High-precision electronic component blister bearing device

Abstract

The utility model discloses a plastic uptake bearing device for high-precision electronic components, which relates to the field of high-precision electronic components and comprises an embedded plastic uptake disc and a clamping type plastic uptake disc, a placing groove is arranged in the embedded plastic uptake disc, a limiting hole is arranged at the upper end of the embedded plastic uptake disc, and a shielding cover is mounted at the upper end of the limiting hole. According to the utility model, through the arrangement of the embedded plastic uptake tray, the placement groove, the clamping type plastic uptake tray and the placement groove, the embedded plastic uptake tray and the clamping type plastic uptake tray can be connected through the telescopic elastic pipe, and through the two different plastic uptake trays, different electronic components can be placed during use, so that the use is convenient. According to the electronic component placing device, chip type electronic components can be placed in an inserted mode, large electronic components and electronic components in irregular shapes can be placed in a clamped mode, meanwhile, the placed electronic components can be shielded and protected through the installed shielding cover and the installed protective cover, and the placing safety is improved.

Description

Technical Field

[0001] This utility model relates to the field of high-precision electronic components, specifically a high-precision electronic component vacuum forming support device. Background Technology

[0002] Blister trays are commonly found in the electronics, toy, stationery, and cosmetics industries. Made using a vacuum forming process, they feature specific grooves that protect and enhance the appearance of electronic components and other products within the grooves, facilitating their transport. As the precision requirements for electronic components increase, higher precision is also required for the vacuum forming devices that support them. This is to better protect the electronic components and prevent damage during transport and use. Therefore, a high-precision vacuum forming support device for electronic components is needed to protect the placed electronic components during transportation and prevent damage.

[0003] Existing high-precision electronic component blister packaging devices cannot simultaneously place and transport electronic components of different sizes and shapes, nor can they provide shielding or protection for the placed electronic components. Furthermore, they cannot improve the environmental friendliness of the blister box, cannot be reused, lack excellent electrical insulation, and suffer from low material strength and fatigue resistance. Therefore, there is an urgent need for a high-precision electronic component blister packaging device. Utility Model Content

[0004] Based on this, the purpose of this utility model is to provide a high-precision electronic component blister packaging device to solve the problems of existing high-precision electronic component blister packaging devices, which cannot simultaneously place and transport electronic components of different sizes and shapes, cannot shield and protect the placed electronic components, cannot improve the environmental friendliness of the blister box, cannot recycle the blister box, do not have good electrical insulation, and have low material strength and poor fatigue resistance.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a high-precision electronic component blister packaging device, comprising an embedded blister tray and a card-type blister tray. The embedded blister tray has a placement groove inside, a limiting hole at the upper end of the embedded blister tray, a cover installed at the upper end of the limiting hole, a telescopic elastic tube installed at one end of the embedded blister tray, and a card-type blister tray installed at the other end of the telescopic elastic tube. The card-type blister tray has a card slot inside, a fixing hole at the upper end of the card-type blister tray, and a protective cover installed at the upper end of the fixing hole.

[0006] Preferably, the placement slots are distributed at equal intervals using embedded blister trays, and the embedded blister trays are made of PS material.

[0007] Preferably, the shielding cover is engaged with the embedded blister tray through a limiting hole, and the shielding cover and the embedded blister tray are tightly fitted together.

[0008] Preferably, the blister pack is formed by a telescopic elastic tube and an embedded blister pack to form a telescopic structure, and the blister pack and the embedded blister pack are the same size.

[0009] Preferably, the card slots are distributed at equal intervals using blister packs, and the blister packs are made of PS material.

[0010] Preferably, the protective cover is engaged with the blister pack through a fixing hole, and the protective cover and the blister pack fit tightly together.

[0011] Compared with the prior art, the beneficial effects of this utility model are:

[0012] 1. This utility model, through the setting of an embedded blister tray, a placement slot, a card-type blister tray, and a placement slot, can connect the embedded blister tray and the card-type blister tray through a telescopic elastic tube. With the two different blister trays, different electronic components can be placed during use. Chip-type electronic components can be inserted, and larger and irregularly shaped electronic components can be placed by snapping. At the same time, the installed shielding cover and protective cover can shield and protect the placed electronic components, improving the safety of placement.

[0013] 2. This utility model features an embedded blister tray and a card-type blister tray. Both the embedded blister tray and the card-type blister tray are made of PS material, which improves the environmental friendliness of the entire blister box. It can be reused repeatedly, has excellent electrical insulation, and the material has high strength, fatigue resistance, and maintains its efficiency. Attached Figure Description

[0014] Figure 1 This is a front view structural diagram of the present utility model;

[0015] Figure 2 This is a frontal sectional view of the structure of this utility model;

[0016] Figure 3 This is a schematic diagram of the embedded blister tray and the card-type blister tray of this utility model;

[0017] Figure 4 This is a top view of the structure of this utility model.

[0018] In the diagram: 1. Embedded blister tray; 2. Placement slot; 3. Limiting hole; 4. Cover; 5. Telescopic elastic tube; 6. Card-type blister tray; 7. Card slot; 8. Fixing hole; 9. Protective cover. Detailed Implementation

[0019] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0020] The embodiments of this utility model will be described below based on its overall structure.

[0021] Please see Figure 1-4 A high-precision electronic component vacuum forming support device includes an embedded vacuum forming tray 1 and a card-type vacuum forming tray 6. Placement slots 2 are evenly spaced around the embedded vacuum forming trays 1, which are made of PS material. Card slots 7 are also evenly spaced around the card-type vacuum forming trays 6, which are also made of PS material. The use of PS material for the embedded vacuum forming trays 1 and 6 improves the device's durability and allows for repeated use. The placement slots 2 can accommodate larger and irregularly shaped electronic components, as well as chip-type electronic components. The device has an internal placement slot 2, an embedded blister tray 1 with a limiting hole 3 at the top, a shielding cover 4 at the top of the limiting hole 3, a telescopic elastic tube 5 at one end of the embedded blister tray 1, and a clip-on blister tray 6 at the other end of the telescopic elastic tube 5. The clip-on blister tray 6 has a clip groove 7 inside, a fixing hole 8 at the top of the clip-on blister tray 6, and a protective cover 9 at the top of the fixing hole 8. The protective cover 9 is engaged with the clip-on blister tray 6 through the fixing hole 8, and the protective cover 9 fits tightly with the clip-on blister tray 6. The protective cover 9 and the shielding cover 4 installed in the device can shield the electronic components in the blister tray, improving the safety of using the blister tray.

[0022] Working principle: In use, the shielding cover 4 is opened through the limiting hole 3 at the upper end of the embedded blister tray 1, and the protective cover 9 at the upper end of the card-type blister tray 6 is also opened. After opening, different electronic components can be placed separately as needed. Irregularly shaped and larger electronic components can be placed inside the embedded blister tray 1, and chip-like strip-shaped electronic components can be inserted into the card-type blister tray 6. After placement, the shielding cover 4 can be used through the limiting hole 3 in the device to shield the electronic components placed inside the embedded blister tray 1. Similarly, the anti-slip cover 9 protects the electronic components placed inside the card-type blister tray 6. Finally, the embedded blister tray 1 and the card-type blister tray 6 are connected by a telescopic elastic tube 5 to prevent collision between the embedded blister tray 1 and the card-type blister tray 6 during use, thus preventing damage to the electronic components. This completes the use of the device. The contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0023] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A high-precision electronic component blister loading device comprising an embedded blister tray (1) and a card blister tray (6), characterized in that: The embedded blister tray (1) is internally provided with a placing groove (2), the upper end of the embedded blister tray (1) is provided with a limiting hole (3), the upper end of the limiting hole (3) is installed with a shielding cover (4), one end of the embedded blister tray (1) is installed with a telescopic elastic tube (5), the other end of the telescopic elastic tube (5) is installed with a clamping type blister tray (6), the clamping type blister tray (6) is internally provided with a clamping groove (7), the upper end of the clamping type blister tray (6) is provided with a fixing hole (8), and the upper end of the fixing hole (8) is installed with a protective cover (9).

2. The high-precision electronic component blister carrier device of claim 1, wherein: The placing grooves (2) are evenly distributed on the embedded blister tray (1), and the embedded blister tray (1) is made of PS material.

3. The high-precision electronic component blister carrier device of claim 1, wherein: The shielding cover (4) is connected with the embedded blister tray (1) through the limiting hole (3), and the shielding cover (4) is closely attached to the embedded blister tray (1).

4. The high-precision electronic component blister carrier device of claim 1, wherein: The clamping type blister tray (6) and the embedded blister tray (1) constitute a telescopic structure through the telescopic elastic tube (5), and the size of the clamping type blister tray (6) is the same as that of the embedded blister tray (1).

5. The high-precision electronic component blister carrier device of claim 1, wherein: The clamping grooves (7) are evenly distributed on the clamping type blister tray (6), and the clamping type blister tray (6) is made of PS material.

6. The high-precision electronic component blister carrier device of claim 1, wherein: The protective cover (9) is connected with the clamping type blister tray (6) through the fixing hole (8), and the protective cover (9) is closely attached to the clamping type blister tray (6).

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