Packaging structure of air pressure sensor

Abstract

The utility model discloses a packaging structure of an air pressure sensor, and belongs to the field of sensors. The packaging structure comprises an upper cover, a lower cover which is detachably connected with the upper cover, a mounting groove which is formed in the lower cover and is used for mounting an air pressure sensor chip, and a via hole which is formed in the mounting groove, penetrates through the lower cover and is used for communicating an external environment with a sensing area of the air pressure sensor chip, a sealing rubber ring is fixedly installed around the through hole in the installation groove, the air pressure sensor chip is in lap joint with the sealing rubber ring, and an induction area of the air pressure sensor chip sequentially penetrates through the sealing rubber ring and the through hole to extend out of the lower cover. According to the packaging structure, the barometric sensor chip is stressed to press the sealing rubber ring at the bottom, so that the barometric sensor chip is tightly combined with the sealing rubber ring, water vapor can be effectively prevented from entering, and stable work of the barometric sensor chip is ensured.

Description

Technical Field

[0001] This application relates to the field of sensor technology, specifically a packaging structure for a barometric pressure sensor. Background Technology

[0002] The sensor is a high-precision, low-power, miniaturized digital barometric pressure sensor. It functions as both a pressure and temperature sensor. The pressure sensing element is based on the capacitive sensing principle, ensuring high accuracy when temperature changes occur. The packaging structure directly affects the sensor's size and specifications.

[0003] Chinese utility model patent CN210689874U discloses a sensor packaging structure. It achieves internal sealing between the base and the cover through a built-in convex groove structure, and the internal mounting method solves the problem of excessive packaging thickness. However, in addressing the sealing issue, this simple packaging structure only seals the edges of the connected packaging structure. In actual packaging, a through-hole needs to be reserved for the sensor's sensing area to contact the outside. The existing design does not optimize the sealing of this through-hole, which can easily allow moisture to enter the packaging structure during subsequent use, affecting the sensor's operation, thus presenting certain shortcomings.

[0004] Therefore, this application provides a packaging structure for a barometric pressure sensor to solve the above-mentioned problems. Utility Model Content

[0005] This application provides a packaging structure for a barometric pressure sensor, which aims to solve the problems of poor sealing performance in existing sensor packaging structures mentioned in the background art.

[0006] To achieve the above objectives, this application provides the following technical solution: a packaging structure for a barometric pressure sensor, comprising an upper cover, a lower cover detachably connected to the upper cover, a mounting slot on the lower cover for mounting a barometric pressure sensor chip, and a through hole formed in the mounting slot and penetrating the lower cover for communicating between the external environment and the sensing area of ​​the barometric pressure sensor chip.

[0007] A sealing ring is fixedly installed in the mounting groove around the through hole. The air pressure sensor chip is attached to the sealing ring. The sensing area of ​​the air pressure sensor chip extends to the outside of the lower cover through the sealing ring and the through hole in sequence.

[0008] Two symmetrically distributed elastic pressure rods are fixedly installed inside the upper cover. The end of each elastic pressure rod away from the upper cover extends towards the lower cover and presses against the top of the pressure sensor chip. During encapsulation, the sealing ring is adhered to the mounting groove, aligned with the through hole, and then the sensing area of ​​the pressure sensor chip is aligned with the through hole and inserted, thus placing the pressure sensor chip horizontally in the mounting groove. The upper cover is then aligned with the lower cover and installed. Pressing down on the upper cover causes it to press against the lower cover, resulting in the elastic pressure rods inside the upper cover pressing against the top of the pressure sensor chip. The pressure sensor chip, in turn, presses against the sealing ring at its bottom, ensuring a tight bond between the pressure sensor chip and the sealing ring. This effectively prevents moisture from entering and ensures stable operation of the pressure sensor chip.

[0009] Preferably, in order to ensure stable pressing, the distance between the two elastic pressure rods gradually increases from the end near the upper cover to the end near the lower cover. The end of the elastic pressure rod near the air pressure sensor chip is designed with rounded corners to ensure that the upper cover and the lower cover can be tightly connected and ensure stable sealing.

[0010] Preferably, to facilitate glue filling, the top cover is provided with a filling hole for threading and filling glue. Several evenly distributed support protrusions are fixedly installed in the mounting groove. There are guide grooves between the support protrusions. The air pressure sensor chip is attached to the support protrusions to improve the flowability of the glue and effectively avoid the problem of dry filling.

[0011] Preferably, to ensure the proper functioning of the sealing ring, the maximum height of the horizontal plane of the supporting protrusion is lower than the maximum height of the horizontal plane of the sealing ring, so that they do not affect normal use.

[0012] Preferably, in order to position the chip, four positioning posts arranged in an array are fixedly installed in the mounting slot. The space between the four positioning posts is adapted to the pressure sensor chip to avoid misalignment with the sealing ring and ensure effective sealing.

[0013] Preferably, in order to connect the upper cover and the lower cover, a pressure ring adapted to the lower cover is fixedly installed on the upper cover, a sealing gasket is sandwiched between the pressure ring and the lower cover, and bolts are screwed onto the pressure ring, the sealing gasket and the lower cover to provide a good seal.

[0014] This packaging structure involves bonding a sealing ring to the mounting groove, aligning it with the through hole, and then inserting the pressure sensor chip with its sensing area aligned with the through hole. The pressure sensor chip is then placed horizontally within the mounting groove. The upper cover is then aligned with the lower cover and installed. Pressing the upper cover causes it to press down on the lower cover, which in turn causes the elastic rod inside the upper cover to press down on the top of the pressure sensor chip. The pressure sensor chip, under pressure, presses down on the sealing ring at its bottom, resulting in a tight bond between the pressure sensor chip and the sealing ring. This effectively prevents moisture from entering and ensures stable operation of the pressure sensor chip.

[0015] In this packaging structure, the leads of the pressure sensor chip are first led out from the injection hole, and then glue is injected into the upper and lower covers through the injection hole. The glue flows on the top of the pressure sensor chip and enters the mounting groove from the side of the pressure sensor chip. The guide groove formed by the support bumps in the mounting groove allows the glue to flow in the mounting groove, thereby injecting and sealing the bottom of the pressure sensor chip, improving the fluidity of the glue and effectively avoiding the problem of dry filling. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the external structure of a barometric pressure sensor packaging.

[0017] Figure 2 This is a schematic diagram of the bottom structure of a barometric pressure sensor packaging structure;

[0018] Figure 3 This is a schematic diagram of the unfolded structure of a barometric pressure sensor's packaging.

[0019] Figure 4 This is a cross-sectional schematic diagram of the packaging structure of a pressure sensor.

[0020] In the picture:

[0021] 1. Top cover; 11. Elastic pressure rod; 12. Injection hole; 13. Pressure ring; 14. Sealing gasket; 15. Bolt; 2. Bottom cover; 21. Mounting groove; 22. Through hole; 23. Sealing ring; 24. Support protrusion; 25. Flow guide groove; 3. Air pressure sensor chip; 4. Positioning post. Detailed Implementation

[0022] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0023] Example 1

[0024] This embodiment provides a packaging structure for a barometric pressure sensor, such as... Figure 1-4 As shown, the packaging structure includes an upper cover 1, a lower cover 2 detachably connected to the upper cover 1, a mounting slot 21 on the lower cover 2 for mounting a barometric pressure sensor chip 3, and a through hole 22 formed in the mounting slot 21 and extending through the lower cover 2 to connect the external environment with the sensing area of ​​the barometric pressure sensor chip 3.

[0025] A sealing ring 23 is fixedly installed in the mounting groove 21 around the through hole 22. The air pressure sensor chip 3 is attached to the sealing ring 23. The sensing area of ​​the air pressure sensor chip 3 extends to the outside of the lower cover 2 through the sealing ring 23 and the through hole 22 in sequence.

[0026] Two symmetrically distributed elastic pressure rods 11 are fixedly installed inside the upper cover 1. The end of the elastic pressure rod 11 away from the upper cover 1 extends toward the lower cover 2 and presses against the top of the air pressure sensor chip 3.

[0027] In use, the sealing ring 23 is glued into the mounting groove 21 and aligned with the through hole 22. Then, the sensing area of ​​the pressure sensor chip 3 is aligned with the through hole 22 and inserted, so that the pressure sensor chip 3 is placed horizontally in the mounting groove 21. Then, the upper cover 1 is aligned with the lower cover 2 and installed. Pressing the upper cover 1 causes the upper cover 1 to press down and cover the lower cover 2, so that the elastic pressure rod 11 in the upper cover 1 presses down on the top of the pressure sensor chip 3. The pressure sensor chip 3 is pressed down on the sealing ring 23 at the bottom, so that the pressure sensor chip 3 and the sealing ring 23 are tightly combined, which can effectively prevent moisture from entering and ensure the stable operation of the pressure sensor chip 3.

[0028] Specifically, the distance between the two elastic pressure rods 11 gradually increases from the end near the upper cover 1 to the end near the lower cover 2, and the end of the elastic pressure rod 11 near the air pressure sensor chip 3 is designed with rounded corners.

[0029] When in use, when the elastic pressure rod 11 is pressed down, after the air pressure sensor chip 3 and the sealing ring 23 are pressed to the maximum extent, the upper cover 1 is further pressed. The two elastic pressure rods 11 will bend elastically to both sides under pressure, providing sufficient downward stroke for the upper cover 1 to be pressed down, ensuring that the upper cover 1 and the lower cover 2 can be tightly connected and ensuring a stable seal.

[0030] Understandably, the rounded corner design at the end of the elastic pressure rod 11 prevents the sharp surface from scratching the surface of the pressure sensor chip 3 when it comes into contact with it, thus ensuring that the pressure sensor chip 3 is not damaged.

[0031] More specifically, four positioning posts 4 are fixedly installed in the mounting slot 21 in an array, and the space between the four positioning posts 4 is adapted to the air pressure sensor chip 3.

[0032] When using the air pressure sensor chip 3, align the edge of the air pressure sensor chip 3 with the inside of the four positioning posts 4. This will prevent the air pressure sensor chip 3 from shaking after it is installed in the mounting groove 21, making it more stable when pressed by the elastic pressure rod 11. This will prevent misalignment with the sealing ring 23 and ensure an effective seal.

[0033] Furthermore, a pressure ring 13 adapted to the lower cover 2 is fixedly installed on the upper cover 1, and a sealing gasket 14 is sandwiched between the pressure ring 13 and the lower cover 2. Bolts 15 are screwed onto the pressure ring 13, the sealing gasket 14 and the lower cover 2.

[0034] In use, the sealing gasket 14 is placed on the edge of the mounting groove 21 of the lower cover 2, and then the pressure ring 13 on the upper cover 1 is aligned with the sealing gasket 14. The upper cover 1 and the lower cover 2 are fixed and sealed by bolts 15 passing through the pressure ring 13, the sealing gasket 14 and the lower cover 2 in sequence.

[0035] Example 2

[0036] Unlike Embodiment 1, in order to improve the stability of the barometric pressure sensor chip 3 during operation, the prior art usually pots glue into the package during encapsulation. However, when the bottom of the barometric pressure sensor chip 3 contacts the lower cover 2 during potting, the glue may not flow into some areas, which may result in dry potting. Therefore, the upper cover 1 is provided with a potting hole 12 for threading and potting glue. Several evenly distributed support protrusions 24 are fixedly installed in the mounting groove 21. There are guide grooves 25 between the support protrusions 24. The barometric pressure sensor chip 3 is attached to the support protrusions 24.

[0037] In use, the lead wire of the pressure sensor chip 3 is first led out from the injection hole 12, and then glue is injected into the upper cover 1 and the lower cover 2 through the injection hole 12. The glue flows on the top of the pressure sensor chip 3 and enters the mounting groove 21 from the side of the pressure sensor chip 3. The guide groove 25 formed by the support protrusion 24 in the mounting groove 21 allows the glue to flow in the mounting groove 21, thereby injecting and sealing the bottom of the pressure sensor chip 3, improving the fluidity of the glue, and effectively avoiding the problem of dry injection.

[0038] Specifically, the maximum height of the horizontal plane of the supporting protrusion 24 is lower than the maximum height of the horizontal plane of the sealing ring 23.

[0039] During use, while ensuring sufficient flow space at the bottom of the pressure sensor chip 3, the lower support protrusion 24 also ensures that the sealing ring 23 has sufficient downward pressure space when pressed down, without affecting normal use.

[0040] The above description is merely a preferred embodiment of this application, but the scope of protection of this application is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in this application, based on the technical solution and concept of this application, should be included within the scope of protection of this application.

Claims

1. An encapsulation structure of a barometric pressure sensor, comprising an upper cover (1), a lower cover (2) detachably connected with the upper cover (1), a mounting groove (21) opened on the lower cover (2) for mounting a barometric pressure sensor chip (3), a through hole (22) opened in the mounting groove (21) and penetrating through the lower cover (2) for connecting an external environment with a sensing area of the barometric pressure sensor chip (3), characterized in that: a sealing rubber ring (23) is fixedly mounted around the through hole (22) in the mounting groove (21), the barometric pressure sensor chip (3) is overlapped on the sealing rubber ring (23), and the sensing area of the barometric pressure sensor chip (3) extends outside the lower cover (2) through the sealing rubber ring (23) and the through hole (22) in sequence; two symmetrically distributed elastic pressure rods (11) are fixedly mounted in the upper cover (1), and the ends of the elastic pressure rods (11) away from the upper cover (1) extend towards the lower cover (2) and are overlaid on the top of the barometric pressure sensor chip (3).

2. The packaging structure of a pressure sensor according to claim 1, wherein: The distance between the two elastic pressure rods (11) gradually expands from the end close to the upper cover (1) to the end close to the lower cover (2), and the end of the elastic pressure rod (11) close to the barometric pressure sensor chip (3) is designed with a rounded corner.

3. The packaging structure of a pressure sensor according to claim 1, wherein: A perfusion hole (12) for threading and glue pouring is opened on the upper cover (1), a plurality of uniformly arranged supporting blocks (24) are fixedly mounted in the mounting groove (21), the supporting blocks (24) are arranged with flow guide grooves (25) therebetween, and the barometric pressure sensor chip (3) is overlapped on the supporting blocks (24).

4. The package structure of a pressure sensor according to claim 3, wherein: The horizontal maximum height of the supporting blocks (24) is lower than that of the sealing rubber ring (23).

5. The package structure of a pressure sensor according to claim 1, wherein: Four positioning columns (4) arranged in an array are fixedly mounted in the mounting groove (21), and the space between the four positioning columns (4) is matched with the barometric pressure sensor chip (3).

6. The packaging structure of a pressure sensor according to claim 1, wherein: The upper cover (1) is fixedly mounted with a pressing ring (13) matched with the lower cover (2), a sealing washer (14) is clamped between the pressing ring (13) and the lower cover (2), and the pressing ring (13), the sealing washer (14) and the lower cover (2) are screwed with a bolt (15).

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