Wafer feeding and discharging device accurate in positioning
By designing a wafer loading and unloading device that includes a pick-up tray, cylinder, suction cup holder, and robotic arm, the problem of slow wafer transfer speed was solved, and fast, accurate, and automated wafer transfer was achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-27
- Publication Date
- 2026-03-27
AI Technical Summary
Existing wafer loading and unloading devices are insufficient in terms of transfer speed, and it is necessary to improve positioning accuracy to speed up the operation.
A wafer loading and unloading device was designed, which includes a material tray, cylinder, suction cup frame and robot arm. The device achieves automated transfer by using a primary suction cup for initial adsorption and a secondary suction cup to enhance the adsorption force, combined with a lifting device and probe detection.
It improves the speed and accuracy of wafer transfer, reduces the risk of wafer drops and breakage, and achieves automation and speed in wafer transfer.
Smart Images
Figure CN224054769U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to the technical field of semiconductor equipment, concretely relates to a wafer loading and unloading device of accurate positioning. BACKGROUND
[0002] Wafer refers to the silicon wafer used for making silicon semiconductor integrated circuit. Various circuit element structures can be processed and made on the silicon wafer, and become IC products with specific electrical properties. Wafer is the basic material for manufacturing semiconductor chips, and is widely used in integrated circuit (IC) and microelectronic industry.
[0003] When using wafer, it needs to be loaded and unloaded, and the device for loading and unloading wafer in the prior art needs to be improved in transfer speed. The utility model tries to provide a wafer loading and unloading device of accurate positioning to speed up wafer transfer. UTILITY MODEL CONTENT
[0004] In view of one or more of the above defects or improvement needs of the prior art, the utility model provides a wafer loading and unloading device of accurate positioning, which has the advantages of fast transfer.
[0005] To achieve the above purpose, the utility model provides a wafer loading and unloading device of accurate positioning, which comprises: a material taking disc;
[0006] The material taking disc is centrally provided with a material taking disc body, the material taking disc body is rectangular, the material taking disc body top is fixedly provided with a mounting portion, both opposite sides of the material taking disc body are provided with a connecting disc, the connecting disc is fixedly connected with a secondary suction disc holder, the secondary suction disc holder is fixedly provided with a secondary suction disc, the other two opposite sides of the material taking disc body are fixedly provided with an air cylinder, the air cylinder is detachably connected with a primary suction disc holder, the height of the primary suction disc holder is higher than that of the secondary suction disc holder, the primary suction disc holder is fixedly provided with a primary suction disc, so that the primary suction disc can first contact the flat wafer when the material taking disc is lowered.
[0007] As a further improvement of the utility model, a probe is also fixedly provided on the material taking disc body, the probe is the same height as the secondary suction disc, so that the secondary suction disc can adsorb the wafer when the probe contacts the wafer.
[0008] As a further improvement of the utility model, a slide is provided on the connecting disc, the slide is provided with a through hole, the slide is fixedly connected with the material taking disc body, the width of the slide is smaller than the diameter, and the length of the slide is greater than the diameter, so that the connecting disc can move along the direction of the slide.
[0009] As a further improvement of the utility model, the installation part is detachably connected with the mechanical hand, so that the mechanical hand can drive the material taking disc to move in multiple directions.
[0010] As a further improvement of the utility model, the device further comprises a lifting device, and the wafer is placed on the top of the lifting device, so that the wafer can move up and down along with the lifting device.
[0011] As a further improvement of the utility model, the material taking disc body is further provided with a plurality of secondary suction discs, and the secondary suction discs have the same height.
[0012] As a further improvement of the utility model, the plurality of secondary suction discs arranged on the material taking disc body are arranged in a cross shape and have the same interval.
[0013] Overall, compared with the prior art, the above technical scheme conceived by the utility model has the beneficial effects including:
[0014] The wafer loading and unloading device with accurate positioning of the utility model is provided with a primary suction disc and a secondary suction disc, the primary suction disc is first lowered by a cylinder to perform one-time suction on the wafer, the wafer is sucked up under the condition of using a small number of suction discs, the suction process is shortened, after suction, the cylinder drives the primary suction disc to reset, at this time, the secondary suction disc performs two-time suction on the wafer to be moved, the suction force is increased, the wafer is prevented from falling during movement, and because the number of suction discs is increased, the stress area of the wafer is also increased, the possibility that the wafer is broken due to uneven stress is reduced. The utility model is further provided with a mechanical hand and a lifting device, so that complete automation is realized during the wafer transfer process, part of the displacement distance is reduced, and the wafer transfer is more rapid. The probe is further provided, so that the secondary suction disc can be sucked to the wafer. BRIEF DESCRIPTION OF DRAWINGS
[0015] Figure 1 It is a schematic view of the wafer loading and unloading device with accurate positioning of the utility model;
[0016] Figure 2 It is a schematic view of the wafer loading and unloading device with accurate positioning of the utility model;
[0017] Figure 3 It is a schematic view of the utility model A;
[0018] Figure 4 It is a schematic view of the bottom of the wafer loading and unloading device with accurate positioning of the utility model;
[0019] Figure 5 It is a schematic view of the top of the wafer loading and unloading device with accurate positioning of the utility model.
[0020] In all the drawings, the same reference signs refer to the same technical features, specifically:
[0021] The material taking tray 100; the mounting part 110; the air cylinder 120; the first-stage suction disc rack 130; the first-stage suction disc 131;
[0022] The connecting disc 140; the slide 141; the second-stage suction disc rack 150; the second-stage suction disc 151; the probe 160;
[0023] The material taking tray body 170; the mechanical arm 200; the lifting device 300. DETAILED DESCRIPTION
[0024] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0025] The terms used herein are merely used for describing the specific embodiments, and are not intended to limit the present application. The terms "comprise", "contain" and the like used herein indicate the existence of the described features, steps, operations and / or components, but do not exclude the existence or addition of one or more other features, steps, operations or components.
[0026] All the terms used herein (including technical and scientific terms) have the meanings generally understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein should be interpreted to have meanings consistent with the context of the present specification, and should not be interpreted in an idealized or overly formal manner.
[0027] In the embodiments, the first-stage suction disc 131 is arranged on the first-stage suction disc rack 130, and the second-stage suction disc 151 is arranged on the second-stage suction disc rack 150. Figures 1-5 It is given that, Figure 1 It is a schematic view of the present application, a positioning accurate wafer loading and unloading device, can see that the material taking tray middle has material taking tray body, top fixedly provided with mounting part, side provided with air cylinder and first-stage suction disc rack, first-stage suction disc rack is provided with first-stage suction disc, material taking tray body other side is also provided with second-stage suction disc rack, second-stage suction disc rack is provided with second-stage suction disc;
[0028] Figure 2 It is a schematic view of the present application, a positioning accurate wafer loading and unloading device, can see that the mounting part is fixed with the mechanical arm, the mechanical arm is provided with lifting device,;
[0029] Figure 3 It is a schematic view of the present application, A, can see that the material taking tray body is also provided with the probe;
[0030] Figure 4 As the bottom schematic view of the wafer loading and unloading device with accurate positioning of the utility model can be seen that a plurality of secondary suction cups are arranged in a cross shape.
[0031] Figure 5 As the top schematic view of the wafer loading and unloading device with accurate positioning of the utility model can be seen that the connecting disc is provided with a slide, and the connecting disc can move along the direction of the slide.
[0032] A wafer loading and unloading device with accurate positioning, comprising: a material taking disc 100.
[0033] The material taking disc 100 is centrally provided with a material taking disc body 170, the material taking disc body 170 is rectangular, the material taking disc body 170 is fixedly provided with a mounting portion 110 at the top, both opposite sides of the material taking disc body 170 are provided with a connecting disc 140, the connecting disc 140 is fixedly connected with a secondary suction cup holder 150, the secondary suction cup holder 150 is fixedly provided with a secondary suction cup 151, both other opposite sides of the material taking disc body 170 are fixedly provided with an air cylinder 120, the air cylinder 120 is detachably connected with a primary suction cup holder 130, the primary suction cup holder 130 is higher than the secondary suction cup holder 150, the primary suction cup holder 130 is fixedly provided with a primary suction cup 131, so that the primary suction cup 131 can first contact the flatly placed wafer when the material taking disc 100 is lowered.
[0034] In use, the material taking disc is horizontally placed above the wafer to be moved, the primary suction cup holder is driven downward by the air cylinder, when the primary suction cup holder drives the primary suction cup to contact the wafer, the wafer is sucked, the primary suction cup is reset by the air cylinder, so that the wafer contacts the secondary suction cup, at this time, the secondary suction cup performs double adsorption on the wafer. This arrangement ensures that fewer suction cups are used for material taking at first, which is convenient and fast, and then more suction cups are used to increase the suction force and contact area immediately, so that the wafer cannot fall due to insufficient suction force, and the wafer is also prevented from being broken due to uneven stress for a long time.
[0035] As a preferred scheme of the utility model, the material taking disc body 170 is further fixedly provided with a probe 160, the probe 160 is the same height as the secondary suction cup 151, so that the secondary suction cup 151 can adsorb the wafer when the probe 160 contacts the wafer. The probe is used to detect whether the wafer is in place, so that the secondary suction cup can adsorb the wafer.
[0036] As one preferred scheme of the utility model, the connecting disc 140 is provided with a slide 141 penetrating the connecting disc 140, the slide 141 is provided with 142 fixedly connected with the material taking disc main body 170, the slide 141 width is less than the 142 diameter, the slide 141 length is greater than the 142 diameter, so that the connecting disc 140 can move along the direction of the slide 141. The connecting disc is arranged to be movable, so that the secondary suction disc frame can be slightly displaced outward, the material taking disc can be adsorbed to a larger area of wafer, and the application range of the material taking disc is increased.
[0037] As one preferred scheme of the utility model, the mounting portion 110 is detachably connected with the manipulator 200, so that the manipulator 200 can drive the material taking disc 100 to move in multiple directions. The material taking disc is fixedly arranged with the manipulator, so that the manipulator can drive the material taking disc to move flexibly, and the material taking process is automated.
[0038] As one preferred scheme of the utility model, further comprising a lifting device 300, the wafer is placed on the top of the lifting device 300, so that the wafer can move up and down along with the lifting device 300. The wafer to be moved is placed on the lifting device, and along with the lifting of the lifting device, the wafer can be driven to a suitable height, so that the manipulator does not need to displace a large amount in the vertical direction, and the working load of the manipulator is reduced.
[0039] As one preferred scheme of the utility model, the material taking disc main body 170 is further provided with a plurality of secondary suction discs 151, and the secondary suction discs 151 are all of the same height. The plurality of secondary suction discs are arranged on the material taking disc main body, so that the suction force is stronger when double adsorption is carried out, and the contact area of the suction disc and the wafer is further increased, so that the wafer is prevented from falling and breaking.
[0040] As one preferred scheme of the utility model, the plurality of secondary suction discs 151 arranged on the material taking disc main body 170 are arranged in a cross shape, and the secondary suction discs 151 are all of the same interval. The positions of the secondary suction discs are reasonably arranged, so that the suction force applied on the wafer is more reasonably distributed, and the wafer is prevented from being unevenly stressed.
[0041] In conclusion, the wafer loading and unloading device with accurate positioning is provided with a first-stage suction cup and a second-stage suction cup, the first-stage suction cup is lowered by a cylinder to adsorb the wafer first, the wafer is adsorbed by the first-stage suction cup to ensure that the wafer is adsorbed by the smaller number of suction cups, so that the adsorption process is not too long, after adsorption, the first-stage suction cup is reset by the cylinder, the second-stage suction cup adsorbs the wafer to be moved, the suction force is increased, the wafer is not dropped during movement, and the number of suction cups is increased, the stress area of the wafer is also increased, and the possibility that the wafer is broken due to uneven stress is reduced.
[0042] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and modifications can be made to these embodiments without departing from the principles and spirits of the utility model, the scope of the utility model is defined by the appended claims and their equivalents.
Claims
1. A precise positioning wafer loading and unloading device, characterized in that, Include: Material taking disc (100); The material taking disc (100) is centrally provided with a material taking disc body (170), which is rectangular. The material taking disc body (170) is fixedly provided with a mounting portion (110) at the top. The two opposite sides of the material taking disc body (170) are provided with connecting plates (140), which are fixedly connected with secondary suction disc racks (150). The secondary suction disc racks (150) are fixedly provided with secondary suction discs (151). The other two opposite sides of the material taking disc body (170) are fixedly provided with air cylinders (120), which are detachably connected with primary suction disc racks (130). The height of the primary suction disc rack (130) is higher than that of the secondary suction disc rack (150). The primary suction disc rack (130) is fixedly provided with a primary suction disc (131), so that the primary suction disc (131) can first contact the flat wafer when the material taking disc (100) is lowered.
2. The wafer positioning and transferring device of claim 1, wherein, The material taking disc body (170) is also fixedly provided with a probe (160), which is the same height as the secondary suction disc (151), so that the secondary suction disc (151) can adsorb the wafer when the probe (160) contacts the wafer.
3. The wafer positioning and transferring device of claim 1, wherein, The connecting plate (140) is provided with a slide (141) penetrating through the connecting plate (140). The slide (141) is provided with a (142) penetrating through the slide (141) and fixedly connected with the material taking disc body (170). The width of the slide (141) is less than the diameter of the (142). The length of the slide (141) is greater than the diameter of the (142), so that the connecting plate (140) can move along the direction of the slide (141).
4. The wafer positioning and transferring device of claim 1, wherein, The mounting portion (110) is detachably connected with a mechanical hand (200), so that the mechanical hand (200) can drive the material taking disc (100) to move in multiple directions.
5. The precise positioning wafer loading and unloading device according to claim 4, wherein, It also includes a lifting device (300), and the wafer is placed on the top of the lifting device (300), so that the wafer can move up and down with the lifting device (300).
6. The precise positioning wafer loading and unloading device according to claim 1, wherein, The material taking disc body (170) is also provided with a plurality of secondary suction discs (151), and the heights of the secondary suction discs (151) are the same.
7. The wafer positioning and transferring device of claim 6, wherein, The plurality of secondary suction discs (151) provided on the material taking disc body (170) are arranged in a cross shape, and the intervals between the secondary suction discs (151) are the same.