that the adsorption hole 4 has the ability to adsorb and fix the chip, avoiding the adsorption hole 4 in each placement area 3 having adsorption force, thereby reducing the occurrence of external particulate matter entering the adsorption hole 4.
[0038] As a further embodiment of the present embodiment, as shown in Figures 1 to 4 As shown, the semiconductor chip test fixing device comprises a weight sensing module 8, at least one weight sensing module 8 is arranged in each placement area 3, and the weight sensing module 8 is signal-connected with the solenoid valve through the controller, as shown in Figure 4 As shown, three placement areas 3 are set, and each placement area 3 is provided with one weight sensing module 8, and the weight sensing module 8 on each placement area 3 is in communication with the corresponding solenoid valve, when the chip is placed in the placement area 3 of the corresponding size, the weight sensing module 8 in the placement area 3 will sense the chip, and therefore transmit a signal to the controller, and the controller can control the solenoid valve corresponding to the adsorption hole 4 in the placement area 3 to open, so that the adsorption hole 4 has the ability to adsorb and fix the chip, and the structure effectively improves the convenience of the device.
[0039] As a further embodiment of the present embodiment, the top plate 6 is a cylindrical structure, and the cross-sectional area of the top plate 6 is smaller than the cross-sectional area of the lowermost placement area 3 in the base 1, so that the top plate 6 can be rotated 360 degrees arbitrarily in the placing port 2.
[0040] As a further embodiment of the present embodiment, the top of the base 1 is surrounded by a smooth transition structure 9, which can avoid scratching the chip when the chip is placed by the worker.
[0041] Although the embodiments of the present application have been shown and described above, it should be understood that the above embodiments are exemplary and should not be construed as limiting the present application, and those skilled in the art can make changes, modifications, replacements and variations to the above embodiments without departing from the principles and purposes of the present application within the scope of the present application. All these changes should be within the protection scope of the present application.
Claims
1. A semiconductor chip testing fixture, characterized in that, include: The base has an inlet at its top, and the inlet has multiple placement areas arranged in a stepped manner for placing chips of different sizes. The cross-sectional area of the placement areas gradually decreases from top to bottom. Each placement area has multiple adsorption holes, which are connected to an external air pump through pipes. Top plate, which is movably disposed within the inlet; A driving component is disposed below the top plate, and the driving component can drive the top plate to move from below the base to above the base.
2. The semiconductor chip testing and fixing device according to claim 1, characterized in that, The drive unit includes two electric actuators, which are symmetrically arranged at both ends below the top plate, and the piston end of the electric actuator is hinged to the bottom of the top plate.
3. The semiconductor chip testing and fixing device according to claim 2, characterized in that, The top plate includes a fixed layer and a rotating layer. The rotating layer is disposed above the fixed layer. The fixed layer is hinged to the piston end of the electric actuator. A rotating shaft is provided between the fixed layer and the rotating layer. The rotating layer can rotate along its own central axis through the rotating shaft.
4. The semiconductor chip testing and fixing device according to claim 1, characterized in that, The number of pipes corresponds to the number of placement areas, and each pipe is connected to the adsorption hole of the corresponding placement area. The pipes are not interconnected, and each pipe is equipped with a solenoid valve.
5. The semiconductor chip testing and fixing device according to claim 4, characterized in that, The semiconductor chip testing fixture includes a weight sensing module, and at least one weight sensing module is provided in each placement area. The weight sensing module is connected to the solenoid valve signal via a controller.
6. The semiconductor chip testing fixture according to claim 1, characterized in that, The top plate is a cylindrical structure.
7. The semiconductor chip testing and fixing device according to claim 1, characterized in that, The top of the base has a smooth transition structure around its perimeter.