Dispensing mechanism for chip packaging

Abstract

The utility model discloses a dispensing mechanism for chip packaging, which comprises a bottom plate, the top side of the bottom plate is fixedly provided with two fixing plates, a conveying belt is arranged between the two fixing plates, the outer side of the conveying belt is provided with a plurality of clamping assemblies, the top side of the bottom plate is fixedly provided with a fixing frame, and the fixing frame is provided with a plurality of clamping assemblies. A draught fan and a collecting box are fixedly installed on the top side of the fixing frame, a connecting pipe is fixedly installed on one side of the draught fan, the other end of the connecting pipe is fixedly connected to one side of the collecting box and communicates with the collecting box, an extraction pipe is fixedly installed on one side of the collecting box, and the other end of the extraction pipe penetrates through the fixing frame and is fixedly connected with a suction nozzle. The cleaning wheel is used for cleaning dust attached to the chip, the phenomenon that the packaging sealing performance and the chip stability are affected due to the fact that the local debonding phenomenon possibly occurs after glue is solidified can be avoided, and the phenomenon that the packaging sealing performance and the chip stability are affected due to the fact that the dust attached to the cleaning wheel is adsorbed can also be avoided when the next chip is cleaned. And dust which is previously attached to the roller can be adhered to the chip again.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging technology, and in particular to a dispensing mechanism for chip packaging. Background Technology

[0002] The control board is equipped with a large number of electronic components to achieve the purpose of controlling the circuit to issue commands. Integrated chips are one of the important electronic components on the control board. In the final step of the control board processing, the chip needs to be coated and encapsulated with glue to fix the chip. Some of the glue can also help dissipate heat from the chip.

[0003] Before the dispensing process in chip packaging, it is necessary to clean any dust that may remain on the chip. Most existing dust removal devices use rollers to remove dust from the chip. However, the problem is that dust cannot be cleaned in time once it adheres to the rollers. This causes the rollers to re-adhere the dust that was previously attached to the rollers to the chip when cleaning the next chip, resulting in an unsatisfactory dust removal effect. Therefore, a dispensing mechanism for chip packaging is proposed to solve the above problems. Utility Model Content

[0004] To address the shortcomings of existing technologies, this invention provides a dispensing mechanism for chip packaging, which solves the problems mentioned in the background section.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A dispensing mechanism for chip packaging includes a base plate. Two fixing plates are fixedly installed on the top side of the base plate, and a conveyor belt is arranged between the two fixing plates. Multiple clamping components are arranged on the outer side of the conveyor belt. A fixing frame is fixedly installed on the top side of the base plate. A fan and a collection box are fixedly installed on the top side of the fixing frame. A connecting pipe is fixedly installed on one side of the fan, and the other end of the connecting pipe is fixedly connected to one side of the collection box and communicates with the collection box. An extraction pipe is fixedly installed on one side of the collection box, and the other end of the extraction pipe passes through the fixing frame and is fixedly connected to a suction nozzle. A toggle plate is fixedly installed on the inner wall of the suction nozzle. A cleaning component is arranged on one side of the suction nozzle. A dispensing component is arranged on the top of the base plate.

[0007] Preferably, the clamping assembly includes a placement frame fixedly installed on the outer side of the conveyor belt, the placement frame having a placement groove, and electric push rods fixedly installed on both sides of the placement frame. The output ends of the two electric push rods pass through the placement frame and are fixedly connected to clamping plates.

[0008] Preferably, the cleaning assembly includes two mounting plates fixedly installed on the bottom side of the fixing frame. Both mounting plates have round holes, and the same rotating rod is provided in the two round holes. A cleaning wheel is fixedly sleeved on the outer side of the rotating rod. A part of the cleaning wheel is located on one side of the suction nozzle, and a first pulley is fixedly sleeved on one end of the rotating rod.

[0009] Preferably, a square plate is fixedly installed on the top side of the fixing frame, and a motor is fixedly installed on one side of the square plate. The output end of the motor rotates through the square plate and is fixedly sleeved with a second pulley. The second pulley and the first pulley are provided with the same belt.

[0010] Preferably, two limiting plates are fixedly sleeved on the outer side of the rotating rod, and the side of the two limiting plates that are close to each other is respectively attached to the side of the two mounting plates that are far from each other.

[0011] Preferably, the dispensing assembly includes two cylinders fixedly installed on the bottom side of the base plate, the output ends of the two cylinders both penetrate the base plate and are fixedly connected to the same top plate, and a dispensing head is provided on the bottom side of the top plate.

[0012] Preferably, the collection box is equipped with a filter plate, and the filter plate has multiple filter holes.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows: In the process of cleaning the chip, the dispensing mechanism for chip packaging starts the fan to drive the suction nozzle to suck up dust. During the dust suction process, because the cleaning wheel is rotating, it will contact the actuating plate fixedly installed on the inner wall of the suction nozzle. The contact between the actuating plate and the cleaning wheel can shake off the dust attached to the cleaning wheel. The shaken dust will enter the collection box through the extraction tube. By cleaning the dust attached to the chip with the cleaning wheel, it is possible to avoid the phenomenon of local detachment after the glue cures, which would affect the sealing of the package and the stability of the chip. By adsorbing the dust attached to the cleaning wheel, it is also possible to prevent the dust previously attached to the roller from sticking back to the chip when cleaning the next chip. Attached Figure Description

[0014] Figure 1 This is a three-dimensional structural schematic diagram of the present utility model;

[0015] Figure 2 This is a cross-sectional view of the structure of this utility model;

[0016] Figure 3 This is a schematic diagram of some parts of the toggle plate structure of this utility model;

[0017] Figure 4 This is a schematic diagram of some parts of the cleaning wheel structure of this utility model.

[0018] In the diagram: 1. Base plate; 2. Fixing plate; 3. Conveyor belt; 4. Placement frame; 5. Electric push rod; 6. Clamping plate; 7. Fixing frame; 8. Mounting plate; 9. Rotating rod; 10. Cleaning wheel; 11. Limiting plate; 12. First pulley; 13. Square plate; 14. Motor; 15. Second pulley; 16. Belt; 17. Fan; 18. Collection box; 19. Connecting pipe; 20. Extraction pipe; 21. Suction nozzle; 22. Actuating plate; 23. Filter plate; 24. Cylinder; 25. Top plate; 26. Dispensing head. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Reference Figure 1-4 A dispensing mechanism for chip packaging includes a base plate 1. Two fixing plates 2 are fixedly mounted on the top side of the base plate 1, and a conveyor belt 3 is arranged between the two fixing plates 2. Multiple clamping components are arranged on the outer side of the conveyor belt 3. A fixing frame 7 is fixedly mounted on the top side of the base plate 1. A fan 17 and a collection box 18 are fixedly mounted on the top side of the fixing frame 7 respectively. A connecting pipe 19 is fixedly mounted on one side of the fan 17, and the other end of the connecting pipe 19 is fixedly connected to one side of the collection box 18 and communicates with the collection box 18. An extraction pipe 20 is fixedly mounted on one side of the collection box 18, and the other end of the extraction pipe 20 passes through the fixing frame 7 and is fixedly connected to a suction nozzle 21. A toggle plate 22 is fixedly mounted on the inner wall of the suction nozzle 21, and a cleaning component is arranged on one side of the suction nozzle 21. A dispensing component is arranged above the base plate 1. By setting the toggle plate 22, the cleaning wheel... During the rotation of the cleaning wheel 10, the fan 17 is simultaneously activated to drive the suction nozzle 21 to perform dust suction. During the dust suction process, because the cleaning wheel 10 is in a rotating state, it will contact the actuating plate 22 fixedly installed on the inner wall of the suction nozzle 21. The contact between the actuating plate 22 and the cleaning wheel 10 can shake off the dust attached to the cleaning wheel 10. The shaken dust will enter the collection box 18 through the extraction tube 20. By cleaning the dust attached to the chip with the cleaning wheel 10, it is possible to avoid the phenomenon of local detachment after the glue has cured, which would affect the sealing of the package and the stability of the chip. By adsorbing the dust attached to the cleaning wheel 10, it is also possible to prevent the dust previously attached to the roller from sticking back to the chip when cleaning the next chip.

[0021] Specifically, the clamping assembly includes a placement frame 4 fixedly installed on the outer side of the conveyor belt 3. The placement frame 4 has a placement slot. Electric push rods 5 are fixedly installed on both sides of the placement frame 4. The output ends of the two electric push rods 5 pass through the placement frame 4 and are fixedly connected to clamping plates 6. When it is necessary to place a chip, the chip is placed in the placement frame 4, and then the electric push rods 5 on both sides of the placement frame 4 are activated to drive the two clamping plates 6 to clamp the chip on both sides. Since the distance between the two clamping plates 6 is controlled by the electric push rods 5, chips of different sizes can be clamped, greatly improving practicality. Since the chip is in a clamped state during dust removal and glue dispensing, it can prevent the rotating cleaning wheel 10 from causing the chip to shift during dust removal.

[0022] Specifically, the cleaning assembly includes two mounting plates 8 fixedly installed on the bottom side of the mounting frame 7. Both mounting plates 8 have circular holes, and a common rotating rod 9 is installed within each hole. A cleaning wheel 10 is fixedly sleeved on the outer side of the rotating rod 9, with a portion of the cleaning wheel 10 located on one side of the suction nozzle 21. A first pulley 12 is fixedly sleeved on one end of the rotating rod 9. A square plate 13 is fixedly installed on the top side of the mounting frame 7. A motor 14 is fixedly installed on one side of the square plate 13. The output end of the motor 14 rotates through the square plate 13 and is fixedly sleeved on a second pulley 15. The second pulley 15 and the first pulley 12 are connected by the same belt 16. When the placement frame 4 holding the chip moves to below the cleaning wheel 10, the motor 14 drives the second pulley 15 to rotate. Since the second pulley 15 and the first pulley 12 share the same belt 16, the first pulley 12 is driven to rotate synchronously by the linkage of the belt 16. Since the cleaning wheel 10 is fixedly sleeved on the outside of the rotating wheel 9, the cleaning wheel 10 can clean the dust attached to the chip surface when the rotating wheel 9 rotates.

[0023] Specifically, two limiting plates 11 are fixedly sleeved on the outer side of the rotating rod 9. The side of the two limiting plates 11 that is close to each other is respectively attached to the side of the two mounting plates 8 that is far from each other. By setting two limiting plates 11, the two limiting plates 11 can limit the rotating rod 9 so that it can only rotate and cannot move forward or backward.

[0024] Specifically, the dispensing assembly includes two cylinders 24 fixedly installed on the bottom side of the base plate 1. The output ends of the two cylinders 24 pass through the base plate 1 and are fixedly connected to the same top plate 25. A dispensing head 26 is provided on the bottom side of the top plate 25. By providing two cylinders 24, when the chip that has been cleaned moves with the conveyor belt 3 to below the dispensing head 26, the two cylinders 24 will operate synchronously, thereby driving the dispensing head 26 on the bottom side of the top plate 25 to move down synchronously, so that the dispensing head 26 can dispense the chip at close range.

[0025] Specifically, a filter plate 23 is installed inside the collection box 18. The filter plate 23 has multiple filter holes. By installing the filter plate 23, the filter plate 23 can block the dust drawn into the collection box 18, preventing the dust from entering the fan 17 and affecting the internal parts, thereby causing damage to the fan 17.

[0026] All electrical components mentioned in this article are connected to an external main controller and 220V AC mains power, and the main controller can be a conventional known device such as a computer for control.

[0027] In use: Place the chip to be glued in the placement frame 4, then activate the electric push rods 5 on both sides of the placement frame 4 to drive the two clamping plates 6 to clamp the chip on both sides. After clamping, the conveyor belt 3 moves the chip to the bottom of the cleaning wheel 10. Then, start the motor 14 to drive the second pulley 15 to rotate. Since the second pulley 15 and the first pulley 12 share the same belt 16, the first pulley 12 synchronously drives the rotating rod 9 to rotate under the linkage of the belt 16. Since the cleaning wheel 10 is fixedly sleeved on the outside of the rotating rod 9, the cleaning wheel 10 can clean the dust attached to the chip surface when the rotating rod 9 rotates. The cleaned dust will adhere to the cleaning wheel 10. At the same time, the fan 17 is started to drive the suction nozzle 21 to vacuum. During the vacuuming process, since the cleaning wheel 10 is rotating, it will contact the actuation device fixedly installed on the inner wall of the suction nozzle 21. The plate 22, when in contact with the cleaning wheel 10, shakes off the dust adhering to the cleaning wheel 10. The shaken dust then enters the collection box 18 through the extraction tube 20. Because the collection box 18 is equipped with a filter plate 23, the filter plate 23 can block the dust, preventing the dust from entering the blower 17 and causing damage to the blower 17. By cleaning the dust adhering to the chip through the cleaning wheel 10, the phenomenon of local detachment that may occur after the glue has cured can be avoided, which would affect the sealing of the package and the stability of the chip. By adsorbing the dust adhering to the cleaning wheel 10, the dust previously attached to the roller can also be prevented from sticking back to the chip when cleaning the next chip. After the chip is cleaned, the conveyor belt 3 will move the chip to the underside of the dispensing head 26. Then, the two cylinders 24 will operate, causing the top plate 25 to move the dispensing head 26 down. Then, the dispensing head 26 will apply the glue to the chip.

[0028] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus.

[0029] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A dispensing mechanism for chip packaging, comprising a base plate (1), characterized in that, The top side of the bottom plate (1) is fixedly installed with two fixed plates (2), a conveying belt (3) is arranged between the two fixed plates (2), a plurality of clamping assemblies are arranged on the outer side of the conveying belt (3), a fixed frame (7) is fixedly installed on the top side of the bottom plate (1), a fan (17) and a collection box (18) are respectively fixedly installed on the top side of the fixed frame (7), one side of the fan (17) is fixedly installed with a connecting pipe (19), the other end of the connecting pipe (19) is fixedly connected on one side of the collection box (18) and communicates with the collection box (18), one side of the collection box (18) is fixedly installed with a suction pipe (20), the other end of the suction pipe (20) penetrates through the fixed frame (7) and is fixedly connected with a suction nozzle (21), a toggle plate (22) is fixedly installed on the inner wall of the suction nozzle (21), a cleaning assembly is arranged on one side of the suction nozzle (21), and a point gluing assembly is arranged above the bottom plate (1).

2. The dispensing mechanism for chip packaging according to claim 1, wherein The clamping assembly comprises a placing frame (4) fixedly installed on the outer side of the conveying belt (3), the placing frame (4) is provided with a placing groove, and the two sides of the placing frame (4) are fixedly installed with electric push rods (5), the output ends of the two electric push rods (5) penetrate through the placing frame (4) and are fixedly connected with clamping plates (6).

3. The dispensing mechanism for chip packaging according to claim 1, wherein The cleaning assembly comprises two mounting plates (8) fixedly installed on the bottom side of the fixed frame (7), the two mounting plates (8) are both provided with a circular hole, and the same rotating rod (9) is arranged in the two circular holes, the outer side of the rotating rod (9) is fixedly sleeved with a cleaning wheel (10), part of the cleaning wheel (10) is located on one side of the suction nozzle (21), and one end of the rotating rod (9) is fixedly sleeved with a first pulley (12).

4. The dispensing mechanism for chip packaging according to claim 3, wherein The top side of the fixed frame (7) is fixedly installed with a square plate (13), one side of the square plate (13) is fixedly installed with a motor (14), the output end of the motor (14) penetrates through the square plate (13) and is fixedly sleeved with a second pulley (15), and the same belt (16) is arranged between the second pulley (15) and the first pulley (12).

5. The dispensing mechanism for chip packaging according to claim 3, wherein The outer side of the rotating rod (9) is fixedly sleeved with two limiting plates (11), and the sides of the two limiting plates (11) close to each other are respectively attached to the sides of the two mounting plates (8) away from each other.

6. The dispensing mechanism for chip packaging according to claim 1, wherein The bottom side of the bottom plate (1) is fixedly installed with two air cylinders (24), the output ends of the two air cylinders (24) penetrate through the bottom plate (1) and are fixedly connected with the same top plate (25), and the bottom side of the top plate (25) is provided with a point gluing head (26).

7. The dispensing mechanism for chip package according to claim 1, wherein, The collection box (18) is provided with a filter plate (23), and the filter plate (23) is provided with a plurality of filter holes.

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