Hybrid drive mode sandwich semiconductor chip heating system
By using a sandwich structure with a hybrid drive mode, combining heating wire and semiconductor chip, the problems of high energy consumption and low heat exchange efficiency in traditional heating systems are solved, realizing a high-efficiency and energy-saving heating system design that can adapt to different ambient temperatures and usage scenarios.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-23
- Publication Date
- 2026-03-31
AI Technical Summary
Traditional car heating systems suffer from high energy consumption, slow heating speed, and heating efficiency that is greatly affected by the environment. In contrast, semiconductor chip heating systems are expensive, have low heat exchange efficiency, and are difficult to adjust in a flexible manner.
The sandwich structure with a hybrid drive mode includes primary and secondary heat transfer fluid pipes, combined with heating wires and semiconductor chips, and connected by metallized welding to achieve liquid circulation and heat transfer, adapting to the heat requirements of different drive modes.
It improves the heat exchange efficiency and energy utilization of the heating system, achieves precise temperature control, avoids energy waste, extends system life, and enhances user comfort and system reliability.
Smart Images
Figure CN224060810U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a hybrid drive mode sandwich-core semiconductor chip heating system. Background Technology
[0002] Traditional automotive heating systems primarily use PTC heating technology, but PTC heating suffers from high energy consumption, slow heating speed, and its efficiency is greatly affected by environmental factors. However, semiconductor chips, with their advantages of high-precision temperature control and rapid response, can also be applied to automotive heating systems.
[0003] At the same time, existing semiconductor chip heating systems have some drawbacks, such as the need to deploy a large number of semiconductor chips to generate heat, which increases costs.
[0004] In addition, existing semiconductor heating systems are all single fluid pipe designs, which are not good in terms of liquid recycling and heat transfer efficiency, and have low heat exchange efficiency.
[0005] In addition, most of them use heat dissipation fins or bent fins to connect to semiconductor chips, which cannot flexibly adjust the heating capacity and make it difficult to quickly and accurately respond to the heating power requirements under different ambient temperatures and usage scenarios. Utility Model Content
[0006] The technical problem to be solved by this utility model is: how to improve the heat exchange efficiency of the heating system at low cost, and to provide a hybrid drive mode sandwich semiconductor chip heating system.
[0007] To solve the above problems, this utility model is achieved through the following technical solution:
[0008] A hybrid drive mode sandwich-type semiconductor chip heating system includes an inlet channel and an outlet channel. At least one primary heat-carrying fluid pipe and at least one secondary heat-carrying fluid pipe are provided between the inlet channel and the outlet channel, respectively. The two ends of the primary heat-carrying fluid pipe and the secondary heat-carrying fluid pipe are respectively connected to the inlet channel and the outlet channel. Heating wires are provided on both sides of the primary heat-carrying fluid pipe, and the two sides of the secondary heat-carrying fluid pipe are respectively connected to the cold end of the semiconductor chip. The hot end of the semiconductor chip is connected to a heat dissipation metal plate.
[0009] The water inlet channel is equipped with an inlet, and the water outlet channel is equipped with an outlet. The inlet and outlet are funnel-shaped.
[0010] The secondary heat transfer fluid pipeline is made of cast aluminum.
[0011] The cold end of the semiconductor chip is metallized and soldered onto the secondary heat transfer fluid pipe.
[0012] The heat dissipation metal sheet is a trapezoidal heat dissipation metal sheet.
[0013] The heating wires on both sides of the main heat-carrying fluid pipeline are metallized and welded.
[0014] Compared with existing technologies, this invention has the following advantages: In electric mode, it employs a hybrid design of heating wire and semiconductor chip, enabling precise temperature control and improved heating efficiency; in fuel mode, the heating wire and semiconductor chip cease operation, and the hot water generated by the engine is used for warm air circulation. Therefore, this invention can adapt to different driving modes, avoid energy waste, enhance the practicality and applicability of the heating system, and bring users a comfortable, energy-saving, and efficient heating experience. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0016] Figure 2 for Figure 1 Side view;
[0017] Figure 3 for Figure 2 Enlarged view of point A in the middle;
[0018] Figure 4 This is a structural diagram of a secondary heat transfer fluid pipeline;
[0019] Figure 5 This is a structural diagram of the chip positioning card. Detailed Implementation
[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0021] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0022] like Figure 1 , Figure 2 , Figure 3As shown, a hybrid drive mode sandwich semiconductor chip heating system includes an inlet channel 9 and an outlet channel 10. At least one primary heat-carrying fluid pipe 4 and at least one secondary heat-carrying fluid pipe 1 are provided between the inlet channel 9 and the outlet channel 10. The two ends of the primary heat-carrying fluid pipe 4 and the secondary heat-carrying fluid pipe 1 are respectively connected to the inlet channel 9 and the outlet channel 10. Heating wires 6 are provided on both sides of the primary heat-carrying fluid pipe 4, and the two sides of the secondary heat-carrying fluid pipe 1 are respectively connected to the cold end of the semiconductor chip 3. The hot end of the semiconductor chip 3 is connected to a heat dissipation metal plate 5.
[0023] It should be noted that the water inlet channel 9 is equipped with a water inlet 7, and the water outlet channel 10 is equipped with a water outlet 8. The water inlet 7 and the water outlet 8 are funnel-shaped to increase the inlet and outlet flow of the heating system.
[0024] It should be noted that all of the above components are encapsulated inside the heater housing.
[0025] Furthermore, the secondary heat transfer fluid pipe 1 is made of cast aluminum.
[0026] Even better, the cold ends of the semiconductor chips 3 are all metallized and welded to the secondary heat transfer fluid pipe 1.
[0027] Furthermore, the heat dissipation metal plate 5 is a trapezoidal heat dissipation metal plate.
[0028] Furthermore, metallized welding heating wires 6 are used on both sides of the main heat-carrying fluid pipeline 4.
[0029] exist Figure 4 , Figure 5 In the middle, chip positioning plates 2 are set on the left and right surfaces of the secondary heat transfer fluid pipe 1, and semiconductor chips 3 are closely attached to the upper and lower surfaces of the positioning plates 2 in order to fix the position of semiconductor chips 3. The chip positioning plates 2 are flat structures.
[0030] The working principle of this utility model is as follows:
[0031] exist Figure 1 In the embodiment shown, liquid enters from inlet 7 and flows through the main heat transfer fluid pipe 4 and the secondary heat transfer fluid pipe 1 respectively. Chip positioning plates 2 are set on the upper and lower surfaces of the secondary heat transfer fluid pipe 1 to ensure the reliability of the semiconductor chip 3 in use and installation. The cold ends of the two rows of semiconductor chips 3 are metallized and welded to the secondary heat transfer fluid pipe 1. The hot ends of the semiconductor chips 3 are connected to the heat dissipation metal plate 5. The heating wires 6 are metallized and welded to both sides of the main heat transfer fluid pipe 4. After the liquid flows through the main heat transfer fluid pipe 4 and the secondary heat transfer fluid pipe 1, it flows out through outlet 8 for the next cycle.
[0032] exist Figure 2 , Figure 3In electric mode, metallized heating wires 6 are welded to both sides of the main heat-carrying fluid pipe 4 to heat the liquid inside the main heat-carrying fluid pipe 4. At the same time, the hot end of the semiconductor chip 3 is welded to a metallized heat dissipation metal plate 5 to dissipate the heat generated by the hot end of the semiconductor chip 3. The cold ends of the two rows of semiconductor chips 3 are attached to the secondary heat-carrying fluid pipe 1, and the heat generated by the cold ends of the semiconductor chips 3 is carried away through the secondary heat-carrying fluid pipe 1. In fuel mode, neither the semiconductor chip 3 nor the heating wires 6 work. After the liquid flows through the main heat-carrying fluid pipe 4 and the secondary heat-carrying fluid pipe 1, the heat is transferred to the heating wires 6 and the heat dissipation metal plate 5 for auxiliary heat dissipation.
[0033] The beneficial effects of this invention are as follows: 1. The hybrid design of primary and secondary heat transfer fluid pipes greatly improves the heat exchange efficiency between the fluid and the semiconductor chip. On the one hand, the primary heat transfer fluid pipe ensures that the liquid circulates at a high flow rate, which can promptly carry away heat and transfer it to the space requiring heating; on the other hand, the secondary heat transfer fluid pipe carries the lower-temperature liquid out at a low flow rate and high velocity, effectively improving the overall heating efficiency of the heating system. 2. In electric mode, the heating wire assists in heating the primary heat transfer fluid pipe, improving the heating efficiency of the heating system. In fuel-fired mode, when only hot water is supplied, the heating wire and heat dissipation metal plate are used to assist in heat dissipation. This flexible adjustment method avoids energy waste and allows the system to operate at optimal power under different ambient temperatures and usage scenarios, improving energy utilization and extending the system's service life. 3. The reasonable fluid pipe design and precise temperature regulation help maintain the semiconductor chip within a suitable operating temperature range, reducing the probability of performance degradation and failure due to overheating, thereby improving the reliability and stability of the entire heating system.
[0034] The above description is only a preferred embodiment of the present utility model. It should be noted that those skilled in the art can make several changes and improvements without departing from the overall concept of the present utility model, and these should also be considered within the protection scope of the present utility model.
Claims
1. A hybrid drive mode sandwiched semiconductor chip warm air system, characterized by: The application relates to a heat dissipation device for semiconductor chips, which comprises a water inlet channel (9) and a water outlet channel (10), at least one main heat carrier fluid pipe (4) and at least one secondary heat carrier fluid pipe (1) are arranged between the water inlet channel (9) and the water outlet channel (10), the two ends of the main heat carrier fluid pipe (4) and the secondary heat carrier fluid pipe (1) are communicated with the water inlet channel (9) and the water outlet channel (10) respectively, heating wires (6) are arranged on the two sides of the main heat carrier fluid pipe (4), the cold ends of semiconductor chips (3) are connected with the two sides of the secondary heat carrier fluid pipe (1) respectively, and the hot ends of the semiconductor chips (3) are connected with heat dissipation metal thin plates (5).
2. A hybrid drive mode sandwiched semiconductor chip warm airflow system according to claim 1, characterized in that: The water inlet channel (9) is provided with a water inlet (7), the water outlet channel (10) is provided with a water outlet (8), and the water inlet (7) and the water outlet (8) are in a trumpet shape.
3. The hybrid drive mode sandwiched semiconductor chip warm airflow system of claim 1, wherein: The secondary heat carrier fluid pipe (1) is made of cast aluminum.
4. The hybrid drive mode sandwiched semiconductor chip warm airflow system of claim 1, wherein: The cold end of the semiconductor chip (3) is welded on the secondary heat carrier fluid pipe (1) by metallization.
5. The hybrid drive mode sandwiched semiconductor chip heating system of claim 1, wherein: The heat dissipation metal thin plate (5) is a trapezoidal heat dissipation metal thin plate.
6. The hybrid drive mode sandwiched semiconductor chip heating system of claim 1, wherein: The heating wires (6) are welded on the two sides of the main heat carrier fluid pipe (4) by metallization.