High-density integrated VCSEL array package

Abstract

The utility model discloses a high-density integrated VCSEL array package, which relates to the technical field of chip packaging, and comprises a substrate, laser chips and a packaging shell, a metal isolation grating is arranged above the substrate, heat dissipation columns are uniformly arranged at the bottom of the substrate, the laser chips are uniformly arranged on the upper end surface of the substrate in an array manner, and the packaging shell is arranged on the substrate. The packaging shell is fixedly installed on the upper end face of the substrate and buckled above the laser chip, an electrode is arranged above the substrate, a light-transmitting window is arranged in the center of the upper end face of the packaging shell, a light-transmitting lens is arranged in the light-transmitting window, and the light-transmitting lens comprises a passivation layer, an optical layer and an anti-reflection layer. The packaging structure has the advantages of high-efficiency heat dissipation, reduction of optical and electromagnetic interference and accurate control of laser divergence angles, and solves the problems of low heat dissipation efficiency and serious optical crosstalk of the traditional packaging technology under high-density integration.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip packaging technical field, concretely is a kind of high-density integrated VCSEL array package. BACKGROUND

[0002] Vertical-cavity surface-emitting lasers (VCSEL) as a new type of semiconductor laser, due to its circularly symmetric beam, low threshold current, can be directly modulated, easy to integrate and other advantages, in high-speed optical communication, optical interconnection, laser radar (LiDAR), three-dimensional sensing and short-range wireless communication and other fields have been widely used. With the development of science and technology, the demand for higher density, higher performance and more compact VCSEL array package is growing.

[0003] However, the traditional VCSEL array packaging technology faces many challenges in high-density integration, and the power density per unit area of high-density integrated VCSEL array increases, which makes it difficult for the chip to dissipate heat quickly, thereby affecting the performance and life of the device. The traditional heat dissipation design often cannot effectively solve the problem of heat concentration of the chip under high-density integration, and the light emitted by adjacent laser chips may interfere with each other, especially when these lights propagate through air or packaging material, which may cause stray light reflection and signal interference, which not only reduces the directivity of laser output and signal quality, but also limits the performance of VCSEL array in precision applications. Therefore, a high-density integrated VCSEL array package is needed to solve the above problems. SUMMARY

[0004] The utility model aims at providing a kind of high-density integrated VCSEL array package, with the advantages of efficient heat dissipation, reducing optical and electromagnetic interference, and accurately controlling laser divergence angle, solving the problems of low heat dissipation efficiency and serious optical crosstalk of traditional packaging technology under high-density integration.

[0005] To achieve the above purpose, the utility model provides the following technical scheme: a kind of high-density integrated VCSEL array package, including substrate, laser chip and package shell, the substrate top is provided with metal isolation grating, the bottom of the substrate is uniformly provided with heat dissipation column;

[0006] The laser chip is uniformly arrayed on the upper end surface of the substrate, and the package shell is fixedly installed on the upper end surface of the substrate and buckled above the laser chip, the upper end surface of the package shell is provided with an electrode, and the upper end surface of the package shell is provided with a light-transmitting window, the light-transmitting window is provided with a light-transmitting lens, and the light-transmitting lens includes a passivation layer, an optical layer and an anti-reflection layer.

[0007] As a kind of high-density integrated VCSEL array package of the utility model, the upper end surface of the light-transmitting lens is provided with array convex points corresponding to the position of laser chip.

[0008] As a kind of high-density integrated VCSEL array package of the utility model, the passivation layer is made of aluminum nitride material, and the thickness of the passivation layer is one to three microns.

[0009] As a kind of high-density integrated VCSEL array package of the utility model, the anti-reflection layer is made of magnesium fluoride material.

[0010] As a kind of high-density integrated VCSEL array package of the utility model, the metal isolation grating is made of several inclined intersecting copper foils, and the metal isolation grating is formed with diamond-shaped grooves corresponding to the position of laser chip.

[0011] As a kind of high-density integrated VCSEL array package of the utility model, the heat dissipation column is a plurality of circular copper columns, the bottom of the substrate is provided with a positioning groove corresponding to the position of the laser chip, and the heat dissipation column is fixedly installed in the positioning groove.

[0012] As a kind of high-density integrated VCSEL array package of the utility model, the length of the heat dissipation column is greater than the depth of the positioning groove, and the bottom of the heat dissipation column is a spherical top structure.

[0013] Compared with the prior art, the utility model has the beneficial effects as follows:

[0014] 1、The utility model discloses a circular copper heat dissipation column and its embedded positioning groove design are evenly distributed at the bottom of the substrate, combined with the spherical top structure of the heat dissipation column, the contact area of the heat dissipation column with the substrate and air is significantly increased, and accurate heat dissipation of high-density laser chip is realized, the problem of insufficient heat dissipation efficiency caused by heat concentration of chip under high-density integration is effectively solved, the performance degradation or damage of device caused by overheating is avoided, and the stability and service life of the overall system are improved.

[0015] 2、The array convex points on the surface of the light-transmitting lens constrain the laser divergence angle through convex lens effect, combined with the interference cancellation effect of the anti-reflection layer, the light loss is reduced and the light extraction efficiency is improved, at the same time, the diamond-shaped groove structure composed of inclined copper foil of the metal isolation grating can block the reflection of stray light of adjacent channels and form faraday cage effect, and high-frequency electromagnetic crosstalk is suppressed, these designs solve the problems of insufficient accuracy and light and electrical interference between adjacent chips caused by laser beam divergence, and the directivity and signal quality of laser output are significantly improved. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1The overall structure schematic view of the utility model;

[0017] Figure 2 The utility model discloses an explosion map;

[0018] Figure 3 The utility model discloses a top view;

[0019] Figure 4 The utility model discloses a Figure 3 The middle A-A section view;

[0020] Figure 5 The utility model discloses a Figure 4 The middle B enlarged view;

[0021] Figure 6 The utility model discloses a Figure 4 The middle C enlarged view.

[0022] In the drawing: 1, base plate; 101, positioning groove; 102, electrode; 2, package shell; 201, light transmission window; 3, light transmission lens; 301, array bump; 302, passivation layer; 303, optical layer; 304, anti-reflection layer; 4, laser chip; 5, metal isolation grating; 6, heat dissipation column. DETAILED DESCRIPTION

[0023] Please refer to Figures 1-6 A high-density integrated VCSEL array package, including base plate 1, laser chip 4 and package shell 2, the top of base plate 1 is provided with metal isolation grating 5, the bottom of base plate 1 is uniformly provided with heat dissipation column 6;

[0024] Laser chip 4 is evenly arrayed and installed on the upper end surface of base plate 1, package shell 2 is fixedly installed on the upper end surface of base plate 1 and is buckled above laser chip 4, the upper side of base plate 1 is provided with electrode 102, the upper end surface center of package shell 2 is provided with light transmission window 201, light transmission window 201 is provided with light transmission lens 3, and light transmission lens 3 includes passivation layer 302, optical layer 303 and anti-reflection layer 304.

[0025] Further, the upper end surface of light transmission lens 3 is provided with array bump 301 corresponding to the position of laser chip 4.

[0026] The convex lens effect formed by array bump 301 refracts and restricts laser, reduces the divergence angle of laser, thereby improving the accuracy of laser and reducing the interference between adjacent laser chips 4.

[0027] Further, passivation layer 302 is made of aluminum nitride material, and the thickness of passivation layer 302 is one to three microns.

[0028] The passivation layer 302 can prevent water vapor and corrosive ions from penetrating, avoid oxidation or electrochemical corrosion of the internal metal lines of the chip, capture surface static charges, reduce interface trap density, and reduce leakage current.

[0029] Further, the anti-reflection layer 304 is made of magnesium fluoride.

[0030] The anti-reflection layer 304 reduces surface reflectivity through interference cancellation, improves the light extraction efficiency of the optoelectronic device, and reduces light scattering loss.

[0031] Further, the metal isolation grating 5 is made of several inclined intersecting copper foils, and the metal isolation grating has diamond-shaped grooves corresponding to the positions of the laser chips 4.

[0032] The metal isolation grating reflects stray light from adjacent channels, reduces interference between adjacent laser chips 4, and can form a Faraday cage effect to suppress high-frequency electromagnetic crosstalk.

[0033] Further, the heat dissipation column 6 is a plurality of circular copper columns, and the bottom of the substrate 1 is provided with positioning grooves 101 corresponding to the positions of the laser chips 4, and the heat dissipation column 6 is fixedly installed in the positioning grooves 101.

[0034] The heat dissipation column 6 precisely dissipates heat from the bottom of the laser chip 4, thereby improving the heat dissipation efficiency of each laser chip 4 and avoiding excessive heat generation of the high-density integrated laser chips 4, which can cause equipment damage.

[0035] Further, the length of the heat dissipation column 6 is greater than the depth of the positioning groove 101, and the bottom of the heat dissipation column 6 is a spherical top structure.

[0036] The heat dissipation column 6 protrudes from the surface of the substrate 1, and the embedded structure increases the contact area between the heat dissipation column 6 and the substrate 1, and also improves the contact area between the heat dissipation column 6 and the air through the spherical top structure, thereby further improving the heat dissipation performance of the heat dissipation column 6.

[0037] The high-density integrated VCSEL array package is used in the following way: the laser chips 4 are uniformly arrayed on the end face of the substrate 1, and emit laser when working; the metal isolation grating 5 is made of several inclined intersecting copper foils, and has rhombic grooves corresponding to the positions of the laser chips 4, which can reflect stray light of adjacent channels, form a Faraday cage effect, suppress high-frequency electromagnetic crosstalk, reduce interference between adjacent laser chips 4, the light-transmitting lens 3 in the light-transmitting window 201 on the upper end face of the package shell 2 is provided with arrayed convex points 301 corresponding to the positions of the laser chips 4, which refract and constrain the laser through convex lens effect, reduce the divergence angle, improve the precision of the laser, and reduce the interference between adjacent laser chips 4; in addition, the heat dissipation columns 6 uniformly arranged on the bottom of the substrate 1 are circular copper columns, which are installed in the positioning grooves 101 corresponding to the positions of the laser chips 4, have a length greater than the depth of the positioning grooves 101, and have a spherical top structure at the bottom, which can accurately dissipate heat from the bottom of the laser chips 4; the design of protruding from the surface of the substrate 1 increases the contact area with air, and the embedded structure increases the contact area with the substrate 1, thereby improving the heat dissipation efficiency and avoiding damage to the equipment caused by excessive heat generated by the high-density integrated laser chips 4.

[0038] The above is only a preferred embodiment of the present application, and is not intended to limit the present application. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A high-density integrated VCSEL array package comprising a substrate (1), a laser chip (4) and a package shell (2), characterized in that: A metal isolation grating (5) is arranged above the substrate (1), and the bottom of the substrate (1) is uniformly provided with heat dissipation columns (6); The laser chips (4) are uniformly arrayed on the upper end surface of the substrate (1), the packaging shell (2) is fixedly installed on the upper end surface of the substrate (1) and buckled above the laser chips (4), the upper end surface of the substrate (1) is provided with an electrode (102), the center of the upper end surface of the packaging shell (2) is provided with a light-transmitting window (201), the light-transmitting window (201) is provided with a light-transmitting lens (3), and the light-transmitting lens (3) comprises a passivation layer (302), an optical layer (303) and an anti-reflection layer (304).

2. A high-density integrated VCSEL array package as claimed in claim 1, characterized in that: The upper end surface of the light-transmitting lens (3) is provided with arrayed convex points (301) corresponding to the positions of the laser chips (4).

3. A high-density integrated VCSEL array package as claimed in claim 1, characterized in that: The passivation layer (302) is made of aluminum nitride, and the thickness of the passivation layer (302) is 1-3 microns.

4. The high-density integrated VCSEL array package as described in claim 1, characterized in that: The anti-reflection layer (304) is made of magnesium fluoride.

5. A high-density integrated VCSEL array package as described in claim 1, characterized in that: The metal isolation grating (5) is made of several inclined intersecting copper foils, and the metal isolation grating is formed with rhombic grooves corresponding to the positions of the laser chips (4).

6. A high-density integrated VCSEL array package as claimed in claim 1, characterized in that: The heat dissipation columns (6) are several circular copper columns, and the bottom of the substrate (1) is provided with positioning grooves (101) corresponding to the positions of the laser chips (4), and the heat dissipation columns (6) are fixedly installed in the positioning grooves (101).

7. A high-density integrated VCSEL array package as claimed in claim 6, characterized in that: The length of the heat dissipation column (6) is greater than the depth of the positioning groove (101), and the bottom of the heat dissipation column (6) is a spherical top structure.

Images