Mobile phone support with refrigeration function
By incorporating a semiconductor cooling chip and a water-cooling circulation system into the phone holder, the problem of existing phone holders being unable to provide continuous and effective cooling has been solved, achieving a continuous cooling effect for the phone and improving its performance and user experience.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-17
- Publication Date
- 2026-03-27
AI Technical Summary
Existing phone holders cannot achieve continuous and effective cooling, affecting the lifespan of the phone and the user experience.
It adopts a semiconductor cooling chip combined with a water cooling circulation system. One side of the semiconductor cooling chip is in contact with the mobile phone to cool it, while the other side is in contact with the water cooling circulation system. The water cooling circulation system removes the heat from the cooling chip by circulating cooling water, forming a highly efficient cooling and heat dissipation mechanism.
It achieves continuous and effective cooling of the phone, improving the overall performance and user experience of the phone, and extending the phone's lifespan.
Smart Images
Figure CN224054291U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to mobile phone accessory technical field especially, relate to a kind of mobile phone support with refrigeration function. BACKGROUND
[0002] Mobile phone support is a kind of equipment for clamping and fixing mobile phone, aims at providing stable support for mobile phone, and it is convenient for user to free hands when watching video, making video call or executing other operations on mobile phone. However, since mobile phone is clamped in mobile phone support, user often cannot perceive the heating condition of mobile phone in time. Long time use of mobile phone can cause equipment overheating, and if not handled, it can affect the service life of mobile phone. In order to solve this problem, some mobile phone supports begin to increase refrigeration function, for example, install semiconductor refrigeration piece on support, and realize refrigeration effect by using the thermoelectric effect of semiconductor refrigeration piece, so as to effectively reduce the temperature of mobile phone, thereby prolonging its use time and life. However, with the popularity of this kind of mobile phone support, people find that semiconductor refrigeration piece also continuously emits heat during refrigeration work. If it is not effectively cooled, the refrigeration effect of semiconductor refrigeration piece on mobile phone will be limited, and it cannot realize continuous and effective cooling of mobile phone, and further affect the overall performance of mobile phone and user experience. SUMMARY
[0003] In view of this, the utility model provides a kind of mobile phone support with refrigeration function, to solve the problem that existing mobile phone support cannot continuously and effectively cool mobile phone.
[0004] The utility model provides a kind of mobile phone support with refrigeration function, including the clamping body for clamping mobile phone, support rod, base and refrigeration device;Wherein, the clamping body includes front shell and rear shell, the front shell and the rear shell are enclosed to form accommodating cavity, the support rod is hollow structure, the top end of the support rod is connected with the clamping body, the bottom end of the support rod is connected with the base, the base includes upper shell and lower shell, the upper shell and the lower shell are enclosed to form containing cavity;
[0005] The refrigeration device includes control circuit, semiconductor refrigeration piece and water-cooling circulation system, the control circuit is located in the containing cavity, the semiconductor refrigeration piece and the water-cooling circulation system are electrically connected with the control circuit, the semiconductor refrigeration piece is located in the accommodating cavity, one side of the semiconductor refrigeration piece is attached to the front shell, the other side of the semiconductor refrigeration piece is attached to the water-cooling circulation system, so as to let the water-cooling circulation system cool the semiconductor refrigeration piece.
[0006] In a possible implementation manner, the water cooling circulation system comprises hollow cooling fins, a water tank, a water pump, a water pipe and a radiator; the water tank, the water pump and the radiator are all located in the accommodating cavity, the cooling fins are located in the accommodating cavity and are attached to the other side of the semiconductor refrigeration fins, one end of the water pipe is connected to the water tank, the other end of the water pipe sequentially passes through the water pump, the hollow region of the support rod, the cooling fins, the hollow region of the support rod and the radiator and then returns to the water tank to form a cooling water circulation channel.
[0007] In a possible implementation manner, the water tank is provided with a silica gel plug, and the silica gel plug is located at the top of the upper shell.
[0008] In a possible implementation manner, the water tank is located at the front of the accommodating cavity, and the radiator and the water pump are respectively located at the left and right sides of the accommodating cavity and are separately arranged.
[0009] In a possible implementation manner, the radiator comprises a hollow connecting portion and a plurality of radiating fins, the radiating fins are parallel to each other, and the hollow regions of all the radiating fins are sequentially connected end to end to form a hollow channel, the hollow region of the connecting portion is in communication with the hollow channel, and cooling water sequentially flows through the water inlet end of the connecting portion, the water inlet of the hollow channel, the hollow channel, the water outlet of the hollow channel, the water outlet end of the connecting portion and then reaches the water tank.
[0010] In a possible implementation manner, the radiator further comprises a fan, and the fan is arranged opposite to the radiating fins.
[0011] In a possible implementation manner, the upper shell is provided with a heat dissipation hole at a position corresponding to the radiating fins, and the lower shell is provided with a ventilation hole.
[0012] In a possible implementation manner, the support rod is a telescopic rod, and the water pipe located in the hollow region of the telescopic rod is a spiral pipe.
[0013] In a possible implementation manner, the clamping body further comprises a metal sheet, two clamping arms and a turnover structure, the metal sheet is arranged on the front shell and is attached to the semiconductor refrigeration fins, the two clamping arms are respectively connected to the left and right sides of the rear shell, and the turnover structure is connected to the rear shell and the rear shell can be rotated by 180 degrees through the turnover structure.
[0014] In a possible implementation manner, the metal sheet is an elliptical aluminum alloy sheet, and the aluminum alloy sheet protrudes from the front shell.
[0015] Compared with the prior art, the mobile phone support with the refrigeration function has the advantages that: the mobile phone support with the refrigeration function is provided with a clamping body for clamping a mobile phone, a supporting rod, a base and a refrigeration device; the clamping body comprises a front shell and a rear shell, the front shell and the rear shell are closed to form a containing cavity, the supporting rod is a hollow structure, the top end of the supporting rod is connected with the clamping body, the bottom end of the supporting rod is connected with the base, the base comprises an upper shell and a lower shell, and the upper shell and the lower shell are closed to form an accommodating cavity; the refrigeration device comprises a control circuit, a semiconductor refrigeration sheet and a water-cooling circulation system, the control circuit is located in the accommodating cavity, the semiconductor refrigeration sheet and the water-cooling circulation system are electrically connected with the control circuit, the semiconductor refrigeration sheet is located in the containing cavity, one side of the semiconductor refrigeration sheet is attached to the front shell, and the other side of the semiconductor refrigeration sheet is attached to the water-cooling circulation system, so that the water-cooling circulation system can dissipate heat of the semiconductor refrigeration sheet during refrigeration. It can be seen that the mobile phone support with the refrigeration function is provided with the semiconductor refrigeration sheet in the clamping body, one side of the semiconductor refrigeration sheet is attached to the front shell in direct contact with the mobile phone, so as to effectively absorb heat generated by the mobile phone through the thermoelectric effect of the semiconductor refrigeration sheet, and refrigerate the mobile phone. The other side is attached to the water-cooling circulation system, so that the water-cooling circulation system can quickly take away the heat generated by the semiconductor refrigeration sheet during refrigeration, thereby maintaining the long-term good working state of the semiconductor refrigeration sheet. The water-cooling circulation system reduces the temperature of the semiconductor refrigeration sheet by circulating cooling water, thereby maintaining the continuous refrigeration effect of the semiconductor refrigeration sheet on the mobile phone. By combining the semiconductor refrigeration sheet and the water-cooling circulation system, the mobile phone support forms an efficient refrigeration and heat dissipation mechanism, which can continuously and effectively reduce the temperature of the mobile phone, thereby improving the overall performance and user experience of the mobile phone. BRIEF DESCRIPTION OF DRAWINGS
[0016] Figure 1 A first structural schematic view of the mobile phone support with the refrigeration function is provided for the embodiments of the utility model.
[0017] Figure 2 A second structural schematic view of the mobile phone support with the refrigeration function is provided for the embodiments of the utility model.
[0018] Figure 3 A third structural schematic view of the mobile phone support with the refrigeration function is provided for the embodiments of the utility model.
[0019] Figure 4 A fourth structural schematic view of the mobile phone support with the refrigeration function is provided for the embodiments of the utility model.
[0020] Figure 5 A structural schematic view of the mobile phone support with the refrigeration function is provided for the embodiments of the utility model.
[0021] Figure 6The utility model provides a structure schematic diagram of the mobile phone support with refrigeration function removes lower shell for the embodiment of the utility model;
[0022] Figure 7 The utility model provides a structure schematic diagram of the clamping body for the embodiment of the utility model removes front shell and rear shell.
[0023] Figure 8 The utility model provides a structure schematic diagram of the clamping body for the embodiment of the utility model removes front shell and rear shell.
[0024] The figure mark is explained as follows:
[0025] 10, clamping body, 11, front shell, 12, rear shell, 13, metal sheet, 14, clamping arm, 15, overturning structure, 20, support rod,
[0026] 30, base, 31, upper shell, 311, silica gel plug, 312, heat dissipation hole, 313, switch button, 32, lower shell, 321, air hole, 40, semiconductor refrigeration sheet,
[0027] 51, cooling fin, 52, water tank, 53, water pump, 54, water pipe, 551, connecting portion, 552, heat dissipation fin, 553, fan. Specific implementation
[0028] The scheme in the embodiment of the utility model will be clearly and completely described in combination with the drawings in the embodiment of the utility model, and obviously, the described embodiment is only a part of the embodiment in the utility model, not all the embodiment. Based on the embodiment in the utility model, all other embodiments obtained by the person skilled in the art without making creative labor belong to the range of protection of the utility model.
[0029] It needs to be explained that if the embodiment of the utility model involves directionality indication (such as up, down, left, right, front, back, …), then the directionality indication is only used to explain the relative position relationship, movement condition and the like between the components in a certain specific posture (such as shown in the drawings), if the specific posture changes, then the directionality indication also changes accordingly.
[0030] In addition, if the embodiments of the utility model have the description of "first", "second" and the like, the description of "first", "second" and the like is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first" and "second" can be explicitly or implicitly included at least one of the features. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of ordinary skilled in the art, when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, also not within the protection scope required by the utility model.
[0031] Please refer to Figures 1-8 The utility model proposes a kind of mobile phone support with refrigeration function, including the clamping body 10 for clamping mobile phone, support rod 20, base 30 and refrigeration device;Wherein, the clamping body 10 includes front shell 11 and rear shell 12, the front shell 11 and the rear shell 12 are enclosed to form accommodating cavity, the support rod 20 is hollow structure, the top end of the support rod 20 is connected with the clamping body 10, the bottom end of the support rod 20 is connected with the base 30, the base 30 includes upper shell 31 and lower shell 32, the upper shell 31 and the lower shell 32 are enclosed to form containing cavity;
[0032] The refrigeration device includes control circuit, semiconductor refrigerating sheet 40 and water-cooling circulation system, the control circuit is located in the containing cavity, the semiconductor refrigerating sheet 40 and the water-cooling circulation system are electrically connected with the control circuit, the semiconductor refrigerating sheet 40 is located in the accommodating cavity, one side of the semiconductor refrigerating sheet 40 is attached to the front shell 11, the other side of the semiconductor refrigerating sheet 40 is attached to the water-cooling circulation system, so that the water-cooling circulation system is heat dissipated to the semiconductor refrigerating sheet 40.
[0033] Specifically, the existing semiconductor refrigerating sheet 40 is usually heat dissipated by air heat dissipation or aluminum heat dissipation sheet and the like. However, air heat dissipation mainly depends on the temperature of natural environment and air flow, and the heat dissipation effect is relatively poor. In order to enhance the effect of air heat dissipation, sometimes fan is configured to accelerate air flow, but in the small equipment such as mobile phone support, the vibration of fan can possibly affect the stability of mobile phone picture, and user experience is poor. Although aluminum heat dissipation sheet can provide certain heat dissipation effect, but in the case that semiconductor refrigerating sheet 40 is continuously in refrigeration working state (corresponding to long time continuous use of mobile phone) for a long time, its heat dissipation capacity is still limited.
[0034] In contrast, the application of a water-cooling circulation system to the semiconductor cooling sheet 40 can exhibit significant advantages in continuous heat dissipation. First, water has a large specific heat capacity, which can quickly absorb and conduct heat, keeping the temperature of the semiconductor cooling sheet 40 at a low level at all times, thereby improving the cooling efficiency and even achieving ice-making effects under certain conditions. Second, the water-cooling circulation system can maintain a stable temperature during long-term use, avoiding a decrease in cooling efficiency due to insufficient heat dissipation. In addition, most components of the water-cooling circulation system are concentrated in the base 30, and such a design does not affect the portability and flexibility of the clamping body 10 in the phone holder, allowing the phone holder to maintain various angle adjustments of the clamping body 10 during use and to maintain these angles for a long time, meeting the different use requirements of users. In summary, the water-cooling circulation system can quickly remove the heat generated by the semiconductor cooling sheet 40 through efficient circulation of cooling water, enabling the semiconductor cooling sheet 40 to more effectively achieve continuous cooling of the phone, improving its overall performance and user experience.
[0035] Compared with the prior art, the phone holder with a cooling function proposed in the embodiment is equipped with a semiconductor cooling sheet 40 inside the clamping body 10, one side of which is in close contact with the front shell 11 of the phone to effectively absorb the heat generated by the phone through its thermoelectric effect and cool the phone. The other side is in contact with the water-cooling circulation system to quickly remove the heat generated by the semiconductor cooling sheet 40 during cooling, thereby maintaining the long-term good working condition of the semiconductor cooling sheet 40. The water-cooling circulation system lowers the temperature of the semiconductor cooling sheet 40 by circulating cooling water, thereby maintaining the continuous cooling effect of the semiconductor cooling sheet 40 on the phone. By combining the semiconductor cooling sheet 40 and the water-cooling circulation system, the phone holder forms an efficient cooling and heat dissipation mechanism that can continuously and effectively lower the temperature of the phone, thereby improving its overall performance and user experience.
[0036] In some embodiments of the present application, the water-cooling circulation system includes a hollow cooling sheet 51, a water tank 52, a water pump 53, a water pipe 54, and a radiator; wherein the water tank 52, the water pump 53, and the radiator are located in the accommodation cavity, the cooling sheet 51 is located in the accommodation cavity and is in contact with the other side of the semiconductor cooling sheet 40, one end of the water pipe 54 is connected to the water tank 52, the other end of the water pipe 54 passes through the water pump 53, the hollow area of the support rod 20, the cooling sheet 51, the hollow area of the support rod 20, and the radiator in turn, and then returns to the water tank 52 to form a cooling water circulation channel.
[0037] Specifically, the water pipes 54 (including the water inlet pipe from the bottom end to the top end of the support rod 20 and the water outlet pipe from the top end to the bottom end of the support rod 20) are arranged in the hollow area of the support rod 20 to avoid the exposure of the water pipes 54 and reduce the influence on the overall appearance and operation of the mobile phone holder. At the same time, the water tank 52, the water pump 53 and the radiator are arranged in the accommodating cavity of the base 30, so that the layout of the entire water cooling circulation system is more compact, space is saved, and the simplicity of the product structure is maintained.
[0038] The cooling fins 51 are tightly attached to the other side of the semiconductor refrigeration fin 40, which can ensure good thermal contact and reduce thermal resistance. The cooling fins 51 can be designed in the same shape as the semiconductor refrigeration fin 40, such as a square shape (the semiconductor refrigeration fin 40 is also designed in a square shape), to achieve complete coverage of the other side of the semiconductor refrigeration fin 40. This kind of complete coverage can maximize the heat conduction efficiency of the semiconductor refrigeration fin 40 when the cooling water flows through the hollow area of the cooling fins 51, so that the heat is quickly absorbed and carried away by the water cooling circulation system, further improving the refrigeration performance of the semiconductor refrigeration fin 40 on the mobile phone and prolonging the service life of the mobile phone.
[0039] In some embodiments of the present application, the water tank 52 is provided with a silica gel plug 311 located at the top of the upper shell 31.
[0040] Specifically, the silica gel plug 311 is arranged at the top of the upper shell 31, which can facilitate the user to open the water tank 52 for maintenance or replacement of the cooling water. In order to further improve the user experience, a hand holding position can be arranged at the opening position of the water tank 52, so that the user can quickly and easily take out the silica gel plug 311 and improve the efficiency of replacing the cooling water. The silica gel plug 311 is circular, and in order to match the circular shape of the silica gel plug 311, the hand holding position can be designed as a sunken arc. The combination of the circular shape and the arc shape makes it more convenient and efficient for the user to take out the silica gel plug 311. In addition, the silica gel material has good elasticity, which can form a tight interference fit with the opening of the water tank 52 to ensure good sealing and effectively prevent the cooling water from leaking. Of course, a switch button 313 can also be arranged at the top of the upper shell 31 to facilitate the user's operation. This switch button 313 can be used to control the refrigeration function of the mobile phone holder, and the user only needs to press it gently to quickly turn on or off the refrigeration mode.
[0041] In some embodiments of the present application, the water tank 52 is located in front of the accommodating cavity, and the radiator and the water pump 53 are respectively located on the left and right sides of the accommodating cavity and are separately arranged.
[0042] Specifically, the water tank 52 is located at the front of the accommodating cavity, and the radiator and the water pump 53 are respectively located at the left and right sides of the accommodating cavity, forming a relatively linear layout. The user can directly lead the water pipe 54 out of the water tank 52 and connect it to the radiator and the water pump 53 respectively, thereby effectively reducing the bending and crossing of the water pipe 54 during connection. This linear connection method helps to reduce the resistance of water flow and improve the flow efficiency of cooling water. The fan 553 is arranged in the radiator to more efficiently promote heat dissipation. However, the vibration generated by the fan 553 during operation may affect the normal operation of the water pump 53. Therefore, arranging the radiator on one side of the accommodating cavity and the water pump 53 on the other side of the accommodating cavity and separating them can ensure that the water pump 53 focuses on circulating cooling water and avoid the influence of fan 553 vibration on the operation of the water pump 53, thereby improving the stability of the entire water cooling circulation system.
[0043] In some embodiments of the present application, the radiator comprises a hollow connecting portion 551 and a plurality of radiating fins 552, the radiating fins 552 are parallel to each other, and the hollow regions of all the radiating fins 552 are sequentially connected end to end to form a hollow channel, the hollow region of the connecting portion 551 communicates with the hollow channel, and the cooling water flows through the water inlet end of the connecting portion 551, the water inlet of the hollow channel, the hollow channel, the water outlet of the hollow channel, and the water outlet end of the connecting portion 551 in sequence to reach the water tank 52.
[0044] Specifically, the radiator is composed of a hollow connecting portion 551 and a plurality of radiating fins 552, and the hollow regions of all the radiating fins 552 are sequentially connected end to end to form a hollow channel, and together with the hollow region of the connecting portion 551, they form a complete water flow path. This design enables the cooling water to form a continuous flow inside the radiator, so that the radiator can cool and heat the cooling water, thereby effectively maintaining the low temperature state of the cooling water. The hollow connecting portion 551 provides a channel for the cooling water to enter and exit, and the radiating fins 552 increase the heat dissipation surface area of the cooling water, thereby improving the heat dissipation efficiency. The parallel arrangement of the radiating fins 552 also ensures that the cooling water is evenly distributed when flowing through the radiator, avoiding local overheating, thereby ensuring the uniform heat dissipation effect of the entire radiator.
[0045] In some embodiments of the present application, the radiator further comprises a fan 553, and the fan 553 is arranged opposite to the radiating fins 552.
[0046] Specifically, the fan 553 can effectively enhance air flow and promote heat dissipation of the heat dissipation fins 552. The fan 553 is arranged opposite to the heat dissipation fins 552, further ensuring that cold air directly flows through the heat dissipation fins 552, maximizing the contact area between the cold air and the heat dissipation fins 552. This direct air flow mode helps to improve heat exchange efficiency, enabling the radiator to reduce the temperature of the cooling water more quickly.
[0047] In some embodiments of the present application, the upper shell 31 is provided with heat dissipation holes 312 at positions corresponding to the heat dissipation fins 552, and the lower shell 32 is provided with air inlet holes 321.
[0048] Specifically, the arrangement of the heat dissipation holes 312 enables hot air to escape from the interior of the radiator more efficiently, promoting the release of heat from the heat dissipation fins 552 to the external environment. Arranging the heat dissipation holes 312 on the side of the upper shell 31 can reduce dust accumulation and keep the heat dissipation holes 312 unobstructed. The air inlet holes 321 are located at the center of the lower shell 32 and are responsible for introducing external cold air. When the water cooling circulation system is running, the fan 553 sucks in cold air through the air inlet holes 321 and pushes it to the heat dissipation fins 552 to absorb the heat of the heat dissipation fins 552, and then the cold air is converted into hot air and discharged through the heat dissipation holes 312. Through this coordinated work, the fan 553 can maintain a long-term stable cooling effect on the heat dissipation fins 552.
[0049] In some embodiments of the present application, the support rod 20 is a telescopic rod, and the water pipe 54 located in the hollow area of the telescopic rod is a spiral pipe.
[0050] Specifically, the telescopic rod design allows the clamping body 10 to adjust the height according to user needs, adapting to different use environments and needs. This flexibility makes the mobile phone holder more convenient to use. When not in use, the telescopic rod can be shortened to reduce the occupied space, facilitating storage and transportation. The spiral pipe allows a longer flow path for the cooling water in a limited space. When the support rod 20 is extended, the spiral pipe can extend inside it without the need for additional lengthening of the water pipe 54. When the support rod 20 is shortened, the spiral shape of the spiral pipe still allows continuous flow of the cooling water, ensuring that the flow of the cooling water in the water pipe is not affected. The design of the spiral pipe enables the cooling water to maintain good flow characteristics at different lengths, avoiding flow dead zones or uneven flow rates caused by length changes.
[0051] In some embodiments of the present application, the clamping body 10 further comprises a metal sheet 13, two clamping arms 14 and a flip structure 15, the metal sheet 13 is arranged on the front shell 11 and adheres to the semiconductor refrigeration sheet 40, the two clamping arms 14 are respectively connected to the left and right sides of the rear shell 12, and the flip structure 15 is connected to the rear shell 12 and the rear shell 12 can be rotated by 180 degrees through the flip structure 15.
[0052] Specifically, referring to FIG. 1, Figures 7-8 As shown in FIG. 1, the clamping arms 14 are made of lightweight and strong materials such as aluminum alloy or high-strength plastic. These materials not only provide sufficient strength to clamp the phone, but also maintain the lightness of the overall structure, making it easy for users to operate. The clamping arms 14 are curved, with soft pads or rubber materials on the inside to increase friction and prevent the phone from sliding or scratching during clamping. At the connection between the left and right clamping arms 14, a spring device is provided. When the user pulls the two clamping arms 14 apart, the spring is stretched, storing energy, and the phone is placed in the clamping position. When the user releases his hand, the spring will automatically contract to pull the two clamping arms 14 inward to tightly clamp the phone, fixing the phone in the clamping position. This design greatly facilitates the placement and removal of the phone, avoiding accidental falling of the phone during use. The flip structure 15 includes a rotating shaft made of high-strength material to withstand the pressure and friction caused by repeated flipping. It should be noted that the flip structure 15 is a prior art technology designed to achieve flexible flipping and angle adjustment of devices, and is widely used in various mechanical and electronic devices, which will not be described here.
[0053] In some embodiments of the present application, the metal sheet 13 is an elliptical aluminum alloy sheet that protrudes from the front shell 11.
[0054] Specifically, the elliptical metal sheet 13 has a more streamlined and modern design than the traditional rectangular design, which can improve the overall aesthetics of the clamping body 10 and attract the user's attention. The aluminum alloy material has excellent thermal conductivity, which can efficiently conduct the heat generated by the phone during operation to the semiconductor refrigeration sheet 40. The protruding design of the aluminum alloy sheet can improve the adhesion of the aluminum alloy sheet to the phone backplate, thereby ensuring better thermal conductivity.
[0055] The mobile phone support with the refrigeration function provided by the embodiment utilizes the semiconductor refrigeration sheet 40 to cool the mobile phone.
[0056] It should be noted that the technical solutions of various embodiments of the present application can be combined with each other, but must be based on the realization of ordinary technical personnel in the art, and when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, nor is it within the scope of the present application.
[0057] The above is only part or preferred embodiment of the present application, neither the text nor the drawings can limit the scope of protection of the present application, any equivalent structural transformation made by using the content of the present application specification and drawings, or direct / indirect application in other related technical fields is included in the scope of protection of the present application.
Claims
1. A mobile phone stand having a refrigeration function, characterized by, The application relates to a refrigerator for mobile phone, which comprises a clamping body for clamping the mobile phone, a supporting rod, a base and a refrigerating device. The clamping body comprises a front shell and a rear shell, which enclose a containing cavity; the supporting rod is a hollow structure, the top end of the supporting rod is connected with the clamping body, the bottom end of the supporting rod is connected with the base, the base comprises an upper shell and a lower shell, and the upper shell and the lower shell enclose a containing cavity; 2. The mobile phone stand with a refrigeration function according to claim 1, characterized in that, The refrigerating device comprises a control circuit, a semiconductor refrigerating sheet and a water cooling circulation system; the control circuit is located in the containing cavity; the semiconductor refrigerating sheet and the water cooling circulation system are electrically connected with the control circuit; the semiconductor refrigerating sheet is located in the containing cavity; one side of the semiconductor refrigerating sheet is attached to the front shell; the other side of the semiconductor refrigerating sheet is attached to the water cooling circulation system, so that the water cooling circulation system can dissipate heat from the semiconductor refrigerating sheet.
3. The mobile phone stand with a refrigeration function according to claim 2, characterized in that, The water cooling circulation system comprises a hollow cooling sheet, a water tank, a water pump, a water pipe and a radiator; the water tank, the water pump and the radiator are located in the containing cavity; the cooling sheet is located in the containing cavity and attached to the other side of the semiconductor refrigerating sheet; one end of the water pipe is connected with the water tank; the other end of the water pipe sequentially passes through the water pump, the hollow area of the supporting rod, the cooling sheet, the hollow area of the supporting rod and the radiator and then returns to the water tank, so as to form a cooling water circulation channel.
4. The mobile phone stand with a refrigeration function according to claim 2, characterized in that, The water tank is provided with a silica gel plug, which is located at the top of the upper shell.
5. The mobile phone stand with a refrigeration function according to claim 2, characterized in that, The water tank is located in front of the containing cavity; the radiator and the water pump are respectively located on the left and right sides of the containing cavity and are separately arranged.
6. The mobile phone stand with a refrigeration function according to claim 5, characterized in that, The radiator comprises a hollow connecting part and a plurality of radiating fins; the radiating fins are parallel to each other; the hollow areas of all the radiating fins are sequentially connected end to end to form a hollow channel; the hollow area of the connecting part is in communication with the hollow channel; cooling water sequentially flows through the water inlet end of the connecting part, the water inlet of the hollow channel, the hollow channel, the water outlet of the hollow channel, the water outlet end of the connecting part and then reaches the water tank.
7. The mobile phone stand with a refrigeration function according to claim 6, characterized in that, The radiator further comprises a fan, which is arranged opposite to the radiating fins.
8. The mobile phone stand with a refrigeration function according to claim 1, characterized in that, The upper shell is provided with radiating holes at positions corresponding to the radiating fins; the lower shell is provided with air holes.
9. The mobile phone stand with a refrigeration function according to claim 1, characterized in that, The supporting rod is a telescopic rod; the water pipe located in the hollow area of the telescopic rod is a spiral pipe.
10. The mobile phone stand with a refrigeration function according to claim 9, characterized in that, The clamping body further comprises a metal sheet, two clamping arms and a turnover structure; the metal sheet is arranged on the front shell and attached to the semiconductor refrigerating sheet; the two clamping arms are respectively connected to the left and right sides of the rear shell; the turnover structure is connected to the rear shell and the rear shell can be rotated by 180 degrees through the turnover structure. The metal sheet is an oval aluminum alloy sheet, which protrudes from the front shell.