Electroplating mold for preparing precious metal circular ring
By designing an electroplating mold, a one-time molding process for precious metal rings was achieved, solving the problems of complex and costly preparation of precious metal rings, reducing preparation costs, and making it suitable for large-scale production.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-29
- Publication Date
- 2026-03-31
AI Technical Summary
Existing processes for preparing precious metal rings are complex and costly, making them unsuitable for large-scale use.
The electroplating mold, including an insulating substrate, an insulating cover, an electrodeposition substrate, and an insulating molded cylindrical fixing cap, is used to form a precious metal ring in one step through an electroplating process. The electroplating equipment has a simple structure and low operation requirements.
It reduces the manufacturing cost of precious metal rings, simplifies the process, and is suitable for large-scale production.
Smart Images
Figure CN224062926U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of precious metal product preparation technology, and in particular to an electroplating mold for preparing precious metal rings. Background Technology
[0002] Precious metal rings are highly sought after for their unique luster, color, and texture, and are often used to make exquisite jewelry such as rings and bracelets. Currently, common processes for producing precious metal rings, such as smelting, casting, and forging, can produce them, but these processes require complex equipment and intricate procedures, demanding high levels of skill from operators. This results in high production costs for precious metal rings, hindering their large-scale use. Utility Model Content
[0003] The technical problem solved by this utility model is to provide an electroplating mold for preparing precious metal rings. The electroplating mold can prepare precious metal rings through an electroplating process, effectively reducing the preparation cost of precious metal rings.
[0004] The technical solution adopted by this utility model to solve its technical problem is: an electroplating mold for preparing precious metal rings, including an insulating substrate, an insulating cover, an electrodeposition substrate, an insulating connecting column, and an insulating molded cylindrical fixing cap. The insulating substrate is provided with a connecting thread groove, the insulating cover is provided with a mounting cavity with the opening facing downward, the top surface of the insulating cover is provided with a molded cylindrical through hole, the molded cylindrical through hole is connected to the mounting cavity, the insulating molded cylindrical fixing cap is provided with a connecting through hole in the center, and the inner wall surface of the connecting through hole is provided with a connecting internal thread.
[0005] The insulating connecting post consists of an upper connecting part, a middle connecting part, and a lower connecting part from top to bottom. The outer surfaces of the upper connecting part and the lower connecting part are respectively provided with connecting external threads. The electrodeposition substrate includes a deposition part and a conductive connecting part. The conductive connecting part is connected to one side of the deposition part, and a connecting via is provided in the deposition part.
[0006] The lower part of the insulating connecting post is vertically and detachably installed in the connecting thread groove via a thread. The electrodeposition substrate is detachably installed on the insulating substrate. The deposition portions of the insulating substrate and the electrodeposition substrate are matched and installed in the mounting cavity. The conductive connection portion is located on the outside of the insulating cover.
[0007] The electrodeposition substrate is mounted on the insulating connecting post through a connecting via. The insulating molded cylindrical fixing cap is detachably mounted on the upper part of the insulating connecting post through a connecting through hole, and the insulating molded cylindrical fixing cap is located in the center of the molded cylindrical through hole. The outer wall of the insulating molded cylindrical fixing cap, the inner wall of the molded cylindrical through hole, and the upper surface of the deposition part form an annular molding cavity.
[0008] Furthermore, the upper surface of the insulating cover is flush with the upper surface of the insulating molded cylindrical fixing cap.
[0009] Furthermore, the cross-sectional area of the deposition section is larger than that of the conductive connection section.
[0010] Furthermore, the deposition section and the conductive connection section are integrated into one structure.
[0011] Furthermore, the insulating cover is equipped with a handle.
[0012] Furthermore, the lower surface of the insulating substrate is provided with anti-slip protrusions.
[0013] The advantages of this invention are: fewer electroplating steps, one-time molding of precious metal rings, simple electroplating equipment structure, relatively low skill requirements for operators, and the ability to produce precious metal rings through electroplating, effectively reducing the manufacturing cost of precious metal rings. Furthermore, the simple structure of the electroplating mold facilitates installation and disassembly, making it suitable for large-scale use. Attached Figure Description
[0014] Figure 1 This is a schematic diagram of the structure of this utility model;
[0015] Figure 2 This is an exploded structural diagram of the present invention;
[0016] Figure 3 This is a schematic diagram of the insulating substrate.
[0017] Figure 4 This is a schematic diagram of the insulating cover.
[0018] Figure 5 This is a schematic diagram of the electrodeposition substrate structure;
[0019] The components, parts and numbers in the figure are as follows: Insulating substrate 1, connecting threaded groove 11, insulating cover 2, mounting cavity 21, molded cylindrical through hole 22, electrodeposition substrate 3, deposition part 31, conductive connection part 32, connecting through hole 33, insulating connecting post 4, insulating molded cylindrical fixing cap 5, connecting through hole 51, and annular molded cavity 6. Detailed Implementation
[0020] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.
[0021] like Figures 1 to 5As shown, the present invention is used to prepare an electroplating mold for precious metal rings, including an insulating substrate 1, an insulating cover 2, an electrodeposition substrate 3, an insulating connecting post 4, and an insulating molded cylindrical fixing cap 5. The insulating substrate 1 is provided with a connecting thread groove 11, the insulating cover 2 is provided with a downward-facing mounting cavity 21, the top surface of the insulating cover 2 is provided with a molded cylindrical through hole 22, the molded cylindrical through hole 22 is connected to the mounting cavity 21, the insulating molded cylindrical fixing cap 5 is provided with a connecting through hole 51 in the center, and the inner wall surface of the connecting through hole 51 is provided with a connecting internal thread.
[0022] The insulating connecting post 4 consists of an upper connecting part, a middle connecting part, and a lower connecting part from top to bottom. The outer surfaces of the upper connecting part and the lower connecting part are respectively provided with connecting external threads. The electrodeposition substrate 3 includes a deposition part 31 and a conductive connecting part 32. The conductive connecting part 32 is connected to one side of the deposition part 31. A connecting via 33 is provided in the deposition part 31.
[0023] The lower part of the insulating connecting post 4 is vertically and detachably disposed in the connecting thread groove 11 via a thread. The electrodeposition substrate 3 is detachably disposed on the insulating substrate 1. The deposition portions 31 of the insulating substrate 1 and the electrodeposition substrate 3 are matched and disposed in the mounting cavity 21. The conductive connecting portion 32 is disposed on the outside of the insulating cover 2.
[0024] The electrodeposition substrate 3 is mounted on the insulating connecting post 4 through the connecting via 33. The insulating molded cylindrical fixing cap 5 is detachably mounted on the upper part of the connecting post 4 through the connecting through hole 51. The insulating molded cylindrical fixing cap 5 is located in the center of the molded cylindrical through hole 22. The outer wall of the insulating molded cylindrical fixing cap 5, the inner wall of the molded cylindrical through hole 22 and the upper surface of the deposition part 31 surround to form an annular molding cavity 6. That is, the outer wall of the insulating molded cylindrical fixing cap 5, the inner wall of the molded cylindrical through hole 22 and the upper surface of the deposition part 31 between the outer wall of the insulating molded cylindrical fixing cap 5 and the inner wall of the molded cylindrical through hole 22 surround to form an annular molding cavity 6.
[0025] The electroplating process is carried out using an electroplating apparatus, which mainly includes a power supply, an electrolytic cell, electrodes, and the electroplating mold of this invention. During electroplating, firstly, a sufficient amount of electrolyte containing precious metal elements is added to the electrolytic cell. The precious metal elements exist in the electrolyte in ionic form. Then, the electroplating mold is placed in the electrolytic cell and connected to the power supply through a conductive connection part 32. Finally, electricity is applied to the electrodeposition substrate 3 and the electrodes to perform electroplating. During electroplating, precious metal elements are directly deposited from the electrolyte solution. Since the insulating substrate 1, insulating cap 2, insulating connecting post 4, and insulating molded cylindrical fixing cap 5 are all made of insulating material, the precious metal elements will not be deposited on the insulating material components. Instead, they will be electroplated and deposited on the upper surface of the deposition part 31 between the outer wall of the insulating molded cylindrical fixing cap 5 and the inner wall of the molded cylindrical through hole 22. Due to the restriction of the outer wall of the insulating molded cylindrical fixing cap 5 and the inner wall of the molded cylindrical through hole 22, the precious metal deposited in the electrolyte solution slowly forms a ring in the ring forming cavity 6. After the ring is prepared, the electroplating mold is removed from the electrolytic tank and disassembled. The precious metal electroplated deposition layer is peeled off from the inner surface of the electrodeposition substrate 3. The peeled-off precious metal electroplated deposition layer is the precious metal ring.
[0026] The electroplating process involves fewer steps, allowing precious metal rings to be formed in a single step. The electroplating equipment has a simple structure and requires relatively low operator skill. This invention's electroplating mold can produce precious metal rings through electroplating, effectively reducing the manufacturing cost. Furthermore, the simple structure of this electroplating mold facilitates installation and disassembly, making it suitable for large-scale use.
[0027] Specifically, in order to ensure the quality of the precious metal ring, the upper surface of the insulating cover 2 is flush with the upper surface of the insulating molded cylindrical fixing cap 5.
[0028] The conductive connection 32 serves to connect and conduct electricity. To reduce the possibility of precious metal deposition on the conductive connection 32, its size cannot be too large. Similarly, to ensure the installation and performance of the deposition part 31, its size cannot be too small. Therefore, for example... Figure 2 , Figure 5 As shown, the deposition part 31 and the conductive connection part 32 of this utility model are preferably both rectangular, and the cross-sectional area of the deposition part 31 is larger than the cross-sectional area of the conductive connection part 32.
[0029] To facilitate the processing and manufacturing of electrodeposition substrate 3, for example... Figure 1 As shown, the deposition part 31 and the conductive connection part 32 are an integral structure. The deposition part 31 is provided in the mounting cavity 21 of the insulating cover 2, and the conductive connection part 32 is provided on the outside of the insulating cover 2.
[0030] To reduce the possibility of the electroplating mold slipping during the electroplating process, the lower surface of the insulating substrate 1 is provided with anti-slip protrusions. To facilitate the removal of the electroplating mold from the electrolytic cell, the insulating cover 2 is provided with a handle.
Claims
1. An electroplating mold for preparing a noble metal ring, characterized in that: The application relates to an insulation connecting column (4) and an insulation formed cylindrical fixing cap (5) are arranged on an insulation base (1), an insulation cover (2) is arranged on the insulation base (1), an electrodeposition base plate (3) is arranged on the insulation cover (2), and a connecting thread groove (11) is formed in the insulation base (1); a downward-opening mounting cavity (21) is formed in the insulation cover (2); a top surface of the insulation cover (2) is provided with a shaped cylindrical through hole (22) which is connected with the mounting cavity (21); and a connecting through hole (51) is arranged in the middle of the insulation formed cylindrical fixing cap (5), and an inner thread is arranged on an inner wall surface of the connecting through hole (51). The insulation connecting column (4) comprises a connecting upper part, a connecting middle part and a connecting lower part from top to bottom; connecting outer threads are arranged on outer surfaces of the connecting upper part and the connecting lower part; the electrodeposition base plate (3) comprises a deposition part (31) and a conductive connecting part (32); the conductive connecting part (32) is arranged on one side of the deposition part (31); and a connecting via hole (33) is arranged in the deposition part (31). The connecting lower part of the insulation connecting column (4) is arranged in the connecting thread groove (11) in a vertical and detachable mode through a thread; the electrodeposition base plate (3) is arranged on the insulation base (1) in a detachable mode; the insulation base (1) and the deposition part (31) of the electrodeposition base plate (3) are arranged in the mounting cavity (21) in a matched mode; and the conductive connecting part (32) is arranged on the outer side of the insulation cover (2). The electrodeposition base plate (3) is sleeved on the insulation connecting column (4) through the connecting via hole (33); the insulation formed cylindrical fixing cap (5) is detachably sleeved on the connecting upper part of the insulation connecting column (4) through the connecting through hole (51), and the insulation formed cylindrical fixing cap (5) is located in the middle of the shaped cylindrical through hole (22); and an outer wall of the insulation formed cylindrical fixing cap (5), an inner wall of the shaped cylindrical through hole (22) and an upper surface of the deposition part (31) form a circular ring-shaped cavity (6).
2. The electroplating mold for preparing a noble metal ring according to claim 1, wherein: The upper surface of the insulation cover (2) is flush with the upper surface of the insulation formed cylindrical fixing cap (5).
3. The electroplating mold for preparing a noble metal ring according to claim 1, wherein: The area of the cross section of the deposition part (31) is larger than the area of the cross section of the conductive connecting part (32).
4. The electroplating mold for preparing a noble metal ring according to claim 1, wherein: The deposition part (31) and the conductive connecting part (32) are in an integrated structure.
5. The electroplating mold for preparing a noble metal ring according to claim 1, wherein: A handle is arranged on the insulation cover (2).
6. The electroplating mold for preparing a noble metal ring according to any one of claims 1 to 5, characterized in that: An anti-skid protrusion is arranged on the lower surface of the insulation base (1).