Air-cooled radiator and mainframe box

Abstract

The utility model discloses an air cooling radiator and a mainframe box. The air cooling radiator comprises a base, a heat conduction pipe assembly, cooling fins and a fan. The heat conduction pipe assembly comprises an L-shaped heat conduction pipe, the heat conduction pipe is provided with a heat source contact section and a heat conduction section, and the heat source contact section is connected to the base. The heat dissipation fins are connected to the heat source contact sections, and an avoiding space for installing a fan is formed between the heat dissipation fins and the base. In the application, the heat source contact section extends along the thickness direction of the heat dissipation fins, so that after the heat dissipation fins are installed on the heat conduction section, the heat dissipation fins are not located on one side of the base along the thickness direction but deviate from the base, thereby forming an avoidance space at the top of the base, facilitating the arrangement of a fan, and improving the heat dissipation efficiency. The fan cannot excessively protrude out of the side, away from the cooling fins, of the base. After the air-cooled radiator is installed on the circuit board, one side of the fan is not easy to interfere with a related structure on the circuit board, so that the air-cooled radiator is convenient to assemble, and the internal space of the mainframe box is also saved.

Description

TECHNICAL FIELD

[0001] The utility model relates to air cooling heat dissipation technical field, concretely relates to an air cooling heat sink and mainframe box. BACKGROUND

[0002] With the improvement of computer hardware performance, the power consumption and heat of CPU, GPU and other core elements increase significantly, and air cooling heat sink becomes the mainstream heat dissipation scheme because of the advantages of low cost, simple installation and maintenance. The traditional air cooling heat sink usually includes a base, a heat dissipation fin and a heat pipe. The base is used for heat conduction contact with the CPU, and the heat pipe is connected to the base and is used for quickly conducting heat to the heat dissipation fin area through the internal phase change heat transfer principle, and then the heat is dissipated by forced convection by the fan. In the related art, the heat pipe is in a U-shaped structure, the middle part is connected to the base, and the two sides are bent out of the base. The U-shaped bending structure causes the heat pipe to extend horizontally, and the heat pipe needs to be connected to the heat dissipation fin on both sides, which causes the horizontal size of the heat sink to expand, making it difficult to adapt to compact cases.

[0003] Therefore, the utility model is provided. UTILITY MODEL CONTENT

[0004] To solve one of the above technical problems, the utility model provides an air cooling heat sink and mainframe box.

[0005] The application provides the following technical scheme:

[0006] In a first aspect, the application provides an air cooling heat sink, comprising:

[0007] a base;

[0008] a heat pipe assembly, the heat pipe assembly comprising a plurality of heat pipes, each heat pipe being in an L-shaped structure and having a heat source contact section and a heat conduction section, the heat source contact section and the heat conduction section being connected, each heat source contact section being connected to the base, and each heat conduction section being located on the same side of the base;

[0009] a heat dissipation fin connected to each heat conduction section of the heat pipe assembly, the heat source contact section extending along the thickness direction of the heat dissipation fin, and an avoidance space being formed between the heat dissipation fin and the base;

[0010] a fan located in the avoidance space and on one side of the base along the thickness direction.

[0011] Optionally, the heat dissipation fin comprises a plurality of heat dissipation fin bodies, each heat dissipation fin body being arranged in sequence along the thickness direction of the base;

[0012] each heat conduction section penetrates each heat dissipation fin body;

[0013] The heat-conducting segments are arranged along the length direction of the heat-dissipating fin body.

[0014] Optionally, the heat-conducting segments are arranged along the same line.

[0015] Optionally, at least two adjacent heat-conducting segments are arranged in a staggered manner along the width direction of the heat-dissipating fin body.

[0016] Optionally, the base is provided with a plurality of embedding grooves on the side away from the heat-dissipating fin, and each heat-source contact segment is embedded in the embedding grooves.

[0017] Optionally, the end of the heat-source contact segment away from the heat-conducting segment protrudes out of the embedding groove.

[0018] Optionally, the length of the end of the heat-source contact segment away from the heat-conducting segment protruding out of the embedding groove is not greater than 1 cm.

[0019] Optionally, the end face of the end of the heat-source contact segment protruding out of the embedding groove and the peripheral side face of the heat-source contact segment are connected and transitioned through a tapered face.

[0020] Optionally, the air-cooled heat-dissipating device comprises a bottom cover connected to the base, the bottom cover covers each heat-source contact segment, and the side of the bottom cover away from each heat-source contact segment has a flat abutting face. The bottom cover can be made of copper and has good electrical conductivity, so that when the bottom cover contacts the CPU, heat can be efficiently transferred.

[0021] Optionally, the air-cooled heat-dissipating device comprises a fixing assembly.

[0022] The fixing assembly comprises a pressing plate and a connecting piece.

[0023] The pressing plate is located on the side of the base close to the fan, and the pressing plate is fixed to the base, and the two ends of the pressing plate protrude out of the pressing plate to be connected to the circuit board through the connecting piece.

[0024] Each heat-conducting pipe is arranged on the two sides of the pressing plate.

[0025] In a second aspect, the embodiments of the present application provide a host box, comprising:

[0026] a circuit board, wherein the circuit board is provided with a CPU;

[0027] The air-cooled heat-dissipating device described above is mounted on the circuit board, and the base covers the CPU.

[0028] By adopting the above technical solutions, the present application has the following beneficial effects:

[0029] The heat conduction pipe of the air-cooled radiator of the present application is of L-shaped structure, simple in structure, and each heat conduction pipe is arranged in sequence along the length direction of the heat dissipation fin, so that the thickness of the heat dissipation fin can be appropriately reduced, the volume of the whole air-cooled radiator is reduced, the internal space of the mainframe box is saved, and the arrangement of other structures in the mainframe box is facilitated. BRIEF DESCRIPTION OF DRAWINGS

[0030] The accompanying drawings, which are part of the present application, serve to further understand the present application, the illustrative embodiments of the present application and the description thereof serve to explain the present application, but do not constitute undue limitation on the present application. Obviously, the drawings described below are only some embodiments, and other drawings can be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0031] Figure 1 A state diagram of the air-cooled radiator mounted on the circuit board in the related art;

[0032] Figure 2 A state diagram of the air-cooled radiator mounted on the circuit board in the present application;

[0033] Figure 3 A perspective structural schematic diagram of the first air-cooled radiator provided in the present application;

[0034] Figure 4 Another view of the first air-cooled radiator provided in the present application;

[0035] Figure 5 A perspective structural schematic diagram of the second air-cooled radiator provided in the present application;

[0036] Figure 6 Another view of the second air-cooled radiator provided in the present application;

[0037] Figure 7 Another view of the air-cooled radiator provided in the present application.

[0038] In the figure: 1, base; 11, embedded groove; 2, heat dissipation fin; 21, heat dissipation fin body; 3, fan; 4, heat conduction pipe; 41, heat source contact section; 411, conical surface; 42, heat conduction section; 5, fixing assembly; 51, pressing plate; 52, connecting piece; 6, circuit board; 61, memory; 7, bottom cover. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments will be clearly and completely described below in combination with the drawings in the embodiments of the utility model, the following embodiments are used to illustrate the utility model, but not to limit the scope of the utility model.

[0040] In the description of the utility model, it needs to be explained that the position or location relationship indicated by the terms "upper", "lower", "inner", "outer" and the like is based on the position or location relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, therefore it cannot be understood as a limitation on the utility model.

[0041] In the description of the utility model, it needs to be explained that unless otherwise explicitly specified and limited, the terms "mounting", "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrally connected, it can be mechanical connection, or electrical connection, it can be directly connected, or indirectly connected through intermediate medium. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0042] With the improvement of computer hardware performance, the power consumption and heat of core elements such as CPU and GPU increase significantly, and the air-cooled radiator becomes the mainstream cooling scheme because of the advantages of low cost, simple installation and maintenance. The traditional air-cooled radiator usually includes a base, a heat dissipation fin and a heat pipe. The base is used for heat conduction contact with the CPU, the heat pipe is connected to the base, and is used for quickly conducting heat to the heat dissipation fin area through the internal phase change heat transfer principle, and then the heat is dissipated by forced convection by the fan. In the related art, the heat pipe is in a U-shaped structure, the middle part is connected to the base, and the two sides are bent out of the base. The U-shaped bending structure causes the heat pipe to extend horizontally, and the heat pipe needs to be connected to the heat dissipation fin on both sides, which causes the horizontal size of the radiator to expand, and it is difficult to adapt to compact cases. As shown in Figure 1 The fan in the air-cooled radiator is located on one side of the base, and when the base is installed on the circuit board 6, the fan of the air-cooled radiator is easy to interfere with the memory 61.

[0043] To solve the above technical problems, see Figures 1 to 7As shown, the embodiment of the present application provides a forced air cooling radiator, which comprises a base 1, a heat dissipation fin 2, a fan 3 and a heat pipe assembly. The heat pipe assembly comprises a plurality of heat pipes 4, each of which is in L-shaped structure and has a heat source contact section 41 and a heat conduction section 42. The heat source contact section 41 and the heat conduction section 42 are connected, each of the heat source contact sections 41 is connected to the base 1, and each of the heat conduction sections 42 is located on the same side of the base 1. The heat dissipation fin 2 is connected to each of the heat conduction sections 41 of the heat pipe assembly. The heat source contact section 41 extends along the thickness direction of the heat dissipation fin 2, and an avoiding space is formed between the heat dissipation fin 2 and the base 1. The fan 3 is located in the avoiding space and on the side of the base 1 along the thickness direction.

[0044] In the embodiment of the present application, the heat source contact section 41 extends along the thickness direction of the heat dissipation fin 2, so that after the heat dissipation fin 2 is installed on the heat conduction section 42, the heat dissipation fin 2 is not located on the side (e.g. directly above) of the base 1 along the thickness direction, but deviates from the base 1, thereby forming an avoiding space on the top of the base 1. The fan is located on the side of the base 1 along the thickness direction (e.g. directly above), and does not protrude too much from the side of the base 1 away from the heat dissipation fin. After the forced air cooling radiator is installed on the circuit board 6, the side of the fan is not easy to interfere with the relevant structure (memory 61) on the circuit board 6, thereby facilitating the assembly of the forced air cooling radiator and saving the internal space of the mainframe. The forced air cooling radiator of the present application is suitable for compact mainframes.

[0045] In some possible embodiments, the heat dissipation fin 2 is located on the side of the base 1 along the thickness direction, the thickness direction of the heat dissipation fin 2 is perpendicular to the thickness direction of the base 1, the fan 3 is arranged on the side of the heat dissipation fin 2 along the thickness direction, the heat pipe assembly comprises a plurality of heat pipes 4, each of which is in L-shaped structure and has a heat source contact section 41 and a heat conduction section 42. The heat source contact section 41 and the heat conduction section 42 are connected, each of the heat source contact sections 41 is connected to the base 1, each of the heat conduction sections 42 is located on the same side of the base 1, each of the heat conduction sections 42 extends to the heat dissipation fin 2, and each of the heat pipes 4 is arranged in sequence along the length direction of the heat dissipation fin 2.

[0046] The heat conduction pipe 4 of the air-cooled radiator of the present application is in L-shaped structure, which is simpler in structure than the U-shaped structure. The heat conduction sections 42 of each heat conduction pipe 4 are located on the same side of the base 1, i.e. only one row of heat conduction pipes 4 is arranged on the base 1. Each heat conduction pipe 4 is arranged in sequence along the length direction of the heat dissipation fin 2 (the length direction of the heat dissipation fin 2 is the length direction of the heat dissipation fin body 21 hereinafter), so that the thickness (i.e. the width of the heat dissipation fin body 21) of the heat dissipation fin 2 can be appropriately reduced, the volume of the entire air-cooled radiator is reduced, the internal space of the mainframe is saved, and the arrangement of other structures in the mainframe is facilitated. The air-cooled radiator of the present application is suitable for compact mainframes.

[0047] In some possible embodiments, the heat dissipation fin 2 comprises a plurality of heat dissipation fin bodies 21, each of which is arranged in sequence along the thickness direction of the base 1, each of the heat conduction sections 42 penetrates each of the heat dissipation fin bodies 21, and each of the heat conduction sections 42 is arranged in sequence and spaced apart along the length direction of the heat dissipation fin body 21. The air-cooled radiator only comprises one row (or one column) of heat conduction sections 42, and each of the heat conduction sections 42 is arranged in sequence along the length direction of the heat dissipation fin body 21. Because only one row of heat conduction sections 42 penetrates the heat dissipation fin body 21, the width dimension of the heat dissipation fin body 21 occupied by the heat conduction sections 42 is small, which is conducive to reducing the width dimension of the heat dissipation fin 2, so as to reduce the size of the entire air-cooled radiator.

[0048] In some possible embodiments, as shown in Figure 1 , each of the heat conduction sections 42 is arranged in sequence along the same straight line. That is, each of the heat conduction sections 42 is located in the same plane, which is perpendicular to the heat dissipation fin body 21 of the heat dissipation fin 2. The width dimension of the heat dissipation fin body 21 occupied by each of the heat conduction sections 42 is small, which is conducive to reducing the thickness dimension of the heat dissipation fin 2, so as to reduce the size of the entire air-cooled radiator.

[0049] In some possible embodiments, as shown in Figure 3 , at least part of the two adjacent heat conduction sections 42 are arranged in staggered manner along the width direction of the heat dissipation fin body 21 along the length direction of the heat dissipation fin body 21. Thus, more heat conduction sections 42 can be arranged on the heat dissipation fin 2. When the number of heat conduction pipes 4 is four, as shown in Figure 1 , the size of the heat dissipation fin body 21 is sufficient, and the heat conduction sections 42 of each heat conduction pipe 4 can be arranged in sequence along the same straight line. When the number of heat conduction pipes 4 is six, as shown in Figure 3 , the heat conduction sections 42 of each heat conduction pipe 4 are arranged in sequence along the length direction of the heat dissipation fin 2, and at least part of the two adjacent heat conduction sections 42 can be arranged in staggered manner, so that more heat conduction sections 42 can be arranged on the heat dissipation fin 2.

[0050] In some possible embodiments, as shown in Figure 1 and Figure 2As shown, the base 1 is provided with a plurality of embedding grooves 11 on the side away from the heat dissipation fins 2, and each of the heat source contact sections 41 is embedded in the embedding groove 11, wherein the end of the heat source contact section 41 away from the heat conduction section 42 extends out of the embedding groove 11.

[0051] In some possible embodiments, as shown in Figure 1 As shown, the length of the end of the heat source contact section 41 away from the heat conduction section 42 extending out of the embedding groove 11 is not greater than 1 cm. The end of the heat source contact section 41 slightly extending out of the embedding groove 11 facilitates assembly.

[0052] In some possible embodiments, as shown in Figure 1 As shown, the end face of the end of the heat source contact section 41 extending out of the embedding groove 11 and the peripheral side face of the heat source contact section 41 are connected and transitioned through a tapered face 411. Thus, the end of the heat source contact section 41 is prevented from forming a sharp structure, and the problem of being easy to cut the peripheral side structure is avoided, and assembly of the heat source contact section 41 and the base 1 is facilitated.

[0053] Optionally, as shown in Figure 7 As shown, the air-cooled heat sink comprises a bottom cover 7 connected to the base 1, the bottom cover 7 covers each of the heat source contact sections 41, and the side of the bottom cover 7 away from each of the heat source contact sections 41 has a flat abutting face. The bottom cover 7 can be a copper piece, has good electrical conductivity, and can efficiently transfer heat when contacting the CPU.

[0054] In some possible embodiments, the air-cooled heat sink comprises a fixing assembly 5, the fixing assembly 5 comprises a pressing plate 51 and a connecting piece 52, the pressing plate 51 is located on the side of the base 1 close to the fan 3, and the pressing plate 51 is fixed to the base 1, the ends of the pressing plate 51 extend out of the pressing plate 51 to be connected to the circuit board 6 through the connecting piece 52, and each of the heat conduction pipes 4 is separately arranged on the two sides of the pressing plate 51. The pressing plate 51 does not interfere with the arrangement of each of the heat conduction pipes 4.

[0055] The second object of the present application is to provide a host box, comprising: a box body, a circuit board 6 and a forced air cooling radiator. The circuit board 6 and the forced air cooling radiator are both arranged in the box body, the CPU is arranged on the circuit board 6, the forced air cooling radiator is installed on the circuit board 6, and the base 1 covers the CPU. The thermally conductive silicone grease can be filled between the base 1 and the CPU, so that the heat is easily introduced into the base 1 and the heat source contact section 41 located on the base 1. It should be noted that when the forced air cooling radiator includes a bottom cover 7, the fitting surface of the bottom cover 7 can directly contact the CPU, so that the heat can be efficiently transmitted. The forced air cooling radiator includes a fixing assembly 5, the fixing assembly 5 includes a pressing plate 51 and a connecting piece 52, the pressing plate 51 is located on the side of the base 1 close to the fan 3, and the pressing plate 51 is fixed to the base 1, both ends of the pressing plate 51 extend out of the pressing plate 51, and the connecting piece 52 such as a bolt is connected to the circuit board 6, so that the base 1 can be in stable thermal contact with the CPU. Each of the heat pipes 4 is arranged on both sides of the pressing plate 51. The pressing plate 51 does not interfere with the arrangement of each of the heat pipes 4.

[0056] The preferred embodiments of the present application disclosed above are only used to help explain the present application. The preferred embodiments do not describe all the details and do not limit the present application to the specific embodiments described. Obviously, many modifications and variations can be made according to the content of the present application. The present application selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present application, so that those skilled in the art can well understand and utilize the present application. The present application is limited only by the claims and their full scope and equivalents.

Claims

1. An air-cooled heat sink, characterized by The application relates to a forced air cooling radiator. The application relates to a forced air cooling radiator. The application relates to a forced air cooling radiator. The application relates to a forced air cooling radiator. The application relates to a forced air cooling radiator.

2. The air-cooled heat sink of claim 1, wherein, The application relates to a forced air cooling radiator. The application relates to a forced air cooling radiator. The application relates to a forced air cooling radiator.

3. The air-cooled heat sink of claim 2, wherein, The application relates to a forced air cooling radiator.

4. The air-cooled heat sink of claim 2, wherein, The application relates to a forced air cooling radiator.

5. The air-cooled heat sink of claim 1, wherein, The application relates to a forced air cooling radiator. The application relates to a forced air cooling radiator.

6. The air-cooled heat sink of claim 5, wherein, The application relates to a forced air cooling radiator.

7. The air-cooled heat sink of claim 6, wherein, The application relates to a forced air cooling radiator.

8. The air-cooled heat sink of claim 1, wherein, The application relates to a forced air cooling radiator. The application relates to a forced air cooling radiator. The application relates to a forced air cooling radiator.

9. The air-cooled heat sink of claim 1, wherein, The application relates to a forced air cooling radiator. The application relates to a forced air cooling radiator. The application relates to a forced air cooling radiator. The application relates to a forced air cooling radiator.

10. A mainframe case characterized by comprising: The application relates to a forced air cooling radiator. The application relates to a forced air cooling radiator. The application relates to a forced air cooling radiator. The application relates to a forced air cooling radiator. The application relates to a forced air cooling radiator. The application relates to a forced air cooling radiator. The application relates to a forced air cooling radiator. The application relates to a forced air cooling radiator. The application relates to a forced air cooling radiator. The application relates to a forced air cooling radiator. The application relates to a forced air cooling radiator. The application relates to a forced air cooling radiator. The application relates to a forced air cooling radiator. The application relates to a forced air cooling radiator. The application relates to a forced air cooling radiator. The application relates to a forced air cooling radiator. 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