Electronic component pin lead bending device

Abstract

The utility model provides an electronic component pin lead bending device, which relates to the technical field of electronic component processing, and comprises a placing plate, one side of the placing plate is rotatably matched with a rotating plate, a plurality of grooves are arranged in the rotating plate, the lower side of the placing plate is provided with a limiting structure, the limiting structure corresponds to the rotating plate, and a support frame is fixed on the placing plate. A fixing structure and a downward pressing structure are arranged on the supporting frame, the downward pressing structure comprises a pressing rod, a first pressing plate is arranged at the end of the pressing rod, a displacement compensation structure is arranged between the first pressing plate and the pressing rod, and the first pressing plate corresponds to the rotating plate. According to the pin bending device, the rotating plate is rotationally installed on one side of the containing plate, the grooves are formed in the rotating plate, the pins can be limited through the grooves so that the pins can be prevented from being bent towards the two sides, the bending angle of the pins can be adjusted by adjusting the rotating angle of the rotating plate, and therefore the pins can be bent at different angles; the application range of the device is expanded.

Description

Technical Field

[0001] This utility model relates to the field of electronic component processing technology, specifically to a device for bending the lead wires of electronic components. Background Technology

[0002] Electronic component pins are the wires that connect the internal circuitry of an integrated circuit to the external circuitry. All the pins constitute the interface of the chip. The end of the lead is soldered to a pad on the printed circuit board to form a solder joint. Pins can be divided into sections such as the heel, toe, and side. An electronic component pin bending machine is a machine that bends the pins of electronic components. For example, patent CN211489417U discloses an electronic component pin bending machine, including a base. A support plate is fixedly installed on the upper rear part of the base, a horizontal plate is fixedly installed on the upper front part of the support plate, and a bending pin is fixedly installed on the lower end of the horizontal plate. The bending mechanism has a controller fixedly installed on the upper left side of the base, a placement plate fixedly installed on the front of the base, a slide rod fixedly installed on the upper front and upper rear of the placement plate, and a fixing plate fixedly installed on the upper ends of the two slide rods. A pressure plate is provided between the fixing plate and the placement plate, and a screw is movably connected through the middle of the upper end of the fixing plate. Although this device can bend the pins of electronic components, it cannot adjust the bending angle, has a limited range of applications, and directly squeezing and bending the pins can easily cause the pins to bend to both sides, resulting in a difference between the bending of the pins and the ideal situation, leading to bending failure.

[0003] Therefore, this utility model provides a device for bending the lead wires of electronic components. Utility Model Content

[0004] To address the shortcomings of existing technologies, the purpose of this invention is to provide a device for bending the pins of electronic components, thereby solving the problems mentioned in the background section. This invention can adjust the bending angle of the pins by adjusting the rotation angle of the rotating plate, thus enabling bending of the pins at different angles and expanding the applicability of the device. It can also prevent electronic components from being crushed. By pressing down on the pins through the pressing structure, the pins can be bent, ensuring the bending effect and preventing pin damage.

[0005] To achieve the above objectives, this utility model is implemented through the following technical solution: an electronic component pin lead bending device, including a placement plate, a rotating plate rotatably fitted on one side of the placement plate, multiple grooves formed in the rotating plate, a limiting structure installed on the lower side of the placement plate, the limiting structure corresponding to the rotating plate, a support frame fixed on the placement plate, a fixing structure and a pressing structure installed on the support frame, the pressing structure including a pressure rod, a first pressure plate installed at the end of the pressure rod, a displacement compensation structure installed between the first pressure plate and the pressure rod, the first pressure plate corresponding to the rotating plate.

[0006] Furthermore, a first rotating shaft is rotatably fitted to one side of the placement plate, and the first rotating shaft is fixedly connected to the rotating plate.

[0007] Furthermore, the fixing structure includes a first electric cylinder fixed to the support frame, a second pressure plate fixed to the output end of the first electric cylinder, and a buffer pad fixed to the lower side of the second pressure plate.

[0008] Furthermore, a second electric cylinder is fixed on the support frame, and the output end of the second electric cylinder is fixedly connected to the pressure rod.

[0009] Furthermore, the displacement compensation structure includes a sliding block, and a groove is provided on the first pressure plate, the groove corresponding to the sliding block.

[0010] Furthermore, a rotating frame is fixed on the sliding block, and a second rotating shaft is rotatably fitted inside the rotating frame. The second rotating shaft is fixedly connected to the pressure rod.

[0011] Furthermore, friction strips are fixed to the lower side of the first pressure plate and the rotating plate, and an iron sheet is fixed to the lower side of the rotating plate.

[0012] Furthermore, the limiting structure includes a third electric cylinder, which is fixedly connected to the placement plate. A limiting ball is fixed to the output end of the third electric cylinder, and an electromagnet is installed inside the limiting ball, with the electromagnet corresponding to the iron sheet.

[0013] The beneficial effects of this utility model are:

[0014] 1. A rotating plate is installed on one side of the placement plate. A groove is made in the rotating plate. The groove can limit the pin and prevent the pin from bending to both sides. The bending angle of the pin can be adjusted by adjusting the rotation angle of the rotating plate, so that the pin can be bent at different angles, thus expanding the applicability of the device.

[0015] 2. The mounting and pressing structures on the support frame can fix electronic components in place and prevent them from being crushed by the cushioning pads. The pressing structure can be used to press down on the pins to bend them, ensuring the bending effect and preventing damage to the pins. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall assembly three-dimensional structure of the electronic component pin lead bending device of this utility model;

[0017] Figure 2 This is a schematic diagram of the overall assembly cross-sectional structure of the electronic component lead wire bending device of this utility model.

[0018] Figure 3 This is a schematic diagram of the assembly structure of the first pressure plate and the rotating plate in the electronic component lead wire bending device of this utility model;

[0019] Figure 4 This is a schematic diagram of the three-dimensional assembly structure of the rotating plate in the electronic component lead wire bending device of this utility model.

[0020] In the diagram: 1. Placement plate; 2. Support frame; 3. First rotating shaft; 4. Rotating plate; 5. First pressure plate; 6. Buffer pad; 7. Second pressure plate; 8. First electric cylinder; 9. Second electric cylinder; 10. Pressure rod; 11. Slide groove; 12. Sliding block; 13. Rotating frame; 14. Second rotating shaft; 15. Groove; 16. Friction strip; 17. Third electric cylinder; 18. Limit ball; 19. Electromagnet; 20. Iron sheet. Detailed Implementation

[0021] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0022] Please see Figures 1 to 4 This utility model provides a technical solution: an electronic component pin lead bending device, including a placement plate 1, a rotating plate 4 rotatably fitted on one side of the placement plate 1, a plurality of grooves 15 formed in the rotating plate 4, a limiting structure installed on the lower side of the placement plate 1, the limiting structure corresponding to the rotating plate 4, a support frame 2 fixed on the placement plate 1, a fixing structure and a pressing structure installed on the support frame 2, the pressing structure including a pressure rod 10, a first pressure plate 5 installed at the end of the pressure rod 10, a displacement compensation structure installed between the first pressure plate 5 and the pressure rod 10, the first pressure plate 5 corresponding to the rotating plate 4.

[0023] In this embodiment, a first rotating shaft 3 is rotatably fitted on one side of the placement plate 1. The first rotating shaft 3 is fixedly connected to the rotating plate 4. A torsion spring is installed between the first rotating shaft 3 and the placement plate 1 for resetting the rotating plate 4.

[0024] Specifically, the rotating plate 4 can rotate via the first rotating shaft 3. When the first pressure plate 5 presses down, the rotating plate 4 rotates, causing the pins to bend. The degree of bending of the pins varies depending on the rotation angle of the rotating plate 4.

[0025] The fixed structure includes a first electric cylinder 8 fixed on the support frame 2, a second pressure plate 7 fixed at the output end of the first electric cylinder 8, and a buffer pad 6 fixed on the lower side of the second pressure plate 7.

[0026] Specifically, the electronic components are placed on the placement plate 1, and then the first electric cylinder 8 is activated, which causes the second pressure plate 7 to move downward, thereby squeezing and fixing the electronic components. The buffer pad 6 can also be used to protect the electronic components from being crushed.

[0027] A second electric cylinder 9 is fixed on the support frame 2, and the output end of the second electric cylinder 9 is fixedly connected to the pressure rod 10.

[0028] Specifically, starting the second electric cylinder 9 causes the pressure rod 10 to move downward, which in turn causes the first pressure plate 5 to move downward, causing the rotating plate 4 to rotate downward, thus bending the pin and bending it to different angles.

[0029] The displacement compensation structure includes a sliding block 12, a groove 11 is provided on the first pressure plate 5, the groove 11 corresponds to the sliding block 12, a rotating frame 13 is fixed on the sliding block 12, a second rotating shaft 14 is rotatably fitted inside the rotating frame 13, and the second rotating shaft 14 is fixedly connected to the pressure rod 10.

[0030] Specifically, when the first pressure plate 5 presses down, it comes into contact with the rotating plate 4. At this time, the friction between the first pressure plate 5 and the rotating plate 4 keeps them relatively stationary. Therefore, the pressure rod 10 continues to press down, causing the second rotating shaft 14 to rotate and the sliding block 12 to slide in the groove 11. This compensates for the rotation of the rotating plate 4, ensuring that the rotating plate 4 and the first pressure plate 5 do not limit the downward pressure of the pressure rod 10.

[0031] Friction strips 16 are fixed on the lower side of the first pressure plate 5 and the rotating plate 4. An iron sheet 20 is fixed on the lower side of the rotating plate 4. The limiting structure includes a third electric cylinder 17, which is fixedly connected to the placement plate 1. A limiting ball 18 is fixed at the output end of the third electric cylinder 17. An electromagnet 19 is installed inside the limiting ball 18, and the electromagnet 19 corresponds to the iron sheet 20.

[0032] Specifically, the third electric cylinder 17 is activated, causing it to push the limiting ball 18 to move, thereby limiting the rotation plate 4. The degree of limiting the rotation plate 4 is adjusted according to the position of the limiting ball 18, thereby limiting the rotation angle of the rotation plate 4 and achieving different degrees of bending. After bending is completed, the electromagnet 19 is activated, causing it to attract and fix the iron sheet 20, thereby fixing the position of the rotation plate 4 and preventing the rotation plate 4 from springing back and causing bending failure.

[0033] Workflow: Place the electronic component on the placement plate 1, then activate the first electric cylinder 8, which moves the second pressure plate 7 downward to press and fix the electronic component. Then activate the third electric cylinder 17, which pushes the limit ball 18 to move, thereby limiting the rotating plate 4. Activate the second electric cylinder 9, which moves the pressure rod 10 downward, thereby moving the first pressure plate 5 downward, causing the rotating plate 4 to rotate downward, thus bending the pin until the rotating plate 4 contacts the limit ball 18. At this time, activate the electromagnet 19, which attracts and fixes the iron sheet 20, thereby fixing the position of the rotating plate 4. Then, the second electric cylinder 9 drives the pressure rod 10 and the first pressure plate 5 to reset, and the first electric cylinder 8 drives the second pressure plate 7 to reset, allowing the bent electronic component to be removed.

[0034] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. An electronic component pin lead bending apparatus comprising a placement plate (1), characterized in that, The placing plate (1) one side rotation cooperation has the rotation plate (4), rotation plate (4) inside is set up multiple recess (15), placing plate (1) downside is equipped with limit structure, limit structure and rotation plate (4) correspond, placing plate (1) is fixed with support frame (2), support frame (2) is equipped with fixed structure and press down structure, press down structure includes pressure rod (10), the end of pressure rod (10) is equipped with first pressure plate (5), first pressure plate (5) and pressure rod (10) between the displacement compensation structure is equipped with, first pressure plate (5) and rotation plate (4) correspond.

2. The electronic component pin lead bending apparatus according to claim 1, wherein: The placing plate (1) one side rotation cooperation has the first rotation shaft (3), and the first rotation shaft (3) is fixedly connected with the rotation plate (4).

3. The electronic component pin lead bending apparatus of claim 1, wherein: The fixed structure includes the first electric cylinder (8) fixed on the support frame (2), and the output end of the first electric cylinder (8) is fixedly connected with the second pressure plate (7), and the lower side of the second pressure plate (7) is fixedly connected with the buffer pad (6).

4. The electronic component pin lead bending apparatus of claim 1, wherein: The support frame (2) is fixedly connected with the second electric cylinder (9), and the output end of the second electric cylinder (9) is fixedly connected with the pressure rod (10).

5. The electronic component pin lead bending apparatus of claim 1, wherein: The displacement compensation structure includes the sliding block (12), and the sliding groove (11) is formed in the first pressure plate (5), and the sliding groove (11) corresponds to the sliding block (12).

6. An electronic component pin lead bending apparatus according to claim 5, wherein: The sliding block (12) is fixedly connected with the rotating frame (13), and the second rotation shaft (14) is rotatably connected in the rotating frame (13), and the second rotation shaft (14) is fixedly connected with the pressure rod (10).

7. The electronic component pin lead bending apparatus of claim 1, wherein: The lower side of the first pressure plate (5) and the rotation plate (4) are fixedly connected with the friction strip (16), and the lower side of the rotation plate (4) is fixedly connected with the iron sheet (20).

8. The electronic component pin lead bending apparatus of claim 7, wherein: The limit structure includes the third electric cylinder (17), and the third electric cylinder (17) is fixedly connected with the placing plate (1), and the output end of the third electric cylinder (17) is fixedly connected with the limiting ball (18), and the limiting ball (18) is internally provided with the electromagnet (19), and the electromagnet (19) corresponds to the iron sheet (20).

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